CN104098340B - High emissivity ceramic fiber plate and preparation method thereof - Google Patents
High emissivity ceramic fiber plate and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a high emissivity ceramic fiber plate and a preparation method thereof. The high emissivity ceramic fiber plate is formed by composite process of a raw material of an ordinary ceramic fiber plate and an infrared high emissivity powder material; the raw material of the ordinary ceramic fiber plate comprises the following raw materials: aluminum silicate short ceramic fiber, an organic binding agent, an inorganic binding agent and an additive; the infrared high emissivity powder material comprises the following raw materials: silicon dioxide or iron-ore slag, iron oxide, manganese oxide, zirconia, chromic oxide and silicon carbide; the organic binding agent comprises the following raw materials: resin, starch and cellulose; the inorganic binding agent comprises silica sol or aluminium colloidal sol; the additive comprises silicon dioxide superfine powder. The prepared high emissivity ceramic fiber plate has various advantages of a conventional ceramic fiber plate, improves heat and shock resistance and aging resistance, particularly has high infrared emissivity, can play the function of increasing radiation in a furnace chamber, can effectively improve heat utilization in the furnace chamber, and plays the function of energy conservation and efficiency acceleration.
Description
Technical field
The present invention relates to a kind of high temperature kiln refractory material, more particularly, to a kind of high emissivity ceramic beaverboard and its preparation
Method.
Background technology
Ceramic beaverboard is a kind of widely used high temperature insulating material, remains to keep preferably during applied at elevated temperature
Mechanical strength and mechanical property, and long service life, are widely used in the kiln of the industries such as cement, petrochemical industry, metallurgy, pottery, glass
Stove is incubated.In recent years, with the raising of the performances such as the intensity of ceramic beaverboard, refractoriness, anti-thermal shock, also it is used for high temperature kiln
Work surface.
In prior art, Chinese patent cn102515661a, cn101591193, cn101462876, cn102464469a
Etc. individually disclosing fine plate of dissimilar pottery and preparation method thereof.
Above-mentioned prior art at least has the disadvantage in that
The fine plate generally existing infrared emittance of pottery relatively low (usually 0.6 about) is it is impossible to the heat in effectively utilizes burner hearth is penetrated
Line.And high infrared emittance can improve the heat utilization efficiency in burner hearth, play the effect of energy saving.Therefore, prior art
In the fine plate of pottery thermal radiation effect poor, especially for the pottery fibre plate in furnace operation face, thermal radiation effect is especially undesirable.
Content of the invention
It is an object of the invention to provide a kind of heat utilization efficiency effectively improving in burner hearth, play the height of energy efficiency effect
Emissivity ceramic beaverboard and preparation method thereof.
The purpose of the present invention is achieved through the following technical solutions:
The high emissivity ceramic beaverboard of the present invention, this high emissivity ceramic beaverboard by common make pottery fine plate raw material with red
Outer high emissivity powder body material Compound Machining forms；
The raw material of described common pottery fibre plate raw material includes: the short ceramic fibre of aluminium silicate, organic bond, inorganic combination
Agent, additive；
The raw material of described infrared high emissivity powder body material includes: silicon dioxide or Iron-ore Slag, ferrum oxide, manganese oxide, oxygen
Change zirconium, chromium oxide, carborundum.
The method preparing above-mentioned high emissivity ceramic beaverboard of the present invention, comprises the following steps:
A, the preparation of infrared high emissivity powder body material:
A1. weigh powder body raw material by following weight proportion: Iron-ore Slag or silicon dioxide 30-75 part, ferrum oxide 5-15 part,
Manganese oxide 5-15 part, zirconium oxide 5-15 part, chromium oxide 5-15 part, carborundum 5-15 part；
A2. weighed for step a1 powder body raw material is carried out ball milling, and be sufficiently mixed uniformly；
A3. step a2 gained mixed powder is carried out heat treatment at high temperature, heat treatment temperature is 1000 DEG C～1150 DEG C,
Process time is 6～24 hours；
A4. the powder body obtaining step a3 carries out ball milling, obtains particle diameter distribution infrared from tens nanometer to some tens of pm
High emissivity powder body；
B, common fine plate slurry preparation of making pottery:
B1. weigh 25-35 part alumina-silicate ceramic fibre by weight ratio, 1-5 part organic bond, 5-15 part additive,
25-35 part inorganic bonding agent；
B2. raw material selected by b1 step is mixed and add water and be uniformly mixing to obtain common fine plate slurry of making pottery；
C, the fine plate slurry preparation of high emissivity pottery:
C1. 20-30 part alumina-silicate ceramic fibre, 1-5 part organic bond, 1-5 part additive, 6- are weighed by weight ratio
15 parts of high emissivity powder body, 25-35 part inorganic bonding agent；
C2. raw material selected by c1 step is mixed and add water and be uniformly mixing to obtain the fine plate slurry of high emissivity pottery；
D, the preparation high emissivity fine wet base of plate of pottery or the fine wet base of plate of compound high emissivity pottery:
Fine for step c gained high emissivity pottery plate slurry is added molding tank, and makes it evenly laid out, then carry out vacuum and take off
Water, the demoulding obtains the fine wet base of plate of high emissivity pottery；
Or:
Fine for made for step c high emissivity pottery plate slurry is added molding tank, first after molding pot bottom uniformly fills one layer,
Again by made for step b common pottery fibre plate slurry uniform fold above it, then it is dehydrated, the demoulding obtains compound high emission
The fine wet base of plate of rate pottery；
E, drying: the high emissivity fine wet base of plate of pottery that be obtained step d or the fine wet base of plate of compound high emissivity pottery are dried
Hardening obtains product.
As seen from the above technical solution provided by the invention, high emissivity ceramic fibre provided in an embodiment of the present invention
Plate and preparation method thereof, because high emissivity ceramic beaverboard is by common fine plate raw material and the infrared high emissivity powder body material of making pottery
Compound Machining forms, and has the fine plate each side advantage of tradition pottery concurrently, has high infrared emittance simultaneously again, can play increase burner hearth
Radiation effects, after high temperature kiln inwall is installed, can effectively improve the heat utilization efficiency in burner hearth, play the effect of energy efficiency.
Brief description
Fig. 1 is the schematic flow sheet of the preparation method of high emissivity ceramic beaverboard in the embodiment of the present invention one and two；
Fig. 2 is the schematic flow sheet of the preparation method of high emissivity ceramic beaverboard in the embodiment of the present invention three and four.
Specific embodiment
The embodiment of the present invention will be described in further detail below.
The high emissivity ceramic beaverboard of the present invention, its preferably specific embodiment is:
This high emissivity ceramic beaverboard is by common fine plate raw material and the infrared high emissivity powder body material Compound Machining of making pottery
Form；
The raw material of described common pottery fibre plate raw material includes: the short ceramic fibre of aluminium silicate, organic bond, inorganic combination
Agent, additive；
The raw material of described infrared high emissivity powder body material includes: silicon dioxide or Iron-ore Slag, ferrum oxide, manganese oxide, oxygen
Change zirconium, chromium oxide, carborundum.
Described organic bond include resin, starch, cellulose or therein one or two, described inorganic bonding agent bag
Include Ludox or Alumina gel, described additive includes silicon dioxide ultrafine powder body.
The composition of described Iron-ore Slag includes: the oxygen of the silicon dioxide of 65%～80% weight portion and 10%～18% weight portion
Change ferrum, in described Iron-ore Slag, calcium, aluminum, the content of magnesium oxide are 10%～18% weight portion.
The method preparing above-mentioned high emissivity ceramic beaverboard of the present invention, its preferably specific embodiment is:
Comprise the following steps:
A, the preparation of infrared high emissivity powder body material:
A1. weigh powder body raw material by following weight proportion: Iron-ore Slag or silicon dioxide 30-75 part, ferrum oxide 5-15 part,
Manganese oxide 5-15 part, zirconium oxide 5-15 part, chromium oxide 5-15 part, carborundum 5-15 part；
A2. weighed for step a1 powder body raw material is carried out ball milling, and be sufficiently mixed uniformly；
A3. step a2 gained mixed powder is carried out heat treatment at high temperature, heat treatment temperature is 1000 DEG C～1150 DEG C,
Process time is 6～24 hours；
A4. the powder body obtaining step a3 carries out ball milling, obtains particle diameter distribution infrared from tens nanometer to some tens of pm
High emissivity powder body；
B, common fine plate slurry preparation of making pottery:
B1. weigh 25-35 part alumina-silicate ceramic fibre by weight ratio, 1-5 part organic bond, 5-15 part additive,
25-35 part inorganic bonding agent；
B2. raw material selected by b1 step is mixed and add water and be uniformly mixing to obtain common fine plate slurry of making pottery；
C, the fine plate slurry preparation of high emissivity pottery:
C1. 20-30 part alumina-silicate ceramic fibre, 1-5 part organic bond, 1-5 part additive, 6- are weighed by weight ratio
15 parts of high emissivity powder body, 25-35 part inorganic bonding agent；
C2. raw material selected by c1 step is mixed and add water and be uniformly mixing to obtain the fine plate slurry of high emissivity pottery；
D, the preparation high emissivity fine wet base of plate of pottery or the fine wet base of plate of compound high emissivity pottery:
Fine for step c gained high emissivity pottery plate slurry is added molding tank, and makes it evenly laid out, then carry out vacuum and take off
Water, the demoulding obtains the fine wet base of plate of high emissivity pottery；
Or:
Fine for made for step c high emissivity pottery plate slurry is added molding tank, first after molding pot bottom uniformly fills one layer,
Again by made for step b common pottery fibre plate slurry uniform fold above it, then it is dehydrated, the demoulding obtains compound high emission
The fine wet base of plate of rate pottery；
E, drying: the high emissivity fine wet base of plate of pottery that be obtained step d or the fine wet base of plate of compound high emissivity pottery are dried
Hardening obtains product.
The thickness of the described high emissivity pottery fibre wet base of plate is 0.8cm～2.5cm；Described compound high emissivity pottery fibre plate is wet
In base, the thickness of the fine flaggy of high emissivity pottery is 0.5cm～1cm.
High emissivity ceramic beaverboard of the present invention and preparation method thereof, has high infrared emittance and can play increase stove
Thorax radiation effects, this pottery fibre plate had both had each side advantage of common fine plate of making pottery, and infrared emittance is high simultaneously, in high temperature kiln
After inwall is installed, the heat utilization efficiency in burner hearth can be effectively improved, play the effect of energy efficiency；And this high emissivity ceramic fibre
High mechanical strength when plate uses, mechanical property is good, surface hallrcuts are few, not scaling-off, do not fall off, can be warm below 1100 DEG C for a long time
Degree work, thermal shock resistance is better than conventional ceramic fibre board.After testing, using the high emissivity ceramic beaverboard of said method preparation
When 800 DEG C, normal direction total emissivity is more than 0.83, and life-time service is non-aging.
Specific embodiment one:
1st, high emissivity powder body material preparation: weigh silicon dioxide 9kg, ferrum oxide 3kg, manganese oxide 2kg, zirconium oxide 2kg,
Chromium oxide 2kg, carborundum 2kg, add ball mill, and ground and mixed is uniform.By the powder body after mix homogeneously in 1100 DEG C of heat treatments 8
Hour.Through ball milling ultra fine, high emission from tens nanometer to some tens of pm for the prepared particle diameter distribution after end to be heated
Rate powder body.Raw material selected by this step is technical pure powder body, and its powder granularity is about 200 mesh.
2nd, common fine plate slurry preparation of making pottery: weigh alumina-silicate ceramic fibre 50kg, organic bond (resin, starch, fiber
Element) 5kg, inorganic bonding agent (Ludox) 50kg, additive (silicon dioxide ultrafine powder body) 20kg add mixing tank stirring, use
Machinery or air stirring method stir to the common pottery fibre plate slurry with certain viscosity.According to inorganic knot used
The content of mixture Ludox, needs when prepared by slurry to add appropriate water if necessary.
3rd, high emissivity pottery fine plate slurry preparation: weigh alumina-silicate ceramic fibre 23kg, organic bond (resin, starch,
Cellulose) 2kg, inorganic bonding agent (Ludox) 25kg, additive (silicon dioxide ultrafine powder body) 2kg addition mixing tank stirring,
High emissivity powder body 12kg, is stirred to the high emissivity with certain viscosity using machinery or air stirring method
The fine plate slurry of pottery.According to the content of inorganic bonding agent Ludox used, appropriate water need to be added when prepared by slurry.
4th, compound high emissivity pottery fibre plate wet base preparation: fine for made for step 3 high emissivity pottery plate slurry is added molding
Tank, after the fine plate slurry of high emissivity pottery is full of and is evenly distributed on molding pot bottom, by made for step 2 common pottery fibre plate slurry
Uniform fold is made pottery on fine plate slurry in high emissivity, then using evacuation mode, slurry is dehydrated, makes band after the demoulding
The compound pottery fibre wet base of plate of high emissivity layer.Wherein, the fine plate slurry layer thickness of high emissivity pottery controls in about 0.8cm, commonly
Pottery fine plate slurry layer thickness controls in 1.5cm.
5th, compound high emissivity pottery fibre board finished product preparation: fine for compound for the step 4 gained high emissivity pottery wet base of plate is put
Enter drying room to dry, drying temperature 100-150 DEG C.Hardening to be dried, reaches and takes out during preferable intensity, obtain compound high emission
The fine plate of rate pottery, and as needed to its cutting, trimming, grinding, prepared finished product of the present invention.
Specific embodiment two:
For reduces cost, the silica material in the preparation of high emissivity powder body material can be substituted by Iron-ore Slag.
1st, high emissivity powder body material preparation: weigh Iron-ore Slag 10kg, ferrum oxide 2kg, manganese oxide 2kg, zirconium oxide 2kg,
Chromium oxide 2kg, carborundum 2kg, add ball mill, and ground and mixed is uniform.By the powder body after mix homogeneously in 1100 DEG C of heat treatments 8
Hour.Through ball milling ultra fine, high emission from tens nanometer to some tens of pm for the prepared particle diameter distribution after end to be heated
Rate powder body.Selected by this step, raw material is technical pure, and its granularity is about 200 mesh.
2nd, common fine plate slurry preparation of making pottery: identical with step 2 in embodiment one.Weigh alumina-silicate ceramic fibre 50kg, have
Machine bonding agent (resin, starch, cellulose) 5kg, inorganic bonding agent (Ludox) 50kg, additive (silicon dioxide ultrafine powder body)
20kg adds mixing tank stirring, is stirred to the common pottery with certain viscosity using machinery or air stirring method
Fine plate slurry.According to the content of inorganic bonding agent Ludox used, appropriate water need to be added when prepared by slurry.
3rd, high emissivity pottery fine plate slurry preparation: identical with step 3 in embodiment one.Weigh alumina-silicate ceramic fibre
23kg, organic bond (resin, starch, cellulose) 2kg, inorganic bonding agent (Ludox) 25kg, (silicon dioxide surpasses additive
Fine powder body) 2kg addition mixing tank stirring, high emissivity powder body 12kg, stirred using machinery or air stirring method
To the fine plate slurry of high emissivity pottery with certain viscosity.According to the content of inorganic bonding agent Ludox used, in slurry system
Appropriate water need to be added when standby.
4th, compound high emissivity pottery fibre plate wet base preparation: fine for made for step 3 high emissivity pottery plate slurry is added molding
Tank, after the fine plate slurry of high emissivity pottery is full of and is evenly distributed on molding pot bottom, by made for step 2 common pottery fibre plate slurry
Uniform fold is made pottery on fine plate slurry in high emissivity, then using evacuation mode, slurry is dehydrated, makes band after the demoulding
The composite ceramic fibre wet base of plate of high emissivity layer.Wherein, the fine plate slurry layer thickness of high emissivity pottery controls in about 0.8cm, common pottery
Fine plate slurry layer thickness controls in 1.5cm.
5th, compound high emissivity pottery fibre board finished product preparation: fine for compound for the step 4 gained high emissivity pottery wet base of plate is put
Enter drying room to dry, drying temperature 100-150 DEG C.Hardening to be dried, reaches and takes out during preferable intensity, obtain compound high emission
The fine plate of rate pottery, and as needed to its cutting, trimming, grinding, prepared finished product of the present invention.
Specific embodiment three:
1st, high emissivity powder body material preparation: weigh silicon dioxide 9kg, ferrum oxide 3kg, manganese oxide 2kg, zirconium oxide 2kg,
Chromium oxide 2kg, carborundum 2kg, add ball mill, and ground and mixed is uniform.By the powder body after mix homogeneously in 1100 DEG C of heat treatments 8
Hour.Through ball milling ultra fine, high emission from tens nanometer to some tens of pm for the prepared particle diameter distribution after end to be heated
Rate powder body.Selected by this step, raw material is technical pure, and its granularity is about 200 mesh.
2nd, high emissivity pottery fine plate slurry preparation: weigh alumina-silicate ceramic fibre 23kg, organic bond (resin, starch,
Cellulose) 2kg, inorganic bonding agent (Ludox) 25kg, additive (silicon dioxide ultrafine powder body) 2kg, high emissivity powder body
12kg adds mixing tank stirring, is stirred to the slurry with certain viscosity using machinery or air stirring method.
According to the content of inorganic bonding agent Ludox used, appropriate water need to be added when prepared by slurry.
3rd, high emissivity pottery fine plate wet base preparation: the fine plate slurry of high emissivity pottery that step 2 is obtained is put in molding tank,
It is uniformly filled in molding pot bottom, in molding tank, the amount of filling paste is to eventually form the finished product high emission that thickness is about 1.5cm
The fine plate of rate pottery is defined, and then, using evacuation mode, slurry is dehydrated, and makes the fine wet base of plate of high emissivity pottery after the demoulding.
4th, high emissivity pottery fine board finished product preparation: drying room put into by the fine wet base of plate of high emissivity pottery that step 3 is obtained dries,
Drying temperature is 100-150 DEG C.Hardening to be dried, reaches and takes out during preferable intensity, obtains the fine plate of high emissivity pottery, and according to
Need to its cutting, trimming, grinding, prepared finished product of the present invention.
Specific embodiment four:
For reduces cost, the silica material in the preparation of high emissivity powder body material can be substituted by Iron-ore Slag.
1st, high emissivity powder body material preparation: weigh Iron-ore Slag 10kg, ferrum oxide 2kg, manganese oxide 2kg, zirconium oxide 2kg,
Chromium oxide 2kg, carborundum 2kg, add ball mill, and ground and mixed is uniform.By the powder body after mix homogeneously in 1100 DEG C of heat treatments 8
Hour.Through ball milling ultra fine, high emission from tens nanometer to some tens of pm for the prepared particle diameter distribution after end to be heated
Rate powder body.Selected by this step, raw material is technical pure, and its granularity is about 200 mesh.
2nd, high emissivity pottery fine plate slurry preparation: weigh alumina-silicate ceramic fibre 23kg, organic bond (resin, starch,
Cellulose) 2kg, inorganic bonding agent (Ludox) 25kg, additive (silicon dioxide ultrafine powder body) 2kg, high emissivity powder body
12kg adds mixing tank stirring, is stirred to the slurry with certain viscosity using machinery or air stirring method.
According to the content of inorganic bonding agent Ludox used, appropriate water need to be added when prepared by slurry.
3rd, high emissivity pottery fine plate wet base preparation: the fine plate slurry of high emissivity pottery that step 2 is obtained is put in molding tank,
It is uniformly filled in molding pot bottom, in molding tank, the amount of filling paste is to eventually form the finished product high emission that thickness is about 1.5cm
The fine plate of rate pottery is defined, and then, using evacuation mode, slurry is dehydrated, and makes the fine wet base of plate of high emissivity pottery after the demoulding.
4th, high emissivity pottery fine board finished product preparation: drying room put into by the fine wet base of plate of high emissivity pottery that step 3 is obtained dries,
Drying temperature is 100-150 DEG C.Hardening to be dried, reaches and takes out during preferable intensity, obtains the fine plate of high emissivity pottery, and according to
Need to its cutting, trimming, grinding, prepared finished product of the present invention.
According to the fine plate of (compound) pottery of the prepared high emissivity of above-mentioned flow process after tested, the normal direction total emissivity when 800 DEG C
More than 0.83, after high-temperature burner hearth inwall uses, there is obvious energy-saving effect.Material mechanical performance, surface in high temperature is strong simultaneously
Spend, not easy to crack, not scaling-off, thermal shock resistance is strong, can long-term work at 1100 DEG C.And product has stable performance, is difficult
Aging, long service life, cheap the advantages of.After using in high temperature kiln burner hearth not only can energy-conservation, and can protect
Furnace retaining thorax, extends kiln service life.
The above, the only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto,
Any those familiar with the art in the technical scope of present disclosure, the change or replacement that can readily occur in,
All should be included within the scope of the present invention.Therefore, protection scope of the present invention should be with the protection model of claims
Enclose and be defined.
Claims (2)
1. a kind of method preparing high emissivity ceramic beaverboard is it is characterised in that described high emissivity ceramic beaverboard is by general
Logical pottery fibre plate raw material is formed with infrared high emissivity powder body material Compound Machining；
The raw material of the fine plate raw material of described common pottery includes: the short ceramic fibre of aluminium silicate, organic bond, inorganic bonding agent, adds
Plus agent；
The raw material of described infrared high emissivity powder body material includes: silicon dioxide or Iron-ore Slag, ferrum oxide, manganese oxide, zirconium oxide,
Chromium oxide, carborundum；
The composition of described Iron-ore Slag includes: the oxidation of the silicon dioxide of 65%～80% weight portion and 10%～18% weight portion
Ferrum, in described Iron-ore Slag, calcium, aluminum, the content of magnesium oxide are 10%～18% weight portion；
Described preparation method comprises the following steps:
A, the preparation of infrared high emissivity powder body material:
A1. weigh powder body raw material: Iron-ore Slag or silicon dioxide 30-75 part, ferrum oxide 5-15 part, oxidation by following weight proportion
Manganese 5-15 part, zirconium oxide 5-15 part, chromium oxide 5-15 part, carborundum 5-15 part；
A2. weighed for step a1 powder body raw material is carried out ball milling, and be sufficiently mixed uniformly；
A3. step a2 gained mixed powder is carried out heat treatment at high temperature, heat treatment temperature is 1000 DEG C～1150 DEG C, process
Time is 6～24 hours；
A4. the powder body obtaining step a3 carries out ball milling, obtains particle diameter distribution infrared occurred frequently from tens nanometer to some tens of pm
Penetrate rate powder body material；
B, common fine plate slurry preparation of making pottery:
B1. the short ceramic fibre of 25-35 part aluminium silicate, 1-5 part organic bond, 5-15 part additive, 25- are weighed by weight ratio
35 parts of inorganic bonding agents；
B2. raw material selected by b1 step is mixed and add water and be uniformly mixing to obtain common fine plate slurry of making pottery；
C, the fine plate slurry preparation of high emissivity pottery:
C1. the short ceramic fibre of 20-30 part aluminium silicate, 1-5 part organic bond, 1-5 part additive, 6-15 are weighed by weight ratio
The infrared high emissivity powder body material of part, 25-35 part inorganic bonding agent；
C2. raw material selected by c1 step is mixed and add water and be uniformly mixing to obtain the fine plate slurry of high emissivity pottery；
D, the preparation high emissivity fine wet base of plate of pottery or the fine wet base of plate of compound high emissivity pottery:
Fine for step c gained high emissivity pottery plate slurry is added molding tank, and makes it evenly laid out, then carry out vacuum dehydration,
The demoulding obtains the fine wet base of plate of high emissivity pottery；
Or:
Fine for made for step c high emissivity pottery plate slurry is added molding tank, first after molding pot bottom uniformly fills one layer, then will
The made common pottery fibre plate slurry uniform fold of step b above it, is then dehydrated, the demoulding obtains compound high emissivity pottery
The wet base of fine plate；
E, drying: the high emissivity fine wet base of plate of pottery that be obtained step d or the fine wet base of plate of compound high emissivity pottery dry hardening
Obtain product；
The thickness of the described high emissivity pottery fibre wet base of plate is 0.8cm～2.5cm；In the described compound high emissivity pottery fibre wet base of plate
The thickness of the fine flaggy of high emissivity pottery is 0.5cm～1cm.
2. the method for preparation high emissivity ceramic beaverboard according to claim 1 is it is characterised in that described combination
Agent includes resin, starch and cellulose, and described inorganic bonding agent includes Ludox or Alumina gel, and described additive includes titanium dioxide
Silicon superfine powder.
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| CN201410323569.1A CN104098340B (en) | 2014-07-08 | 2014-07-08 | High emissivity ceramic fiber plate and preparation method thereof |
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|---|---|---|---|
| CN201410323569.1A CN104098340B (en) | 2014-07-08 | 2014-07-08 | High emissivity ceramic fiber plate and preparation method thereof |
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| CN104098340B true CN104098340B (en) | 2017-01-18 |
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| US7179546B1 (en) * | 2004-12-03 | 2007-02-20 | Vapor Technologies, Inc. | Decorative and protective coating |
| CN202943945U (en) * | 2012-11-22 | 2013-05-22 | 阿尔赛(苏州)无机材料有限公司 | Refractory fiber module |
| CN103613962B (en) * | 2013-11-08 | 2015-07-29 | 中国科学院合肥物质科学研究院 | A kind of infrared high emissivity coating material and preparation method |
| CN103640284B (en) * | 2013-12-11 | 2015-08-19 | 重庆埃泰克能源科技有限公司 | A kind of infra-red radiation strengthens composite ceramic fiber board and preparation method |
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