CN104130736A - Encapsulating compound for thin-film capacitor - Google Patents
Encapsulating compound for thin-film capacitor Download PDFInfo
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- CN104130736A CN104130736A CN201410366519.1A CN201410366519A CN104130736A CN 104130736 A CN104130736 A CN 104130736A CN 201410366519 A CN201410366519 A CN 201410366519A CN 104130736 A CN104130736 A CN 104130736A
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Abstract
The invention discloses an encapsulating compound for a thin-film capacitor, and relates to the technical field of capacitor. The encapsulating compound comprises the following raw materials by weight: 60-70 parts of epoxy resin, 15-20 parts of silicone rubber, 5-10 parts of a ceramic particle additive, 3-5 parts of a curing agent, and 5-8 parts of a toughening agent. The encapsulating compound of the invention has low raw material cost and is convenient for use; due to the silicone rubber added in the raw material, the encapsulating compound has good insulation, waterproof and moistureproof performances; due to addition of ceramic particles additive, the encapsulating compound has good thermal performance, can effectively radiate the thermal heat generated by capacitor during working to the outside of the capacitor shell; and the added toughening agent can prevent fragmentation of solidified gum in the capacitor shell, which leads to the capacitor damage.
Description
Technical field
The present invention relates to capacitor technology field, be specifically related to a kind of film capacitor encapsulating compound.
Background technology
Electrical condenser is being complied with the difference of medium, its kind is a lot, for example: electrolyte capacitance, papery electric capacity, thin-film capacitor, ceramic condenser, mica capacitor, air electric capacity etc., but the most used in sound appliances, surely belong to electrolytic condenser and film capacitor, chemical capacitor is used in the place that needs electrical capacity very large mostly, the for example filter capacitor of primary source part, except filtering, and the double use of doing store electrical energy, thin-film capacitor is extensively used in the commissure of simulating signal, the places such as the bypass of power supply noise.
Chinese patent 201110352482.3 discloses a kind of two curing encapsulating compounds and preparation method thereof.Described two curing encapsulating compound comprises each raw material of following weight percent: epoxy resin 35%～60%, polyvalent alcohol 2%～20%, silane coupling agent 1%～20%, light trigger 0.1%～2%, thermal initiator 0.1%～2%, filler 30%～60%.The two curing encapsulating compound shrinking percentages of this invention are low, and water tolerance and cold-hot cyclicity are superior, effectively ensured the reliability of encapsulation components and parts; UV light, heat can fast setting, can locate fast, and can ensure again has good mechanical property by completion of cure; After solidifying, smell is little, has complied with the trend of environmental protection; Stability in storage is good, is applicable to the bonding encapsulation of electronic devices and components.Its weak point is, encapsulating compound thermal conductivity described in this invention is poor, it is external that the heat that metallized film in electrical condenser produces when by electric current cannot effectively give out capacitor protector, cause capacitor internal temperature to raise, easily damage the metallized film in electrical condenser, affect capacitor life-span.
Summary of the invention
For the problems referred to above, the invention provides a kind of film capacitor encapsulating compound, good heat conductivity, can effectively give out electric capacity internal heat.
In order to address the above problem, technical scheme provided by the invention is:
A kind of film capacitor encapsulating compound, is characterized in that: the raw material that comprises following weight part: 60～70 parts of epoxy resin, 15～20 parts, silicon rubber, 5～10 parts of ceramic particle additives, 3～5 parts, solidifying agent, 5～8 parts of toughner.
Preferably, described film capacitor encapsulating compound, is characterized in that: the raw material that comprises following weight part: 60～63 parts of epoxy resin, 15～18 parts, silicon rubber, 7～10 parts of ceramic particle additives, 3～4 parts, solidifying agent, 6～8 parts of toughner.
Preferably, described film capacitor encapsulating compound, is characterized in that: the raw material that comprises following weight part: 63～67 parts of epoxy resin, 15～18 parts, silicon rubber, 5～7 parts of ceramic particle additives, 3～4 parts, solidifying agent, 5～6 parts of toughner.
Preferably, described film capacitor encapsulating compound, is characterized in that: the raw material that comprises following weight part: 67～70 parts of epoxy resin, 18～20 parts, silicon rubber, 7～10 parts of ceramic particle additives, 4～5 parts, solidifying agent, 6～8 parts of toughner.
Preferably, described film capacitor encapsulating compound, is characterized in that: described ceramic particle additive is boron nitride, aluminum oxide, magnesian wherein a kind of.
Preferably, described film capacitor encapsulating compound, is characterized in that: described solidifying agent is the wherein one of polymeric amide, methyl tetrahydro phthalic anhydride, aliphatic cyclic amine.
Preferably, described film capacitor encapsulating compound, is characterized in that: described toughner is the wherein one of urethane, vinylbenzene, polybutylene terephthalate.
Compared with prior art, beneficial effect of the present invention is: raw materials cost of the present invention is low, easy to use, has added silicon rubber in raw material, there are good insulating property, waterproof and dampproof, add ceramic particle additive, heat conductivility is fine, it is external that the electric heating producing when can effectively electrical condenser be worked gives out capacitor protector, be added with toughner, can prevent that the colloid after solidifying is cracked in capacitor protector, and cause electrical condenser to damage.
Embodiment
In conjunction with embodiment, technical scheme of the present invention is further described in detail:
Embodiment mono-:
A kind of film capacitor encapsulating compound, comprises the raw material of following weight part: 60 parts of epoxy resin, 18 parts, silicon rubber, 7 parts, aluminum oxide, 4 parts of polymeric amide, 8 parts of urethane.
Method of preparation and use of the present invention is: first by weight various raw materials are weighed, after weighing up, put into press injector hopper, various raw materials are uniformly mixed in press injector, after mixing fully, press injector is injected into colloid in electrical condenser the metallized film in electrical condenser is enclosed in capacitor casing, after glue to be encapsulated solidifies completely, electrical condenser is connected to high frequency electric source, side capacitors temperature, in the time that capacitor case temperature reaches 95 DEG C, power-off is also cut electrical condenser, recording capacitor internal temperature is 95.3 DEG C, it is external that capacitor internal heat production is passed to capacitor protector.
Embodiment bis-:
A kind of film capacitor encapsulating compound, comprises the raw material of following weight part: 63 parts of epoxy resin, 15 parts, silicon rubber, 10 parts of boron nitride, 5 parts of polymeric amide, 8 parts of urethane.
Method of preparation and use of the present invention is: first by weight various raw materials are weighed, after weighing up, put into press injector hopper, various raw materials are uniformly mixed in press injector, after mixing fully, press injector is injected into colloid in electrical condenser the metallized film in electrical condenser is enclosed in capacitor casing, after glue to be encapsulated solidifies completely, electrical condenser is connected to high frequency electric source, side capacitors temperature, in the time that capacitor case temperature reaches 100 DEG C, power-off is also cut electrical condenser, recording capacitor internal temperature is 100.5 DEG C, it is external that capacitor internal heat production is passed to capacitor protector.
Embodiment tri-:
A kind of film capacitor encapsulating compound, comprises the raw material of following weight part: 67 parts of epoxy resin, 18 parts, silicon rubber, 7 parts, aluminum oxide, 4 parts of methyl tetrahydro phthalic anhydrides, 6 parts of vinylbenzene.
Method of preparation and use of the present invention is: first by weight various raw materials are weighed, after weighing up, put into press injector hopper, various raw materials are uniformly mixed in press injector, after mixing fully, press injector is injected into colloid in electrical condenser the metallized film in electrical condenser is enclosed in capacitor casing, after glue to be encapsulated solidifies completely, electrical condenser is connected to high frequency electric source, side capacitors temperature, in the time that capacitor case temperature reaches 120 DEG C, power-off is also cut electrical condenser, recording capacitor internal temperature is 122 DEG C, it is external that capacitor internal heat production is passed to capacitor protector.
Embodiment tetra-:
A kind of film capacitor encapsulating compound, comprises the raw material of following weight part: 70 parts of epoxy resin, 20 parts, silicon rubber, 5 parts, magnesium oxide, 3 parts of aliphatic cyclic amines, 5 parts of polybutylene terephthalates.
Method of preparation and use of the present invention is: first by weight various raw materials are weighed, after weighing up, put into press injector hopper, various raw materials are uniformly mixed in press injector, after mixing fully, press injector is injected into colloid in electrical condenser the metallized film in electrical condenser is enclosed in capacitor casing, after glue to be encapsulated solidifies completely, electrical condenser is connected to high frequency electric source, side capacitors temperature, in the time that capacitor case temperature reaches 150 DEG C, power-off is also cut electrical condenser, recording capacitor internal temperature is 154 DEG C, it is external that capacitor internal heat production is passed to capacitor protector.
More than show and described ultimate principle of the present invention, principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; that in above-described embodiment and specification sheets, describes just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (7)
1. a film capacitor encapsulating compound, is characterized in that: the raw material that comprises following weight part: 60～70 parts of epoxy resin, 15～20 parts, silicon rubber, 5～10 parts of ceramic particle additives, 3～5 parts, solidifying agent, 5～8 parts of toughner.
2. film capacitor encapsulating compound according to claim 1, is characterized in that: the raw material that comprises following weight part: 60～63 parts of epoxy resin, 15～18 parts, silicon rubber, 7～10 parts of ceramic particle additives, 3～4 parts, solidifying agent, 6～8 parts of toughner.
3. film capacitor encapsulating compound according to claim 1, is characterized in that: the raw material that comprises following weight part: 63～67 parts of epoxy resin, 15～18 parts, silicon rubber, 5～7 parts of ceramic particle additives, 3～4 parts, solidifying agent, 5～6 parts of toughner.
4. film capacitor encapsulating compound according to claim 1, is characterized in that: the raw material that comprises following weight part: 67～70 parts of epoxy resin, 18～20 parts, silicon rubber, 7～10 parts of ceramic particle additives, 4～5 parts, solidifying agent, 6～8 parts of toughner.
5. film capacitor encapsulating compound according to claim 1, is characterized in that: described ceramic particle additive is boron nitride, aluminum oxide, magnesian wherein a kind of.
6. film capacitor encapsulating compound according to claim 1, is characterized in that: described solidifying agent is the wherein one of polymeric amide, methyl tetrahydro phthalic anhydride, aliphatic cyclic amine.
7. film capacitor encapsulating compound according to claim 1, is characterized in that: described toughner is the wherein one of urethane, vinylbenzene, polybutylene terephthalate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410366519.1A CN104130736A (en) | 2014-07-28 | 2014-07-28 | Encapsulating compound for thin-film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410366519.1A CN104130736A (en) | 2014-07-28 | 2014-07-28 | Encapsulating compound for thin-film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104130736A true CN104130736A (en) | 2014-11-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410366519.1A Withdrawn CN104130736A (en) | 2014-07-28 | 2014-07-28 | Encapsulating compound for thin-film capacitor |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104559136A (en) * | 2014-12-03 | 2015-04-29 | 华南理工大学 | Alumina/polyurethane/epoxy resin heat-conducting composite material and preparation method thereof |
| CN105349075A (en) * | 2015-11-30 | 2016-02-24 | 淮安盛宇电子有限公司 | Encapsulating compound for thin-film capacitor |
| CN106047249A (en) * | 2016-06-08 | 2016-10-26 | 蚌埠高华电子股份有限公司 | Composite nano-magnesia filling modified composite epoxy pouring sealant for LED displays |
| CN106047251A (en) * | 2016-06-03 | 2016-10-26 | 安徽福源光电科技有限公司 | Boron nitride nanotube modified composite epoxy pouring sealant for LED display screen |
| CN106847509A (en) * | 2016-12-13 | 2017-06-13 | 厦门法拉电子股份有限公司 | A kind of polypropylene film capacitor installed for surface |
| CN106867386A (en) * | 2017-03-28 | 2017-06-20 | 朱正和 | A kind of high adhesion force capacitor aluminum housing coating paint and preparation method thereof |
-
2014
- 2014-07-28 CN CN201410366519.1A patent/CN104130736A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104559136A (en) * | 2014-12-03 | 2015-04-29 | 华南理工大学 | Alumina/polyurethane/epoxy resin heat-conducting composite material and preparation method thereof |
| CN104559136B (en) * | 2014-12-03 | 2017-12-26 | 华南理工大学 | Aluminum oxide/polyurethane/epoxy resin heat-conductive composite material and preparation method thereof |
| CN105349075A (en) * | 2015-11-30 | 2016-02-24 | 淮安盛宇电子有限公司 | Encapsulating compound for thin-film capacitor |
| CN106047251A (en) * | 2016-06-03 | 2016-10-26 | 安徽福源光电科技有限公司 | Boron nitride nanotube modified composite epoxy pouring sealant for LED display screen |
| CN106047249A (en) * | 2016-06-08 | 2016-10-26 | 蚌埠高华电子股份有限公司 | Composite nano-magnesia filling modified composite epoxy pouring sealant for LED displays |
| CN106847509A (en) * | 2016-12-13 | 2017-06-13 | 厦门法拉电子股份有限公司 | A kind of polypropylene film capacitor installed for surface |
| CN106867386A (en) * | 2017-03-28 | 2017-06-20 | 朱正和 | A kind of high adhesion force capacitor aluminum housing coating paint and preparation method thereof |
| CN106867386B (en) * | 2017-03-28 | 2019-09-06 | 朱正和 | A kind of high adhesion force capacitor aluminum housing coating paint and preparation method thereof |
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| C04 | Withdrawal of patent application after publication (patent law 2001) | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20141105 |