CN104078204A - Inductor and method for manufacturing the same - Google Patents
Inductor and method for manufacturing the same Download PDFInfo
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- CN104078204A CN104078204A CN201310670739.9A CN201310670739A CN104078204A CN 104078204 A CN104078204 A CN 104078204A CN 201310670739 A CN201310670739 A CN 201310670739A CN 104078204 A CN104078204 A CN 104078204A
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- ferrite
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 40
- 150000001875 compounds Chemical class 0.000 claims description 49
- 229910000859 α-Fe Inorganic materials 0.000 claims description 43
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 239000000843 powder Substances 0.000 claims description 18
- 238000003475 lamination Methods 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 9
- 239000011230 binding agent Substances 0.000 claims description 7
- 239000002270 dispersing agent Substances 0.000 claims description 6
- 239000004014 plasticizer Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 239000006247 magnetic powder Substances 0.000 description 20
- 229940125810 compound 20 Drugs 0.000 description 12
- JAXFJECJQZDFJS-XHEPKHHKSA-N gtpl8555 Chemical compound OC(=O)C[C@H](N)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1CCC[C@@H]1C(=O)N[C@H](B1O[C@@]2(C)[C@H]3C[C@H](C3(C)C)C[C@H]2O1)CCC1=CC=C(F)C=C1 JAXFJECJQZDFJS-XHEPKHHKSA-N 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- 230000035699 permeability Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910000714 At alloy Inorganic materials 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 241000446313 Lamella Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000007891 compressed tablet Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
Abstract
The invention relates to an inductor and a method manufacturing the same. According to the embodiment of the invention, the inductor comprises a ferrite-organism with a through hole; an internal electrode disposed in the ferrite-organism; a metal-organism which forms a device body through covering the ferrite-organism; and an external electrode which covers the device body and is electrically connected to the internal electrode.
Description
quoting of related application
Require the priority of following domestic priority application and external priority application and be incorporated to by reference:
" quoting of related application
The application requires, in the rights and interests of the korean patent application sequence number 10-2013-0034706 of submission on March 29th, 2013, by reference its full content to be bonded in the application ".
Technical field
The present invention relates to inductor and the method for the manufacture of it, more specifically relate to the inductor of the inductance characteristic with improvement and the method for the manufacture of it.
Background technology
Multilayer power inductor is mainly used in power circuit as in the DC-DC converter of mobile electronic device, and is particularly useful in high-intensity currrent because it suppresses magnetically saturated characteristic in material and structure aspects.Compared with wirewound power inductor, because multilayer power inductor has the shortcoming that inductance greatly changes according to the application of electric current, but it is conducive to miniaturization and attenuation, and therefore it goes for the current trend of electronic component.
There is the magnetic sheet of printing the internal electrode on it by lamination and manufacture typical multilayer power inductor to form device body and form the outer electrode that is electrically connected to internal electrode on the surface of device body.At this, magnetic sheet is made up of the compound that comprises ferrite powder.And clearance layer can optionally be formed in device body and change to reduce for the inductance of foreign current.
But, in the time using ferrite powder as the magnetic material of multilayer power inductor as above, thereby due to the ferritic magnetic moment of composed component be determine improving the upper limitation that exists of saturation magnetization (Ms), be therefore difficult to realize for improve biasing compared with high saturation amount.And, can improve inductance characteristic owing to improving permeability by the packed density of magnetic material in relative increase device body, therefore need the structure of improving inductor to increase the packed density of magnetic material.
[association area document]
[patent documentation]
Patent documentation 1: Korean Patent Publication No. 2004-0107408
Summary of the invention
Invent the present invention in order to overcome the problems referred to above, therefore, an object of the present invention is to provide and can improve the inductor of inductance characteristic and the method for the manufacture of it.
Another object of the present invention is to provide to have can improve the inductor of the structure that forms inductor device body magnetosphere overall penetration and the method for the manufacture of it.
According to one aspect of the present invention of realizing this object, provide the inductor that comprises the following: the ferrite-organism with through hole; Be arranged on the internal electrode in ferrite-organism; By covering the metal-organism of ferrite-organism and ferrite-organism composition device body; And covering device body is to be electrically connected to the outer electrode of internal electrode.
According to the embodiment of the present invention, metal-organism can be made up of metal-organic double compound, and wherein metal-organic double compound can comprise a kind of metal in iron (Fe), Fe base alloy and Fe base amorphous and at least one organic substance in resin, curing agent and silane coupler.
According to the embodiment of the present invention, metal-organism can be made as the metal-organic double compound of organic substance by comprising crystalline epoxy.
According to the embodiment of the present invention, metal-organism can be made up of the metal-organic double compound that comprises a kind of metal in iron (Fe), Fe base alloy and Fe base amorphous with the amount of 65wt% to 95wt%.
According to the embodiment of the present invention, ferrite-organism can be made up of ferrite-organic double compound, and wherein ferrite-organic double compound can comprise ferrite powder, organic binder bond, dispersant and plasticizer.
According to the embodiment of the present invention, ferrite-organism can have by lamination multiple ferrite sheets formation of internal electrode thereon.
According to the embodiment of the present invention, the distance between cross section and the internal electrode of through hole can be 2.2 μ m to 4.1 μ m.
According to the embodiment of the present invention, ferrite-organism can have the sheet layered product forming by the multiple magnetic sheets of lamination, and internal electrode can carry out lamination and have the lattice coil structure around through hole along the laminating direction of sheet layered product.
According to the another aspect of the present invention that realizes object, be provided for manufacturing the method for inductor, comprise the following steps: multiple ferrite sheets of preparing to have from the teeth outwards internal electrode; Manufacture sheet layered product so that the internal electrode that must be formed on each ferrite sheet forms single lattice coil by lamination ferrite sheet; Manufacture ferrite-organism by forming through hole in the non-formation region of sheet layered product lattice coil; Cover ferrite-organic metal-organism by formation and manufacture device body; And form and be electrically connected to the outer electrode of lattice coil on the surface of device body.
According to the embodiment of the present invention, forming metal-organic step can comprise the following steps: manufacture comprise iron (Fe), Fe base alloy and Fe-based amorphous in a kind of metal and the metal-organic double compound of organic substance, and in device body molded metal-organic double compound.
According to the embodiment of the present invention, form metal-organic step and can comprise the step of preparing the metal-organic double compound that comprises metal and crystalline epoxy.
According to the embodiment of the present invention, can use metal-organic double compound to form metal-organic step, metal-organic double compound comprise iron (Fe), Fe base alloy and Fe-based amorphous in a kind of metal and organic substance, wherein the content of metal can be 65wt% to 95wt%.
According to the embodiment of the present invention, form through hole step can by carry out punching on layered product, to implement to make through hole to the distance of internal electrode be 3.0 μ m to 5.0 μ m.
According to the embodiment of the present invention, the step of preparation ferrite sheet can comprise the following steps: manufacture the ferrite-organic double compound and film casting (film-casting) ferrite-organic double compound that comprise ferrite powder, organic binder bond, dispersant and plasticizer.
Brief description of the drawings
From the description of following execution mode, together with accompanying drawing, these of present general inventive concept of the present invention and/or other aspects and advantage will obviously and be easier to understand, wherein:
Fig. 1 is the view illustrating according to the inductor of embodiment of the present invention.
Fig. 2 is the figure that Q characteristic is shown according to the AC of the inductor of embodiment of the present invention;
Fig. 3 is the figure illustrating according to the DC-biasing characteristic of the inductor of an embodiment of the invention;
Fig. 4 illustrates for the manufacture of according to the flow chart of the method for embodiment of the present invention inductor; And
Fig. 5 A to Fig. 5 E is for explaining according to the view of the manufacture method of embodiment of the present invention inductor.
Embodiment
By reference to the following execution mode about accompanying drawing of describing in detail, advantages and features of the invention and the method that realizes it will be apparent.But the present invention is not limited to the execution mode of following disclosure and can realizes with various form.It is only in order to improve disclosure of the present invention and in order fully to show scope of the present invention to those skilled in the art that execution mode is provided.In whole specification, similarly reference number refers to similar element.
Term used herein is for explaining execution mode, instead of restriction the present invention.In whole specification, unless context clearly indicates in addition, odd number forms and comprises plural form.Except above mentioned component, step, operation and/or device, term used herein " comprises " and/or " comprising " do not got rid of the existence of another kind of component, step, operation and/or device and add.
And, the execution mode of describing in whole specification is described with reference to sectional view and/or plane graph, these figure are exemplary drawings that the present invention is desirable.In the accompanying drawings, for effective interpretation technique content, can amplification layer and the thickness in region.Therefore, can pass through production technology and/or tolerance modified example accompanying drawing.Therefore, embodiments of the present invention are not limited to accompanying drawing, and can comprise the amendment producing according to production technology.For example, the etching area showing with right angle can form or be formed as having predetermined curvature with circle.
Hereinafter, describe in more detail with reference to the accompanying drawings according to the inductor of embodiment of the present invention with for the manufacture of its method.
Fig. 1 is the view illustrating according to the inductor of embodiment of the present invention.With reference to Fig. 1, according to the inductor 100 of embodiment of the present invention, it is multilayer power inductor, can comprise ferrite-organism 110, metal-organism 130 and outer electrode 140.
Ferrite-organism 110 can be in inductor 100 inside center along longitudinal setting of ferrite-organism 110 to form the core layer of inductor 100.Ferrite-organism 110 can have sheet layered product 113 and be arranged on the internal electrode 115 on sheet layered product 113.Sheet layered product 113 can be to form by the ferrite sheet 112 of lamination and the multiple Fig. 5 a of extruding (punching press, press) product obtaining, and ferrite sheet 112 has the conductive pattern 114 forming for internal electrode 115.Through hole 113a can form in the non-formation region of ferrite-organism 110 internal electrodes 115.Through hole 113 can be along the laminating direction of sheet layered product 113 by sheet layered product 113.
Meanwhile, sheet layered product 113 can be made up of ferrite-organic double compound.Ferrite-organic double compound can be the material that comprises ferrite powder, organic binder bond, dispersant and plasticizer.
Internal electrode 115 can have the sandwich construction along the laminating direction of sheet layered product 113 with height.In addition, internal electrode 115 can have around the coil shape of through hole 113a.Internal electrode 115 can have a lip-deep first electrode 115a who is formed on sheet layered product 113 and another the lip-deep second electrode 115b that is formed on sheet layered product 113.The first electrode 115a and the second electrode 115b, they,, for internal electrode 115 is electrically connected to outer electrode 140, can be formed as being exposed to the outside of ferrite-organism 110.Therefore, the first electrode 115a and the second electrode 115b can be arranged on the boundary of ferrite-organism 110 and metal-organism 130.
Metal-organism 130 can cover ferrite-organism 110.Metal-organism 130 can be made up of with the cover part 134 that covers ferrite-organism 110 surfaces the filling part 132 being filled in through hole 113a.Filling part 132 and cover part 134 can form by the identical process that is compounded to form simultaneously.Therefore, filling part 132 and cover part 134 can provide and not boundary therebetween with entirety.Metal-the organism 130 with said structure can form with sheet layered product 113 magnetosphere of inductor 100.And metal-organism 130 can form with ferrite-organism 110 the hexahedron device body 120 of inductor 100.
Table 1
Upper table 1 is the form of the chip characteristics of the inductor sample prepared of the distance between cross section and the internal electrode illustrating by constantly regulating through hole.With reference to table 1, preferably the inner surface of through hole 113a to the distance B 1 of internal electrode 115 is approximately greater than 2.2 μ m and is less than 4.1 μ m.More particularly, as sample 1 and 2, in the time that distance B 1 is less than approximately 2.2 μ m, detect between the metallic magnetic powder in internal electrode and metal-organism, to occur electrical short or because inductance value Ls when the 1MHz is less than 0.7 μ H and does not meet the inductance specification of reference.On the contrary, as sample 7, sample 8 and sample 9, in the time that distance B 1 exceedes approximately 4.1 μ m, the value due to Isat detected, DC-offset change is-30% current value, is less than 2.00A and does not meet the Isat specification of reference.Therefore, can be greater than 2.2 μ m and be less than 4.1 μ m by preferred distance D1, and can more preferably distance B 1 be adjusted to and approximately be greater than 2.5 μ m and be less than 4.0 μ m.
Outer electrode 140 can be as the link that device body 120 is installed to external electrical device (not shown).For this reason, outer electrode 140 can be formed on the surface of device body 120.Outer electrode 140 can be made up of the part that is electrically connected to the part of the first electrode 115a on device body 120 one end and the second electrode 115b of electrical connection body 120 other ends.
The metallic magnetic powder that meanwhile, can be preferred for metal-organic double compound of preparing metal-organism 130 is iron (Fe) Base Metal.With reference to following table 2, in the time comprising the Fe that exceedes 99wt% as metal-organic double compound, detect and guarantee that saturation magnetisation value is greater than 192(emu/g), but in this case, may exist the processability of metal-organic double compound to reduce and do not guarantee the problem of electrical characteristics.
Therefore, can preferably use various types of Fe base alloys etc.At this,, detect in the time that Fe content exceedes about 50wt% as metallic magnetic powder in the situation that at alloy, guarantee that saturation magnetisation value is greater than 150(emu/g).Although not shown in table 1,, in the time that Fe content is less than about 50wt%, detects that saturation magnetisation value Ms is reduced to and be less than 100(emu/g).
[table 2]
| Sequence number | The type of metallicl magnetic material | Saturation magnetisation value (Ms) |
| 1 | Fe base (being greater than 99wt%) | 192（emu/g） |
| 2 | Fe-(3～10wt%) Si base | 172（emu/g） |
| 3 | Fe-Si-Al iron silica/aluminum-based alloy | 115（emu/g） |
| 4 | Fe-Ni base (being greater than the iron of 50wt%) | 150（emu/g） |
| 5 | Fe-Si-Cr base | 180（emu/g） |
| 6 | Fe-Si-B-Cr base amorphous | 145（emu/g） |
As mentioned above, can comprise thering is the ferrite-organism 110 of internal electrode 115 and comprise metallic magnetic powder and form device body 120 and cover simultaneously the metal organism 130 of ferrite-organism 110 with ferrite-organism 110 according to the inductor 100 of embodiment of the present invention.In this case, by using metal-organism 130 can improve significantly permeability, metal-organism 130 uses the metal that has relative more high saturation value than common ferrite powder as magnetic powder.Therefore, compared with situation about being formed by ferrite powder with whole device body, ferrite-the organic double compound that comprises ferrite magnetic powder by use forms therein and in the part of internal electrode, forms body and have the more metal of high saturation value than ferrite powder and in remainder, form body as the metal-organic double compound of magnetic powder with comprising, and can have the structure of inductance characteristic of improvement to improve permeability according to inductor of the present invention.
And, there is the structure that wherein through hole 113a is formed in ferrite-organism 110 regions simultaneously and can prevent electrical short and optimize chip characteristics by the distance B 1 between through hole 113a and internal electrode 115 being adjusted to be approximately greater than 2.2 μ m and be less than 4.1 μ m according to the inductor 100 of embodiment of the present invention, wherein do not form the internal electrode 115 of device body 120, and the metal-organic double compound that comprises metallic magnetic powder is filled in through hole 113a.The distance that therefore, can have by regulating internal electrode and metal-organic double compound to fill between through hole cross section wherein according to inductor of the present invention can prevent electrical short and improve the chip characteristics structure of (comprising inductance characteristic).
Fig. 2 is the chart illustrating according to the Q characteristic of the AC of the inductor of embodiment of the present invention.As shown in Figure 2, detect compared with the Q factor curve 4 of inductor with its device body that uses ferrite to form as magnetic powder, the metal by use with comparison high saturation value forms the metal-organism 130 of device body 120 as magnetic powder, for having the higher Q factor to realize the low-loss on AC according to the Q factor curve 2 of the inductor 100 of embodiment of the present invention.
Fig. 3 is the chart illustrating according to the DC-biasing characteristic of the inductor of embodiment of the present invention.As shown in Figure 3, detect with using ferrite and form as magnetic powder compared with the DC-bias curve 8 of inductor of its device body, the metal by use with relative high saturation value forms the metal-organism 130 of device body 120 as magnetic powder, according to having higher value for the DC-bias curve 6 changing according to the electric current of the inductor 100 of embodiment of the present invention.
Then, will describe in detail for the manufacture of according to the method for the inductor of embodiment of the present invention.At this, can omit or simplify and described inductor 100 those overlapping descriptions above.
Fig. 4 illustrates for the manufacture of according to the flow chart of the method for the inductor of embodiment of the present invention, and Fig. 5 A to Fig. 5 E manufactures according to the view of the method for the inductor of embodiment of the present invention for explaining.
With reference to Fig. 4 and Fig. 5 A, can prepare ferrite sheet 112(S110).The step of preparing ferrite sheet 112 can comprise the following steps: prepare ferrite-organic double compound and by film casting ferrite-organic double compound, ferrite-organic double compound be configured as to sheet.Ferrite-organic double compound can be the slurries of preparing by mixed ferrite powder, organic binder bond, dispersant, plasticizer etc. and organic solvent.Organic binder bond can be polyvinyl butyrate (PVB) or acrylic compounds material.
Can manufacture magnetic sheet 111(S120 by form conductive pattern 114 on ferrite sheet 112).The step that forms conductive pattern 114 can complete by carrying out following steps: in ferrite sheet 112, form through hole and print conductive paste on ferrite sheet 112.Metal paste can be the metal paste that comprises copper (Cu), silver (Ag), nickel (Ni) etc.Can prepare multiple magnetic sheets 111 by the above-mentioned technique that repeats magnetic sheet 111.
With reference to Fig. 4 and Fig. 5 B, can prepare ferrite-organism 110(S130 by lamination and compacting magnetic sheet 111).The step of manufacturing ferrite-organism 110 can complete to manufacture sheet layered product 113 and compressed tablets layered product 113 by lamination magnetic sheet 111.At this moment wait, manufacture the step of sheet layered product 113 can lamination magnetic sheet 111 to make conductive pattern 114 be exposed to the outer surface of the sheet layered product 113 of final preparation.In other words, can lamination magnetic sheet 111 after alignment to make lamella laminate 113 there are 110 1 lip-deep the first internal electrode 115a of the ferrite of being arranged on-organism and to be arranged on ferrite-organism 110 another lip-deep second internal electrode 115b.
By above-mentioned technique, can on sheet layered product 113, prepare the internal electrode 115 with lattice coil structure by the laminating direction lamination conductive pattern 114 along magnetic sheet 111.
With reference to Fig. 4 and Fig. 5 C, can in ferrite-organism 110, form through hole 113a(S140).The step that forms through hole 113a can be carried out punching technology as laser method or boring method complete by the central area at ferrite-organism 110, does not wherein form internal electrode 115.At this moment wait, the step that can preferably carry out punching technology carried out in case through hole 113a to the distance B 1 of internal electrode 115 are approximately 3.0 to 5.0 μ m.In other words, as described with reference to FIG. 1, preferably the distance B 1 between through hole 113a and internal electrode 115 is 2.2 to 4.1 μ m.But, when form through hole 113a in the scope of ferrite-organism 110 so that distance B 1 is while being less than approximately 3.0 μ m, ferrite-organism 110 can be by contractions such as sintering processes, and sintering processes is processing subsequently, is less than 2.2 μ m so that distance B 1 can be reduced to.By contrast, when form through hole 113a in the scope of ferrite-organism 110, so that distance B 1 is while exceeding approximately 5.0 μ m, after sintering processes, distance B 1 still can exceed 4.1 μ m.
With reference to Fig. 4 and Fig. 5 D, can fabricate devices body 120(S150 by using metal-organic double compound 20 to carry out molding process on ferrite-organism 110).The step of carrying out molding process can comprise the following steps: prepares metal-organic double compound 20, metal-organic double compound 20 is filled in mould 12, ferrite-organism 110 is remained in mould 12, and by press portion 14 compacting tool sets 12.Therefore, by form with reservation shape metal-organism 130 that metal-organic double compound 20 can be prepared Fig. 5 e in ferrite-organism 110.
At this, the temperature of molding process can be adjusted to approximately 170 to 200 DEG C.In the time that the temperature in molding process is less than 170 DEG C, may be difficult to complete cured layer stampings, and in the time exceeding 200 DEG C, the resin of metal-organic double compound 20 may be degenerated.Surface pressing in molding process can be adjusted to approximately 0.05 to 20 kilograms.In the time that surface pressing is less than 0.05 kilogram, due to pressing pressure lower on laminated product, the manufacture Efficiency Decreasing of metal-organism 130, and in the time that surface pressing exceedes 200 kilogram, body 110 and 130 is because over-compressed may be out of shape.
Metal-the organism 130 forming by above-mentioned technique can form by being filled in the filling part 132 in through hole 113a and covering 110 two surperficial cover parts 134 of ferrite-organism.Therefore, metal-organism 130 can form with ferrite-organism 110 device body 120 of inductor.
Meanwhile, the step of preparing metal-organic double compound 20 can complete by mixing a kind of metal dust in iron (Fe), Fe base alloy and Fe base amorphous and at least one organic substance in resin, curing agent and silane coupler.Can preferred resin be crystalline epoxy.Because crystalline epoxy has high-adhesiveness energy, is greater than the glass transition temperature Tg of approximately 100 DEG C and is less than the low melting point of approximately 100 DEG C, can guarantee the strong adhesion with Fe Base Metal.This is because because the relatively strong adhesiveness of crystalline epoxy can be guaranteed low thermal coefficient of expansion.As following table 3, compared with using the situation of non-crystalline epoxy, in the time using crystalline epoxy, detect that thermal coefficient of expansion can be reduced to and be less than about 20.0(μ m/m DEG C).Therefore, for the impact being applied on the inductor of preparation, by crystalline epoxy can be guaranteed to strong resistance as resin, as scolder crack.[table 3]
| Sequence number | The type of epoxy resin | Thermal coefficient of expansion (CTE) |
| 1 | Crystallization BPF epoxy resin | 16.9（μm/m℃） |
| 2 | Crystallization BP epoxy resin | 17.5（μm/m℃） |
| 3 | Amorphous OCN epoxy resin | 23.2（μm/m℃） |
| 4 | Amorphous modified epoxy-1 | 27.5（μm/m℃） |
| 5 | Amorphous modified epoxy-2 | 28.3（μm/m℃） |
And, preparing in the step of metal-organic double compound 20, based on compound 20, can preferably the content of metal be adjusted to approximately 65 to 95wt%.With reference to following table 4, in the time being less than about 65wt% based on compound 20 tenors, because permeability greatly reduces the inductance that can not guarantee expectation.By contrast, in the time exceeding about 95wt% based on compound 20 tenors, owing to not guaranteeing the insulation property of compound 20, the local current path in compound 20 between metal occurs.Therefore, can not guarantee the characteristic of inductor due to the increase of eddy current loss.
[table 4]
With reference to Fig. 2 and Fig. 5 E, in device body 120, can form outer electrode 140(S160).The step that forms outer electrode 140 can be undertaken by the metal level that uses plating, impregnation process etc. to form the internal electrode 115 that is electrically connected to device body 120 on the two ends of products obtained therefrom.
As mentioned above, the organism 110(that manufactures device body 120 for the manufacture of the compound that comprises ferrite magnetic powder in use according to the method for the inductor 100 of embodiment of the present invention is wherein provided with internal electrode 115) afterwards, use comprises and has the relatively compound of the metal of high saturation value, can manufacture metal-organism 130, it is the remainder of device body 120.In this case, having the relatively metal of high saturation value by use than common ferrite powder can prepare and have the larger inductor that improves permeability structure as metal-organic double compound structure most devices body of magnetic powder.Therefore, compared with situation about being formed by ferrite powder with whole device body, for the manufacture of according to the method for inductor of the present invention, ferrite-the organic double compound that comprises ferrite magnetic powder by use forms therein and in the part of internal electrode, forms body and have the more metal of high saturation value than ferrite powder and in remainder, form body as the metal-organic double compound of magnetic powder with comprising, and can manufacture and have the inductor that improves inductance characteristic structure to improve permeability.
Compared with situation about being formed by ferrite powder with whole device body, ferrite-the organic double compound that comprises ferrite magnetic powder by use forms therein and in the part of internal electrode, forms body and have the more metal of high saturation value than ferrite powder and in remainder, form body as the metal-organic double compound of magnetic powder with comprising, and can have the structure of inductance characteristic of improvement to improve permeability according to inductor of the present invention.
By by internal electrode be wherein filled with distance adjustment between the through hole cross section of metal-organic double compound to optimum range, can have and prevent electrical short and improve the chip characteristics structure of (comprising inductance characteristic) according to inductor of the present invention.
Compared with situation about being formed by ferrite powder with whole device body, form therein for the manufacture of the ferrite-organic double compound that comprises ferrite magnetic powder by use according to the method for inductor of the present invention and in the part of internal electrode, form body and there is the more metal of high saturation value than ferrite powder and in remainder, form body as the metal-organic double compound of magnetic powder with comprising, can manufacture and there is the inductor that improves inductance characteristic structure to improve permeability.
More than describe and illustrated the present invention.In addition, foregoing description only illustrates and has explained the preferred embodiment of the present invention, but should be understood that the present invention can be used in various other combinations, amendment and environment and within the scope of the inventive concept that can express in this article and above-mentioned instruction and/or the technology of association area or variation and the amendment that knowledge matches.The execution mode of above describing is further used for explaining implements known best mode of the present invention and for making the others skilled in the art can be with this or other execution modes with by concrete application of the present invention or use needed various amendment to use the present invention.Therefore, description is not used in the present invention is limited to form presently disclosed.And, be intended to claims to be interpreted as comprising alternative execution mode.
Claims (14)
1. an inductor, comprising:
There is the ferrite-organism of through hole;
Be arranged on the internal electrode in described ferrite-organism;
Form the metal-organism of device body by covering described ferrite-organism and described ferrite-organism; And
Cover described device body to be electrically connected to the outer electrode of described internal electrode.
2. inductor according to claim 1, wherein, described metal-organism is made up of metal-organic double compound, and wherein, described metal-organic double compound comprises:
A kind of metal in iron (Fe), Fe base alloy and Fe base amorphous; And
At least one organic substance in resin, curing agent and silane coupler.
3. inductor according to claim 1, wherein, described metal-organism is made as the metal-organic double compound of organic substance by comprising crystalline epoxy.
4. inductor according to claim 1, wherein, described metal-organism is made up of the metal-organic double compound that comprises a kind of metal in iron (Fe), Fe base alloy and Fe base amorphous with the amount of 65wt% to 95wt%.
5. inductor according to claim 1, wherein, described ferrite-organism is made up of ferrite-organic double compound, and wherein said ferrite-organic double compound comprises ferrite powder, organic binder bond, dispersant and plasticizer.
6. inductor according to claim 1, wherein, multiple ferrite sheets that described ferrite-organism is formed with described internal electrode thereon by lamination form.
7. inductor according to claim 1, wherein, the distance between the cross section of described through hole and described internal electrode is 2.2 μ m to 4.1 μ m.
8. inductor according to claim 1, wherein, described ferrite-organism has the sheet layered product forming by the multiple magnetic sheets of lamination, and
Described internal electrode carries out lamination and has the lattice coil structure around described through hole along the laminating direction of described layered product.
9. for the manufacture of a method for inductor, comprising:
Prepare to have from the teeth outwards multiple ferrite sheets of internal electrode;
Manufacture sheet layered product by ferrite sheet described in lamination and form single lattice coil so that must be formed on the described internal electrode on ferrite sheet described in each;
Form through hole by the non-formation region of the described lattice coil at described layered product and manufacture ferrite-organism;
Manufacture device body by forming metal-organism to cover described ferrite-organism; And
On the surface of described device body, form the outer electrode that is electrically connected to described lattice coil.
10. the method for the manufacture of inductor according to claim 9, wherein, forms described metal-organism and comprises:
Manufacture comprises a kind of metal in iron (Fe), Fe base alloy and Fe base amorphous and the metal-organic double compound of organic substance; And
Molded described metal-organic double compound in described device body.
11. methods for the manufacture of inductor according to claim 9, wherein, form described metal-organism and comprise:
Metal-organic double compound that preparation comprises metal and crystalline epoxy.
12. methods for the manufacture of inductor according to claim 9, wherein, use comprises a kind of metal in iron (Fe), Fe base alloy and Fe base amorphous and the metal-organic double compound of organic substance forms described metal-organism, and the content of wherein said metal is 65wt% to 95wt%.
13. methods for the manufacture of inductor according to claim 9, wherein, by carry out punching processing on described layered product, to implement to form described through hole be 3.0 μ m to 5.0 μ m to make described through hole to the distance of described internal electrode.
14. methods for the manufacture of inductor according to claim 9, wherein, prepare described ferrite sheet and comprise:
Ferrite-organic double compound that preparation comprises ferrite powder, organic binder bond, dispersant and plasticizer; And
Ferrite-organic double compound described in film casting.
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| KR101730228B1 (en) | 2015-01-27 | 2017-04-26 | 삼성전기주식회사 | Inductor Including Magnetic Composition and Method of Fabricating the Same |
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| CN1321991A (en) * | 2000-04-28 | 2001-11-14 | 松下电器产业株式会社 | Composite magnetic body, magnetic element and mfg. method thereof |
| JP2004039957A (en) * | 2002-07-05 | 2004-02-05 | Taiyo Yuden Co Ltd | Multilayer inductor |
| CN1627457A (en) * | 2003-12-10 | 2005-06-15 | 胜美达集团株式会社 | Magnetic component and its making method |
| CN1685452A (en) * | 2002-10-31 | 2005-10-19 | 松下电器产业株式会社 | Inductance part and electronic device using the same |
| JP2007067214A (en) * | 2005-08-31 | 2007-03-15 | Taiyo Yuden Co Ltd | Power inductor |
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| JP2005175159A (en) | 2003-12-10 | 2005-06-30 | Sumida Corporation | Inductor |
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| CN1321991A (en) * | 2000-04-28 | 2001-11-14 | 松下电器产业株式会社 | Composite magnetic body, magnetic element and mfg. method thereof |
| JP2004039957A (en) * | 2002-07-05 | 2004-02-05 | Taiyo Yuden Co Ltd | Multilayer inductor |
| CN1685452A (en) * | 2002-10-31 | 2005-10-19 | 松下电器产业株式会社 | Inductance part and electronic device using the same |
| CN1627457A (en) * | 2003-12-10 | 2005-06-15 | 胜美达集团株式会社 | Magnetic component and its making method |
| JP2007067214A (en) * | 2005-08-31 | 2007-03-15 | Taiyo Yuden Co Ltd | Power inductor |
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