CN104098906A - Single-component addition type liquid silicone rubber for protecting electronic packaging chips - Google Patents
Single-component addition type liquid silicone rubber for protecting electronic packaging chips Download PDFInfo
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- CN104098906A CN104098906A CN201410298005.7A CN201410298005A CN104098906A CN 104098906 A CN104098906 A CN 104098906A CN 201410298005 A CN201410298005 A CN 201410298005A CN 104098906 A CN104098906 A CN 104098906A
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Abstract
The invention discloses a single-component addition type liquid silicone rubber for protecting electronic packaging chips. The single-component addition type liquid silicone rubber for protecting electronic packaging chips is prepared from the following raw materials in parts by weight: 70-90 parts of vinyl-terminated silicone fluid, 4-6 parts of a methyl hydrogen silicone oil cross-linking agent, 10-30 parts of ethenyl hydrogen-containing silicone, 5-10 parts of filling materials, 1.5-2.5 parts of a thickening agent, 0.5-0.7 part of low-decomposition-temperature organic peroxide, 0.4-0.6 part of a high-decomposition-temperature organic peroxide restrainer and 0.02-0.05 part of a catalyst. According to the single-component addition type liquid silicone rubber, semi-conductor integrated chips subjected to bonding are coated with the liquid silicone rubber, through the adoption of the methods of middle-low temperature preliminary solidification and high temperature deep solidification, the electronic packaging chips are protected; therefore, the purposes of protecting electronic packaging chips during process and the plastic package compression molding process, and increasing the qualified rate of the product quality can be realized.
Description
Technical field
The present invention relates to liquid silastic technical field, espespecially a kind of single component add-on type liquid silicon rubber for the protection of Electronic Packaging chip.
Background technology
Epoxy plastic cement is with low cost with it, technique is simple and be suitable for the advantages such as scale operation and come out top in Electronic Packaging chip encapsulation material, current global integrated antenna package more than 90% adopts epoxy plastic cement, along with Electronic Packaging chip, especially the development of semiconductor integrated chip and encapsulation technology, more and more demonstrate the fundamental position of epoxy plastic cement and the effect of ascendancy, epoxy plastic cement is to take epoxy resin as basic resin, take high performance resol as solidifying agent, add silicon powder etc. for filler, and add the powdered plastic that multiple additive mixture forms, during plastic packaging, adopt the shaping method to suppress of compression molding and transfer moudling to make its moulding, and in actual package technological process, chip is after bonding, its nude film is easily subject to environmental factors as moisture in turnover and plastic packaging process, the factor impacts such as airborne dust and static, even can be subject to silicon powder compacting in epoxy plastic cement scratches, have influence on the quality of Electronic Packaging product, therefore be necessary Electronic Packaging integrated chip effectively protecting after bonding, thereby improve the product qualified rate of product.
Summary of the invention
A kind of single component add-on type liquid silicon rubber for the protection of Electronic Packaging chip of the present invention, it is characterized in that overcoming the deficiency of above-mentioned technology, a kind of single component add-on type liquid silicon rubber is provided, utilize low viscous vinyl-terminated silicone fluid and low viscous Methyl Hydrogen Polysiloxane Fluid linking agent to dilute full-bodied vinyl Silicon Containing Hydrogen resin, the organo-peroxide inhibitor of the low decomposition temperature of reasonable compatibility, high decomposition temperature organo-peroxide inhibitor, the additive such as catalyzer and tackifier, be coated on the semiconductor integrated chip after bonding, by the mode of low temperature primary solidification in adopting and high temperature deeply-curing, semiconductor integrated chip is protected, realize between technique that protection and plastic packaging compression moulding process are protected and the object of the qualification rate of improving the quality of products.
To achieve these goals, technical solution of the present invention is: a kind of single component add-on type liquid silicon rubber for the protection of Electronic Packaging chip comprises the raw material of following mass parts: 70～90 parts of vinyl-terminated silicone fluids, 4～6 parts of Methyl Hydrogen Polysiloxane Fluid linking agents, 10～30 parts of vinyl Silicon Containing Hydrogen resins, 5～10 parts of fillers, 1.5～2.5 parts of tackifier, 0.5～0.7 part of low decomposition temperature organo-peroxide, 0.4～0.6 part, high decomposition temperature organo-peroxide inhibitor, 0.02～0.05 part of catalyzer.
On the basis of such scheme, the present invention further can do following improvement:
Further, described vinyl-terminated silicone fluid preferred vinyl massfraction is 0.08%～0.1%, the vinyl-terminated silicone fluid of viscosity 300～500m Pa ﹒ s, and its chemical general formula is ViMe
2siO (Me
2siO)
xme
2the compound of SiVi, in formula: Vi is vinyl, Me is methyl, x is greater than 5 integer;
Described Methyl Hydrogen Polysiloxane Fluid preferred active hydrogen massfraction is 0.8%～1.5%, the Methyl Hydrogen Polysiloxane Fluid of viscosity 500～800mPa ﹒ s, and its chemical general formula is Me
3siO (Me
2siO)
m(MeHSiO)
nsiMe
3compound, in formula: Vi is vinyl, Me is methyl, m is greater than 0 integer, n is greater than 3 integer, and meets m+ n=8～60;
Described vinyl Silicon Containing Hydrogen resin is that chemical general formula is (Ph
3siO
3/2)
a1(Me
2siO)
a2(ViMe
2siO
1/2)
a3(R
3siO
1/2)
a4(HMe
2siO
1/2)
a5compound, its viscosity is 1500～7600mPa ﹒ s, in formula, a1, a2, a3, a4, a5 are 0 or be greater than 1 decimal, and meet a1+ a2+ a3+ a4+ a5=1, in formula: R is methyl or phenyl, Vi is vinyl, Me is methyl, Ph is phenyl;
Preferred platinum-1 of described catalyzer, the microcapsule platinum catalyst that 3-divinyl tetramethyl disiloxane, diethyl phthalate are sealed, one or more in platinum-tetrahydrofuran base;
The electronic grade high-purity ball-type silicon powder of described filler preferable particle size 10～30 μ m;
Any in the preferred γ-aminopropyl triethoxysilane of described tackifier, γ-(2,3-epoxy the third oxygen) propyl trimethoxy silicane and γ-methacryloxypropyl trimethoxy silane;
Described low decomposition temperature organo-peroxide preferably 2,5-2，5-dimethyl-2，5-di(t-butyl peroxy)2，5-hexane and tertbutyl peroxide;
Described high decomposition temperature organo-peroxide inhibitor preferably 1,1-bis-(t-butylperoxy)-3,3,5-trimethyl-cyclohexane, peroxidized t-butyl perbenzoate and peroxide acid tert-amyl acetate;
Preferred platinum-1 of described catalyzer, the microcapsule platinum catalyst that 3-divinyl tetramethyl disiloxane, diethyl phthalate are sealed, one or more in platinum-tetrahydrofuran base;
The preparation method of a kind of single component add-on type liquid silicon rubber for the protection of Electronic Packaging chip of the present invention is: adopt high speed shear dispersion machine, adding mass parts is 70～90 parts of the vinyl-terminated silicone fluid vinyl-terminated silicone fluids of 70～90 parts, mass parts is that vinyl Silicon Containing Hydrogen resin and the mass parts of 10～30 parts is 5～10 parts of fillers, under strong stirring, be uniformly dispersed, under strong stirring condition, keep mixed system below 30 ℃, adding successively mass parts is the Methyl Hydrogen Polysiloxane Fluid linking agent of 4～6 parts again, mass parts is the tackifier of 1.5～2.5 parts, mass parts is the low decomposition temperature organo-peroxide of 0.5～0.7 part, mass parts is the high decomposition temperature organo-peroxide inhibitor of 0.4～0.6 part, mass parts is the catalyzer of 0.02～0.05 part, mix 30～45 minutes, mixture is discharged bubble through vacuum and is processed, obtain single component add-on type for the liquid silastic of Electronic Packaging chip protection.
During use; the liquid silastic that the single component add-on type making is protected for Electronic Packaging chip utilizes point gum machine to be coated on the semiconductor integrated chip surface after bonding; be placed in thermostatic drying chamber; in the lower low temperature primary solidification of the temperature of 70～80 ℃ 1～3 hour; be cooled to after 30～50 ℃; carry out epoxy molding plastic plastic packaging, silicon rubber carries out high temperature deeply-curing together with epoxy molding plastic again.
Advantage and disadvantage of the present invention is: a kind of single component add-on type liquid silicon rubber for the protection of Electronic Packaging chip of the present invention,
By low viscous vinyl-terminated silicone fluid and low viscous Methyl Hydrogen Polysiloxane Fluid linking agent, full-bodied vinyl Silicon Containing Hydrogen resin is diluted, can reduce the viscosity of liquid silastic; Adopt low decomposition temperature organo-peroxide and high decomposition temperature organo-peroxide to carry out step curing to liquid silastic; at utmost the rational and efficient use energy reduces energy consumption; improve security; and Electronic Packaging chip is protected, reach between Electronic Packaging chip technology that protection and plastic packaging compression moulding process are protected and the effect of the qualification rate of improving the quality of products.
Embodiment
Embodiment 1
A kind of single component add-on type liquid silicon rubber for Electronic Packaging chip protection comprises the raw material of following mass parts: viscosity is 9 kilograms of the vinyl-terminated silicone fluids of 500m Pa ﹒ s, viscosity is 0.6 kilogram of the Methyl Hydrogen Polysiloxane Fluid linking agent of 500mPa ﹒ s, viscosity is 1 kilogram of the vinyl Silicon Containing Hydrogen resin of 7600mPa ﹒ s, 1 kilogram of electronic grade high-purity ball-type silicon powder, 0.25 kilogram of tackifier γ-aminopropyl triethoxysilane, low decomposition temperature organo-peroxide 2, 5-dimethyl-2, 0.07 kilogram of 5-bis-(t-butylperoxy) hexane, high decomposition temperature organo-peroxide inhibitor 1, 1-bis-(t-butylperoxy)-3, 3, 0.04 kilogram of 5-trimethyl-cyclohexane, catalyst platinum-1, 0.005 kilogram of 3-divinyl tetramethyl disiloxane.Its preparation method is: adopt high speed shear dispersion machine, adding mass parts is that 9 kilograms of viscosity are the vinyl-terminated silicone fluid vinyl-terminated silicone fluid of 500m Pa ﹒ s, mass parts is that 1 kilogram of viscosity is the vinyl Silicon Containing Hydrogen resin of 7600mPa ﹒ s and the electronic grade high-purity ball-type silicon powder that mass parts is 1 kilogram, under strong stirring, be uniformly dispersed, under strong stirring condition, keep mixed system below 30 ℃, adding successively mass parts is that 0.6 kilogram of viscosity is the Methyl Hydrogen Polysiloxane Fluid linking agent of 500mPa ﹒ s again, mass parts is the tackifier γ-aminopropyl triethoxysilane of 0.25 kilogram of part, mass parts is the low decomposition temperature organo-peroxide 2 of 0.07 kilogram, 5-dimethyl-2, 5-bis-(t-butylperoxy) hexane, mass parts is the high decomposition temperature organo-peroxide inhibitor 1 of 0.04 kilogram, 1-bis-(t-butylperoxy)-3, 3, 5-trimethyl-cyclohexane, mass parts is platinum-1 of 5 kilograms, 3-divinyl tetramethyl disiloxane, mix 40 minutes, mixture is discharged bubble through vacuum and is processed, obtain single component add-on type for the liquid silastic of Electronic Packaging chip protection.
During use; the liquid silastic that the single component add-on type making is protected for Electronic Packaging chip utilizes point gum machine to be coated on the semiconductor integrated chip surface after bonding; be placed in thermostatic drying chamber; in the lower low temperature primary solidification of the temperature of 80 ℃ 1 hour; be cooled to after 30～40 ℃; carry out epoxy molding plastic plastic packaging, silicon rubber carries out high temperature deeply-curing together with epoxy molding plastic again.
Embodiment 2
A kind of single component add-on type liquid silicon rubber for Electronic Packaging chip protection comprises the raw material of following mass parts: viscosity is 7 kilograms of the vinyl-terminated silicone fluids of 300m Pa ﹒ s, viscosity is 0.4 kilogram of the Methyl Hydrogen Polysiloxane Fluid linking agent of 800mPa ﹒ s, viscosity is 3 kilograms of the vinyl Silicon Containing Hydrogen resins of 2800mPa ﹒ s, 0.5 kilogram of electronic grade high-purity ball-type silicon powder, tackifier γ-(2, 3-epoxy the third oxygen) propyl trimethoxy silicane is 0.15 kilogram, 0.05 kilogram of low decomposition temperature organo-peroxide tertbutyl peroxide, 0.06 kilogram of high decomposition temperature organo-peroxide inhibitor peroxidized t-butyl perbenzoate, 0.002 kilogram of the microcapsule platinum catalyst that diethyl phthalate is sealed.Its preparation method is: adopt high speed shear dispersion machine, adding mass parts is that 7 kilograms of viscosity are the vinyl-terminated silicone fluid of 300m Pa ﹒ s, mass parts is that 3 kilograms of viscosity are the vinyl Silicon Containing Hydrogen resin of 2800mPa ﹒ s and the electronic grade high-purity ball-type silicon powder filler that mass parts is 0.5 kilogram, under strong stirring, be uniformly dispersed, under strong stirring condition, keep mixed system below 30 ℃, adding successively mass parts is that 0.4 kilogram of viscosity is the Methyl Hydrogen Polysiloxane Fluid linking agent of 800mPa ﹒ s again, mass parts is the tackifier γ-(2 of 0.15 kilogram of part, 3-epoxy the third oxygen) propyl trimethoxy silicane, mass parts is the low decomposition temperature organo-peroxide superoxide tertbutyl peroxide of 0.05 kilogram, mass parts is the high decomposition temperature organo-peroxide inhibitor peroxidized t-butyl perbenzoate of 0.06 kilogram, mass parts is the microcapsule platinum catalyst that the diethyl phthalate of 2 grams is sealed, mix 30 minutes, mixture is discharged bubble through vacuum and is processed, obtain single component add-on type for the liquid silastic of Electronic Packaging chip protection.
During use; the liquid silastic that the single component add-on type making is protected for Electronic Packaging chip utilizes point gum machine to be coated on the semiconductor integrated chip surface after bonding; be placed in thermostatic drying chamber; in the lower low temperature primary solidification of the temperature of 70 ℃ 2 hours; be cooled to after 40～50 ℃; carry out epoxy molding plastic plastic packaging, silicon rubber carries out high temperature deeply-curing together with epoxy molding plastic again.
Embodiment 3
A kind of single component add-on type liquid silicon rubber for Electronic Packaging chip protection comprises the raw material of following mass parts: viscosity is 8 kilograms of the vinyl-terminated silicone fluids of 500m Pa ﹒ s, viscosity is 0.5 kilogram of the Methyl Hydrogen Polysiloxane Fluid linking agent of 800mPa ﹒ s, viscosity is 2 kilograms of the vinyl Silicon Containing Hydrogen resins of 1500mPa ﹒ s, 0.7 kilogram of electronic grade high-purity ball-type silicon powder, 0.2 kilogram of tackifier γ-methacryloxypropyl trimethoxy silane, low decomposition temperature organo-peroxide 2, 5-dimethyl-2, 0.06 kilogram of 5-bis-(t-butylperoxy) hexane, 0.05 kilogram of high decomposition temperature organo-peroxide inhibitor peroxide acid tert-amyl acetate, catalyst based 0.004 kilogram of platinum-tetrahydrofuran (THF).Its preparation method is: adopt high speed shear dispersion machine, adding mass parts is that 8 kilograms of viscosity are the vinyl-terminated silicone fluid vinyl-terminated silicone fluid of 500m Pa ﹒ s, mass parts is that 2 kilograms of part viscosity are the vinyl Silicon Containing Hydrogen resin of 1500m Pa ﹒ s and the electronic grade high-purity ball-type silicon powder filler that mass parts is 0.7 kilogram, under strong stirring, be uniformly dispersed, under strong stirring condition, keep mixed system below 30 ℃, adding successively mass parts is that 0.5 kilogram of viscosity is the Methyl Hydrogen Polysiloxane Fluid linking agent of 800m Pa ﹒ s again, mass parts is the tackifier γ-methacryloxypropyl trimethoxy silane of 0.2 kilogram, mass parts is the low decomposition temperature organo-peroxide 2 of 0.06 kilogram, 5-dimethyl-2, 5-bis-(t-butylperoxy) hexane, mass parts is the high decomposition temperature organo-peroxide inhibitor peroxide acid tert-amyl acetate of 0.05 kilogram, mass parts is that the platinum-tetrahydrofuran (THF) of 4 grams is catalyst based, mix 45 minutes, mixture is discharged bubble through vacuum and is processed, obtain single component add-on type for the liquid silastic of Electronic Packaging chip protection.
During use; the liquid silastic that the single component add-on type making is protected for Electronic Packaging chip utilizes point gum machine to be coated on the semiconductor integrated chip surface after bonding; be placed in thermostatic drying chamber; in the lower low temperature primary solidification of the temperature of 75 ℃ 3 hours; be cooled to after 35～45 ℃; carry out epoxy molding plastic plastic packaging, silicon rubber carries out high temperature deeply-curing together with epoxy molding plastic again.
The above; embodiment is only that the preferred embodiment of the present invention is described; not scope of the present invention is limited; under the prerequisite of spirit that does not depart from the technology of the present invention; various distortion and improvement that this area engineering technical personnel make technical scheme of the present invention, all should fall in the definite protection domain of claims of the present invention.
Claims (2)
1. for a single component add-on type liquid silicon rubber for Electronic Packaging chip protection, it is characterized in that: described a kind of single component add-on type comprises the raw material of following mass parts for the liquid silastic of Electronic Packaging chip protection: 70～90 parts of vinyl-terminated silicone fluids, 4～6 parts of Methyl Hydrogen Polysiloxane Fluid linking agents, 10～30 parts of vinyl Silicon Containing Hydrogen resins, 5～10 parts of fillers, 1.5～2.5 parts of tackifier, 0.5～0.7 part of low decomposition temperature organo-peroxide, 0.4～0.6 part, high decomposition temperature organo-peroxide inhibitor, 0.02～0.05 part of catalyzer;
Its preparation method is: adopt high speed shear dispersion machine, adding mass parts is 70～90 parts of the vinyl-terminated silicone fluid vinyl-terminated silicone fluids of 70～90 parts, mass parts is that vinyl Silicon Containing Hydrogen resin and the mass parts of 10～30 parts is 5～10 parts of fillers, under strong stirring, be uniformly dispersed, under strong stirring condition, keep mixed system below 30 ℃, adding successively mass parts is the Methyl Hydrogen Polysiloxane Fluid linking agent of 4～6 parts again, mass parts is the tackifier of 1.5～2.5 parts, mass parts is the low decomposition temperature organo-peroxide of 0.5～0.7 part, mass parts is the high decomposition temperature organo-peroxide inhibitor of 0.4～0.6 part, mass parts is the catalyzer of 0.02～0.05 part, mix 30～45 minutes, mixture is discharged bubble through vacuum and is processed, obtain single component add-on type for the liquid silastic of Electronic Packaging chip protection.
2. a kind of single component add-on type liquid silicon rubber for Electronic Packaging chip protection according to claim 1; it is characterized in that: described vinyl-terminated silicone fluid preferred vinyl massfraction is 0.08%～0.1%; the vinyl-terminated silicone fluid of viscosity 300～500m Pa ﹒ s, its chemical general formula is ViMe
2siO (Me
2siO)
xme
2the compound of SiVi, in formula, Vi is vinyl, and Me is methyl, and x is greater than 5 integer; Described Methyl Hydrogen Polysiloxane Fluid preferred active hydrogen massfraction is 0.8%～1.5%, the Methyl Hydrogen Polysiloxane Fluid of viscosity 500～800mPa ﹒ s, and its chemical general formula is Me
3siO (Me
2siO)
m(MeHSiO)
nsiMe
3compound, in formula, Vi is vinyl, Me is methyl, m is greater than 0 integer, n is greater than 3 integer, and meets m+ n=8～60; Described vinyl Silicon Containing Hydrogen resin is that chemical general formula is (Ph
3siO
3/2)
a1(Me
2siO)
a2(ViMe
2siO
1/2)
a3(R
3siO
1/2)
a4(HMe
2siO
1/2)
a5compound, its viscosity is 1500～7600mPa ﹒ s, in formula, a1, a2, a3, a4, a5 are 0 or be greater than 1 decimal, and meet a1+ a2+ a3+ a4+ a5=1, R is methyl or phenyl, Vi is vinyl, Me is methyl, Ph is phenyl; Preferred platinum-1 of described catalyzer, the microcapsule platinum catalyst that 3-divinyl tetramethyl disiloxane, diethyl phthalate are sealed, one or more in platinum-tetrahydrofuran base; The electronic grade high-purity ball-type silicon powder of described filler preferable particle size 10～30 μ m; Any in the preferred γ-aminopropyl triethoxysilane of described tackifier, γ-(2,3-epoxy the third oxygen) propyl trimethoxy silicane and γ-methacryloxypropyl trimethoxy silane; Described low decomposition temperature organo-peroxide preferably 2,5-2，5-dimethyl-2，5-di(t-butyl peroxy)2，5-hexane and tertbutyl peroxide; Described high decomposition temperature organo-peroxide inhibitor preferably 1,1-bis-(t-butylperoxy)-3,3,5-trimethyl-cyclohexane, peroxidized t-butyl perbenzoate and peroxide acid tert-amyl acetate; Preferred platinum-1 of described catalyzer, the microcapsule platinum catalyst that 3-divinyl tetramethyl disiloxane, diethyl phthalate are sealed, one or more in platinum-tetrahydrofuran base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410298005.7A CN104098906A (en) | 2014-06-30 | 2014-06-30 | Single-component addition type liquid silicone rubber for protecting electronic packaging chips |
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|---|---|---|---|
| CN201410298005.7A CN104098906A (en) | 2014-06-30 | 2014-06-30 | Single-component addition type liquid silicone rubber for protecting electronic packaging chips |
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ID=51667470
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|---|---|---|---|
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105219100A (en) * | 2015-11-12 | 2016-01-06 | 三友（天津）高分子技术有限公司 | A kind of organic silicon resin encapsulant for LED and preparation method thereof |
| CN105778515A (en) * | 2014-12-26 | 2016-07-20 | 广东生益科技股份有限公司 | Halogen-free and phosphorus-free silicon resin composition and prepreg, laminated board, copper-clad board and printing circuit board using same |
| CN111171577A (en) * | 2020-02-10 | 2020-05-19 | 江西蓝星星火有机硅有限公司 | Single-component liquid silicone rubber and preparation method thereof |
| CN111295422A (en) * | 2017-11-07 | 2020-06-16 | 陶氏东丽株式会社 | Organopolysiloxane composition |
| CN111607353A (en) * | 2020-05-20 | 2020-09-01 | 宿迁市同创化工科技股份有限公司 | Branched silicone oil for gluing refractory insulating tape and preparation method thereof |
| CN112694865A (en) * | 2020-12-18 | 2021-04-23 | 广东普赛达密封粘胶有限公司 | Single-component thermosetting organic silicon adhesive for adhering electric kettle and preparation method thereof |
| US11390715B2 (en) | 2017-11-07 | 2022-07-19 | Dow Toray Co., Ltd. | Organopolysiloxane composition |
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2014
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105778515A (en) * | 2014-12-26 | 2016-07-20 | 广东生益科技股份有限公司 | Halogen-free and phosphorus-free silicon resin composition and prepreg, laminated board, copper-clad board and printing circuit board using same |
| CN105219100A (en) * | 2015-11-12 | 2016-01-06 | 三友（天津）高分子技术有限公司 | A kind of organic silicon resin encapsulant for LED and preparation method thereof |
| CN111295422A (en) * | 2017-11-07 | 2020-06-16 | 陶氏东丽株式会社 | Organopolysiloxane composition |
| US11390715B2 (en) | 2017-11-07 | 2022-07-19 | Dow Toray Co., Ltd. | Organopolysiloxane composition |
| CN111295422B (en) * | 2017-11-07 | 2022-11-04 | 陶氏东丽株式会社 | Organopolysiloxane composition |
| US11655367B2 (en) | 2017-11-07 | 2023-05-23 | Dow Toray Co., Ltd. | Organopolysiloxane composition |
| CN111171577A (en) * | 2020-02-10 | 2020-05-19 | 江西蓝星星火有机硅有限公司 | Single-component liquid silicone rubber and preparation method thereof |
| CN111171577B (en) * | 2020-02-10 | 2022-08-30 | 江西蓝星星火有机硅有限公司 | Single-component liquid silicone rubber and preparation method thereof |
| CN111607353A (en) * | 2020-05-20 | 2020-09-01 | 宿迁市同创化工科技股份有限公司 | Branched silicone oil for gluing refractory insulating tape and preparation method thereof |
| CN112694865A (en) * | 2020-12-18 | 2021-04-23 | 广东普赛达密封粘胶有限公司 | Single-component thermosetting organic silicon adhesive for adhering electric kettle and preparation method thereof |
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Application publication date: 20141015 |