CN104080267A - Circuit board gasket - Google Patents
Circuit board gasket Download PDFInfo
- Publication number
- CN104080267A CN104080267A CN201410295970.9A CN201410295970A CN104080267A CN 104080267 A CN104080267 A CN 104080267A CN 201410295970 A CN201410295970 A CN 201410295970A CN 104080267 A CN104080267 A CN 104080267A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- gasket body
- silicon chip
- sealing cover
- insulating gasket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a circuit board gasket which comprises a metal sealing cover and an insulating gasket body. One end of the metal sealing cover is provided with two or more metal connecting rods. The insulating gasket body is movably connected to the metal connecting rods in a penetrating mode and is separated from or attached to one end of the metal sealing cover. A silicon chip is laminated between the metal sealing cover and the insulating gasket body, the metal connecting rods at one end of the metal sealing cover penetrate through the insulating gasket body so that the insulating gasket body can be welded to a circuit board, and therefore welding performance between the gasket body and the silicon chip and welding performance between the gasket body and the circuit board can be effectively improved, the silicon chip can be stably welded to the circuit board, the structure is simple, welding between the silicon chip and the circuit board is stable and firm, the silicon chip is protected against chemical corrosion, the service life of the device is prolonged, and work performance of the silicon chip can be conveniently improved; meanwhile, the insulating gasket body has the advantages of having high temperature resistance, corrosion resistance, radiation resistance, flame resistance, balanced physical and mechanical performance, high size stability, excellent electrical performance and the like.
Description
Technical field
The present invention relates to a kind of circuit board pad.
Background technology
Metallic gasket in traditional circuit-board, directly adopts ironly, and iron material property is poor, affects circuit board useful life.On available circuit plate, adopt with the insulation spacer of metal level as pad, insulation spacer directly and when welding circuit board, easily causes crystal chip to be welded on circuit board unstable by cover plate or pad.
Summary of the invention
Be welded in the deficiency of welding firm poor performance on circuit board for crystal chip in prior art; the invention provides a kind of simple in structure; the welding of crystal chip and circuit board is stable, firm; protect it not to be subject to chemical corrosion; extension device useful life, be convenient to improve the service behaviour of crystal chip. insulation spacer has high temperature resistant, corrosion-resistant, radiation hardness, fire-retardant, balanced physical and mechanical properties and the fabulous feature such as dimensional stability and good electrical property simultaneously.
The technical solution used in the present invention is:
A kind of circuit board pad, is characterized in that: comprise metal cover and insulation spacer, one end of metal cover is provided with two above metal connecting rods, and insulation spacer activity is connected on metal connecting rod and is and separates or fit-state with metal cover one end.
Preferably, described insulation spacer is black polyphenylene sulfide pad in the present invention.
Utilization of the present invention is pressed on crystal chip between metal cover and insulation spacer, metal connecting rod by metal cover one end passes insulation spacer soldered circuit board, can effectively improve pad respectively and crystal chip, circuit board between welding performance, thereby realize, crystal chip is stable to be welded on circuit board, it is simple in structure, the welding of crystal chip and circuit board is stable, firm, is convenient to improve the service behaviour of crystal chip.
Brief description of the drawings
Fig. 1 is structural representation of the present invention.
In figure: insulation spacer 1, metal cover 2, metal connecting rod 3, circuit board 4, crystal chip 5.
Embodiment
Shown in Fig. 1, a kind of circuit board pad comprises metal cover 2 and insulation spacer 1, and insulation spacer 1 is black polyphenylene sulfide pad, and one end of metal cover 2 is provided with two above metal connecting rods 3, and insulation spacer 1 activity is connected on metal connecting rod 2; When use, by metal connecting rod 3 soldered circuit boards 4, crystal chip 5 pressings are connected between insulation spacer 1, metal cover 2, realize crystal chip 5 and be connected with the stable of circuit board 4.
Claims (2)
1. a circuit board pad, is characterized in that: comprise metal cover and insulation spacer, one end of metal cover is provided with two above metal connecting rods, and insulation spacer activity is connected on metal connecting rod and is and separates or fit-state with metal cover one end.
2. a kind of circuit board pad according to claim 1, is characterized in that: described insulation spacer is black polyphenylene sulfide pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410295970.9A CN104080267A (en) | 2014-06-27 | 2014-06-27 | Circuit board gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410295970.9A CN104080267A (en) | 2014-06-27 | 2014-06-27 | Circuit board gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104080267A true CN104080267A (en) | 2014-10-01 |
Family
ID=51601251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410295970.9A Pending CN104080267A (en) | 2014-06-27 | 2014-06-27 | Circuit board gasket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104080267A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252808A (en) * | 2008-02-29 | 2008-08-27 | 友达光电（苏州）有限公司 | Soldering circuit plate and soldering method thereof |
| CN102244043A (en) * | 2011-05-23 | 2011-11-16 | 威盛电子股份有限公司 | Pad structure, circuit carrier plate and integrated circuit chip |
| CN102427333A (en) * | 2011-10-25 | 2012-04-25 | 钦州华成自控设备有限公司 | Preamplifier of electrode |
| CN202737823U (en) * | 2012-07-30 | 2013-02-13 | 江苏泰氟隆科技有限公司 | SMD heatproof insulation gasket for miniaturized quartz crystal resonator |
| US20130168140A1 (en) * | 2011-12-28 | 2013-07-04 | Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd. | Printed Circuit Board and Method of Manufacturing Same |
-
2014
- 2014-06-27 CN CN201410295970.9A patent/CN104080267A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252808A (en) * | 2008-02-29 | 2008-08-27 | 友达光电（苏州）有限公司 | Soldering circuit plate and soldering method thereof |
| CN102244043A (en) * | 2011-05-23 | 2011-11-16 | 威盛电子股份有限公司 | Pad structure, circuit carrier plate and integrated circuit chip |
| CN102427333A (en) * | 2011-10-25 | 2012-04-25 | 钦州华成自控设备有限公司 | Preamplifier of electrode |
| US20130168140A1 (en) * | 2011-12-28 | 2013-07-04 | Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd. | Printed Circuit Board and Method of Manufacturing Same |
| CN202737823U (en) * | 2012-07-30 | 2013-02-13 | 江苏泰氟隆科技有限公司 | SMD heatproof insulation gasket for miniaturized quartz crystal resonator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141001 |