CN104096657A - Equipment convenient for coating of bottoms of printed circuit boards and method thereof - Google Patents
Equipment convenient for coating of bottoms of printed circuit boards and method thereof Download PDFInfo
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- CN104096657A CN104096657A CN201410336854.7A CN201410336854A CN104096657A CN 104096657 A CN104096657 A CN 104096657A CN 201410336854 A CN201410336854 A CN 201410336854A CN 104096657 A CN104096657 A CN 104096657A
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- wiring board
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to the coating technology, in particular to equipment convenient for coating of bottoms of printed circuit boards and a method thereof. The equipment comprises a washing claw system, a horizontal flowing type coating system, a hot air circulating system, a preheating sealing system and a cooling system, all of which are connected to a double-guide rail transmission system in sequence. An air extraction system is arranged above the horizontal flowing type coating system. The horizontal flowing type coating system comprises an incoming board connecting mechanism, a photoelectric sensor, a PLC, a glue barrel and a horizontal flowing wave nozzle valve, wherein the incoming board connecting mechanism is connected with the double-guide rail transmission system; the photoelectric sensor is arranged on the incoming board connecting mechanism; the PLC is connected with the photoelectric sensor and the horizontal flowing wave nozzle valve; and the horizontal flowing wave nozzle valve is connected to the glue barrel through a pipe. The invention further includes a coating method realized based on the equipment. The equipment has the advantages of simple production process, convenience for operation, safety and reliability, low investment cost, high product yield and high production efficiency, and can coat the printed circuit boards of different types in the electronic industry.
Description
Technical field
The present invention relates to the paint-on technique on a kind of electronic product surface, be specifically a kind ofly convenient to the Apparatus for () and method therefor that the primary coat of printed substrate plate is covered.
Background technology
Surface coating technique refers to the technology that applies a kind of prevention material on the surface of product, and its effect is mainly manifested in the waterproof on product coating surface, dustproof, antistatic.It is in product stromal surface, to form a kind of rete that surface applies, and is used for improving and protecting the surface of product.The coating thickness that electronic product surface applies is generally tens microns, even still less.At present, the painting method in electron trade is mainly divided into hand spray, immersion, brushing, equipment spraying.
Equipment spraying is exactly to adopt special spraying equipment product to be carried out to the coating of three anti-glue, and this painting method is the method for covering for the primary coat of printed substrate plate the most often adopting in current electron trade.The general technology flow process of existing equipment spraying is: first by manually the wiring board being completed being entered to spraying equipment (upper plate) by transmitting guide rail; Then, open the spraying valve on spraying equipment, spraying equipment is controlled software program according to the Coating having editted, utilize the method for atomization or injection that three anti-glue are sprayed on printed substrate and (by the flow of accurate control spraying valve, guarantee three anti-coating effects of 0.03mm-0.13mm thickness); After equipment full-automatic spraying completes (spraying), the coating thickness (inspection) of desk checking wiring board, then through heat cure or the curing baking and curing (solidifying) of UV, whether solidify intact (inspection) through manually again checking; Cooling system finally by equipment tail end is automatically cooling, after wiring board is automatically cooling, has completed coating processes, then by wiring board through being manually sent to next procedure (lower plate).
Equipment spraying method has had revolutionary improvement compared with methods such as hand spray, immersion, brushings, has greatly improved production efficiency and product quality.But also there is very large deficiency in existing equipment spraying: equipment investment cost is large, expensive, complicated operation, inefficiency; In addition, equipment spraying needs personnel to stand fast in workplace in process of production, and equipment spraying process needs clean maintenance in time, and cost of labor is very large; Equipment is after stopping using after a while, and while reusing, solvent pipe needs all to change, and increases consumables cost; Spray to turnover consolidation zone from printed substrate access arrangement, production status is discontinuity therebetween, enters inspection point and just allow next flake products to enter spraying after need one flake products spraying, and production efficiency is comparatively low.
Summary of the invention
The object of the invention is to solve the deficiency in background technology, propose a kind of Apparatus for () and method therefor that the primary coat of printed substrate plate is covered of being convenient to, can reduce manual operation, enhance productivity, reduce production costs.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is: be a kind ofly convenient to the equipment that the primary coat of printed substrate plate is covered, comprise and wash jaw system, exhausting system, flat flow application system, hot air circulating system, preheating sealing system and cooling system, it is characterized in that, also comprise two guide rail transmission systems; The described jaw system, flat flow application system, hot air circulating system, preheating sealing system, cooling system washed is connected in two guide rail transmission systems successively, and described exhausting system is located at flat flow application system top; Described flat flow application system comprises entering plate connecting mechanism, induction light eye, PLC, glue bucket and advection ripple nozzle valve, described entering plate connecting mechanism connects two guide rail transmission systems, described induction light eye is located on entering plate connecting mechanism, described PLC is connected with induction light eye, advection ripple nozzle valve respectively, and described advection ripple nozzle valve is connected in glue bucket by pipeline.
The equipment that printed substrate plate primary coat based on described is covered, the invention allows for a kind of method that the primary coat of printed substrate plate is covered of being convenient to, it is characterized in that, the method comprises the following steps: (1) first opens described coating equipment, the intact wiring board of test is placed in two guide rail transmission systems, after two guide rails transmission, the wiring board described jaw system of washing of flowing through, cleans wiring board through washing jaw system; (2) wiring board after cleaning is transported to the below of described exhausting system through two guide rails, dries up through exhausting system; (3) wiring board after drying up is linked in flat flow application system by described entering plate connecting mechanism, simultaneously, induction light eye on entering plate connecting mechanism receives wiring board and enters the signal of coating state, and by signal feedback to PLC, PLC starts timing and opens advection ripple nozzle valve, be connected wiring board is sprayed with the form of advection ripple with glue bucket by pipeline, in the time that PLC counts the default time, close immediately advection ripple nozzle valve, and by PLC timing zero clearing, for the timing of next wiring board is prepared; (4) coated wiring board is delivered to described hot air circulating system through two guide rail transmission systems, through hot air circulating system, wiring board is carried out to hot air circulation and solidifies; (5) wiring board after solidifying is resent to preheating sealing system and carries out preheating, seal operation; (6) wiring board after pre-heat seal is resent to described cooling system, carries out the cooling work of wiring board; (7) finally cooling complete wiring board is sent to next process through two guide rail transmission systems; By that analogy, lower a slice wiring board repeats according to described painting method.
Preferred: the coating thickness of described flat flow application system is between 30 microns ~ 130 microns.
The invention has the beneficial effects as follows: the equipment covering by inventing a kind of novel printed substrate plate primary coat, simplify coating operating procedure, reduce equipment cost; This equipment adopts two guide rail transmission systems, and orbital velocity can require to adjust according to different product; And adopting flat flow paint-on technique, wiring board cladding thickness after applying can meet technical requirement, effectively prevents shade, blind spot; Adopt wash jaw system can ensure to clean simultaneously liquid level constant height with ensure cleaning performance; The method is controlled advection ripple nozzle valve by PLC and is directly ensured that from extracting glue in glue bucket glue avoids secondary pollution, ensures glue liquid level constant in gum box simultaneously, ensures that glue applies effect and glue quality; Reduce manual operation, reduced cost of labor.
Brief description of the drawings
Fig. 1, coating apparatus structure figure of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
As shown in Figure 1, it is the structure chart of coating equipment of the present invention, this coating equipment is specifically a kind of is convenient to the equipment that the primary coat of printed substrate plate is covered, and this equipment specifically forms by washing jaw system 1, exhausting system 2, flat flow application system 3, hot air circulating system 4, preheating sealing system 5, cooling system 6 and two guide rail transmission system 7.The described jaw system 1, flat flow washed applies 3 systems, hot air circulating system 4, preheating sealing system 5, cooling system 6 and is connected in successively in two guide rail transmission systems 7; Described exhausting system 2 is the tops that are arranged at flat flow application system 3.Further illustrate, described flat flow application system 3 comprises entering plate connecting mechanism, induction light eye, PLC, glue bucket and advection ripple nozzle valve, described entering plate connecting mechanism connects two guide rail transmission systems 7, described induction light eye is located on entering plate connecting mechanism, described PLC is connected with induction light eye, advection ripple nozzle valve respectively, and described advection ripple nozzle valve is connected in glue bucket by pipeline.
Embodiment: the coating equipment of the present embodiment based on described illustrates a kind of method that the primary coat of printed substrate plate is covered of being convenient to, the method comprises the steps: that one is upper plate and cleaning, first open described coating equipment, the intact wiring board of test is placed in two guide rail transmission systems 7, after two guide rail transmission, the wiring board described jaw system 1 of washing of flowing through, cleans wiring board through washing jaw system 1, the wiring board cleaning up is transported to the below of described exhausting system 2 through two guide rails, dry up through exhausting system 2, employing is washed jaw system 1 and is ensured to clean liquid level constant height to ensure cleaning performance with exhausting system 2 simultaneously, the 2nd, apply, wiring board after drying up is linked in flat flow application system 3 by described entering plate connecting mechanism, simultaneously, induction light eye on entering plate connecting mechanism receives wiring board and enters the signal of coating state, and by signal feedback to PLC, PLC starts timing and opens advection ripple nozzle valve, be connected wiring board is sprayed with the form of advection ripple with glue bucket by pipeline, directly ensure that from extracting glue in glue bucket glue avoids secondary pollution, ensure glue liquid level constant in gum box simultaneously, to ensure that glue applies effect and glue quality, gush cementing Shu Shike and be back to glue bucket sealing preservation by advection ripple nozzle valve, prevent glue oxidation, dry, according to the size of the area of the requirement of wiring board coating thickness and wiring board, preset the timing time value in PLC, in the time that PLC counts the default time, close immediately advection ripple nozzle valve, and by PLC timing zero clearing, for the timing of next wiring board is prepared, adopt flat flow application system 3, wiring board cladding thickness after applying meets technical requirement, effectively prevent shade, blind spot, the 3rd, hot air circulation is solidified, and coated wiring board is delivered to described hot air circulating system through two guide rail transmission systems, through hot air circulating system, wiring board is carried out to hot air circulation and solidifies, wiring board after solidifying is resent to preheating sealing system and carries out preheating, seal operation, adopts hot air circulating system 4 and preheating sealing system to make to heat in more effective removal glue of soft while diluent to reach glue rapid curing drying effect, the 4th, cooling, the wiring board after pre-heat seal is resent to described cooling system, carries out the cooling work of wiring board, finally cooling complete wiring board is sent to next process through two guide rail transmission systems, so far, completed the coating processes of a slice wiring board, by that analogy, lower a slice wiring board repeats according to described painting method.
Utilize coating equipment of the present invention and painting method to meet coat thickness requirement in IPC-CC-860; According to the requirement of printed substrate coating thickness, equipment can do the angle adjustment of 4 degree ~ 7 degree, and coating thickness interval is at 30 microns ~ 130 microns; Monolithic printed substrate consecutive production applies, and reduces the turnover plate stand-by period, and coating time only needs 10S, 8 hours 2880 of outputs; Manufacturing process is simple, easy to operate, safe and reliable, and equipment investment cost is low, product percent of pass is high, production efficiency is high; Can apply different classes of printed substrate in electron trade.
Claims (3)
1. be convenient to the equipment that the primary coat of printed substrate plate is covered for one kind, comprise and wash jaw system (1), exhausting system (2), flat flow application system (3), hot air circulating system (4), preheating sealing system (5) and cooling system (6), it is characterized in that: also comprise two guide rail transmission systems (7); The described jaw system, flat flow application system, hot air circulating system, preheating sealing system, cooling system washed is connected in two guide rail transmission systems successively, and described exhausting system is located at flat flow application system top; Described flat flow application system (3) comprises entering plate connecting mechanism, induction light eye, PLC, glue bucket and advection ripple nozzle valve, described entering plate connecting mechanism connects two guide rail transmission systems (7), described induction light eye is located on entering plate connecting mechanism, described PLC is connected with induction light eye, advection ripple nozzle valve respectively, and described advection ripple nozzle valve is connected in glue bucket by pipeline.
2. being convenient to the method that the primary coat of printed substrate plate is covered, is coating equipment based on described in claim 1, it is characterized in that: the method comprises the following steps,
(1) first open the power supply of described coating equipment, the intact wiring board of test is placed on to two guide rail transmission systems (7) upper, after two guide rails transmission, wiring board is washed jaw system (1) described in flowing through, and through washing jaw system, wiring board is cleaned;
(2) wiring board after cleaning is transported to the below of described exhausting system (2) through two guide rails, dries up through exhausting system;
(3) wiring board after drying up is linked in flat flow application system (3) by described entering plate connecting mechanism, simultaneously, induction light eye on entering plate connecting mechanism receives wiring board and enters the signal of coating state, and by signal feedback to PLC, PLC starts timing and opens advection ripple nozzle valve, be connected wiring board is sprayed with the form of advection ripple with glue bucket by pipeline, in the time that PLC counts the default time, close immediately advection ripple nozzle valve, and by PLC timing zero clearing, for the timing of next wiring board is prepared;
(4) coated wiring board is delivered to described hot air circulating system (4) through two guide rails, through hot air circulating system, wiring board is carried out to hot air circulation and solidifies;
(5) wiring board after solidifying is resent to preheating sealing system (5) and carries out preheating, seal operation;
(6) wiring board after pre-heat seal is resent to described cooling system (6), carries out the cooling work of wiring board;
(7) finally cooling complete wiring board is sent to next process through two guide rail transmission systems (7); By that analogy, lower a slice wiring board repeats according to described painting method.
3. be according to claim 2ly convenient to the method that the primary coat of printed substrate plate is covered, it is characterized in that: the coating thickness of described flat flow application system (3) is between 30 microns ~ 130 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410336854.7A CN104096657A (en) | 2014-07-15 | 2014-07-15 | Equipment convenient for coating of bottoms of printed circuit boards and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410336854.7A CN104096657A (en) | 2014-07-15 | 2014-07-15 | Equipment convenient for coating of bottoms of printed circuit boards and method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104096657A true CN104096657A (en) | 2014-10-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410336854.7A Pending CN104096657A (en) | 2014-07-15 | 2014-07-15 | Equipment convenient for coating of bottoms of printed circuit boards and method thereof |
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Citations (7)
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| US20090092761A1 (en) * | 2007-10-03 | 2009-04-09 | Seiko Epson Corporation | Discharge method, continuous film formation method, alignment film formation method, method for forming liquid crystal display device, head unit, droplet discharge device, and electronic apparatus |
| CN201862529U (en) * | 2010-10-18 | 2011-06-15 | 汕头市华天富工业发展有限公司 | Production line for coating photographic film of printed-circuit board |
| CN102218381A (en) * | 2010-04-16 | 2011-10-19 | 深圳市佳士科技股份有限公司 | Full-automatic paint spraying machine and paint spraying technology thereof |
| CN202238523U (en) * | 2011-07-19 | 2012-05-30 | 宜桦科技有限公司 | Automatic spraying device for circuit board |
| CN103108493A (en) * | 2013-02-25 | 2013-05-15 | 上海夏普电器有限公司 | Damp-proof processing method of electronic circuit board |
| CN103247558A (en) * | 2012-02-09 | 2013-08-14 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate processing method |
| CN203482508U (en) * | 2013-10-12 | 2014-03-12 | 惠州中城电子科技有限公司 | Circuit board post-processing system for intelligent ammeter |
-
2014
- 2014-07-15 CN CN201410336854.7A patent/CN104096657A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090092761A1 (en) * | 2007-10-03 | 2009-04-09 | Seiko Epson Corporation | Discharge method, continuous film formation method, alignment film formation method, method for forming liquid crystal display device, head unit, droplet discharge device, and electronic apparatus |
| CN102218381A (en) * | 2010-04-16 | 2011-10-19 | 深圳市佳士科技股份有限公司 | Full-automatic paint spraying machine and paint spraying technology thereof |
| CN201862529U (en) * | 2010-10-18 | 2011-06-15 | 汕头市华天富工业发展有限公司 | Production line for coating photographic film of printed-circuit board |
| CN202238523U (en) * | 2011-07-19 | 2012-05-30 | 宜桦科技有限公司 | Automatic spraying device for circuit board |
| CN103247558A (en) * | 2012-02-09 | 2013-08-14 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate processing method |
| CN103108493A (en) * | 2013-02-25 | 2013-05-15 | 上海夏普电器有限公司 | Damp-proof processing method of electronic circuit board |
| CN203482508U (en) * | 2013-10-12 | 2014-03-12 | 惠州中城电子科技有限公司 | Circuit board post-processing system for intelligent ammeter |
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Application publication date: 20141015 |
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