CN104125745A - Protection device - Google Patents
Protection device Download PDFInfo
- Publication number
- CN104125745A CN104125745A CN201310144475.3A CN201310144475A CN104125745A CN 104125745 A CN104125745 A CN 104125745A CN 201310144475 A CN201310144475 A CN 201310144475A CN 104125745 A CN104125745 A CN 104125745A
- Authority
- CN
- China
- Prior art keywords
- substrate
- protective device
- radiator
- hard carbon
- carbon rete
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a protection device that is used for protecting an electronic element installed at a circuit board. The protection device comprises a substrate arranged on the electronic element and a hard carbon film layer covering the outer surface of the substrate; and the substrate is made of an anti-electromagnetic interference material. Compared with the prior art, the provided protection device has the following beneficial effects: because the hard carbon film layer covers the outer surfaces of the substrate made of the anti-electromagnetic interference material, the device not only has the excellent anti-electromagnetic interference performance but also can take advantage of the good performances of heat conduction and thermal radiation of the hard carbon film layer, so that the electronic element can be well protected.
Description
Technical field
The present invention relates to a kind of protective device for electronic component.
Background technology
Along with the fast development of electronics and information industry, the electronic component disposal abilities such as central processing unit (CPU) constantly promote, and cause the heat of its generation to increase thereupon.Nowadays, heat dissipation problem has become a key factor that affects computer run performance, also becomes the bottleneck of high speed processor practical application.Industry mainly adopts the protective device being comprised of substrate, heat pipe, radiator and fan at present; be installed on central processing unit (CPU); make substrate be in contact with it to absorb the heat that it produces, then by heat pipe, transmit heat and finally shed to radiator.
Described substrate adopts the material that heat conductivility is good to make conventionally.Yet, for actual needs, sometimes the electronic component for fear of high-frequency circuit produces electromagnetic interference (Electro Magnetic Interference) phenomenon at work, can adopt the material with better anti-EMI performance, the heat conductivility of these materials is relatively poor, can affect the heat radiation of electronic component, and then cause shorten its useful life.
Summary of the invention
In view of this, be necessary to provide a kind of protective device with better cooling efficiency.
A kind of protective device; for the electronic component being installed on circuit board is protected; described protective device comprises the hard carbon rete on the outer surface that is arranged at the substrate on described electronic component and is covered in substrate, and described substrate is made by anti-electromagnetic interference material.
Compared with prior art; this protective device of the present invention is coated with hard carbon rete by the outer surface of the substrate made at anti-electromagnetic interference material; not only can possess good anti-emi characteristics; can use thermal conductivity and the thermal radiation that hard carbon rete is good, thereby realize, protect preferably electronic component simultaneously.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Accompanying drawing explanation
Fig. 1 is the protective device of one embodiment of the invention and the three-dimensional combination figure of circuit board and electronic component.
Fig. 2 is the inverted three-dimensional combination figure of the element shown in Fig. 1, wherein for clear, shows, described circuit board is removed.
Fig. 3 is the three-dimensional exploded view of the protective device shown in Fig. 1.
Fig. 4 is that protective device in Fig. 2 is along the generalized section of IV-IV line.
Main element symbol description
| Circuit board | 100 |
| Electronic component | 200 |
| Radiator | 10 |
| Radiating fin | 12 |
| Storage tank | 120 |
| Centrifugal fan | 20 |
| Wind scooper | 22 |
| Top cover | 220 |
| Bottom | 222 |
| Sidewall | 224 |
| Impeller | 24 |
| Heat pipe | 30 |
| Evaporation section | 32 |
| Condensation segment | 34 |
| Linkage section | 36 |
| Substrate | 40 |
| Hard carbon rete | 41 |
| Connector | 42 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1 to Fig. 3, protective device of the present invention is for protecting the electronic component 200 being installed on circuit board 100.This protective device specifically can be electromagnetic interference protective case or heat abstractor etc., and in the present embodiment, this protective device is specially a heat abstractor.The centrifugal fan 20 that this protective device comprises a radiator 10, be positioned at these radiator 10 1 sides in order to this radiator 10, provide forced draft, with described radiator 10 lead a hot linked heat pipe 30, with a substrate 40 of the free end phase operative connection of this heat pipe 30.
Above-mentioned radiator 10 comprises some radiating fins that mutually combine 12.These radiating fins 12 are parallel to each other and vertically arrange.Between every adjacent two radiating fins 12, form a gas channel (not indicating).These radiating fins 12 cave inward and form a breach (not indicating) respectively at the middle part towards described centrifugal fan 20 1 sides, and these breach are connected to form a bar shaped storage tank 120 that laterally runs through described radiator 10, use for described heat pipe 30 and wear wherein.
Above-mentioned centrifugal fan 20 comprises the hollow wind-guiding cover 22 combining with described radiator 10 and is installed in an impeller 24 of these wind scooper 22 inside.Described wind scooper 22 comprises a top cover 220, parallels a bottom 222 of setting and an annular sidewall 224 that is extended upward and be connected with described top cover 220 by these bottom 222 outer peripheral edges with this top cover 220.Described top cover 220 middle parts are formed with a circular air inlet (not indicating).This top cover 220, bottom 222 and sidewall 224 surround an accommodation space (not indicating) jointly.Described impeller 24 is contained in this accommodation space and is connected with described air inlet.One side of described wind scooper 22 forms a bar shaped air outlet (not indicating).Some gas channels of this air outlet and described radiator 10 face, so that the forced draft that described impeller 24 produces is positive through this radiator 10 after air outlet.
Above-mentioned heat pipe 30 is roughly flat, the linkage section 36 that it comprises the condensation segment 34 that a straight evaporation section 32, is straight and connects this evaporation section 32 and a bending of condensation segment 34.This linkage section 36 and evaporation section 32, condensation segment 34 are in same level.End face and the bottom surface of described heat pipe 30 are plane, are convenient to it and match with other elements.Evaporation section 32 correspondences of this heat pipe 30 adhere on described substrate 40, and condensation segment 34 correspondences of this heat pipe 30 are placed through in the storage tank 120 of described radiator 10.
Please refer to Fig. 4, aforesaid substrate 40 is a rectangle plate body.This substrate 40 is made by anti-electromagnetic interference material (EMI), as tinplate, conducting foam, conductive rubber, beryllium copper reed, flexible transparent conducting film, woven wire etc.In the present embodiment, this substrate 40 is made by tinplate.Tinplate is nonmagnetic substance, and it has good anti-EMI (Electro Magnetic Interference) performance.On the outer surface of this substrate 40, be further coated with a hard carbon rete 41.Described hard carbon rete 41 can be diamond film and class diamond film.The thickness of this hard carbon rete 41 is not less than 0.1 μ m.This hard carbon rete 41 has higher hardness, preferably electrical insulating property and high thermal conductivity.This hard carbon rete 41 can be formed on the outer surface of substrate 40 by methods such as evaporation, plasma enhanced chemical vapor deposition method or non-balance magnetically controlled sputters.In the present embodiment, described hard carbon rete 41 covers on the whole outer surface of substrate 40 equably.Understandably, described hard carbon rete 41 also can optionally cover on the part outer surface of substrate 40.The relative both sides of described substrate 40 are equipped with respectively a lengthwise connector 42, in order to this substrate 40 is fixed on circuit board 100.Described heat pipe 30 can be by welding or adding the modes such as buckling element and substrate 40 is fixedly linked.
Please again consult Fig. 1 to Fig. 4, while assembling protective device of the present invention, described centrifugal fan 20 is installed on a side of radiator 10, to it, provides forced draft.Evaporation section 32 thermal conductivity of described heat pipe 30 fit on described substrate 40.The condensation segment 34 of this heat pipe 30 is placed through in the storage tank 120 of radiator 10, is combined with described radiating fin 12 thermal conductivity.Described substrate 40 fits on electronic component 200.
During protective device work of the present invention, described heat pipe 30 thermal conductivity are connected between radiator 10 and described substrate 40.This protective device is coated with hard carbon rete 41 by the outer surface of the substrate 40 made at anti-electromagnetic interference material; not only can possess good anti-EMI characteristic; can use thermal conductivity and the thermal radiation that hard carbon rete 41 is good, thereby realize, protect preferably electronic component 200 simultaneously.
In addition, protective device of the present invention according to actual needs, also can only include the hard carbon rete 41 on the outer surface that is arranged at the substrate 40 on described electronic component 200 and is covered in substrate 40.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (10)
1. a protective device; for the electronic component being installed on circuit board is protected; it is characterized in that: described protective device comprises the hard carbon rete on the outer surface that is arranged at the substrate on described electronic component and is covered in substrate, described substrate is made by anti-electromagnetic interference material.
2. protective device as claimed in claim 1, is characterized in that: described hard carbon rete is diamond film or class diamond film.
3. protective device as claimed in claim 1, is characterized in that: the thickness of described hard carbon rete is more than or equal to 0.1 μ m.
4. protective device as claimed in claim 1, is characterized in that: described hard carbon rete is formed on the outer surface of substrate by evaporation, plasma enhanced chemical vapor deposition method or non-balance magnetically controlled sputter method.
5. protective device as claimed in claim 1, is characterized in that: described hard carbon rete covers on the whole outer surface of substrate equably.
6. protective device as claimed in claim 1, is characterized in that: described protective device also comprises the radiator being connected with substrate thermal conductivity, and this radiator comprises some radiating fins that mutually combine.
7. protective device as claimed in claim 6; it is characterized in that: described protective device also comprises that heat conduction connects the heat pipe of described substrate and radiator, described heat pipe comprises the evaporation section connected with substrate, the condensation segment connected with radiator and is connected the linkage section of this evaporation section and condensation segment.
8. protective device as claimed in claim 6; it is characterized in that: a side of described radiator is provided with fan; this fan comprises the hollow wind-guiding cover combining with described radiator and is installed in an impeller of this wind scooper inside; one side of described wind scooper forms air port, and this air outlet and described radiator face.
9. protective device as claimed in claim 1, is characterized in that: described substrate is made by tinplate.
10. protective device as claimed in claim 1, is characterized in that: the relative both sides of described substrate are equipped with respectively connector, in order to substrate is fixed on circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310144475.3A CN104125745A (en) | 2013-04-24 | 2013-04-24 | Protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310144475.3A CN104125745A (en) | 2013-04-24 | 2013-04-24 | Protection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104125745A true CN104125745A (en) | 2014-10-29 |
Family
ID=51770961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310144475.3A Pending CN104125745A (en) | 2013-04-24 | 2013-04-24 | Protection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104125745A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US49493A (en) * | 1865-08-22 | Improvement in spittoons | ||
| US4938279A (en) * | 1988-02-05 | 1990-07-03 | Hughes Aircraft Company | Flexible membrane heat sink |
| CN2772190Y (en) * | 2004-12-29 | 2006-04-12 | 葉春海 | Heat conduction structure for increasing radiation and heat conduction effect |
| CN1941347A (en) * | 2005-09-29 | 2007-04-04 | 中国砂轮企业股份有限公司 | High-heat conductive efficency circuit board |
| CN101207995A (en) * | 2006-12-20 | 2008-06-25 | 富准精密工业(深圳)有限公司 | Heat radiation model set and electronic device adopting the same |
| CN101877958A (en) * | 2009-04-28 | 2010-11-03 | 英业达股份有限公司 | Electronic device having electromagnetic shielding and heat radiation and assembling method thereof |
-
2013
- 2013-04-24 CN CN201310144475.3A patent/CN104125745A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US49493A (en) * | 1865-08-22 | Improvement in spittoons | ||
| US4938279A (en) * | 1988-02-05 | 1990-07-03 | Hughes Aircraft Company | Flexible membrane heat sink |
| CN2772190Y (en) * | 2004-12-29 | 2006-04-12 | 葉春海 | Heat conduction structure for increasing radiation and heat conduction effect |
| CN1941347A (en) * | 2005-09-29 | 2007-04-04 | 中国砂轮企业股份有限公司 | High-heat conductive efficency circuit board |
| CN101207995A (en) * | 2006-12-20 | 2008-06-25 | 富准精密工业(深圳)有限公司 | Heat radiation model set and electronic device adopting the same |
| US20080151500A1 (en) * | 2006-12-20 | 2008-06-26 | Foxconn Technology Co., Ltd. | Thermal module and electronic assembly incorporating the same |
| CN101877958A (en) * | 2009-04-28 | 2010-11-03 | 英业达股份有限公司 | Electronic device having electromagnetic shielding and heat radiation and assembling method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201336790Y (en) | Radiating device | |
| US20140362525A1 (en) | Low-noise computer heat dissipation device | |
| US9646935B1 (en) | Heat sink of a metallic shielding structure | |
| US20160266622A1 (en) | Mobile Terminal Heat Dissipation Apparatus and Shielding Cover Frame | |
| CN104426244B (en) | Wireless charging device | |
| CN203788636U (en) | Shielding case | |
| CN204392739U (en) | Radiator structure and use the image transmission of this radiator structure | |
| US20140247559A1 (en) | Heat dissipation structure of electronic shield cover | |
| CN104981134A (en) | Electronic device | |
| CN104375572A (en) | Central processing unit casing | |
| CN204733519U (en) | A kind of electronic installation | |
| US20170034901A1 (en) | Heat dissipation structure | |
| CN104125745A (en) | Protection device | |
| CN209488908U (en) | A kind of double-sided wiring board with waterproof cooling function | |
| KR20100131835A (en) | Radiant heat led board | |
| WO2016131296A1 (en) | Thermal conductor and electronic terminal | |
| CN108633213B (en) | Electronic device | |
| CN107318236B (en) | portable electronic product and heat dissipation type shell structure for same | |
| CN102802347B (en) | Directed conductivity printed circuit board (PCB) and electronic equipment | |
| CN209768096U (en) | Heat dissipation structure and electronic device | |
| TW201441797A (en) | Protective device | |
| US9414528B2 (en) | Thermal spreading for an externally pluggable electronic module | |
| CN201000887Y (en) | Rectifier diode naked crystal structure on radiation fin | |
| JP2007207800A (en) | Heat dissipating member using graphite sheet and electronic apparatus | |
| CN204104210U (en) | A kind of pcb board with radiator structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141029 |
|
| WD01 | Invention patent application deemed withdrawn after publication |