CN104132712A - Method for pouring glue into capacitive water level sensor - Google Patents
Method for pouring glue into capacitive water level sensor Download PDFInfo
- Publication number
- CN104132712A CN104132712A CN201410339169.XA CN201410339169A CN104132712A CN 104132712 A CN104132712 A CN 104132712A CN 201410339169 A CN201410339169 A CN 201410339169A CN 104132712 A CN104132712 A CN 104132712A
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- China
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- circuit board
- level sensor
- water level
- soldering
- capacitive water
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- Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
Abstract
The invention discloses a method for pouring glue into a capacitive water level sensor. The method for pouring glue into the capacitive water level sensor comprises the following steps that S1, a circuit board installation cavity is formed in a spacer sleeve of the capacitive water level sensor; S2, a circuit board with a signal acquiring and conditioning circuit is placed in the circuit board installation cavity in the vertical direction; S3, a bonding pad P1 of the circuit board and a copper pad used for sensing original capacitance data are connected through soldering by means of a first high-temperature wire, a bonding pad P2 of the circuit board and a connector are connected through soldering by means of a second high-temperature wire, a bonding pad V+ of the circuit board and a power line of the capacitive water level sensor are connected through soldering, a bonding pad V- of the circuit board and a ground wire of the capacitive water level sensor are connected through soldering, and a bonding pad Vout of the circuit board and an output wire of the capacitive water level sensor are connected through soldering; S4, epoxy resin glue is poured into the circuit board installation cavity until the circuit board is just submerged in the epoxy resin glue. By means of the method for pouring glue into the capacitive water level sensor, the vibration resistance, the pressure resistance and the waterproof performance of the capacitive water level sensor can be improved, and the manufacturing cost of the circuit board is effectively reduced.
Description
Technical field
The present invention relates to a kind of glue-pouring method of capacitance water level sensor.
Background technology
Level sensor is a kind of sensor of measuring SEA LEVEL VARIATION situation, is mainly to utilize SEA LEVEL VARIATION to cause that the variation of capacitance between two electrodes measures water level.Level sensor, by signals collecting and modulate circuit, is converted into electric signal by capacitance, and output has water and the voltage signal when anhydrous.Level sensor is mainly used in various water tanks, as the water level monitoring of water-tower water tank, radiator, engineering machinery water tank, need to have higher freedom from vibration, crushing resistance and water proofing property.
At present, the circuit board of capacitance water level sensor is to be mainly fixed in spacer sleeve by screw, adopt rubber seal to carry out waterproof sealing, when this type of capacitance water level sensor is arranged in large-scale walking machine, owing to being subject to the impact of engine or machine-walking, can produce vibration, circuit board rocks with ambient vibration with the wire that is connected of electrode, the soldering place of circuit board may disconnect, and causes the unstable or non-output signal of output signal; And screw fixation method is easily loosening under long-term vibration, affects the normal use of product.
Meanwhile, water proofing property and the crushing resistance of capacitance water level sensor to product itself had relatively high expectations, and adopts rubber seal to carry out waterproof sealing, often do not reach IPX7(anti-water quality standard) protection against flooding grade, easily cause sensor internal immersion; Current capacitance water level sensor generally adopts the spacer sleeve of plastic material, glue is not filled in spacer sleeve inside, this type of spacer sleeve generally can only bear the hydraulic pressure that is less than 1Mpa, while use in the hydraulic pressure environment that is greater than 1Mpa, spacer sleeve may break, water may immerse capacitance water level sensor inside, once water immerses capacitance water level sensor inside, will cause product to use.
In addition, when circuit board is fixed in spacer sleeve by screw, circuit board is required to be mounting screw and reserves more space, makes effective usable floor area of circuit board less, has increased the cost of manufacture of circuit board.
Summary of the invention
Technical matters to be solved by this invention is, overcomes the deficiency of above-mentioned background technology, and a kind of glue-pouring method that strengthens product freedom from vibration, crushing resistance, water proofing property and reduce the capacitance water level sensor of cost of manufacture is provided.
The technical scheme that the present invention solves its technical matters employing is that a kind of glue-pouring method of capacitance water level sensor, comprises the following steps:
S1: circuit board installation cavity is set in the spacer sleeve of capacitance water level sensor;
S2: the circuit board that is loaded with signals collecting and modulate circuit is vertically put into circuit board installation cavity;
S3: the pad P1 of circuit board is connected with the first high temperature wire soldering with the copper packing of induction original capacitance data; The pad P2 of circuit board is connected with the second high temperature wire soldering with joint; The pad V+ of circuit board is connected with the power lead soldering of capacitance water level sensor; The pad V-of circuit board is connected with the ground wire soldering of capacitance water level sensor; The pad Vout of circuit board is connected with the output line soldering of capacitance water level sensor;
S4: pour into epoxide-resin glue in circuit board installation cavity, until just circuit board is all flooded.
Further, in step S4, described epoxide-resin glue, at 25 DEG C of temperature, soaks after 24 hours the number percent < 0.15% of its mass penalty.
Compared with prior art, advantage of the present invention is as follows:
(1) in circuit board installation cavity, be filled with epoxide-resin glue, epoxide-resin glue can be solidificated in circuit board in circuit board installation cavity, and the soldering place of circuit board can be solidified, avoid causing rocking of circuit board under vibration environment, the soldering place that prevents circuit board disconnects, cause the unstable or non-output signal of output signal, can strengthen freedom from vibration.
(2) circuit board installation cavity is set in spacer sleeve, in circuit board installation cavity, is filled with epoxide-resin glue, can strengthen the crushing resistance of spacer sleeve, the crushing resistance >=30Mpa of spacer sleeve can use in higher hydraulic pressure environment.
(3) epoxide-resin glue can enter in circuit board installation cavity by effectively anti-sealing, can strengthen water proofing property.
(4) by epoxide-resin glue, circuit board is solidificated in circuit board installation cavity, avoids using screw, effective usable floor area that can increasing circuit plate, thus effectively reduce the cost of manufacture of circuit board.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of the present invention.
In figure: 1-joint, 2-spacer sleeve, 3-copper packing, 4-circuit board, the 5-the first high temperature wire, the 6-the second high temperature wire, 7-power lead, 8-ground wire, 9-output line, 10-epoxide-resin glue.
Embodiment
Below in conjunction with drawings and the specific embodiments, the present invention is described in further detail.
With reference to Fig. 1, the present embodiment comprises the following steps:
S1: at the interior circuit board installation cavity that arranges of spacer sleeve 2 of capacitance water level sensor;
S2: the circuit board 4 that is loaded with signals collecting and modulate circuit is vertically put into circuit board installation cavity;
S3: the pad P1 of circuit board 4 is connected with copper packing 3 use first high temperature wire 5 solderings of induction original capacitance data; The pad P2 of circuit board 4 is connected with joint 1 use the second high temperature wire 6 solderings; The pad V+ of circuit board 4 is connected with power lead 7 solderings of capacitance water level sensor; The pad V-of circuit board 4 is connected with ground wire 8 solderings of capacitance water level sensor; The pad Vout of circuit board 4 is connected with output line 9 solderings of capacitance water level sensor;
S4: pour into epoxide-resin glue 10 in circuit board installation cavity, until just circuit board 4 is all flooded.
Described epoxide-resin glue 10 has good fire resistance characteristic, and water-intake rate is lower, and described epoxide-resin glue 10, at 25 DEG C of temperature, soaks after 24 hours the number percent < 0.15% of its mass penalty.
In the present invention, connecting portion, first higher temperature line 5 of circuit board 4 and circuit board 4 and the first high temperature wire 5 are all solidificated in circuit board installation cavity by epoxide-resin glue 10 with the connecting portion of three extension lines (being power lead 7, ground wire 8, output line 9) of connecting portion, circuit board and the capacitance water level sensor of joint 1 with connecting portion, second high temperature wire 6 of connecting portion, circuit board 4 and second high temperature wire 6 of copper packing 3, can effectively prevent from disconnecting because vibration causes connecting portion, and effective anti-sealing enters contact circuit plate 4 in circuit board installation cavity; Epoxide-resin glue 10 has higher hardness, tensile shear strength (steel～steel) >=12Mpa of epoxide-resin glue 10, epoxide-resin glue 10 and the spacer sleeve 2 of filling form an entirety, can increase the anti-pressure ability of spacer sleeve 2, the crushing resistance >=30Mpa of spacer sleeve 2.
Those skilled in the art can carry out various modifications and variations to the embodiment of the present invention, if these amendment and modification within the scope of the claims in the present invention and equivalent technologies thereof, these revise and modification also within protection scope of the present invention.
The prior art that the content of not describing in detail in instructions is known to the skilled person.
Claims (2)
1. a glue-pouring method for capacitance water level sensor, is characterized in that: comprise the following steps:
S1: in the spacer sleeve (2) of capacitance water level sensor, circuit board installation cavity is set;
S2: the circuit board (4) that is loaded with signals collecting and modulate circuit is vertically put into circuit board installation cavity;
S3: the pad P1 of circuit board (4) is connected with the first high temperature wire (5) soldering with the copper packing (3) of induction original capacitance data; The pad P2 of circuit board (4) is connected with the second high temperature wire (6) soldering with joint (1); The pad V+ of circuit board (4) is connected with power lead (7) soldering of capacitance water level sensor; The pad V-of circuit board (4) is connected with ground wire (8) soldering of capacitance water level sensor; The pad Vout of circuit board (4) is connected with output line (9) soldering of capacitance water level sensor;
S4: pour into epoxide-resin glue (10) in circuit board installation cavity, until just circuit board (4) is all flooded.
2. the glue-pouring method of capacitance water level sensor as claimed in claim 1, is characterized in that: in step S4, described epoxide-resin glue (10), at 25 DEG C of temperature, soaks after 24 hours the number percent < 0.15% of its mass penalty.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410339169.XA CN104132712A (en) | 2014-07-17 | 2014-07-17 | Method for pouring glue into capacitive water level sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410339169.XA CN104132712A (en) | 2014-07-17 | 2014-07-17 | Method for pouring glue into capacitive water level sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104132712A true CN104132712A (en) | 2014-11-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410339169.XA Pending CN104132712A (en) | 2014-07-17 | 2014-07-17 | Method for pouring glue into capacitive water level sensor |
Country Status (1)
| Country | Link |
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| CN (1) | CN104132712A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104588876A (en) * | 2014-12-02 | 2015-05-06 | 苏州长风航空电子有限公司 | Method for welding outgoing cable shielding layer of sensor with shell |
| CN109239164A (en) * | 2018-08-01 | 2019-01-18 | 南京艾伊科技有限公司 | A kind of fixture and encapsulation means of defence for electrochemical oxygen sensor encapsulation |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2191417Y (en) * | 1994-01-13 | 1995-03-08 | 陈义新 | Static levelmeter |
| CN2267454Y (en) * | 1996-03-26 | 1997-11-12 | 刘志强 | Liquid level indicating sensor |
| JP5158633B2 (en) * | 2008-01-25 | 2013-03-06 | 国立大学法人神戸大学 | Liquid hydrogen level sensor and liquid hydrogen level gauge |
| CN103471681A (en) * | 2013-09-29 | 2013-12-25 | 湖南宇航科技有限公司 | Capacitance type oil level sensor filling method |
| CN103630195A (en) * | 2013-11-14 | 2014-03-12 | 湖南宇航科技有限公司 | Capacitive water level sensor using metal gasket as inducting electrode |
-
2014
- 2014-07-17 CN CN201410339169.XA patent/CN104132712A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2191417Y (en) * | 1994-01-13 | 1995-03-08 | 陈义新 | Static levelmeter |
| CN2267454Y (en) * | 1996-03-26 | 1997-11-12 | 刘志强 | Liquid level indicating sensor |
| JP5158633B2 (en) * | 2008-01-25 | 2013-03-06 | 国立大学法人神戸大学 | Liquid hydrogen level sensor and liquid hydrogen level gauge |
| CN103471681A (en) * | 2013-09-29 | 2013-12-25 | 湖南宇航科技有限公司 | Capacitance type oil level sensor filling method |
| CN103630195A (en) * | 2013-11-14 | 2014-03-12 | 湖南宇航科技有限公司 | Capacitive water level sensor using metal gasket as inducting electrode |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104588876A (en) * | 2014-12-02 | 2015-05-06 | 苏州长风航空电子有限公司 | Method for welding outgoing cable shielding layer of sensor with shell |
| CN109239164A (en) * | 2018-08-01 | 2019-01-18 | 南京艾伊科技有限公司 | A kind of fixture and encapsulation means of defence for electrochemical oxygen sensor encapsulation |
| CN109239164B (en) * | 2018-08-01 | 2021-07-27 | 南京艾伊科技有限公司 | Tool for packaging electrochemical oxygen sensor and packaging protection method |
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Application publication date: 20141105 |
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| RJ01 | Rejection of invention patent application after publication |