CN104130734B - Low temperature bonding agent in a kind of mixed type - Google Patents
Low temperature bonding agent in a kind of mixed type Download PDFInfo
- Publication number
- CN104130734B CN104130734B CN201410256421.0A CN201410256421A CN104130734B CN 104130734 B CN104130734 B CN 104130734B CN 201410256421 A CN201410256421 A CN 201410256421A CN 104130734 B CN104130734 B CN 104130734B
- Authority
- CN
- China
- Prior art keywords
- low temperature
- bonding agent
- mixed type
- temperature bonding
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Organic Insulating Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to low temperature bonding agent in a kind of mixed type, its component includes E-44 epoxy resin, triethylene tetramine, acetone, silicon powder and silane coupler KH560, in the mixed type of the present invention, low temperature bonding agent enhances the mechanical performance of lamination insulating part under the premise ensureing lamination insulating part electric property, and insulating board both can have been made to have good adhesive property, the hardening time of binding agent can be controlled again, meet the use needs of different user。
Description
Technical field
The present invention relates to low temperature bonding agent in one, mainly low temperature bonding agent in the mixed type of a kind of bonding pressing insulating products for 500kV electric pressure layer above。
Background technology
The insulating part of high-tension transformer, such as: pressing plate, wire folder etc., in process of production, multilayer insulation cardboard just can be made through operations such as bonding, laminations, in prior art, the binding agent used is Electrician casein glue, the electrical insulation properties of Electrician casein glue is fine, but mechanical performance performance is general, therefore, bond effect is not satisfactory, so needing to develop a kind of novel binding agent to solve this problem。
Summary of the invention
Present invention aims to the existing Electrician casein glue mechanical performance described in background technology relatively low, the situation that bond effect is undesirable, it is provided that low temperature bonding agent in a kind of novel mixed type of one that can solve the problem that this problem。
(in mixed type low temperature bonding agent) scheme of the present invention is as follows:
Low temperature bonding agent in a kind of mixed type, its component and quality proportioning are as follows:
The optimum ratio scheme of such scheme is as follows:
The content of triethylene tetramine is 1.2-1.4 part。
The content of silane coupler KH560 is 0.12-0.16 part。
The content of acetone is 1.5-1.8 part。
In the mixed type of the present invention, the advantage of low temperature bonding agent is in that: 1) has selected E-44 epoxy resin as primary raw material, has enhanced the mechanical performance of lamination insulating part under the premise ensureing lamination insulating part electric property；2) selection of component, it is ensured that the insulating properties of insulating part, it is possible to be applied to 500kV electric pressure layer above pressure insulating products；3) component rational proportion, both can make insulating board have good adhesive property, and can control again the hardening time of binding agent, meet user and use needs。
Accompanying drawing explanation
Fig. 1 is the comparison diagram of the polyester resin binder of the present invention and the mechanical performance of other three kinds of main flow bonding agents and electric property。
Detailed description of the invention
Low temperature bonding agent in a kind of mixed type, its component and quality proportioning are as follows:
The optimum ratio scheme of such scheme is as follows:
The content of triethylene tetramine is 1.2-1.4 part。
The content of silane coupler KH560 is 0.12-0.16 part。
The content of acetone is 1.5-1.8 part。
Several specific embodiment is set forth below the solution of the present invention is further described:
Embodiment 1
Low temperature bonding agent in a kind of mixed type, its component and quality proportioning are as follows:
Embodiment 2
Low temperature bonding agent in a kind of mixed type, its component and quality proportioning are as follows:
Embodiment 3
Low temperature bonding agent in a kind of mixed type, its component and quality proportioning are as follows:
In the mixed type of the present invention, the preparation method of low temperature bonding agent is as follows: by E-44 epoxy resin, acetone, silicon powder, silane coupler KH560 mixing and stirring, prepare mixture 1, in use, triethylene tetramine is joined in mixture 1, be uniformly mixed, react two minutes, preparing low temperature bonding agent in mixed type, can directly use, this binding agent must exhaust in 40 minutes, otherwise will directly solidify, cause the waste of glue。
According to temperature condition, in summer, the consumption of triethylene tetramine slightly lacks, and the consumption of triethylene tetramine is slightly more in the winter time。When using in the winter time, mixture 1 to be heated to 20 DEG C to 30 DEG C, add triethylene tetramine。In the mixed type of the present invention, low temperature bonding agent can adopt when producing lamination insulating part and cold pressing or the mode of middle low temperature and pressure。
It is the contrast block diagram of the electric property of the binding agent of polyester resin binder and several main flows of the present invention and mechanical performance as shown in Figure 1, first square frame represents the electric property of binding agent, second square frame represents the mechanical performance of binding agent, from block diagram, can be seen that, the combination property of the polyester resin binder of the present invention is better than casein binding agent, and its electric property is slightly below casein binding agent, but mechanical performance is but far above casein binding agent。The polyester resin binder of the present invention is compared with phenolic resin and two-sided sized paper, and the electric property of polyester resin binder and mechanical performance are all far above phenolic resin and two-sided sized paper。
Polyester resin binder is on stream, the solidification situation of binding agent and the laminated paper board of making performance in mechanical strength are always up emphasis and the difficult point of research, through the time more than 2 years to the constantly adjustment of the formula of binding agent, optimization, the mechanical strength of the laminated paper board that polyester resin makes improves nearly 80%。
Above example is the explanation to the specific embodiment of the present invention; but not limitation of the present invention; person skilled in the relevant technique is without departing from the spirit and scope of the present invention; can also making various conversion and change and obtain corresponding equivalent technical scheme, therefore all equivalent technical schemes all should be included into the scope of patent protection of the present invention。
Claims (4)
1. low temperature bonding agent in a mixed type, it is characterised in that: its component and quality proportioning are as follows:
2. low temperature bonding agent in a kind of mixed type according to claim 1, it is characterised in that: the content of triethylene tetramine is 1.2-1.4 part。
3. low temperature bonding agent in a kind of mixed type according to claim 1, it is characterised in that: the content of silane coupler KH560 is 0.12-0.16 part。
4. low temperature bonding agent in a kind of mixed type according to claim 1, it is characterised in that: the content of acetone is 1.5-1.8 part。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410256421.0A CN104130734B (en) | 2014-07-21 | 2014-07-21 | Low temperature bonding agent in a kind of mixed type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410256421.0A CN104130734B (en) | 2014-07-21 | 2014-07-21 | Low temperature bonding agent in a kind of mixed type |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104130734A CN104130734A (en) | 2014-11-05 |
| CN104130734B true CN104130734B (en) | 2016-06-22 |
Family
ID=51803597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410256421.0A Active CN104130734B (en) | 2014-07-21 | 2014-07-21 | Low temperature bonding agent in a kind of mixed type |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104130734B (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101608106B (en) * | 2009-07-23 | 2012-06-27 | 中国西电电气股份有限公司 | Room-temperature curing adhesive for insulator sleeve adhesion |
| CN103131364A (en) * | 2011-11-30 | 2013-06-05 | 常熟市辛庄镇前进五金厂 | Preparation method of single component room temperature curing epoxy construction glue |
| CN103709984B (en) * | 2013-12-31 | 2015-05-27 | 中材金晶玻纤有限公司 | In-situ thread adhesive for fiber reinforced plastic pipeline |
-
2014
- 2014-07-21 CN CN201410256421.0A patent/CN104130734B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104130734A (en) | 2014-11-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106221666A (en) | A kind of high heat conduction, high-adhesive-strength organosilicon casting glue and preparation method thereof and the method for its encapsulated motor end | |
| CN102925080A (en) | Book thermoplastic binding hot melt glue used at low temperature and preparation method thereof | |
| CN107266861A (en) | Epoxy resin functional graphene integration filtering IC and preparation method thereof | |
| CN106626626A (en) | High thermal conduction film reinforcement mica tape, preparation method thereof and application | |
| CN104017519A (en) | Binding agent for plywood and preparation method thereof | |
| CN107227133A (en) | A kind of High-Voltage Electrical Appliances Heat Conductive Insulation Adhesive and preparation method thereof | |
| CN102850988A (en) | Epoxy resin pouring sealant and usage method | |
| CN105374543B (en) | A kind of preparation method of Agglutinate neodymium-iron-boron ferrite permanent magnet | |
| CN102169744B (en) | Laminated magnetic conducting plate and manufacturing method thereof | |
| CN103409115A (en) | Enhanced heat conducting interface material and preparation method thereof | |
| CN107189103A (en) | A kind of conductive filler, preparation method and the usage | |
| CN104130734B (en) | Low temperature bonding agent in a kind of mixed type | |
| CN104312529B (en) | Organic silicon heat conduction electronic filling adhesive and preparation method thereof | |
| CN103131373B (en) | Composite adhesive for single-sided film reinforced little glue mica tape and preparation method thereof | |
| CN207699509U (en) | A kind of composite heat-conducting insulated rubber film | |
| CN102969097A (en) | Manufacturing method of mica plate | |
| CN105131880A (en) | LED die attach adhesive as well as preparation method and application thereof | |
| CN114687246B (en) | Epoxy-based silicone resin sizing agent, mica plate and preparation method and application thereof | |
| CN102290901A (en) | Composite slot wedge used for motor rotor and manufacturing method thereof | |
| CN105062390A (en) | Preparation method of adhesive for metal material packaging | |
| CN103881310A (en) | Halogen-free environment-friendly epoxy resin envelope material for thermistors and application thereof | |
| CN106938566B (en) | A kind of nanometer of expoxy glass dry mica paper tape and preparation method thereof | |
| CN107116886B (en) | A kind of preparation method of that resist warping printed wiring board cover film | |
| CN105722254A (en) | Photo-curable resistance paste for flexible electrothermal film and preparation method of photo-curable resistance paste | |
| CN105585817A (en) | Modified bismaleimide resin, a preparing method thereof and a cured substance of the modified bismaleimide resin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |