CN104092028B - 抑制共模噪声的平衡馈电差分缝隙天线 - Google Patents

抑制共模噪声的平衡馈电差分缝隙天线 Download PDF

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CN104092028B
CN104092028B CN201410324341.4A CN201410324341A CN104092028B CN 104092028 B CN104092028 B CN 104092028B CN 201410324341 A CN201410324341 A CN 201410324341A CN 104092028 B CN104092028 B CN 104092028B
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洪伟
杨天杨
张彦
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Southeast University
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Abstract

本发明公开了一种抑制共模噪声的平衡馈电差分缝隙天线，基于平面基片集成波导结构，采用缝隙天线作为辐射单元，通过利用在不同激励模式下基片集成波导内电场分布的不同实现在差模信号激励时有效地将能量进行辐射，在共模信号激励时将绝大部分能量反射回去；采用本发明结构的天线能够有效地发射和接收差模信号，同时抑制共模信号的发射和接收，从而实现抑制共模噪声的功能。

Description

抑制共模噪声的平衡馈电差分缝隙天线
技术领域
本发明涉及一种抑制共模噪声、平面集成、小型化的平衡馈电差分缝隙天线，属于通信系统设计技术。
背景技术
微波、毫米波天线作为现代无线通信系统中的重要组成部分，其基本特性是将电信号转化为电磁波信号或者将电磁波信号转化为电信号。根据收发机的系统结构，天线位于系统的末级，负责将射频信号进行发射或将电磁波信号进行接收。天线直接影响着整个系统的性能。选择合适的天线，能够对整个系统性能起到重要的改善。
随着通信技术的发展，微波、毫米波技术开始获得广泛的应用。在微波、毫米波系统中，通信系统对天线性能的要求也提高。高性能的天线结构开始获得受到广泛的关注。
传统的天线结构由于无法对于差模信号中的共模噪声分量实现有效的抑制，因而无法有效的改善系统的信噪比、提高信道容量、改善传输速率。
发明内容
发明目的：为了克服现有技术中存在的不足，本发明提供一种抑制共模噪声的平衡馈电差分缝隙天线，差模激励增益远大于共模激励增益，利用在差模激励和共模激励的情况下天线辐射方向图和反射系数的不同，实现有效地抑制发射电磁波中的共模噪声部分、减小输入到后级差分电路的共模噪声信号、降低对后级电路共模抑制比(CMRR)的要求，同时避免由于巴伦所带来的损耗以及体积的增加(单端电路与双端差分电路连接时需要使用巴伦将单端信号转化为双端差分信号进行连接；使用差分天线与差分电路连接可以省去巴伦)，具有小型化、平面化、可以通过介质基片实现、具有便于与后级射频电路进行集成的优势。
技术方案：为实现上述目的，本发明采用的技术方案为：
一种抑制共模噪声的平衡馈电差分缝隙天线，包括介质基板、设置在介质基板上表面的顶层金属层、设置在介质基板下表面的底层金属层，在介质基板上设置有金属化通孔，金属化通孔的上下两端分别与顶层金属层和底层金属层连接，顶层金属层、底层金属层和金属化通孔共同实现n个基片集成波导结构，在每一个基片集成波导结构的两端激励差分信号，形成差分对馈基片集成波导；对于任意一个基片集成波导结构，顶层金属层上刻蚀有一组条形缝隙，该组条形缝隙中条形缝隙的数目为偶数个，且该组条形缝隙相对于该基片集成波导结构中心成中心对称布置，同时条形缝隙的厚度等于顶层金属层的厚度(即贯穿顶层金属层)；n为自然数，且n≥1；
在基片集成波导结构的两端激励差分信号时，会形成驻波：对于差模信号分量，驻波的波峰个数为偶数个，且波峰的位置与每个条形缝隙的中心位置对应，让差模信号能有效辐射；对于共模信号分量，驻波的波峰个数为奇数个，且波峰的位置与相邻两个条形缝隙的中心位置对应，让共模信号不能有效辐射，实现对共模信号的抑制。
本发明由差分信号进行激励，理想的差分信号是只含有差模激励、不含有共模激励的，但是实际中的差分信号却是含有共模信号分量的，因此需要滤除共模信号分量；本发明中条形缝隙的设计对共模信号分量进行了有效抑制。
优选的，构成一个基片集成波导结构的金属化通孔形成两条平行线阵列，两条平行线阵列相对于直线l对称，且两条平行线阵列垂直于直线l。
优选的，同一组条形缝隙中，相邻两条条形缝隙的中心间距为1/2波长，条形缝隙的长度尺寸和偏移量依据缝隙天线设计理论结合基片集成波导结构的宽度和工作频率得到；条形缝隙的长度和偏移量是不相等的。
优选的，所有基片集成波导结构通过功分器相连，功分器由顶层金属层、底层金属层和另一部金属化通孔构成。
优选的，所述条形缝隙为矩形。
有益效果：本发明提供的抑制共模噪声的平衡馈电差分缝隙天线，基于平面基片集成波导结构，采用缝隙天线作为辐射单元，通过利用在不同激励模式下基片集成波导内电场分布的不同实现在差模激励时有效地将能量进行辐射，在共模激励时将绝大部分能量反射回去；采用本发明结构的天线能够有效地发射和接收差模信号，同时抑制共模信号的发射和接收，从而实现抑制共模噪声的功能；另外，本发明针对毫米波差分电路发展的需求，避免了由巴伦带来的损耗以及体积上的增加，实现了具有高效率，低损耗，高共模噪声抑制比，可与平面射频电路一体集成。
附图说明
图1为本发明中顶层金属层的结构示意图；
图2为本发明沿对称轴虚线剖开的剖视图；
图3为本发明中底层金属层的结构示意图；
图4为实施例的天线反射系数S参数测量结果；
图5为实施例的差模激励时的方向图；
图6为实施例的共模激励时的方向图。
具体实施方式
下面结合附图对本发明作更进一步的说明。
一种抑制共模噪声的平衡馈电差分缝隙天线，包括介质基板3、设置在介质基板3上表面的顶层金属层1、设置在介质基板3下表面的底层金属层2，在介质基板3上设置有金属化通孔4，金属化通孔4的上下两端分别与顶层金属层1和底层金属层2连接，顶层金属层1、底层金属层2和金属化通孔4共同实现n个基片集成波导结构9，在每一个基片集成波导结构9的两端激励差分信号，形成差分对馈基片集成波导；对于任意一个基片集成波导结构9，顶层金属层1上刻蚀有一组条形缝隙5，该组条形缝隙5中条形缝隙5的数目为偶数个，且该组条形缝隙5相对于该基片集成波导结构9中心成中心对称布置，同时条形缝隙5的厚度等于顶层金属层1的厚度；设计底层金属层2为完整的结构，便于与其他电路结构进行集成；n为自然数，且n≥1。
在基片集成波导结构的两端激励差分信号时，会形成驻波：对于差模信号分量，驻波的波峰个数为偶数个，且波峰的位置与每个条形缝隙5的中心位置对应，让差模信号能有效辐射；对于共模信号分量，驻波的波峰个数为奇数个，且波峰的位置与相邻两个条形缝隙5的中心位置对应，让共模信号不能有效辐射，实现对共模信号的抑制。即利用基片集成波导结构的两端激励差分信号时，对于差模信号分量和共模信号分量形成的驻波位置的不同，使用成中心对称的条形缝隙5在差模激励时有效的辐射，在共模激励时不能有效的辐射，实现对共模信号的抑制。
下面结合实施例对本发明做出进一步的说明。
如图1、图2和图3所示为一种抑制共模噪声的平衡馈电差分缝隙天线，采用两层金属印制电路板工艺实现；金属化通孔4形成两个部分：一部分金属化通孔4与顶层金属层1和底层金属层2共同形成六个基片集成波导结构9，另一部分金属化通孔4与顶层金属层1和底层金属层2共同形成两个功分器6、正差分激励端口7和负差分激励端口8，通过两个功分器6将六个基片集成波导结构9连接为一体，正差分激励端口7和负差分激励端口8分别与两个功分器6相连，通过正差分激励端口7和负差分激励端口8向基片集成波导结构9激励差分信号。
如图所示，构成六个基片集成波导结构9的金属化通孔4形成七条平行线阵列，七条平行线阵列相对于直线l对称，且七条平行线阵列垂直于直线l；每一个基片集成波导结构中都设置有一组偶数个矩形的条形缝隙5，且每一组条形缝隙5都相对于对应的基片集成波导结构9中心成中心对称布置。
本案中，通过设置两排金属化通孔之间的距离，保证基片集成波导只传播TE10模式，其传播特性可以通过传统波导理论进行分析。在基片集成波导结构的两端激励差分信号时，会形成驻波，根据波导缝隙天线设计理论计算条形缝隙5的长度和偏移量，使得：对于差模信号分量，驻波的波峰个数为偶数个，且波峰的位置与每个条形缝隙5的中心位置对应，让差模信号能有效辐射；对于共模信号分量，驻波的波峰个数为奇数个，且波峰的位置与相邻两个条形缝隙5的中心位置对应，让共模信号不能有效辐射，实现对共模信号的抑制。
在尺寸上，本案相关参数的设计如下(单位均为mm)：介质基板3的尺寸为长×宽×厚＝44.5×21.5×0.508。本案实测的天线反射系数、差模激励方向图和共模激励的方向图结果示于图4、图5和图6所示。
其余性能的测试结果如下：中心频率为41.4GHz，对应的差模反射系数<-10dB，共模反射系数>-7dB，差模增益为19.1dBi，共模增益为3.7dBi。该测试结果包含了用于测试的一对接头和转接部分的损耗，因此，实际集成应用中差模反射系数可以更小、增益可以更高，共模反射系数可以更大、增益可以更小。
基于本实施例，可以分析出：
1、本发明设计的抑制共模噪声的平衡馈电差分缝隙天线，避免了由巴伦带来的损耗和体积的增加，具有结构简单、体积小巧、便于与平面电路进行集成、成本低、便于批量生产等优势，可适应用于无线通信系统中；
2、根据测试结果可以看出，本发明设计的抑制共模噪声的平衡馈电差分缝隙天线，可以满足QLink-PAN通信系统应用需求；
3、本发明设计的抑制共模噪声的平衡馈电差分缝隙天线，基于集成波导结构以及采用了梳状功分器结构，外形尺寸小；并且该天线除了刻蚀的条形缝隙外，其余部分都是封闭结构，因此对周围电路影响小，可以方便与后级射频电路进行集成，以降低成本，可以进行大规模生产；
4、设计时所使用的抑制共模噪声平衡馈电差分缝隙天线的理论和设计方法具有一般性，可以在微波、毫米波频段进行广泛的使用；
5、整个天线结构自成一体，结构简单，可全部利用印刷电路板工艺进行生产，具有成本低、精度高、重复性好等特点，适合大批量生产。
以上所述仅是本发明的优选实施方式，应当指出：对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (5)

1.一种抑制共模噪声的平衡馈电差分缝隙天线，包括介质基板(3)、设置在介质基板(3)上表面的顶层金属层(1)、设置在介质基板(3)下表面的底层金属层(2)，在介质基板(3)上设置有金属化通孔(4)，金属化通孔(4)的上下两端分别与顶层金属层(1)和底层金属层(2)连接，顶层金属层(1)、底层金属层(2)和金属化通孔(4)共同实现n个基片集成波导结构(9)，在每一个基片集成波导结构(9)的两端激励差分信号，形成差分对馈基片集成波导；其特征在于：对于任意一个基片集成波导结构(9)，顶层金属层(1)上刻蚀有一组条形缝隙(5)，该组条形缝隙(5)中条形缝隙(5)的数目为偶数个，且该组条形缝隙(5)相对于该基片集成波导结构(9)中心成中心对称布置，同时条形缝隙(5)的厚度等于顶层金属层(1)的厚度；n为自然数，且n≥1；
在基片集成波导结构(9)的两端激励差分信号时，会形成驻波：对于差模信号分量，驻波的波峰个数为偶数个，且波峰的位置与每个条形缝隙(5)的中心位置对应，让差模信号能有效辐射；对于共模信号分量，驻波的波峰个数为奇数个，且波峰的位置与相邻两个条形缝隙(5)的中心位置对应，让共模信号不能有效辐射，实现对共模信号的抑制。
2.根据权利要求1所述的抑制共模噪声的平衡馈电差分缝隙天线，其特征在于：构成一个基片集成波导结构的金属化通孔(4)形成两条平行线阵列，两条平行线阵列相对于直线l对称，且两条平行线阵列垂直于直线l。
3.根据权利要求1所述的抑制共模噪声的平衡馈电差分缝隙天线，其特征在于：同一组偶数个条形缝隙(5)中，相邻两条条形缝隙(5)的中心间距为1/2波长，条形缝隙(5)的长度尺寸和偏移量依据缝隙天线设计理论结合基片集成波导结构(9)的宽度和工作频率得到。
4.根据权利要求1所述的抑制共模噪声的平衡馈电差分缝隙天线，其特征在于：所有基片集成波导结构通过功分器(6)相连，功分器(6)由顶层金属层(1)、底层金属层(2)和金属化通孔(4)构成。
5.根据权利要求1所述的抑制共模噪声的平衡馈电差分缝隙天线，其特征在于：所述条形缝隙(5)为矩形。
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