CN104061946A - Multi-station MEMS gyro testing socket - Google Patents

Multi-station MEMS gyro testing socket Download PDF

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Publication number
CN104061946A
CN104061946A CN201410314306.4A CN201410314306A CN104061946A CN 104061946 A CN104061946 A CN 104061946A CN 201410314306 A CN201410314306 A CN 201410314306A CN 104061946 A CN104061946 A CN 104061946A
Authority
CN
China
Prior art keywords
float plate
base
top board
standing groove
multistation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410314306.4A
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Chinese (zh)
Inventor
朱小刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU CHUANGRUI MACHINERY AND ELECTRICAL TECHNOLOGY Co Ltd
Original Assignee
SUZHOU CHUANGRUI MACHINERY AND ELECTRICAL TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU CHUANGRUI MACHINERY AND ELECTRICAL TECHNOLOGY Co Ltd filed Critical SUZHOU CHUANGRUI MACHINERY AND ELECTRICAL TECHNOLOGY Co Ltd
Priority to CN201410314306.4A priority Critical patent/CN104061946A/en
Publication of CN104061946A publication Critical patent/CN104061946A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • G01C25/005Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)

Abstract

The invention provides a multi-station MEMS gyro testing socket which comprises an upper pressing plate and a base. The base is pressed by the upper pressing plate. The multi-station MEMS gyro testing socket is characterized in that a floating plate containing groove is formed in the base, a floating plate is arranged in the floating plate containing groove, an elastic piece is arranged at the bottom of the floating plate, a plurality of element containing grooves are formed in the floating plate, a plurality of protrusions corresponding to the element containing grooves in position are arranged on the upper pressing plate, a plurality of sets of probes are arranged on the base, the upper ends of the multiple sets of probes movably penetrate through the floating plate and are located in the element containing grooves respectively, and the lower ends of the multiple sets of probes are connected with an adapter PCB. By means of the multi-station MEMS gyro testing socket, the testing accuracy of an MEMS gyro can be effectively improved, the testing speed of the MEMS gyro can be effectively increased, and the working efficiency is improved.

Description

The test jack of multistation MEMS gyroscope
Technical field
The present invention relates to a kind of gyroscope test jack, particularly a kind of socket that can test MEMS gyroscope at multistation.
Background technology
MEMS (micro electro mechanical system) (MEMS, Micro-Electro-Mechanical System) is a kind of advanced person's manufacturing technology platform.It take semiconductor fabrication as base growth.MEMS technology has adopted a series of prior art and the materials such as the photoetching in semiconductor technology, burn into film, and therefore from manufacturing technology itself, in MEMS, basic manufacturing technology is ripe.But MEMS more lays particular emphasis on ultraprecise machining, and to relate to microelectronics, material, mechanics, chemistry, mechanics subjects field.Its subject face also expands physical each branches such as power under microscale, electricity, light, magnetic, sound, surface to.
People utilize the gyroscopic apparatus of the made various functions of the mechanical property of gyro to be called gyroscope (gyroscope), and it has a wide range of applications in every field such as science, technology, military affairs.Such as: gyrostatic compass, directed indicator, the upset of shell, the nutating of gyro, the earth draw precession (precession of the equinoxes) under moment loading etc. at the sun (moon).Gyroscope is widely used in Aeronautics and Astronautics and navigational field.At present, the MEMS gyroscope of part has gradually adopted BGA packing forms, and pin Pitch is also more and more less.Its product test process will guarantee that test environment reaches without magnetic requirement, requires again the contact stabilization of tin ball dot matrix.Test jack meeting in the market adopts SEMI-CONTACTOR probe (POGO PIN) to detect, but due to its intrinsic design defect, cause in multistation test process, often occur that product takes out difficulty, locate inaccurate, Electrostatic Absorption, the unfavorable condition such as short circuit even, testing efficiency is not high all the time.
Summary of the invention
The shortcoming of prior art, the object of the present invention is to provide a kind of accurate positioning, the test jack of the much higher station MEMS of testing efficiency gyroscope in view of the above.
For achieving the above object and other relevant objects, the invention provides the test jack of a kind of multistation MEMS gyroscope, it comprises a top board and a base, described top board is pressed on described base, it is characterized in that: described base is provided with a float plate standing groove, in described float plate standing groove, be provided with a float plate, the bottom of described float plate is provided with elastic component, in described float plate, be provided with several element standing grooves, described top board is provided with the corresponding projection in several and described element standing groove position, described base is provided with array probe, the upper end of described array probe is mobilizable through described float plate and lay respectively in described element standing groove, the lower end of described array probe is connected with switching pcb board.
Preferably, between described top board and described base, by buckle structure, be connected.
Preferably, the coboundary opening part of described element standing groove is provided with guide angle.
Preferably, described top board is provided with blowing mouth, and when described top board is pressed on described base, described blowing mouth is communicated with described element standing groove.
Preferably, the elastic component of described float plate bottom is spring.
As mentioned above, multistation MEMS gyroscope of the present invention test jack has following beneficial effect: this test jack is set directly at element standing groove in float plate, when testing, several MEMS gyroscopes are placed on respectively in each element standing groove in float plate, then top board and base are compressed, now float plate can be according to element size and the suffered elastic force automatic position adjusting function of float plate, thereby can make probe fully contact with the tin ball on MEMS gyroscope, the circuit connection of guaranteeing the circuit on MEMS gyroscope and transferring on PCB, guarantee that tin ball does not break simultaneously.Adopt this test jack can effectively improve the gyrostatic measuring accuracy of MEMS and speed, increase work efficiency.
Accompanying drawing explanation
Fig. 1 is the front section view of the embodiment of the present invention.
Fig. 2 is the vertical view (not comprising top board) of the embodiment of the present invention
Element numbers explanation
1 switching pcb board
2 bases
3 snap closes
4 top boards
5 float plate
6 probes
7 element standing grooves
Embodiment
By particular specific embodiment explanation embodiments of the present invention, person skilled in the art scholar can understand other advantages of the present invention and effect easily by the disclosed content of this instructions below.
Refer to Fig. 1,2.Notice, appended graphic the illustrated structure of this instructions, ratio, size etc., equal contents in order to coordinate instructions to disclose only, for person skilled in the art scholar, understand and read, not in order to limit the enforceable qualifications of the present invention, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, not affecting under the effect that the present invention can produce and the object that can reach, all should still drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, in this instructions, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under without essence change technology contents, when being also considered as the enforceable category of the present invention.
As shown in Figure 1, 2, the invention provides the test jack of a kind of multistation MEMS gyroscope, comprise a top board 4 and a base 2, top board 4 is pressed on base 2, and MEMS gyroscope is clipped between the two to be tested.On base 2, be provided with a float plate standing groove, be provided with a float plate 5 in float plate standing groove, the bottom of float plate 5 is provided with elastic component, and float plate 5 can move up and down freely in float plate standing groove, and the elastic component of float plate 5 bottoms is spring.In float plate 5, be provided with several element standing grooves 7, top board 4 is provided with several projections corresponding with element standing groove 7 positions, base 2 is provided with array probe 6, the upper end of array probe 6 is mobilizable through float plate 5 and lay respectively in element standing groove 7, the lower end of array probe 6 is connected with switching pcb board 1, and switching pcb board 1 is positioned at the lower surface of base 2.
When testing, several MEMS gyroscopes are placed on respectively in each element standing groove 7 in float plate 5, then top board 4 and base 2 are compressed, for the ease of clamping, can on top board 4 or base 2, snap close 3 be set, make by buckle structure, to be connected between top board 4 and base 2.After snap close locking, float plate 5 can be according to element size and the suffered elastic force automatic position adjusting function of float plate 5, thereby can make probe fully contact with the tin ball on MEMS gyroscope, the circuit connection of guaranteeing the circuit on MEMS gyroscope and transferring on PCB guarantees that tin ball does not break simultaneously.
While compressing with base 2 for the ease of top board 4, the projection on top board 4 can be pressed in element standing groove 7 smoothly, can be provided with guide angle at the coboundary opening part of element standing groove 7.The problem that while opening in order to solve top board 4, MEMS gyroscope is easily taken out of by top board, can be provided with blowing mouth by top board 4, and when top board 4 is pressed on base 2, blowing mouth is communicated with element standing groove 7, each like this while opening top board 4, only need to blowing in element standing groove 7, just can prevent that MEMS gyroscope from being taken out of by blowing mouth.
This test jack meets the basic demand of MEMS gyroscope product test: open-short circuit requires False Rate lower than 3%; Measuring current, voltage, resistor satisfied product design, signal transmission attenuation rate is lower than 3 ‰; Product tin ball damaged area is less than 1/4 of tin bulb diameter; Meet the small-sized, integrated of product: tin sphere gap 0.4mm; Test electrostatic prevention: higher than 14 order of magnitude OHM.CM (this test jack mainly adopts ceramic PEEK and copper as starting material); By the cooperation with tester table, meet product test and reach production capacity requirement: a hour test volume reaches 1KPCS; Adopt as can be seen here this test jack can effectively improve the gyrostatic measuring accuracy of MEMS and speed, increase work efficiency.So the present invention has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all can, under spirit of the present invention and category, modify or change above-described embodiment.Therefore, such as in affiliated technical field, have and conventionally know that the knowledgeable, not departing from all equivalence modifications that complete under disclosed spirit and technological thought or changing, must be contained by claim of the present invention.

Claims (5)

1. multistation MEMS gyroscope test jack, it comprises a top board and a base, described top board is pressed on described base, it is characterized in that: described base is provided with a float plate standing groove, in described float plate standing groove, be provided with a float plate, the bottom of described float plate is provided with elastic component, in described float plate, be provided with several element standing grooves, described top board is provided with the corresponding projection in several and described element standing groove position, described base is provided with array probe, the upper end of described array probe is mobilizable through described float plate and lay respectively in described element standing groove, the lower end of described array probe is connected with switching pcb board.
2. multistation MEMS gyroscope according to claim 1 test jack, is characterized in that: between described top board and described base, by buckle structure, be connected.
3. multistation MEMS gyroscope according to claim 1 test jack, is characterized in that: the coboundary opening part of described element standing groove is provided with guide angle.
4. multistation MEMS gyroscope according to claim 1 test jack, is characterized in that: described top board is provided with blowing mouth, and when described top board is pressed on described base, described blowing mouth is communicated with described element standing groove.
5. multistation MEMS gyroscope according to claim 1 test jack, is characterized in that: the elastic component of described float plate bottom is spring.
CN201410314306.4A 2014-07-03 2014-07-03 Multi-station MEMS gyro testing socket Pending CN104061946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410314306.4A CN104061946A (en) 2014-07-03 2014-07-03 Multi-station MEMS gyro testing socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410314306.4A CN104061946A (en) 2014-07-03 2014-07-03 Multi-station MEMS gyro testing socket

Publications (1)

Publication Number Publication Date
CN104061946A true CN104061946A (en) 2014-09-24

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108168578A (en) * 2017-12-26 2018-06-15 陕西航天时代导航设备有限公司 A kind of novel MEMS gyroscope test device
CN110672120A (en) * 2019-09-09 2020-01-10 武汉元生创新科技有限公司 Device calibration device
CN111983439A (en) * 2019-05-23 2020-11-24 河南许继仪表有限公司 Relay positioning testing device and relay testing equipment using same

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CN202614796U (en) * 2012-05-02 2012-12-19 苏州创瑞机电科技有限公司 Upper cover air blowing system for chip testing socket
CN202614795U (en) * 2012-05-02 2012-12-19 苏州创瑞机电科技有限公司 Chip module resistor test socket
CN202794228U (en) * 2012-05-02 2013-03-13 苏州创瑞机电科技有限公司 Pressure plate rotary mechanism of chip module group testing socket
CN103439541A (en) * 2013-09-03 2013-12-11 苏州创瑞机电科技有限公司 Automatic locating and testing socket for CMOS camera shooting chip floating carrier plate
CN103487043A (en) * 2012-06-08 2014-01-01 精工爱普生株式会社 Sensor unit, electronic device, and moving body
CN103487609A (en) * 2013-09-09 2014-01-01 苏州创瑞机电科技有限公司 Tens of millions of pixel level CMOS optical chip module test socket
CN203519658U (en) * 2013-09-03 2014-04-02 苏州创瑞机电科技有限公司 Automatic test socket of megapixel-level CMOS optical chip module
CN203519657U (en) * 2013-09-03 2014-04-02 苏州创瑞机电科技有限公司 Wafer level camera module (WLC) automatic test socket
CN103809097A (en) * 2012-11-13 2014-05-21 京元电子股份有限公司 Test seat and system with improved pressure columns
CN203964924U (en) * 2014-07-03 2014-11-26 苏州创瑞机电科技有限公司 The test jack of multistation MEMS gyroscope

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202614796U (en) * 2012-05-02 2012-12-19 苏州创瑞机电科技有限公司 Upper cover air blowing system for chip testing socket
CN202614795U (en) * 2012-05-02 2012-12-19 苏州创瑞机电科技有限公司 Chip module resistor test socket
CN202794228U (en) * 2012-05-02 2013-03-13 苏州创瑞机电科技有限公司 Pressure plate rotary mechanism of chip module group testing socket
CN103487043A (en) * 2012-06-08 2014-01-01 精工爱普生株式会社 Sensor unit, electronic device, and moving body
CN103809097A (en) * 2012-11-13 2014-05-21 京元电子股份有限公司 Test seat and system with improved pressure columns
CN103439541A (en) * 2013-09-03 2013-12-11 苏州创瑞机电科技有限公司 Automatic locating and testing socket for CMOS camera shooting chip floating carrier plate
CN203519658U (en) * 2013-09-03 2014-04-02 苏州创瑞机电科技有限公司 Automatic test socket of megapixel-level CMOS optical chip module
CN203519657U (en) * 2013-09-03 2014-04-02 苏州创瑞机电科技有限公司 Wafer level camera module (WLC) automatic test socket
CN103487609A (en) * 2013-09-09 2014-01-01 苏州创瑞机电科技有限公司 Tens of millions of pixel level CMOS optical chip module test socket
CN203964924U (en) * 2014-07-03 2014-11-26 苏州创瑞机电科技有限公司 The test jack of multistation MEMS gyroscope

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108168578A (en) * 2017-12-26 2018-06-15 陕西航天时代导航设备有限公司 A kind of novel MEMS gyroscope test device
CN111983439A (en) * 2019-05-23 2020-11-24 河南许继仪表有限公司 Relay positioning testing device and relay testing equipment using same
CN110672120A (en) * 2019-09-09 2020-01-10 武汉元生创新科技有限公司 Device calibration device
CN110672120B (en) * 2019-09-09 2021-04-27 武汉元生创新科技有限公司 Device calibration device

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Application publication date: 20140924

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