CN104133264A - Method of manufacturing polarizer - Google Patents
Method of manufacturing polarizer Download PDFInfo
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- CN104133264A CN104133264A CN201310158906.1A CN201310158906A CN104133264A CN 104133264 A CN104133264 A CN 104133264A CN 201310158906 A CN201310158906 A CN 201310158906A CN 104133264 A CN104133264 A CN 104133264A
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Abstract
The invention relates to a method of manufacturing a polarizer. The method comprises the following steps: step A, a first drum, a second drum, a flexible template and a substrate are provided, wherein one surface of the flexible template forms a plurality of convex strips parallel mutually and arranged at intervals; and the substrate comprises a transparent layer and a reflection layer stacked together; step B, the flexible template is arranged on the surface of the first drum to enable the convex strips on the flexible template to be convex along the direction far away from the drum; step C, a layer of oil ink is formed on the surface, far away from the first drum, of the convex strip; step D, the oil ink on the surface, far away from the first drum, of the convex strip is attached to the surface of the reflection layer of the substrate in a reel-to-reel continuous printing mode; and step E, the reflection layer not covered by the oil ink is etched to expose the transparent layer.
Description
Technical field
The present invention relates to a kind of method of preparing polaroid, relate in particular to a kind of method of preparing wire grid type polaroid.
Background technology
With regard to concept, the simplest linear polarizer plate is wiregrating polaroid, and it consists of the regular array being placed on perpendicular to the thin parallel wire in the plane of incident beam.Have with the electromagnetic wave of the electric field component of these tinsel parallel aligned and cause that electronics is along the movement of tinsel length direction.Because electronics upwards moves freely the party, the performance of polaroid when reflected light is similar to metal surface; And ripple is along incident beam turn back (deducting a small amount of energy loss producing because of Joule heat wiry).
For the ripple having perpendicular to electric field wiry, thus electronics can not be mobile very far away from each one metal wire; Therefore, a small amount of energy is reflected, and reflection wave can pass grid.Owing to being parallel to electric field component wiry, be reflected, the electromagnetic wave being passed only has electric field linear polarization thus on perpendicular to direction wiry.It should be noted, polarization direction is perpendicular to wiry; This understanding that ripple " is slipped away " from the gap between tinsel is incorrect.
In actual applications, between tinsel, indirectly must be less than radiation wavelength, and width wiry should be the sub-fraction of this spacing.This means that wiregrating polaroid is conventionally only for microwave and far away, mid-infrared light.By using advanced photoetching technique, can make the metal grate of the spacing very dense of energy polarization visible ray.Because degree of polarization is not high to incident light wavelength and dependence of angle, so they are applied in the wideband application such as projection.Yet advanced photoetching technique is for too expensive the manufacture of the cheap volume to volume formula wiregrating polaroid for display application.
Linear polarizer plate is widely used in the production of liquid crystal display.Two orthogonal polaroids are attached to liquid crystal cells pro and con, and when the top in cell electrode and bottom apply electric field, it makes liquid crystal play the effect of dimmer.Yet larger problem is that its light output that makes display has weakened 50% in existing polyvinyl polymkeric substance polaroid.Recent decades, this drawback of light output facet has become the difficult problem in consumer electronics market, because realize the especially required energy of exterior lighting degree, can reduce battery life.
In prior art, be mostly to adopt the method for etch silicon substrate to prepare polaroid, its efficiency is low, cost is high.
Summary of the invention
(1) technical matters that will solve
In view of this, the necessary preparation method that the polaroid that a kind of efficiency is high, cost is low is provided.
(2) technical scheme
The invention provides a kind of method of preparing polaroid, it comprises the following steps: steps A: two cylinders, Flexible formwork assembly and substrates are provided, one surface of wherein said Flexible formwork assembly is formed with a plurality of parallel to each other and spaced raised lines, and described substrate comprises stacked hyaline layer and reflection horizon; Step B: the surface that described Flexible formwork assembly is mounted to a cylinder in described two cylinders makes the raised line on described Flexible formwork assembly protruding along the direction away from cylinder; Step C: formation one deck ink is the surface away from cylinder in described raised line; Step D: the method that adopts volume to volume continuous printing by raised line away from the lip-deep ink adhesion of cylinder to the surface, reflection horizon of described substrate; And step e: thus the reflection horizon that etching is not covered by ink exposes hyaline layer.
(3) beneficial effect
The method of preparing polaroid provided by the invention has following beneficial effect: the first, and adopt the mode of volume to volume continuous printing to prepare, can make the process of preparing polaroid carry out continuously, and then improve the preparation efficiency of polaroid; The second, if described Flexible formwork assembly is damaged in preparation process, can be convenient for changing, reduced maintenance cost; Three, described Flexible formwork assembly is prepared by the method for injection mo(u)lding, and the pattern on Flexible formwork assembly is easy to change, and therefore, is easy to prepare the polaroid of different size, structure, makes its application wider.
Accompanying drawing explanation
Two cylinders that Fig. 1 provides for the embodiment of the present invention.
The three-dimensional process flow diagram of preparing Flexible formwork assembly that Fig. 2 provides for the embodiment of the present invention.
The side-looking process flow diagram of preparing Flexible formwork assembly that Fig. 3 provides for the embodiment of the present invention.
The stereographic map of the photoresist of the patterning that Fig. 4 provides for the embodiment of the present invention.
The side view of the substrate that Fig. 5 provides for the embodiment of the present invention.
The employing volume to volume continuation mode that Fig. 6 provides for the embodiment of the present invention is prepared the stereographic map of the method for polaroid.
The employing volume to volume mode that Fig. 7 provides for the embodiment of the present invention is prepared the process flow diagram of the method for polaroid.
Fig. 8 is the side view of the polaroid for preparing of the embodiment of the present invention.
Embodiment
Below with reference to accompanying drawing, illustrate in greater detail the preparation method of the polaroid that the embodiment of the present invention provides.
The embodiment of the present invention provides a kind of method of preparing polaroid, and it comprises the following steps:
Steps A: two cylinders, Flexible formwork assembly and substrates are provided, and a surface of wherein said Flexible formwork assembly is formed with a plurality of parallel to each other and spaced raised lines, and described substrate comprises stacked hyaline layer and reflection horizon;
Step B: the surface that described Flexible formwork assembly is mounted to a cylinder in described two cylinders makes the raised line on described Flexible formwork assembly protruding along the direction away from cylinder;
Step C: formation one deck ink is the surface away from cylinder in described raised line;
Step D: the method that adopts volume to volume continuous printing by raised line away from the lip-deep ink adhesion of cylinder to the surface, reflection horizon of described substrate; And
Step e: thus the reflection horizon that etching is not covered by ink exposes hyaline layer.
In steps A, refer to Fig. 1, described two cylinders are respectively the first cylinder 10 and second tin roller 20.Described the first cylinder 10 and second tin roller 20 are all rigid cylinder, and the material of the first cylinder 10 and second tin roller 20 can be glass, pottery or metal.The material of described Flexible formwork assembly can be the flexible polymeric materials such as silicones, urethanes, urethane or epoxy resin.Described Flexible formwork assembly has certain pliability, and described Flexible formwork assembly should be bent under external force circular and long period and keep circular and do not fracture or damage.
Refer to Fig. 2 and Fig. 3, in described steps A, the preparation method of Flexible formwork assembly 60 comprises following sub-step:
Steps A 1: a substrate 30 is provided, and in the upper one deck photoresist 40 that forms in a surface of this substrate 30;
Steps A 2: form a plurality of parallel and spaced grooves 42 thereby adopt photoetching process that photoresist 40 is exposed, developed on the surface of described photoresist 40, described substrate 30 and the photoresist 40 being formed in substrate 30 form a caster;
Steps A 3: cast one liquid curable material 50 is formed with in described caster on the surface of groove 42, described liquid curable material 50 is filled described groove 42, and covers described photoresist 40 completely;
Steps A 4: form a Flexible formwork assembly 60 thereby solidify described liquid curable material 50; And
Steps A 5: peel off described Flexible formwork assembly 60 and obtain an independent Flexible formwork assembly 60, have a plurality of parallel to each other and spaced raised lines 62 on a surface of described Flexible formwork assembly 60, described raised line 62 is engaged with each other with the groove 42 being formed on caster.
In steps A 1, the material of substrate 30 is the hard substrates such as silicon wafer or glass.The surface of described substrate 30 has good smoothness, and preferably, the surface flatness of described substrate 30 is less than 10 nanometers, and further preferably, the surface flatness of described substrate 30 is less than 5 nanometers.In the present embodiment, the material of described substrate 30 is silicon wafer, because silicon wafer and the process equipment and the processing technology comparison match that are less than the linear geometrical feature of 100 nanometers.The thickness of described photoresist 40 is 50 nanometers to 5 micron.Described photoresist 40 can be positive photoresist or negative photoresist.In the present embodiment, the thickness of described photoresist 40 is 2.5 microns.Described photoresist 40 is preferably SU8, because it can form firm mechanical fine rule feature, and can adhere on silicon chip surface capitally.
In steps A 2, described photoresist 40 is exposed identical with photoetching process of the prior art with the photoetching process of developing.Refer to Fig. 4, wherein the recess width of photoresist 40 is defined as the distance between the opposing sidewalls of groove, i.e. width D in Fig. 4, the minor increment between the sidewall of the interval definition adjacent notches of the groove of photoresist 40, be the spacing W in Fig. 4, the degree of depth of described groove is defined as the H in Fig. 4.The scope of the width D of groove between 500nm, is preferably 80 nanometers between 120nm in 50 nanometers, and the scope of the spacing W between groove be 50 nanometers between 500nm, be preferably 80 nanometers to 120nm.The scope of the depth H of groove can be 0.005 micron to 5 microns, is preferably 0.01 micron to 2 microns.In the present embodiment, the depth H of described groove is 102 nanometers, and the width D of described groove is 100 nanometers, and the spacing W between described groove is 100 nanometers.
In steps A 3, described liquid curable material 50 is liquid unimolecule oligomer, is preferably the combination in any of silicones, urethanes, silicone resin 184, polyurethane, polydiene, elastic epoxy thing or epoxy resin and aforementioned polymer material.Described liquid curable material 50 can also be thermoplastic polymer or thermosetting polymer further.Described thermoplastic polymer comprises tygon, polyethylene terephthalate or organic glass etc.Described thermosetting polymer comprises phenolics or vulcanized rubber etc.The thickness of the Flexible formwork assembly 60 that the amount of the liquid unimolecule oligomer of pouring into a mould by adjusting obtains in can regulating step A5.By regulating mechanical stretching performance and the hardness of the Flexible formwork assembly 60 that condition of cure obtains in can regulating step A5.The Flexible formwork assembly 60 of different-thickness, mechanical stretching performance and hardness is applicable to different volume to volume printing processes.
In steps A 4, the method for described cure polymer can be cooling curing, heat curing or photocuring.The method of heat of solidification thermoplastic polymer is cooling curing, and the method for cured thermoset polymkeric substance is for being heating and curing, and the method for solidified liquid unimolecule oligomer is for adopting the method for ultraviolet ray irradiation to solidify.
In steps A 5, pattern on described Flexible formwork assembly 60 and the lip-deep pattern of photoresist 40 are engaged with each other, that is to say, raised line 62 on described Flexible formwork assembly 60 is one to one with the groove 42 on described photoresist, raised line on described Flexible formwork assembly 60 62 embeds the groove 42 of described photoresist, and contacts completely with the inwall of the groove 42 of described photoresist.
Refer to Fig. 5, in described substrate 72, the material of hyaline layer 80 is hard or the soft transparent materials such as silicon, silicon dioxide, cellulose ethanoate, thermal stability polyester, polycarbonate, cyclopolyolefin film or amorphous polyester.The material in described reflection horizon 70 is for having reflexive metal, and described metal comprises aluminium, gold, silver, copper and mickel.The thickness in described reflection horizon should guarantee visible reflection of light, and the thickness in described reflection horizon 70 is 5 nanometer to 1000 nanometers.In the present embodiment, the material in described reflection horizon 70 is aluminium, and thickness is 200 nanometer to 400 nanometers, is in particular 300 nanometers.
In step B, described Flexible formwork assembly 60 sticks to the surface of described the first cylinder 10 by cementing agent.Understandably, described Flexible formwork assembly 60 sticks to behind the first cylinder 10 surfaces, and the whole surface of the first cylinder 10 forms a plurality of continuous raised lines 62.The axis direction that the bearing of trend of the raised line 62 on described Flexible formwork assembly 60 can be parallel to the first cylinder 10 also can have a certain degree in the axis direction of the first cylinder 10, that is to say, the bearing of trend of raised line 62 is restriction not.In the present embodiment, the raised line 62 on described Flexible formwork assembly is parallel to the axle center of described the first cylinder 10, and a plurality of raised lines 62 on described the first cylinder 10 surfaces are continuous equally spaced and parallel to each other.
In step C, the material of described ink 90 is silane, mercaptan and phosphonate ester etc.Described ink 90 is self-composed monomolecular ink.The material of ink described in the present embodiment 90 is fluorinated phosphate ester.In this step, region or ink 90 that described ink 90 also can be formed between raised line 62 are only formed at raised line 60 away from the surface of the first cylinder 10.
In step D, refer to Fig. 6, Fig. 6 schematically illustrates step D, and described the first cylinder 10 and second tin roller 20 are oppositely arranged, between described the first cylinder 10 and second tin roller 20, form a gap, described substrate 72 can be through the gap between described the first cylinder 10 and second tin roller 20.Wherein the first cylinder 10 act as printing-ink 90 to substrate 72, second tin roller 20 plays the effect of support.The surface of second tin roller 20 is smooth, is not provided with Flexible formwork assembly on it.In the process of printing, reflection horizon 70 in described substrate 72 is oppositely arranged with the raised line 62 of described Flexible formwork assembly 60, thereby in the time of between substrate 72 is through the first cylinder 10 and second tin roller 20, reflection horizon 70 in described substrate 72 is pushed each other with the raised line 62 on Flexible formwork assembly 60, and the ink of raised line 62 surface adhesion on described Flexible formwork assembly 60 is transferred to the surface in the reflection horizon 70 of substrate 72.
Refer to Fig. 7, Fig. 7 has illustrated step C and step D, and wherein the first width figure in Fig. 7 and the second width figure have illustrated step C, and the 3rd width figure and the 4th width figure in Fig. 7 have illustrated step D.Because described reflection horizon 70 is metal, described ink 90 forms covalent bond with described metal, thereby 90 moments of described ink adhere on the metal surface being in contact with it.Yet because even the region between raised line 62 is formed with ink 90, this part ink 90 keeps certain distance by raised line 62 and described metal, so the ink 90 of the part between raised line 62 also cannot adhere to metal surface.Therefore the pattern that ink 90 forms, adhering on metal surface and raised line away from the surface of the first cylinder 10 to form pattern corresponding.
In step e, the reflection horizon 70 that etching is not covered by ink 90, the method in described etching reflection horizon 70 is reactive ion etching method or uses etching liquid etching reflection horizon 70.In step e, described ink 90 has played the effect of protective seam, and the reflection horizon 70 that ink 90 protections are positioned at ink below is not etched.After step e finishes, obtain polaroid 100.
Selectively, if adopt etching liquid etching reflection horizon 70, after etching finishes, further comprise and adopt washed with de-ionized water dry step.
Refer to Fig. 8, the polaroid 100 preparing comprises a hyaline layer 80, is a plurality ofly arranged at intervals at the lip-deep reflection horizon 70 of hyaline layer 80 and is arranged on reflection horizon 70 away from the ink 90 on hyaline layer 80.
Described polaroid 100 in use, incident light is entered to inject by hyaline layer 80, thereby a part for incident light is reflected layer, 70 reflection cannot transmission from polaroid 100, and another part of incident light, through hyaline layer 80 transmission from polaroid 100, is realized thus to incident polarisation of light.
The method that the present invention prepares polaroid 100 has the following advantages: the first, and adopt the mode of volume to volume printing to prepare, can make the process of preparing polaroid 100 carry out continuously, and then improve the preparation efficiency of polaroid 100; The second, if described Flexible formwork assembly is damaged in preparation process, can be convenient for changing, reduced maintenance cost; Three, described Flexible formwork assembly is prepared by the method for injection mo(u)lding, and the pattern on Flexible formwork assembly is easy to change, and therefore, is easy to prepare the polaroid 100 of different size, structure, makes its application wider.
Although specifically illustrated and described the present invention with reference to specific implementations, one skilled in the art should appreciate that in the situation that spirit of the present invention and the protection domain not limiting departing from claims can be made the variation of various forms and details.Therefore claims have represented protection scope of the present invention, and therefore wish to have comprised all changes of doing in the implication that is equal in claim and scope.
Claims (12)
1. a method of preparing polaroid, it comprises the following steps:
Steps A: the first cylinder, second tin roller, Flexible formwork assembly and substrate are provided, and a surface of wherein said Flexible formwork assembly is formed with a plurality of parallel to each other and spaced raised lines, and described substrate comprises stacked hyaline layer and reflection horizon;
Step B: the surface that described Flexible formwork assembly is mounted to the first cylinder makes the raised line on described Flexible formwork assembly protruding along the direction away from the first cylinder;
Step C: formation one deck ink is the surface away from the first cylinder in described raised line;
Step D: the method that adopts volume to volume continuous printing by raised line away from the lip-deep ink adhesion of the first cylinder to the surface, reflection horizon of described substrate; And
Step e: thus the reflection horizon that etching is not covered by ink exposes hyaline layer.
2. the method for preparing polaroid as claimed in claim 1, is characterized in that, in described steps A, the preparation method of Flexible formwork assembly comprises following sub-step:
Steps A 1: substrate is provided, and in the upper one deck photoresist that forms in a surface of this substrate;
Steps A 2: form a plurality of parallel and spaced grooves thereby adopt photoetching process photoresist to be exposed and develop on the surface of described photoresist, described substrate and be formed at suprabasil photoresist and form a caster;
Steps A 3: pouring liquid curable materials forms on reeded surface in described caster, described liquid curable material is filled described groove, and covers described photoresist completely;
Steps A 4: form a Flexible formwork assembly thereby solidify described liquid curable material; And
Steps A 5: peel off described Flexible formwork assembly and obtain an independent Flexible formwork assembly, have a plurality of parallel to each other and spaced raised lines on a surface of described Flexible formwork assembly, described raised line is engaged with each other with the groove being formed on caster.
3. the method for preparing polaroid as claimed in claim 2, is characterized in that, in described steps A 1, the material of described substrate is silicon wafer or glass plate.
4. the method for preparing polaroid as claimed in claim 2, is characterized in that, in described steps A 3, described liquid curable material comprises thermoplastic polymer, thermosetting polymer or liquid unimolecule oligomer.
5. the method for preparing polaroid as claimed in claim 1, is characterized in that, the material in the reflection horizon in described steps A is for having reflexive metal.
6. the method for preparing polaroid as claimed in claim 1, is characterized in that, in described steps A, the thickness in reflection horizon is 5 nanometer to 1000 nanometers.
7. the method for preparing polaroid as claimed in claim 1, is characterized in that, the material of the described hyaline layer in described steps A is silicon, silicon dioxide, cellulose ethanoate, thermal stability polyester, polycarbonate, cyclopolyolefin film or amorphous polyester.
8. the method for preparing polaroid as claimed in claim 1, is characterized in that, the material of the described ink in described step C is silane, mercaptan, fluorinated phosphonate or phosphonate ester.
9. the method for preparing polaroid as claimed in claim 1, is characterized in that, the first cylinder and second tin roller described in described steps A relatively and interval arrange and form a gap between two cylinders.
10. the method for preparing polaroid as claimed in claim 9, is characterized in that, in described step D, described substrate is through the gap between described the first cylinder and second tin roller.
11. methods of preparing polaroid as claimed in claim 9, is characterized in that, in described step D, the metal in described ink and described reflection horizon forms covalent bond.
12. 1 kinds of polaroids that adopt the method for claim 1 to prepare, is characterized in that comprising a hyaline layer, are a plurality ofly arranged at intervals at the reflection horizon in transparent layer surface and are arranged on reflection horizon away from the lip-deep ink of hyaline layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310158906.1A CN104133264A (en) | 2013-05-02 | 2013-05-02 | Method of manufacturing polarizer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310158906.1A CN104133264A (en) | 2013-05-02 | 2013-05-02 | Method of manufacturing polarizer |
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| CN104133264A true CN104133264A (en) | 2014-11-05 |
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| CN201310158906.1A Pending CN104133264A (en) | 2013-05-02 | 2013-05-02 | Method of manufacturing polarizer |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1003078A2 (en) * | 1998-11-17 | 2000-05-24 | Corning Incorporated | Replicating a nanoscale pattern |
| CN1866062A (en) * | 2005-01-19 | 2006-11-22 | Lg电子株式会社 | Wire grid polarization film, and method for manufacturing mold for forming wire grids thereof |
| CN101909858A (en) * | 2008-03-24 | 2010-12-08 | 夏普株式会社 | Process for production of nano-imprinted film, displays and liquid crystal displays |
| CN102472855A (en) * | 2009-07-01 | 2012-05-23 | 旭硝子株式会社 | Method for producing article having fine recessed and projected structure on surface, and method for producing wire grid polarizer |
-
2013
- 2013-05-02 CN CN201310158906.1A patent/CN104133264A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1003078A2 (en) * | 1998-11-17 | 2000-05-24 | Corning Incorporated | Replicating a nanoscale pattern |
| CN1866062A (en) * | 2005-01-19 | 2006-11-22 | Lg电子株式会社 | Wire grid polarization film, and method for manufacturing mold for forming wire grids thereof |
| CN101909858A (en) * | 2008-03-24 | 2010-12-08 | 夏普株式会社 | Process for production of nano-imprinted film, displays and liquid crystal displays |
| CN102472855A (en) * | 2009-07-01 | 2012-05-23 | 旭硝子株式会社 | Method for producing article having fine recessed and projected structure on surface, and method for producing wire grid polarizer |
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