CN104078081B - Not scratch interface fingertip and the equipment for connecting semiconductor device - Google Patents
Not scratch interface fingertip and the equipment for connecting semiconductor device Download PDFInfo
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- CN104078081B CN104078081B CN201310108488.5A CN201310108488A CN104078081B CN 104078081 B CN104078081 B CN 104078081B CN 201310108488 A CN201310108488 A CN 201310108488A CN 104078081 B CN104078081 B CN 104078081B
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- lid
- substrate
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- group
- memory assembly
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Abstract
Not scratch interface fingertip and the method and apparatus for testing semiconductor device.The carrier for receiving memory assembly is disclosed, for supporting memory assembly during the electrical testing of memory assembly.The carrier includes connector, and the connector has substrate and is pivotally mounted to the substrate and can be engaged to the lid of the substrate.The substrate includes first group of contact pilotage that the fingertip on the first surface when the memory assembly is located in the carrier with memory assembly is electrically coupled.The lid includes second group of contact pilotage that the fingertip on the second surface when the lid is engaged to the substrate with memory assembly is electrically coupled.First and second groups of contact pilotages when the lid is engaged in substrate by power supply, and signal the edge connector of carrier is transferred to from memory assembly.
Description
Background technology
The strong growth of portable consumer electronics product needs to promote the demand to high capacity storage device.Such as flash memory
The Nonvolatile semiconductor memory device of storage card is just becoming increasingly to be widely used in satisfaction to digital information storage and exchanged
It is growing the need for.Their portability, more multi-purpose and stable design and its high reliability and Large Copacity have made
Obtain this storage component part and be ideally used to various electronic equipments, such as including digital camera, digital music player, video trip
Gaming machine, PDA and cell phone.
A kind of purposes of flash memory device is to be used for so-called solid-state disk (SSD).SSD be include it is hard with traditional input/output
The semiconductor device for data storage of the compatible electrical interface of disk drive interface.SSD is more superior than conventional hard, its advantage
Including the part without motion, and be used at present in the past using in the platform of hard disk.
Fig. 1 is can be as SSD semiconductor devices or the memory assembly 20 that can be used in SSD semiconductor devices
The prior art diagram of example.Memory assembly 20 can include multiple flash-memory semiconductor naked cores 22 and controller naked core 24, its
Can be for example as the surface for being installed to printed circuit board (PCB) (" PCB ") 26.Memory assembly 20 can also include multiple passive
Element 28 (one of them is marked with sequence number), and connect multiple electric leads of each semiconductor bare chip and passive element (not
Show), passive element may, for example, be resistor, capacitor and inductor.The memory assembly 20 can also be encapsulated in
In molding composite (not shown), to protect semiconductor bare chip and passive element.
In order to which to from the transmitting telecommunication number of memory assembly 20, PCB 26 can include edge connector (edge
Connector) 30, it has multiple fingertips 32 of the interface slot on insertion host device.Can be as shown edge connection
The upper surface of device 30 provides fingertip 32, but can also provide fingertip 32 in the lower surface of edge connector.In one example,
Edge connector 30 can be configured according to quick peripheral assembly interconnecting (PCIe) series connection expansion bus standard, certainly it is also known that side
The other configurations of edge connector 30.
During assembly, SSD memory assembly 20 passes through some test phases, and it includes for example various electric and burned survey
Examination.In order to protect memory assembly 20 and edge connector 30, it is known that to install memory assembly 20 in carrier 40, its
Example is shown in prior art fig. 2.Carrier 40 includes being used to receive the slot 42 of memory assembly 20 and for receiving side
The interface slot 44 of edge connector 32, carrier 40 is electrically coupled to by memory assembly 20.Carrier 40 is included interface slot 44 again
Electrical connection extend to the electric lead (not shown) of carrier edge connector 46.Edge connector 46 coordinates in interface 50, should
Interface 50 is used to carrier 40 being inserted into test equipment.
Carrier 40 is used to transmit the different survey of the memory assembly 20 to two during memory assembly technique
Try equipment.Carrier 40 also aims to the fingertip 32 of Protect edge information connector 30.However it has been found that inserting edge to interface slot 44
Connector 30 and from interface slot 44 remove edge connector 30 cause the scratch on fingertip 32.It will expect to use not cause to touch
Refer to the memory assembly 20 with carrier 40 of the scratch on 32.
The content of the invention
In one example, this technology is related to the connector for connecting memory assembly and carrier, the memory group
Piece installing includes multiple fingertips, and the connector includes：Substrate；Lid, is pivotally mounted to substrate, and can be engaged to substrate, institute
Stating substrate and lid includes multiple contact pilotages, and when the lid is engaged to substrate, the multiple stylus contact memory assembly is multiple
The memory assembly can be electrically coupled to the carrier by fingertip, the substrate and lid, and the substrate and lid being capable of things
The memory assembly is coupled in the carrier by reason ground.
In another example, this technology is related to the carrier for receiving the memory assembly for including multiple fingertips, above-mentioned
Carrier includes：In the edge connector of the end of the carrier；Connector, including：Substrate, and lid, are pivotably mounted
To substrate, and the substrate can be engaged to, the substrate and lid include memory assembly physically being coupled in into institute
State carrier；And multiple fingertips, it is each to be used to be formed many of memory assembly when the lid is engaged to the substrate
Individual fingertip is electrically coupled to a part for the conductive path of the edge connector at the end of the carrier.
In another example, this technology is related to a kind of carrier, includes the first surface of memory assembly for receiving
First group of fingertip and the memory group relative to second group of fingertip on the second surface of the memory assembly of first surface
Piece installing, the carrier includes：In the edge connector of the end of the carrier；Connector, including：Substrate, the substrate bag
First group of contact pilotage is included, for contacting the memory assembly when the memory assembly is placed on the substrate
First group of fingertip on first surface, and lid, are pivotally mounted to the substrate, and can be in open position and closure position
Moved between putting, the substrate is pivoted away from lid described in the open position, and in the closing position, the lid rotation
Towards the substrate, the lid includes being used for the second table that the memory assembly is contacted when the lid is in the close position
Second group of contact pilotage of second group of fingertip on face；Each contact pilotage formation of first group of contact pilotage is in the close position when the lid
When be electrically coupled the conductive path of edge connector at the end of first group of fingertip of the memory assembly and the carrier
A part；Each contact pilotage formation of second group of contact pilotage is electrically coupled the memory group when the lid is in the close position
A part for the conductive path of edge connector at second group of fingertip of piece installing and the end of the carrier.
Brief description of the drawings
Fig. 1 be can for example as solid state disk device legacy memory assembly top view.
Fig. 2 is the exploded perspective view for transmitting and testing the conventional carriers of memory assembly.
Fig. 3 is the stereogram for being used to transmitting and testing the carrier of memory assembly of the embodiment according to this technology.
Fig. 4 is the stereogram of the carrier for the first example for including memory assembly.
Fig. 5 is the stereogram of the carrier for the second example for including memory assembly.
Fig. 6 is the rear isometric view for transmitting and testing the carrier of memory assembly.
Fig. 7 is the stereogram for memory assembly to be electrically connected to the first embodiment of the connector of carrier.
Fig. 8 is the second embodiment for memory assembly to be electrically connected to the connector (connector) of carrier
Stereogram.
Fig. 9 is the side view for memory assembly to be electrically connected to the connector of carrier.
Figure 10 is the stereogram for memory assembly to be electrically connected to the connector of carrier, and it shows that a lid will be closed
Cover in the substrate of connector.
Figure 11 is the side view for memory assembly to be electrically connected to the connector of carrier, and it shows that the lid wants closing lid
Onto the substrate of connector.
Figure 12 is the side view for memory assembly to be electrically connected to the connector of carrier, and it shows that the lid is engaged
Onto the substrate of connector.
Figure 13 is the top view for showing the connector by the blocking mechanism for being engaged to the substrate is covered.
Figure 14 and 15 is the side view of the contact pilotage for the fingertip for contacting memory assembly.
Figure 16 is the connector for being used to being electrically connected to memory assembly into carrier of the alternative embodiment according to this technology
Side view.
Figure 17 is the connector for being used to being electrically connected to memory assembly into carrier of the alternative embodiment according to this technology
Stereogram.
Figure 18 and 19 is the stereogram and side view of the alternative embodiment shown in Figure 17.
Figure 20 is the solid of the carrier of the interface including carrier to be connected to test equipment of the embodiment according to this technology
Figure.
Embodiment
This technology will be described referring to figs. 3 to 20, this technology is related to the carrier including connector in embodiment, the connection
Device in the case where not damaging the fingertip of memory assembly, electricity and physically memory assembly is fixed in carrier.Can
To understand, the present invention can be embodied in many different forms, and should not be limited to embodiment set forth herein.And
These embodiments are to provide so that the disclosure fully and completely, and fully will pass on the invention to those skilled in the art.Really
Real, it is contemplated that covering the replacement of these embodiments, modification and equivalent, these are included in is limited by appended claims
In fixed scope and spirit of the present invention.In addition, the present invention it is described in detail below in, a large amount of details are illustrated to carry
For thorough understanding of the present invention.However, it will be apparent to one skilled in the art that this hair can be put into practice without this detail
It is bright.
The term " top " that may be used herein and " bottom ", "up" and "down" and " vertical " and " level " merely due to
Citing and illustration purpose, and description of the invention is not intended to limit, cited project can be exchanged in position and direction.And
And, as used herein, term " substantial ", " approximate " and/or " about " means for given application, specified chi
Degree or parameter can change in acceptable manufacture tolerance.In one embodiment, the acceptable manufacture tolerance for ±
0.25%.
With reference now to Fig. 3-6, show includes the carrier 100 of connector 102 according to the embodiment of this technology.Connector
102 include being fixed on the substrate 104 of carrier 100 and the lid 106 of substrate 104 are attached to by hinge.Memory assembly 110
One end (Fig. 4-5) can be placed in substrate 104, and contact pilotage and/or lid 106 in substrate 104 in the case that lid 106 is covered
Coordinate with the fingertip in the edge connector of memory assembly 110, memory assembly 110 is electrically coupled to carrier 100.
Because memory assembly 110 can be electrically coupled to carrier 100 without the contact pilotage and memory assembly of slide connector 102
Contacted between 110 fingertip, therefore can be in the case of the fingertip of not scratch memory assembly, in the carrier 100 can be with
Use the memory assembly 110.
In embodiment described below, memory assembly 110 can be any various memory assemblies, all Tathagata
From the Woodstock of Illinois Other World Computing Gumstick SSD.Carrier 100 can be applicable
In the SSD for supporting different in width, such as narrow Gumstick SSD (Fig. 3) or width Gumstick SSD (Fig. 4).In other embodiment
In, memory assembly 110 can be other SSD of other yardsticks.Each memory assembly 110 can include memory group
Edge connector 114 and second end 116 relative with edge connector 114 at the first end of piece installing.Depositing shown in Fig. 3-4
Reservoir assembly is only example, and can be used for including the edge connector with fingertip according to the connector 102 of this technology
114 wide variety of different memory assembly 110.Additionally, it is contemplated that being applied to not according to the connector 102 of this technology
The semiconductor memory assembly of memory assembly used in SSD equipment is same as, its such as SD storage cards, micro- SD are stored
Card, USB device and other semiconductor memory assemblies with the fingertip to be protected during test and assembling.
In addition to memory assembly 110 is electrically coupled into carrier 100, connector 102 is also physically by memory group
The edge connector 114 of piece installing 110 is fixed on carrier 100.Such as in Fig. 3-5 isometric front view and Fig. 6 rear isometric view
See, the second end 116 of memory assembly 110 can be attached to carrier 110 via mechanical connector 118.Mechanical connector
118 can have with the identical mechanically actuated of connector 102, as will be described below.But, because the second end 116 may not
Including fingertip, therefore mechanical connector need not include the electrical connection of contact pilotage and connector 102.But, if memory group
Second end 116 of piece installing 110 includes the edge connector with fingertip and (replaces or be additional to the relative of memory assembly 110
Edge connector), mechanical connector 118 can include contact pilotage and electrical connection, and can be with the phase of connector 102 described below
Together.
Carrier 100 supports memory to assemble along its length between being additionally may included in the end 116 of edge connector 114 and second
The support 122 of part 110.As shown in Figures 4 and 5, support 122 can include extremity piece 124 and 126, and it is close to each other that it is installed as translation
Or away from each other, think the space between the memory assembly adjustment extremity piece 124 and 126 of different in width.In other embodiment
In, support 122 can have the extremity piece in fixed position, and in other embodiments, it is convenient to omit support 122.
Fig. 7 and 8 shows the stereogram of the amplification of connector 102.The connector 102 shown in Fig. 7 and 8 figure is each other
Slightly different embodiment, but substantially have it is similar structurally and operationally.Substrate 104 and lid 106 can be formed by various plastics,
It is for example including PEI, makrolon or its combination.In other embodiments, connector 102 can be by other dielectrics
Material is formed.Substrate 104 and lid 106 can be formed as the part of separation, then be connected by hinge 128.Hinge 128 can be used
Spring loads are upwardly away from substrate 104 to bias lid 106.In other embodiments, hinge 128 need not be added with spring
Carry.
With reference to Fig. 7, substrate 104 can include being used to receive the spill of the edge connector 114 of memory assembly 110
134.The size of the length and width of spill 130 can correspond to the length and width of edge connector 114, to ensure that edge connects
Connect being properly aligned with spill 130 of device 114.
Spill 130 can also include the first row contact pilotage 134.There is provided contact pilotage 134 is used for the lower surface with edge connector 114
On fingertip matching.As described below, when lid is engaged to substrate 104, each contact pilotage 134 is formed memory assembly
Fingertip 140 on 110 lower surface is electrically coupled to a part for the conductive path of the edge connector at the end of carrier 100.
Fig. 8 shows multiple fingertips 140 on the upper surface of the edge connector 114 of memory assembly 110.Edge connects
One group of fingertip of identical can be included by connecing the relative lower surface of device 114.The arrangement contact pilotage 134 in the spill 130 of substrate 104,
So that when edge connector 114 is located in spill 130, the fingertip on the lower surface of edge connector 114 can be located at correspondence
Contact pilotage 134 top on.
In one embodiment, edge connector 114 can be configured according to PCIe Serial Extensions bus standard, and it includes
32 fingertips 140 on an upper and 32 fingertips on the lower surface.It is appreciated that any various PCIe can be used total
Line width, including 1x, 2x, 4x, 8x, 12x, 16x and 32x highway width.Additionally, it is contemplated that using with non-standard quantity
The PCIe edge connectors configuration of the customization of fingertip.It is also contemplated that in other embodiments, can be according to different from PCIe buses
The standard of standard configures edge connector 114.In embodiment, can have in spill 130 at least with edge connector 114
Lower surface on fingertip contact pilotage 134 as many.Contact pilotage 134 can be with touching on the lower surface of edges matched connector 114
The position of finger.
As shown in Fig. 9 side view, when the edge connector 114 of memory assembly 110 is located in substrate 104, touch
Pin 134 is engaged with each fingertip 140 on the lower surface of edge connector 114, so as in fingertip 140 and contact pilotage 134
Between transmission power supply, and signal.The second end that contact pilotage 134 each makes electrical contact with the touch pad 144 on PCB 148, touch pad can
It is formed in carrier, on carrier or as a part for carrier 100.Touch pad 144 is coupled in electric lead 150 again, the electric lead
150 by power supply, and signal fingertip 152 on the lower surface of the edge connector 154 of carrier 100 is transferred to from contact pilotage 134.Side
Edge connector 154 is for example shown in Fig. 9 and Fig. 3-6.In this way, it is possible to by the edge connector 114 from memory assembly 110
Lower surface on fingertip 140 power supply, and signal be transferred on the lower surface of the edge connector 154 of carrier 100 touch
Refer to 152.
With reference to Fig. 7-12, substrate 104 can include the second row contact pilotage 160, and lid 106 can include the third line touch pad 162
With fourth line contact pilotage 164.When lid 106 is engaged into substrate 104, this second, third and fourth line in each contact pilotage
160th, 164 and each contact pilotage 162 formed and the fingertip 140 on the upper surface of memory assembly 110 be electrically coupled to carrier 100
The conductive path of the fingertip 152 of edge connector 154, as will now be described.
Once placing memory assembly 110 edge connector 114 is put into spill 130, the lid 106 can be rotated
To cover, as Fig. 9-12 consistently shown in.Once cover, contact pilotage 164 and each fingertip on the upper surface of edge connector 114
140 coordinate.In embodiment, there can be the contact pilotage at least with the fingertip 140 on the upper surface of edge connector 114 as many
164.Contact pilotage 164 can be with the position of the fingertip on the upper surface of edges matched connector 114.
Once the lid 106 is covered, then fingertip 140 is coupled in contact pilotage 164, and contact pilotage 164 is coupled in touch pad via electric lead 168
162.When the lid is covered, touch pad 162 is also in contact with contact pilotage 160.It is appreciated that each position of contact pilotage 162 and touch pad 160
Putting to exchange so that touch pad is in substrate 104, and contact pilotage is in lid 106.
Contact pilotage 160 each has the second end made electrical contact with the touch pad 172 on PCB 148.Touch pad 172 is coupled in electric lead
174, the electric lead 174 is coupled in the fingertip 152 on the upper surface of the edge connector 154 of carrier 100 again.In this way, one
The denier lid is covered and carrier 100 is inserted into test equipment, then can be by power supply from the edge connector 154 of carrier 100
Fingertip 152 on upper surface is sent to the fingertip 140 on the upper surface of the edge connector 114 of memory assembly 110.So
Afterwards, signal can be transmitted bidirectionally
When lid 106 is covered onto substrate 104,180,182 can be fastened with a bolt or latch for example, by a pair of the lockings formed in lid 106
Lid is engaging in place, as shown in figure 13.Specifically, when the lid 106 is covered, the shape in substrate 104 of locking door bolt 180,182
Into respective hole 184,186 in pin, lid is engaged in substrate, and one end of memory assembly 110 is fastened on
In carrier 100.When expecting to remove memory assembly 110 from carrier 100, a pair of buttons 188,190 can be pressed will to lock
Door bolt 180,182 is closed to discharge from hole 184,186.Button 188,190 can be relative to each other, so as to be squeezed by using thumb and forefinger
Button 188,190 is pressed easily to discharge the lid.It is appreciated that in other embodiments, can by other locking mechanisms come
Lid 106 is engaged in substrate 104.
As shown in Figure 6, will for example, mechanical connector 118 can have the locking mechanism similar with connector 102
Second end 116 of memory assembly 110 is engaged in carrier 110.Can be provided on mechanical connector 118 includes such as silicon
The sponge 192 of rubber cushion ensures that the second end 116 of memory assembly 110 is held firmly in mechanical connector 118
It is interior.Sponge 192 can be omitted in other embodiments.
When lid 106 is engaged to the substrate 104 in connector 102, contact pilotage 134 and 164 is respectively to edge connector 114
The fingertip 140 of upper and lower surface exert a force.In order to control these power, while still providing good between contact pilotage and fingertip
Electrical contact, the contact pilotage used in connector 102 can be so-called pogo contact pilotages, and it has spring-loaded telescopic portion
Point, as shown in figs. 14-15.Figure 14 and 15 shows the contact pilotage 134 with top, and edge connector 114 and fingertip are worked as in the top
140 are depressed to resist the power of spring 196 when disposed thereon.When lid 106 is engaged to substrate 104, in edge connector 114
Upper surface on contact pilotage 164 and fingertip 140 between set up similar contact.The spring constant of control spring 196 is provided, can be controlled
The power that applies between contact pilotage 134,164 and fingertip 140 is made in acceptable level so that formed not on fingertip scratch or
Impression.The contact pilotage 160 engaged in substrate 104 by the touch pad 162 in lid 106 can be with similar to be as described above spring-loaded
Pogo contact pilotages.Below with reference to as described in Figure 17-19, in other embodiments, contact pilotage 134,164 and/or 160 can be other classes
The electrical contact of type.
As described above, in embodiment, memory assembly 110 can according to PCIe Serial Extensions bus standard work
Make, it includes the fingertip in both upper and lower surfaces of edge connector 114.But, in other embodiments, memory
Assembly 110 can be according to the configuration of different bus standards or customization come work.Connector 102 shown in Figure 16 is configured to
Worked together with the memory assembly 110 with fingertip only on the upper surface of edge connector 114.In this embodiment
In, it is convenient to omit the contact pilotage 134 of existing embodiment.Can be via contact pilotage 164 as described above, electric lead 168, the and of touch pad 162
Contact pilotage 160 by the power supply of the fingertip 140 on the upper surface from edge connector 114, and signal be sent to carrier.At other
In embodiment, fingertip 140 can be provided only on the lower surface of edge connector 114.In such embodiments it is possible to by such as
Upper described contact pilotage 134 transmit the power supply from fingertip 140, and signal.In such embodiments it is possible to omit contact pilotage 164,
Electric lead 168, touch pad 162 and contact pilotage 160.
As described above, in the embodiment of connector 102, spring-loaded pogo contact pilotages can be used to be used as contact pilotage
134th, 164 and/or 160 with control to fingertip 140 apply power.Figure 17-19 is illustrated replaces contact pilotage 160 by electric connector 202
With 164 another example.Each electric connector 202 can be installed in lid 106, and can be included when lid 106 is covered
The first end 204 contacted with the fingertip 140 on the upper surface of edge connector 114.First end 204 can be by cantilever
(cantilever) so that they can bend, and provide against fingertip 140 contact force, the contact force can be controlled and
Maintain possible scratch or weigh the below horizontal of fingertip wounded.
Each electric connector 202 can include second end 206 relative with first end 204.When lid 106 is covered, the
Two ends 206 can with the touch pad 210 that is formed on the PCB 148 of carrier 100 surface it is relative against.Electric lead then can be by electricity
Source, and signal fingertip 152 on the upper surface of the edge connector 154 before carrier 100 is transferred to from touch pad 210.The
Two ends 204 can also be by cantilever so that they can bend, and provides the controlled exposure power to touch pad 210.
Although it is not shown, but contact pilotage 134 additional can be replaced alternatively or by the electric connector with such as cantilever end.
As described above, these electric connectors can be to/from the fingertip on the upper surface of the edge connector 114 of memory assembly 110
140 transmission power supplys, and signal.
Contact for some spring biasings of formation of fingertip 140 or cantilever can provide some advantages.However, it is possible to manage
Solution, can be in substrate 104 and/or lid 106 using not being that the electric connector of spring biasing or cantilever carrys out engagement edge connector
Fingertip 140 on 114 lower surface and/or upper surface.In other embodiments, the lid 106 can use following mechanism is next can
Substrate 104 is pivotally mounted to, the lid is biased against substrate 104 by the mechanism when lid is covered, but allows this to cover vertical
In some floatings on the direction of the upper surface of substrate 104.When the power between fingertip and contact pilotage reaches predetermined force, the mechanism
The lid 106 translation can be allowed to depart slightly from substrate 104.In this way, the electrical contact in substrate and lid applies relative to fingertip
Power can be controlled and be maintained scratch or the below horizontal of fingertip may be weighed wounded.
Operationally, connector 102 and mechanical connector 118 can be initially installed on carrier 100.In an example
In son, the connector 102 can be pinned to the carrier 100 with screw, it is ensured that the above-mentioned electrical contact at the lower surface of connector 102
It is appropriately aligned with each touch pad on the PCB 148 of carrier 100.Mechanical connector 118 can similarly be pinned to load with screw
On body 100.Other attachment schemes are also possible.
Memory assembly 110 can be then placed in carrier 100, and edge connector 114 is located at spill 130
In, and the second end 116 is in mechanical connector 118.It is then possible to using above-mentioned locking mechanism, by connector 102 and machinery
Lid on connector 118 engages relative to its respective substrate.It is contemplated that can be assembled for different types of memory
Part 110 customizes different connectors 102.
After being installed in carrier 100, the memory assembly 110 can be transmitted and test in carrier.As above institute
State, the electrical connection in connector 102 by power supply, and signal from the upper surface of the edge connector 114 of memory assembly 110
(the figure of fingertip 152 in the upper and lower surface of the edge connector 154 of carrier 100 is sent to the fingertip 140 on lower surface
7 and Fig. 9).Referring now to Figure 20, interface 216 can be attached to the edge connector 154 of carrier 100, to allow carrier 100
It is inserted into for testing in the test equipment of the memory assembly 110.
In one example, interface 216 can include change-over panel 218 and can be the interface connection of such as mSATA interfaces
Device 220.Change-over panel 218 can be provided PCIe interface is converted into mSATA interfaces.Interface connector 220 can include having
The first end of the needle connectors of standard PCIe x4 64, for inserting change-over panel 218.Interface connector 220 can include having using
In the second end of 16 pin mSATA interfaces of insertion test equipment.The insertion change-over panel of fingertip 152 of carrier edge connector 154
218.During testing, tester can have PCIe interface or mSATA interfaces.If tester is mSATA, change-over panel
PCIe interface is converted to mSATA interfaces by 218.On the other hand, if tester interface is PCIe, without using change-over panel 218.
It is appreciated that interface 216 can also only be PCIe interface, only be mSATA interfaces or some other interface.
After completion of testing, connector 102 and mechanical connector 118 can be opened, and memory assembling can be removed
Part 110.According to this technology, the above-mentioned electric connector contacted with the fingertip 150 of memory assembly 110 will not scratch, pressure
Wound and/or other types damage fingertip 150.
The described above of the present invention has been presented for purposes of illustration and description.It is not intended to the exhaustive or limitation present invention
To disclosed precise forms.In the above teachings, many modifications and variations are possible.Above-described embodiment is selected so as to most preferably
Illustrate the principle and its practical application of the present invention, so that those skilled in the art most preferably can make in various embodiments
With the present invention, and using the various modifications suitable for contemplated special-purpose.The scope of the present invention is intended to will by appended right
Ask to limit.
Claims (20)
1. a kind of connector for being used to connect memory assembly and carrier, the memory assembly includes multiple fingertips, institute
Stating connector includes：
Substrate；
Lid, is pivotally mounted to substrate, and can be engaged to the substrate, and the substrate and lid include multiple contact pilotages, when this
Lid is engaged to multiple fingertips of the multiple stylus contact memory assembly during the substrate, and the substrate and lid can be by
The memory assembly is electrically coupled to the carrier, and the substrate and lid can be physically by the memory assembly couplings
Together in the carrier.
2. connector according to claim 1, wherein, the multiple contact pilotage is installed in the lid, for when described
Contact memory assembly towards multiple fingertips in the surface of lid when lid is engaged to the substrate.
3. connector according to claim 1, wherein, the multiple contact pilotage is installed in the substrate, for working as
State memory assembly be placed to contacted when in the substrate memory assembly towards many in the surface of the substrate
Individual fingertip.
4. connector according to claim 1, wherein, first group of multiple contact pilotage is installed in the lid, for working as
State when lid is engaged to the substrate and contact towards first group of multiple fingertip in the surface of the memory assembly of the lid, and
Wherein, second group of multiple contact pilotage is installed in the substrate, for being placed on the substrate when the memory assembly
Contacted when upper towards second group of multiple fingertip in the surface of the memory assembly of the substrate.
5. connector according to claim 1, wherein, the multiple contact pilotage is inclined by spring against the multiple fingertip
Put.
6. connector according to claim 5, wherein, the multiple contact pilotage is pogo contact pilotages.
7. a kind of carrier for being used to receive the memory assembly for including multiple fingertips, the carrier includes：
In the edge connector of the end of the carrier；
Carrier connector, including：
Substrate, and
Lid, is pivotally mounted to substrate, and can be engaged to the substrate, and the substrate and lid include physically depositing
Reservoir assembly is coupled in the carrier；And
Multiple contact pilotages, it is each to be used to be formed the described many of the memory assembly when the lid is engaged to the substrate
Individual fingertip is electrically coupled to a part for the conductive path of the edge connector at the end of the carrier.
8. carrier according to claim 7, wherein, the multiple contact pilotage is installed in the lid, for when the lid
Contact memory assembly towards multiple fingertips in the surface of lid when being engaged to the substrate.
9. carrier according to claim 8, wherein, the multiple contact pilotage includes first group of multiple contact pilotage, and the carrier is also
Including：
Multiple touch pads in the lid, are electrically coupled to first group of multiple contact pilotage；
Second group of multiple contact pilotage in the substrate, second group of multiple contact pilotage described in when the lid is engaged to the substrate
The multiple touch pad in the lid is electrically coupled to, second group of multiple contact pilotage are also electric via the electric lead in the carrier
It is coupled in the edge connector in the carrier.
10. carrier according to claim 9, wherein, it is described more than second group when the lid is pivoted away from the substrate
Individual contact pilotage is not electrically coupled to multiple touch pads in the lid.
11. carrier according to claim 8, wherein, the multiple contact pilotage includes first group of multiple contact pilotage, and the carrier is also
Including：
Second group of multiple contact pilotage in the lid, are electrically coupled to first group of multiple contact pilotage；
Multiple touch pads in the substrate, when the lid is engaged to the substrate, the multiple touch pad is electrically coupled to described
Second group of multiple contact pilotage in lid, the multiple touch pad is also electrically coupled to the load via the electric lead in the carrier
Edge connector in body.
12. carrier according to claim 11, wherein, it is the multiple to touch when the lid is pivoted away from the substrate
Pad is not electrically coupled to second group of multiple contact pilotage in the lid.
13. carrier according to claim 7, wherein, the multiple contact pilotage is installed in the substrate, for when described
Memory assembly be placed to contacted when in the substrate memory assembly towards multiple in the surface of the substrate
Fingertip.
14. carrier according to claim 7, in addition to for the lid to be engaged to the locking mechanism of the substrate.
15. carrier according to claim 7, in addition to for relative with one end including the edge connector to be deposited
Second end of reservoir assembly is fixed to the mechanical connector of the carrier.
16. a kind of carrier, for receive include first group of multiple fingertip on the first surface of memory assembly and relative to
The memory assembly of second group of multiple fingertip on the second surface of the memory assembly of first surface, the carrier bag
Include：
In the edge connector of the end of the carrier；
Carrier connector, including：
Substrate, the substrate includes first group of multiple contact pilotage, for being placed on the substrate when the memory assembly
When contact first group of multiple fingertip on the first surface of the memory assembly, and
Lid, is pivotally mounted to the substrate, and can move between the open and the closed positions, in the open position
In putting, the lid is pivoted away from the substrate, and in the closing position, the lid is rotated towards the substrate, the lid
It is multiple tactile including second group on the second surface for contacting the memory assembly when the lid is in the close position
The second group of multiple contact pilotage referred to；
Each contact pilotage formation of first group of multiple contact pilotage is electrically coupled the memory group when the lid is in the close position
A part for the conductive path of edge connector at first group of multiple fingertip of piece installing and the end of the carrier；
Each contact pilotage formation of second group of multiple contact pilotage is electrically coupled the memory group when the lid is in the close position
A part for the conductive path of edge connector at second group of multiple fingertip of piece installing and the end of the carrier.
17. carrier according to claim 16, wherein, second group is electrically coupled when the lid is in the close position and multiple is touched
Refer to and the conductive path of edge connector includes the Part II in Part I and the substrate in the lid, when the lid
First and second parts are electrically coupled to one another described in when in the close position.
18. carrier according to claim 17, wherein, first and second part when the cover is in an open position
It is not electrically coupled to one another.
19. carrier according to claim 16, wherein, the substrate and lid are electrically coupled the memory assembly and described
Carrier, and the substrate and lid physically couple the memory assembly and the carrier.
20. carrier according to claim 16, wherein, matched somebody with somebody according to quick peripheral assembly interconnecting Serial Extension bus standard
Put first group of multiple contact pilotage and second group of multiple contact pilotage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310108488.5A CN104078081B (en) | 2013-03-29 | 2013-03-29 | Not scratch interface fingertip and the equipment for connecting semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310108488.5A CN104078081B (en) | 2013-03-29 | 2013-03-29 | Not scratch interface fingertip and the equipment for connecting semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104078081A CN104078081A (en) | 2014-10-01 |
| CN104078081B true CN104078081B (en) | 2017-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310108488.5A Expired - Fee Related CN104078081B (en) | 2013-03-29 | 2013-03-29 | Not scratch interface fingertip and the equipment for connecting semiconductor device |
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| Country | Link |
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| CN (1) | CN104078081B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11570924B2 (en) | 2020-02-24 | 2023-01-31 | Western Digital Technologies, Inc. | Data storage device adaptor with securement mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101005002B1 (en) * | 2005-11-01 | 2010-12-30 | 샌디스크 아이엘 엘티디 | A method, system and computerreadable code for testing of flash memory |
| CN101452744B (en) * | 2007-12-05 | 2011-05-25 | 华东科技股份有限公司 | Mini side disk with plug-in resisting concatenation groove |
| CN201364887Y (en) * | 2008-12-17 | 2009-12-16 | 中芯国际集成电路制造(上海)有限公司 | Scratchproof track |
| WO2012092707A1 (en) * | 2011-01-04 | 2012-07-12 | Sandisk Semiconductor (Shanghai) Co., Ltd. | Continuous wire bonding |
| CN202713772U (en) * | 2012-06-14 | 2013-01-30 | 广州美维电子有限公司 | Gold-plated finger printed circuit board |
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