CN104112796A - 照明用发光二极管封装体的制造方法 - Google Patents

照明用发光二极管封装体的制造方法 Download PDF

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CN104112796A
CN104112796A CN201310139878.9A CN201310139878A CN104112796A CN 104112796 A CN104112796 A CN 104112796A CN 201310139878 A CN201310139878 A CN 201310139878A CN 104112796 A CN104112796 A CN 104112796A
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张忠民
张简千琳
胡雪凤
吴雅婷
杨政华
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Priority to CN201310139878.9A priority Critical patent/CN104112796A/zh
Priority to TW102125309A priority patent/TW201503420A/zh
Priority to JP2014087060A priority patent/JP2014216649A/ja
Publication of CN104112796A publication Critical patent/CN104112796A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Abstract

一种照明用发光二极管模组的制造方法，包括如下步骤：提供背光用的发光二极管封装体；提供红光光源及绿光光源，并使所述红光光源与绿光光源发出的光与所述背光用的发光二极管封装体发出的光线进行混合，从而得到演色性提高的照明用发光二极管封装体；其中所述红光光源在CIE1931色坐标的X轴方向上的坐标值大于0.5，在Y轴方向上的坐标值大于0.2。本发明中，因红光光源的添加，并且红光光源在CIE1931色坐标上的X轴方向上的坐标值大于0.5，在Y轴方向上的坐标值大于0.2，所以照明用发光二极管封装体的演色性能相较背光用发光二极管封装得以提升。

Description

照明用发光二极管封装体的制造方法
技术领域
本发明涉及一种半导体元件的制造方法，特别涉及一种照明用发光二极管封装体的制造方法。
背景技术
传统的背光模组包括导光板及固定在导光板上的发冷白光的发光二极管封装体。由于背光模组的特性，该种背光用的发光二极管封装体通常具有低的演色性及高的色温，因此，背光用的发光二极管封装体不能用于具有高演色性的通常照明产品上。因此，如何将背光用的发光二极管封装体加以改进来满足通用照明的要求成为业界亟待解决的一个技术难题。
发明内容
有鉴于此，有必要提供一种将背光用的发光二极管封装体制成通用照明用的发光二极管封装体的方法。
一种照明用发光二极管模组的制造方法，包括如下步骤：
提供背光用的发光二极管封装体；
提供红光光源及绿光光源，并使所述红光光源与绿光光源发出的光与所述背光用的发光二极管封装体发出的光线进行混合，从而得到演色性提高的照明用发光二极管封装体；
其中所述红光光源在CIE 1931色坐标的X 轴方向上的坐标值大于0.5，在Y轴方向上的坐标值大于0.2。
本发明中，因红光光源的添加，并且红光光源在CIE 1931色坐标上的X 轴方向上的坐标值大于0.5，在Y轴方向上的坐标值大于0.2，所以照明用发光二极管封装体的演色性能相较背光用发光二极管封装得以提升。
附图说明
无。
具体实施方式
本发明的照明用发光二极管封装体的制造方法包括如下步骤：
提供一发冷白光、具有低演色性、高色温的背光用的发光二极管封装体。此背光用的发光二极管封装体的平均演色性评价数（Ra）为70，其在CIE 1931色坐标的X 轴及Y轴方向上的坐标值皆大于0.2。
提供一红光光源及一绿光光源，并使所述红光光源与绿光光源发出的光与所述背光用的发光二极管封装体发出的光线进行混合，从而得到发暖白光并具有高演色性的照明用发光二极管封装体。
所述红光光源在CIE 1931色坐标的X 轴方向上的坐标值大于0.5，在Y轴方向上的坐标值大于0.2。所述绿光光源的在CIE 1931色坐标的Y轴方向上的坐标值大于0.6。可以理解的，所述红光光源及绿光光源可分别为单色红光发光二极管及单色绿光发光二极管，亦或所述红光光源及绿光光源可分别由背光用的发光二极管封装体搭载红色荧光粉及绿色荧光粉的方式获得。具体的，分别将红色荧光粉及绿色荧光粉与相应的透明胶体混合，然后通过点胶的方式，将这些红色荧光粉剂绿色荧光粉与胶体的混合物点在背光用发光二级管封装体上。
本发明中，因特定红光光源的添加，照明用发光二极管封装体的演色性能相较背光用发光二极管封装得以提升。并且因特定绿光光源的添加，使原本偏离黑体辐射线的高演色性的光线能够回到黑体辐射线的区域，并由于绿光光源与红光光源发出的光线的混合，从而降低照明用发光二极管封装体的色温而使其能发出暖白光。
可以理解的，在其他实施例中，可进一步增加黄光光源与上述红光光源、绿光光源及背光用的发光二极管封装体进行搭配并进行混光。所述黄光光源在CIE 1931色坐标上的X轴方向上的坐标值大于0.3。因为所述黄光光源的加入，从而增强了黄光的强度，进而可进一步降低照明用发光二极管封装体的色温。

Claims (9)

1.一种照明用发光二极管模组的制造方法，包括如下步骤：
提供背光用的发光二极管封装体；
提供红光光源及绿光光源，并使所述红光光源与绿光光源发出的光与所述背光用的发光二极管封装体发出的光线进行混合，从而得到演色性提高的照明用发光二极管封装体；
其中所述红光光源在CIE 1931色坐标的X 轴方向上的坐标值大于0.5，在Y轴方向上的坐标值大于0.2。
2.如权利要求1所述的照明用发光二极管封装体的制造方法，其特征在于：所述绿光光源的在CIE 1931色坐标的Y轴方向上的坐标值大于0.6。
3.如权利要求1所述的照明用的发光二极管封装体的制造方法，其特征在于：所述红光光源及绿光光源分别为单色红光发光二极管及单色绿光发光二极管。
4.如权利要求1所述的照明用发光二极管封装体的制造方法，其特征在于：所述红光光源及绿光光源分别由背光用的发光二极管封装体搭载红色荧光粉及绿色荧光粉的方式获得。
5.如权利要求4所述的照明用发光二极管封装体的制造方法，其特征在于：分别将红色荧光粉和绿色荧光粉与透明胶体混合，然后通过点胶的方式，将这些红色荧光粉与胶体的混合物、绿色荧光粉与胶体的混合物点在背光用发光二级管封装体上，从而得到所述红光光源及绿光光源。
6.如权利要求1所述的照明用发光二极管封装体的制造方法，其特征在于：进一步包括黄光光源，所述黄光光源发出的光线与所述红光光源、绿光光源及背光用的发光二极管封装体发出的光线进行混光。
7.如权利要求6所述的照明用发光二极管封装体的制造方法，其特征在于：所述黄光光源在CIE 1931色坐标上的X轴方向上的坐标值大于0.3。
8.如权利要求1所述的照明用发光二极管封装体的制造方法，其特征在于：所述背光用的发光二极管封装体的平均演色性评价数为70。
9.如权利要求1所述的照明用发光二极管封装体的制造方法，其特征在于：所述背光用的发光二极管封装体在CIE 1931色坐标的X 轴及Y轴方向上的坐标值皆大于0.2。
CN201310139878.9A 2013-04-22 2013-04-22 照明用发光二极管封装体的制造方法 Pending CN104112796A (zh)

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CN201310139878.9A CN104112796A (zh) 2013-04-22 2013-04-22 照明用发光二极管封装体的制造方法
TW102125309A TW201503420A (zh) 2013-04-22 2013-07-15 照明用發光二極體模組的製造方法
JP2014087060A JP2014216649A (ja) 2013-04-22 2014-04-21 照明用の発光ダイオードモジュールの製造方法

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101031843A (zh) * 2004-08-18 2007-09-05 索尼株式会社 背光装置及彩色液晶显示装置
CN101309536A (zh) * 2007-05-14 2008-11-19 夏普株式会社 发光设备、照明装置和液晶显示设备
CN102797999A (zh) * 2011-05-25 2012-11-28 松下电器产业株式会社 可变颜色光发射装置及使用该装置的照明设备
CN102891243A (zh) * 2011-07-18 2013-01-23 三星电子株式会社 发白光器件以及使用该器件的显示设备和照明设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004253309A (ja) * 2003-02-21 2004-09-09 Nichia Chem Ind Ltd 演色性を備えた特殊用途ｌｅｄ照明
JP2006155956A (ja) * 2004-11-25 2006-06-15 Harison Toshiba Lighting Corp 照明装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101031843A (zh) * 2004-08-18 2007-09-05 索尼株式会社 背光装置及彩色液晶显示装置
CN101309536A (zh) * 2007-05-14 2008-11-19 夏普株式会社 发光设备、照明装置和液晶显示设备
CN102797999A (zh) * 2011-05-25 2012-11-28 松下电器产业株式会社 可变颜色光发射装置及使用该装置的照明设备
CN102891243A (zh) * 2011-07-18 2013-01-23 三星电子株式会社 发白光器件以及使用该器件的显示设备和照明设备

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Application publication date: 20141022