CN104101088A - Dual-heat source water heater and control method thereof - Google Patents
Dual-heat source water heater and control method thereof Download PDFInfo
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- CN104101088A CN104101088A CN201310116290.1A CN201310116290A CN104101088A CN 104101088 A CN104101088 A CN 104101088A CN 201310116290 A CN201310116290 A CN 201310116290A CN 104101088 A CN104101088 A CN 104101088A
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Abstract
The invention discloses a dual-heat source water heater. The dual-heat source water heater comprises a heat pump system and a water side system, wherein the heat pump system comprises an electric motor, a draught fan, a heat pump heating subsystem, a pressure relief subsystem and a defrosting subsystem; the water side system comprises an electrical heating system, the electrical heating system comprises an MCU (Micro Controller Unit), a water inlet temperature sensor, a first temperature sensor, a second temperature sensor, a terminal block and an SCR (Silicon Controlled Rectifier) assembly, the water inlet temperature sensor, the first temperature sensor, the second temperature sensor, the terminal block and the SCR assembly are respectively and electrically connected with the MCU, the heat pump heating subsystem, the pressure relief subsystem and the defrosting subsystem are respectively, correspondingly and electrically connected with the MCU through a first electromagnetic valve, a second electromagnetic valve and a third electromagnetic valve, and the MCU is used for controlling the switching on and off of the first electromagnetic valve, the second electromagnetic valve and the third electromagnetic valve according to a water inlet temperature signal, a heat pump water outlet temperature signal, a total water outlet temperature signal and a water flow signal and controlling the power output of a heating element assembly through the SCR assembly. The invention also discloses a control method of the dual-heat source heater.
Description
Technical field
The present invention relates to field of water heaters, relate in particular to a kind of double-heat source water heater and control method thereof.
Background technology
Traditional air source hot pump water heater is generally made up of host machine part and water tank part, for domestic type water tank, capacity generally arrives 320L at 150L, bulky, when installation, need occupy very large space, even if some water tanks use support to be installed on outside wall, because the weight that water tank itself adds water is very heavy, this type of mounting means has certain danger; In addition, the material that inner water tank itself adopts and technique, no matter be stainless or the inner bag of enamel, always there will be of being difficult to avoid leaked, and in the poor area of water quality, the heat exchanger tube of water tank inside is easily corroded and bores a hole, and causes coolant leakage; Further, due to the hot pump characteristics of storage-type, water temperature is risen to the time that higher temperature consumes longer, can not meet the demand of instant water, and to the water later stage, fluctuating temperature is larger, the comfortableness that impact is used; In the time of water, generally all need mixed water, the hot water utilization rate of water tank the inside is not high, and in insulating process, declining inevitably appears in water temperature, increases energy consumption.The unit of tradition with water tank moves for a long time under high condensation temperature and high condensing pressure, to the life-span of compressor be also a very large test.
Summary of the invention
The technical problem that the present invention mainly solves be to provide with powerful pair of thermal source, can constant-temperature effluent water heater and control method thereof, can improve on the one hand the comfort level of water, ensure Electrical Safety by Based Intelligent Control on the other hand.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is:
A kind of double-heat source water heater is provided, comprises heat pump and water side system, described heat pump comprises motor and blower fan, heat pump subsystem, pressure relief subsystem and defroster subsystem, described water side system is made up of the water supply connector being connected successively, inflow temperature sensor, water flow switch, plate type heat exchanger, water ga(u)ge, Water flow adjusting valve, electric heating system and water out adapter, wherein, described electric heating system comprises successively connected heating unit assembly outlet pipe, heating unit assembly and heating unit assembly water inlet pipe, described heating unit assembly outlet pipe is connected with water out adapter, and described heating unit assembly water inlet pipe is connected with described Water flow adjusting valve, this electric heating system also comprises MCU and the first temperature sensor being electrically connected with MCU respectively, the second temperature sensor, terminal board and silicon controlled component, silicon controlled component is electrically connected with described heating unit assembly, the first temperature sensor is sent to MCU for detection of total leaving water temperature of heating unit assembly outlet pipe and by total leaving water temperature signal, the second temperature sensor is sent to MCU for detection of the heat pump leaving water temperature of heating unit assembly water inlet pipe and by heat pump leaving water temperature signal, described inflow temperature sensor, water ga(u)ge and Water flow adjusting valve are electrically connected with MCU respectively, described inflow temperature sensor is sent to MCU for detection of inflow temperature and by inflow temperature signal, described water ga(u)ge is sent to MCU for detection of discharge and by water flow signal, described heat pump subsystem, pressure relief subsystem, defroster subsystem are electrically connected with MCU by the first magnetic valve, the second magnetic valve, the 3rd magnetic valve respectively accordingly, and described MCU is used for according to the break-make of inflow temperature signal, heat pump leaving water temperature signal, total leaving water temperature signal and water flow signal control the first magnetic valve, the second magnetic valve, the 3rd magnetic valve and by the power stage of silicon controlled component control heating unit assembly.
Wherein, described MCU is for judging that according to inflow temperature signal whether inflow temperature is lower than start-up temperature, judge according to heat pump leaving water temperature signal whether heat pump leaving water temperature reaches design temperature, and judge according to total leaving water temperature signal whether total leaving water temperature reaches design temperature; Described MCU, also in the time judging inflow temperature lower than start-up temperature, connects the first magnetic valve and starts heat pump subsystem; In the time judging inflow temperature not lower than start-up temperature, cut off the first closed electromagnetic valve heat pump subsystem; In the time judging that total leaving water temperature reaches design temperature, do not export by silicon controlled component control heating unit assembly; In the time judging that total leaving water temperature does not reach design temperature, export corresponding electrical heating power according to total leaving water temperature by silicon controlled component control heating unit assembly and control the amplitude of accommodation of Water flow adjusting valve so that total leaving water temperature reaches design temperature.
Wherein, in the time judging that inflow temperature does not reach design temperature and heat pump leaving water temperature and do not reach design temperature lower than start-up temperature, total leaving water temperature, by silicon controlled component control heating unit assembly output numerical value lower than the electrical heating power of heater flat-out 70% and control the Water flow adjusting valve amplitude of accommodation so that total leaving water temperature reaches design temperature.
Wherein, described MCU is also for judging that whether total leaving water temperature is higher than maximum design temperature, and when judging that inflow temperature connects the second magnetic valve lower than start-up temperature and total leaving water temperature during higher than maximum design temperature and open pressure relief subsystem.
Wherein, described heat pump subsystem is the closed-loop system being connected to form in turn by compressor, described the first magnetic valve, described plate type heat exchanger, filter, expansion valve, evaporimeter, gas-liquid separator and described compressor, and described heat pump subsystem is for heating the water by plate type heat exchanger; Described pressure relief subsystem is the closed-loop system being connected to form in turn by described compressor, described the second magnetic valve, release condenser, release capillary, described evaporimeter, described gas-liquid separator and described compressor; Described defroster subsystem is the closed-loop system being connected to form in turn by described compressor, described the 3rd magnetic valve, defrosting capillary, evaporimeter, gas-liquid separator and compressor.
Wherein, described heat pump and water side system are integrated in casing.
Another technical scheme that the present invention adopts is:
A kind of double-heat source water heater control method is provided, runs in described double-heat source water heater, comprise
MCU judges that according to inflow temperature signal whether inflow temperature is lower than start-up temperature, judges according to heat pump leaving water temperature signal whether heat pump leaving water temperature reaches design temperature, and judges according to total leaving water temperature signal whether total leaving water temperature reaches design temperature; In the time judging inflow temperature lower than start-up temperature, MCU starts heat pump subsystem; In the time judging inflow temperature not lower than start-up temperature, MCU closes heat pump subsystem; In the time judging that total leaving water temperature reaches design temperature, MCU does not export by silicon controlled component control heating unit assembly; In the time judging that total leaving water temperature does not reach design temperature, MCU exports corresponding electrical heating power according to total leaving water temperature by silicon controlled component control heating unit assembly and controls the amplitude of accommodation of Water flow adjusting valve so that total leaving water temperature reaches design temperature.
Wherein, described a kind of double-heat source water heater control method, also comprise: in the time judging that inflow temperature does not reach design temperature and heat pump leaving water temperature and do not reach design temperature lower than start-up temperature, total leaving water temperature, MCU is the electrical heating power lower than heater flat-out 70% by silicon controlled component control heating unit assembly output numerical value, and MCU controls the amplitude of accommodation of Water flow adjusting valve so that total leaving water temperature reaches design temperature.
Wherein, described a kind of double-heat source water heater control method, also comprises: MCU judges that whether total leaving water temperature is higher than maximum design temperature; In the time judging total leaving water temperature higher than maximum design temperature, MCU opens pressure relief subsystem.
The invention has the beneficial effects as follows: 1, adopt cistern freeization design, save installing space, easy for installation and use safety; 2, realize air energy heat pump and high-power electrically heated flexible switching, can maximize favourable factors and minimize unfavourable ones, avoid unit to exceed in use the load of electric wire; 3, reduce the link that uses tube connector, greatly reduced the probability of coolant leakage; 4, can accomplish plug and play, save the time of waiting for hot water, ensure the sustainability of constant-temperature effluent and water, improve the comfortableness of water, unit efficiency in this water situation is higher, and be conducive to source pump and safely and steadily run, thus the service life of guarantee unit; 5, by using release condenser, when avoiding total leaving water temperature too high, can also reduce the operating load of unit, greatly reduce units consumption, meet the requirement that national energy-saving reduces discharging.
Brief description of the drawings
Fig. 1 is the structural representation of double-heat source water heater in an embodiment of the present invention;
Fig. 2 is the structural representation of electric heating system in an embodiment of the present invention.
Main element symbol description:
1, compressor; 2, the first magnetic valve; 3, plate type heat exchanger; 4, Water flow adjusting valve;
6, electric heating system; 8, water out adapter; 9, water supply connector; 10, water flow switch; 11, filter;
12, expansion valve; 13, the 3rd magnetic valve; 14, defrosting capillary; 15, the second magnetic valve;
16, release capillary; 17, blower fan; 18, motor; 19, evaporimeter; 20, release condenser;
21, gas-liquid separator; 22, water ga(u)ge; 61, heating unit assembly outlet pipe;
62, heating unit assembly; 63, the first temperature sensor; 64, casing; 65, the second temperature sensor;
66, terminal board; 67, silicon controlled component; 68, heating unit assembly water inlet pipe.
Detailed description of the invention
By describing technology contents of the present invention, structural feature in detail, being realized object and effect, below in conjunction with embodiment and coordinate accompanying drawing to be explained in detail.
Referring to Fig. 1, is the structural representation of a kind of double-heat source water heater in an embodiment of the present invention.This double-heat source water heater comprises heat pump and water side system, is integrated in casing 64.Described heat pump comprises motor 18 and blower fan 17, heat pump subsystem, pressure relief subsystem and defroster subsystem.
Described heat pump subsystem is the closed-loop system being connected to form in turn by compressor 1, the first magnetic valve 2, plate type heat exchanger 3, filter 11, expansion valve 12, evaporimeter 19, gas-liquid separator 21 and compressor 1, and described heat pump subsystem is used for heating by the water of plate type heat exchanger 3.Described pressure relief subsystem is the closed-loop system being connected to form in turn by compressor 1, the second magnetic valve 15, release condenser 20, release capillary 16, evaporimeter 19, gas-liquid separator 21 and compressor 1.Described defroster subsystem is the closed-loop system being connected to form in turn by compressor 1, the 3rd magnetic valve 13, defrosting capillary 14, evaporimeter 19, gas-liquid separator 21 and compressor 1.When described heat pump operation, motor 18 and blower fan 17 are opened according to demand or close.
Described water side system is made up of the water supply connector 9 being connected successively, inflow temperature sensor (not shown), water flow switch 10, plate type heat exchanger 3, water ga(u)ge 22, Water flow adjusting valve 4, electric heating system 6 and water out adapter 8.Referring to Fig. 2, is the structural representation of electric heating system in an embodiment of the present invention.This electric heating system 6 comprises successively connected heating unit assembly outlet pipe 61, heating unit assembly 62 and heating unit assembly water inlet pipe 68, described heating unit assembly outlet pipe 61 is connected with water out adapter 8, and described heating unit assembly water inlet pipe 68 is connected with described Water flow adjusting valve 4.
This electric heating system 6 also comprises that MCU(figure does not show) and the first temperature sensor 63, the second temperature sensor 65, terminal board 66 and the silicon controlled component 67 that are electrically connected with MCU respectively, silicon controlled component 67 is electrically connected with described heating unit assembly 62, the first temperature sensor 63 is sent to MCU for detection of total leaving water temperature of heating unit assembly outlet pipe 61 and by total leaving water temperature signal, and the second temperature sensor 65 is sent to MCU for detection of the heat pump leaving water temperature of heating unit assembly water inlet pipe 68 and by heat pump leaving water temperature signal.Described compressor 1 and motor 18, blower fan 17, water ga(u)ge 22, inflow temperature sensor and Water flow adjusting valve 4 are electrically connected with MCU respectively, and described water ga(u)ge 22 is sent to MCU for detection of discharge and by water flow signal.Described heat pump subsystem, pressure relief subsystem, defroster subsystem are electrically connected with MCU by work the first magnetic valve 2, the second magnetic valve 15, the 3rd magnetic valve 13 respectively accordingly, and described MCU is used for according to the break-make of inflow temperature signal, heat pump leaving water temperature signal, total leaving water temperature signal and water flow signal control the first magnetic valve 2, the second magnetic valve 15, the 3rd magnetic valve 13 and by the power stage of silicon controlled component control heating unit assembly.
Particularly, described MCU, for judging that according to inflow temperature signal whether inflow temperature is lower than start-up temperature, judges according to heat pump leaving water temperature signal whether heat pump leaving water temperature reaches design temperature and judge according to total leaving water temperature signal whether total leaving water temperature reaches design temperature.And whether higher than maximum design temperature, described MCU is also in the time judging inflow temperature lower than start-up temperature, connect the first magnetic valve 2 and open heat pump subsystem, start compressor 1, the heat pump subsystem components such as blower fan 17 and motor 18, particularly, in the present embodiment, described MCU is not in the time that judgement inflow temperature works on power during stoppage protection lower than start-up temperature and compressor 1, be during compressor shutdown can not be restarted in 1～5 minute afterwards, can between 0～100% of complete moving rate, export electrical heating power by silicon controlled component control heating unit assembly, when compressor 1 is removed stoppage protection and starts, can between 0～70% of complete moving rate, export electrical heating power by silicon controlled component control heating unit assembly.
Described MCU is also in the time judging inflow temperature not lower than start-up temperature, and close compressor 1, blower fan 17 and motor 18, cut off the first magnetic valve 2 and close heat pump subsystem; Described MCU also, in the time judging that total leaving water temperature reaches design temperature, controls heating unit assembly 62 by silicon controlled component 67 and does not export; Described MCU, also in the time judging that total leaving water temperature does not reach design temperature, controls heating unit assembly 62 according to total leaving water temperature by silicon controlled component 67 and exports corresponding electrical heating power and control the amplitude of accommodation of Water flow adjusting valve 4 so that total leaving water temperature reaches design temperature; Described MCU is also in the time judging that inflow temperature does not reach design temperature and heat pump leaving water temperature and do not reach design temperature lower than start-up temperature, total leaving water temperature, control heating unit assembly 62 by silicon controlled component 67 and export the electrical heating power of numerical value lower than heater flat-out 70%, described MCU is also for controlling the amplitude of accommodation of Water flow adjusting valve 4 so that total leaving water temperature reaches design temperature simultaneously; The load that ensures electric wire is unlikely to exceed the load that it can bear.Described MCU also opens pressure relief subsystem for connect the second magnetic valve 15 in the time judging total leaving water temperature higher than maximum design temperature; Described MCU is also in the time judging inflow temperature higher than start-up temperature and always leaving water temperature does not reach design temperature, control heating unit assembly 62 by silicon controlled component 67 and can between 0～100% of complete moving rate, export electrical heating power, so that total leaving water temperature reaches design temperature;
In an embodiment of the present invention, a kind of double-heat source water heater control method runs in above-mentioned double-heat source water heater, and the method comprises the steps:
Step S101, MCU judge that according to inflow temperature signal whether inflow temperature is lower than start-up temperature;
Step S102, MCU judge according to heat pump leaving water temperature signal whether heat pump leaving water temperature reaches design temperature;
Step S103, MCU judge according to total leaving water temperature signal whether total leaving water temperature reaches design temperature;
Step S104, when judging that inflow temperature is not during lower than start-up temperature, thereby MCU close compressor, blower fan 17 and motor 18 are closed heat pump subsystem;
Step S105, when judging that total leaving water temperature is while reaching design temperature, MCU controls heating unit assembly 62 by silicon controlled component 67 and does not export;
Step S106, when judging that inflow temperature is during lower than start-up temperature, open heat pump subsystems thereby MCU starts compressor, blower fan 17 and motor 18; Particularly; in the present embodiment; when judging that inflow temperature is when start-up temperature and compressor are during stoppage protection; MCU is controlled heating unit assembly 62 and is exported the electrical heating power of heater total power 0～100% by silicon controlled component 67; when compressor is removed when stoppage protection, MCU is controlled heating unit assembly 62 and is exported the electrical heating power of heater total power 0～70% by silicon controlled component 67.
Step S107, when judging that total leaving water temperature is not while reaching design temperature, MCU controls heating unit assembly 62 according to total leaving water temperature by silicon controlled component 67 and exports corresponding electrical heating power and control the amplitude of accommodation of Water flow adjusting valve 4 so that total leaving water temperature reaches design temperature;
Step S108, in the time judging that inflow temperature does not reach design temperature and total leaving water temperature and do not reach design temperature lower than start-up temperature, heat pump leaving water temperature, MCU controls heating unit assembly 62 by silicon controlled component 67 and exports the electrical heating power of numerical value lower than heater flat-out 70%, the load that ensures electric wire is unlikely to exceed the load that it can bear, and MCU controls the amplitude of accommodation of Water flow adjusting valve 4 so that total leaving water temperature reaches design temperature simultaneously;
Step S109, when judging that inflow temperature is higher than start-up temperature, and total leaving water temperature is not while reaching design temperature, MCU is controlled heating unit assembly 62 and is exported the electrical heating power of heater total power 0～100% by silicon controlled component 67.
Wherein, described double-heat source water heater control method also comprises step:
MCU judges that whether total leaving water temperature is higher than maximum design temperature;
In the time judging total leaving water temperature higher than maximum design temperature, MCU opens pressure relief subsystem.
The invention has the beneficial effects as follows: 1, adopt cistern freeization design, save installing space, easy for installation and use safety; 2, realize air energy heat pump and high-power electrically heated flexible switching, can maximize favourable factors and minimize unfavourable ones, avoid unit to exceed in use the load of electric wire; 3, reduce the link that uses tube connector, greatly reduced the probability of coolant leakage; 4, can accomplish plug and play, save the time of waiting for hot water, ensure the sustainability of constant-temperature effluent and water, improve the comfortableness of water, unit efficiency in this water situation is higher, and be conducive to source pump and safely and steadily run, thus the service life of guarantee unit; 5, by using release condenser, when avoiding total leaving water temperature too high, can also reduce the operating load of unit, greatly reduce units consumption, meet the requirement that national energy-saving reduces discharging.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (9)
1. a double-heat source water heater, is characterized in that: comprise heat pump and water side system, described heat pump comprises motor and blower fan, heat pump subsystem, pressure relief subsystem and defroster subsystem; Described water side system is made up of the water supply connector being connected successively, inflow temperature sensor, water flow switch, plate type heat exchanger, water ga(u)ge, Water flow adjusting valve, electric heating system and water out adapter, wherein, described electric heating system comprises successively connected heating unit assembly outlet pipe, heating unit assembly and heating unit assembly water inlet pipe, described heating unit assembly outlet pipe is connected with water out adapter, and described heating unit assembly water inlet pipe is connected with described Water flow adjusting valve;
Described electric heating system also comprises MCU and the first temperature sensor being electrically connected with MCU respectively, the second temperature sensor, terminal board and silicon controlled component, silicon controlled component is electrically connected with described heating unit assembly, the first temperature sensor is sent to MCU for detection of total leaving water temperature of heating unit assembly outlet pipe and by total leaving water temperature signal, the second temperature sensor is sent to MCU for detection of the heat pump leaving water temperature of heating unit assembly water inlet pipe and by heat pump leaving water temperature signal, described inflow temperature sensor, water ga(u)ge and Water flow adjusting valve are electrically connected with MCU respectively, described inflow temperature sensor is sent to MCU for detection of inflow temperature and by inflow temperature signal, described water ga(u)ge is sent to MCU for detection of discharge and by water flow signal,
Described heat pump subsystem, pressure relief subsystem, defroster subsystem are electrically connected with MCU by work the first magnetic valve, the second magnetic valve, the 3rd magnetic valve respectively accordingly, and described MCU is used for according to the break-make of inflow temperature signal, heat pump leaving water temperature signal, total leaving water temperature signal and water flow signal control the first magnetic valve, the second magnetic valve, the 3rd magnetic valve and by the power stage of silicon controlled component control heating unit assembly.
2. double-heat source water heater according to claim 1, is characterized in that:
Described MCU is for judging that according to inflow temperature signal whether inflow temperature is lower than start-up temperature, judge according to heat pump leaving water temperature signal whether heat pump leaving water temperature reaches design temperature, and judge according to total leaving water temperature signal whether total leaving water temperature reaches design temperature, and described start-up temperature is lower than design temperature;
Described MCU also, in the time judging inflow temperature lower than start-up temperature, connects the first magnetic valve and opens heat pump subsystem; In the time judging inflow temperature not lower than start-up temperature, cut off the first magnetic valve and close heat pump subsystem; In the time judging that total leaving water temperature reaches design temperature, do not export by silicon controlled component control heating unit assembly; In the time judging that total leaving water temperature does not reach design temperature, export corresponding electrical heating power according to total leaving water temperature by silicon controlled component control heating unit assembly and control the amplitude of accommodation of Water flow adjusting valve so that total leaving water temperature reaches design temperature.
3. double-heat source water heater according to claim 2, is characterized in that:
Described MCU also, in the time judging that inflow temperature does not reach design temperature lower than start-up temperature, heat pump leaving water temperature and always leaving water temperature does not reach design temperature, is exported numerical value lower than the electrical heating power of heater flat-out 70% and is controlled the Water flow adjusting valve amplitude of accommodation so that total leaving water temperature reaches design temperature by silicon controlled component control heating unit assembly.
4. double-heat source water heater according to claim 2, is characterized in that:
Described MCU is also for judging that whether total leaving water temperature is higher than maximum design temperature, and connects the second magnetic valve and open pressure relief subsystem in the time judging total leaving water temperature higher than maximum design temperature.
5. double-heat source water heater according to claim 1, is characterized in that:
Described heat pump subsystem is the closed-loop system being connected to form in turn by compressor, described the first magnetic valve, described plate type heat exchanger, filter, expansion valve, evaporimeter, gas-liquid separator and described compressor, and described heat pump subsystem is for heating the water by plate type heat exchanger;
Described pressure relief subsystem is the closed-loop system being connected to form in turn by described compressor, described the second magnetic valve, release condenser, release capillary, described evaporimeter, described gas-liquid separator and described compressor;
Described defroster subsystem is the closed-loop system being connected to form in turn by described compressor, described the 3rd magnetic valve, defrosting capillary, evaporimeter, gas-liquid separator and compressor.
6. double-heat source water heater according to claim 1, is characterized in that: heat pump and water side system are integrated in a casing.
7. a double-heat source water heater control method, runs in the double-heat source water heater described in claim 1-6 any one, it is characterized in that, comprising:
MCU judges that according to total leaving water temperature signal whether inflow temperature is lower than start-up temperature, judges whether total leaving water temperature reaches design temperature, and judge according to heat pump leaving water temperature signal whether heat pump leaving water temperature reaches design temperature according to total leaving water temperature signal;
In the time judging inflow temperature lower than start-up temperature, MCU opens heat pump subsystem;
In the time judging inflow temperature not lower than start-up temperature, MCU closes heat pump subsystem;
In the time judging that total leaving water temperature reaches design temperature, MCU does not export by silicon controlled component control heating unit assembly;
In the time judging that total leaving water temperature does not reach design temperature, MCU exports corresponding electrical heating power by silicon controlled component control heating unit assembly and controls the amplitude of accommodation of Water flow adjusting valve so that total leaving water temperature reaches design temperature according to entering total leaving water temperature.
8. a kind of double-heat source water heater control method according to claim 7, is characterized in that, also comprises:
In the time judging that inflow temperature does not reach design temperature and heat pump leaving water temperature and do not reach design temperature lower than start-up temperature, total leaving water temperature, MCU is the electrical heating power lower than heater flat-out 70% by silicon controlled component control heating unit assembly output numerical value, and MCU controls the amplitude of accommodation of Water flow adjusting valve so that total leaving water temperature reaches design temperature.
9. a kind of double-heat source water heater control method according to claim 7,, it is characterized in that, also comprise:
MCU judges that whether total leaving water temperature is higher than maximum design temperature;
In the time judging total leaving water temperature higher than maximum design temperature, MCU opens pressure relief subsystem.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310116290.1A CN104101088B (en) | 2013-04-03 | double-heat source water heater and control method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310116290.1A CN104101088B (en) | 2013-04-03 | double-heat source water heater and control method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104101088A true CN104101088A (en) | 2014-10-15 |
| CN104101088B CN104101088B (en) | 2016-11-30 |
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| CN105953425A (en) * | 2016-06-15 | 2016-09-21 | 许鸣华 | Direct bathing type air energy water heater |
| CN110840362A (en) * | 2019-11-25 | 2020-02-28 | 广州易帮客环保科技有限公司 | Novel dish washer water heating trouble self-checking system |
| WO2023024877A1 (en) * | 2021-08-27 | 2023-03-02 | 青岛经济技术开发区海尔热水器有限公司 | Control method for water heating system |
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Cited By (5)
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| CN110840362A (en) * | 2019-11-25 | 2020-02-28 | 广州易帮客环保科技有限公司 | Novel dish washer water heating trouble self-checking system |
| WO2023024877A1 (en) * | 2021-08-27 | 2023-03-02 | 青岛经济技术开发区海尔热水器有限公司 | Control method for water heating system |
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