CN104056674B - A kind of electron spray micro-fluid chip, preparation method and mask plate equipment - Google Patents
A kind of electron spray micro-fluid chip, preparation method and mask plate equipment Download PDFInfo
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Abstract
A kind of electron spray micro-fluid chip, its preparation method and mask plate equipment, two pieces of mask plates that the method adopts translucent construction different, by using two pieces of mask plates successively, different structures can be formed in the different photoresist degree of depth, final development obtains desired structure, using it as micro-fluid chip mould, the integration on micro-fluid chip of the nozzle of micro-fluid chip can be made to be formed, and namely fluid channel outlet is directly formed to the nozzle of micro-fluid chip.Because nozzle can direct stripping forming from the mould that photoresist is formed, and non-cutting finishing obtained, and gained micro-fluid chip can obtain good electron spray effect, effectively the problem of the existing high polymer micro-fluid chip electron spray weak effect of solution.
Description
Technical field
The present invention relates to micro-fluid chip, particularly relate to a kind of electron spray micro-fluid chip, preparation method and mask plate equipment.
Background technology
Micro-fluid chip particularly possesses the integrated microfluidic chip of high density, extensive, high flux, the feature such as multi-functional, plays an important role in fields such as chemistry and biologies.Compared with the experimental provision of macro-scale, this technology significantly reduces the consumption of sample, improves reaction efficiency.Also reduce experiment simultaneously and produce refuse to the pollution of environment; The parallel advantage of integrated microfluidic chip operation can realize high flux, the Automated condtrol of testing; And accurately can be controlled by fine structures such as micro-valve Micropumps.This makes micro-fluid chip in analysis field, have irreplaceable advantage.
Mass spectral analysis is a kind of analytical method measuring ion mass-to-charge ratio, its general principle is that each component in sample is ionized in an ion source, generate the positively charged ion of different mass-to-charge ratio, through the effect of accelerating field, form ion beam, enter mass analyzer, utilize Electric and magnetic fields that ion is deflected, they are focused on respectively and obtains mass spectrogram, thus determine its quality.The instrument that this principle is analyzed unknown materials applied just by mass spectrograph.Electrospray ionization mass spectrum (ElectrosprayIon-MassSpectrometer, ESI-MS) coupling is applied to species analysis field more for a long time, but while mass spectrograph has this advantage of high sensitivity, it is often also very high to ionogenic requirement.Traditional spray needle ion gun needs on other platforms, to carry out that pre-treatment, sample consumption are large to sample, separative efficiency and the problem such as efficiency of transmission is not high.The mass spectrographic microfluid electric spray ion source of coupling arises at the historic moment, and micro-fluid chip can the function such as pre-treatment, pre-separation, electron spray of integrated sample, substantially increases the sensitivity of detection, reduces the consumption of sample.
The many employing quartz of the micro-fluid chip with better electron spray effect reported in research, glass material.Another kind of common used material is high polymer dimethyl silicone polymer (polydimethylsiloxane, PDMS), and the electron spray effect adopting it to obtain is then more difficult.But its relative first two material cost is much lower, manufacture craft is simple, and Production Time is short, can batch making, has a very big significance so carry out technologic innovation research to this material and is worth.The structure of good micro-fluid chip, material and a preparation method, can bring very large help to analytical system on cost and structural stability.
Summary of the invention
For solving the problem of existing high polymer micro-fluid chip electron spray weak effect, the invention provides a kind of electron spray micro-fluid chip, preparation method and mask plate equipment.
For achieving the above object, the present invention is by the following technical solutions:
A preparation method for electron spray micro-fluid chip, comprises the following steps:
A. on substrate, the first photoresist layer is covered, by the first mask plate, described first photoresist layer is exposed, develop after exposure, remove and blocked and unexposed photoresist part by described mask plate, wherein said first mask plate has the transmission region for the formation of the liquid storage tank in micro-fluid chip and fluid channel;
B. on described first photoresist layer through development, photoresist layer is covered further, exposed by the photoresist layer of the second mask plate to described further covering, develop after exposure, remove and blocked and unexposed photoresist part by described second mask plate, form groove, there is in described groove the remainder of described first photoresist layer be retained because of the transmission region exposure through described first mask plate, the overlay area of wherein said second mask plate is identical with the overlay area of described first mask plate or be in the overlay area of described first mask plate, and the region of the transmission region for the formation of described fluid channel that described second mask plate corresponds to described first mask plate is lighttight or printing opacity or partial light permeability,
C. high polymer mother metal is solidify to form with the substrate through step b process for mould, chip layer is obtained from described high polymer mother metal, described chip layer comprises the chip part by described recess defining, and described chip part contains the liquid storage tank and fluid channel that are defined by described remainder;
D. another biopolymer layer and described chip layer are bonded together, form the inner micro-fluid chip with fluid channel.
According to preferred embodiment, technical scheme of the present invention can also adopt following technical characteristics:
Described first mask plate and described second mask plate have right angle on the position of correspondence, the transmission region for the formation of described fluid channel of described first mask plate extends facing to the right angle of described first mask plate, and at least extends to the position corresponding to the top of the horn at the right angle of described second mask plate of described first mask plate.
Described first mask plate and described second mask plate are rectangle.
Described first mask plate and described second mask plate printing opacity on the position of correspondence, to provide telltale mark when arranging described second mask plate above described first photoresist layer through development.
Described first mask plate and described second mask plate printing opacity on the position at other three right angles except described right angle of its rectangle, to provide telltale mark when arranging described second mask plate above described first photoresist layer through development, preferably, the shape of printing opacity is cross.
Rotation whirl coating mode is adopted to cover photoresist layer, the degree of depth making described groove reach predetermined by multiple whirl coating, exposure and development in step b.
In steps d, the high polymer mother metal solidify to form has base part and the chip part by described recess defining, described chip section is divided into the boss layer be shaped on described base part, the described vertical projection profile according to described chip part is cut described base part in the mode leaving certain surplus, obtains described chip layer.
Use the electron spray micro-fluid chip that described method makes, the outlet of the fluid channel in described electron spray micro-fluid chip is on a right angle of described electron spray micro-fluid chip.
Preferably, described electron spray micro-fluid chip take high polymer material as material of main part, and preferred described high polymer material is dimethyl silicone polymer.
A kind of mask plate equipment for electron spray micro-fluid chip, comprise the first mask plate and the second mask plate, described first mask plate has the transmission region for the formation of the liquid storage tank in micro-fluid chip and fluid channel, the overlay area of described second mask plate is less than the overlay area of described first mask plate, and the region of the transmission region for the formation of described fluid channel that described second mask plate corresponds to described first mask plate is lighttight or printing opacity or partial light permeability.Preferably, described first mask plate and described second mask plate have right angle on the position of correspondence, the transmission region for the formation of described fluid channel of described first mask plate extends facing to the right angle of described first mask plate, and at least extends to the position corresponding to the top of the horn at the right angle of described second mask plate of described first mask plate.More preferably, described first mask plate and described second mask plate are rectangle, described first mask plate and described second mask plate printing opacity on the position at other three right angles except described right angle of its rectangle, to provide telltale mark when arranging described second mask plate above described first photoresist layer through development.More preferably, the shape of printing opacity is cross.
Beneficial effect of the present invention:
In the present invention, be different from conventional soft lithography process, two pieces of mask plates that method of the present invention adopts translucent construction different, by using two pieces of mask plates successively, can form different structures in the different photoresist degree of depth, final development obtains desired structure, using it as micro-fluid chip mould, the integration on micro-fluid chip of the nozzle of micro-fluid chip can be made to be formed, and namely fluid channel outlet is directly formed to the nozzle of micro-fluid chip.Because nozzle can direct stripping forming from the mould that photoresist is formed, and non-cutting finishing obtained, and gained micro-fluid chip can obtain good electron spray effect, effectively the problem of the existing high polymer micro-fluid chip electron spray weak effect of solution.
Wherein, the position that second mask plate corresponds to the transmission region for the formation of the fluid channel in micro-fluid chip of the first mask plate can be printing opacity, in such situation, the degree of depth of fluid channel is deepened further after use second mask plate, and, different by the width of the transmission region arranging the corresponding fluid channel of first and second mask plate, fluid channel different depth with different in width can also be formed in.
The position that second mask plate corresponds to the transmission region for the formation of the fluid channel in micro-fluid chip of the first mask plate can be lighttight, in this case formed fluid channel, its total depth can be avoided cutting to fluid channel outlet when carrying out follow-up cutting, guarantees the flatness that fluid channel exports.
When partial light permeability, it is light tight that the second mask plate corresponds to fluid channel exit, also can obtain above-mentioned advantage.
The printing opacity design of the corresponding fluid channel of the second mask plate can be determined according to required chip structure.
Further, first mask plate and the second mask plate coordinate the transmission region forming fluid channel to adopt right-angle design on the position of correspondence, thus make nozzle be formed on the right angle of micro-fluid chip, instead of on edge, the spraying of such formation affects little by chip edge, significantly can improve spray effect.Based on the present invention, the relating design of two mask plates can make fluid channel export and accurately remain on chip right angle, effective solution by high polymer as PDMS properties of materials the right angle pipeline that brings generate the problem of difficulty, the structural advantage at right angle improves stability and the ionising effect of electron spray.Can be used for the right angle electron spray micro-fluid chip with mass spectrometry.
Further, polylith mask plate is all containing being used as specifically labelled transmission region, and preferred cross alignment structures, aligns gained photoresist structure after use first mask plate with the second mask plate, the relative position of both restrictions pattern, thus the making quality improving chip structure.
Further, adopt the design of repeatedly whirl coating, exposure, developing process in the technical process of use second mask plate, make chip reach a desirable thickness.
Accompanying drawing explanation
Fig. 1 shows the main flow figure of embodiment of the present invention micro flow chip preparation method;
Fig. 2 shows the schematic diagram of two pieces of mask plates of the embodiment of the present invention;
Fig. 3 to show in Fig. 1 repeatedly the detailed process schematic diagram of whirl coating, exposure and development;
Fig. 4 a to Fig. 4 b shows the top view before chip layer cutting and sectional view;
Fig. 4 c to Fig. 4 d shows the top view after chip layer cutting and sectional view;
Fig. 5 a to Fig. 5 b show with slide and film bonding after overall chip top view and sectional view;
The micro-fluid chip that Fig. 6 shows embodiment carries out the schematic diagram of electric spray sample introduction after being integrated with the preseparating structure based on EOF to mass spectrograph injection port.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiments of the present invention are elaborated.It is emphasized that following explanation is only exemplary, instead of in order to limit the scope of the invention and apply.
Consult Fig. 1, according to the preparation method of the embodiment of the present invention, soft lithographic technique can be adopted to make Chip mold, and basic procedure comprises: prepare mask plate, get rid of photoresist, expose, develop to mould, mixing high polymer pours into mould, solidifies stripping, stripping and slicing and bonding.In Fig. 1,1. represent whirl coating step; 2. step of exposure is represented; 3. development step is represented; 4. represent that high polymer enters mould step; 5. solidification, cutting step; 6. bonding steps is represented.Wherein 1., 2., 3. step can carry out repeatedly (hereafter will be described in further detail) as required.
As shown in Figure 2, the film material mask plate 201,202 of two pieces of rectangles can be adopted, each mask plate has transparent area and light tight district.
Two pieces of mask plates 201,202 all have the transmission region of three cross, and they are for guaranteeing in double exposure process, and two pieces of mask plates can align by identical relative position with silicon chip 100.
Mask plate 201 also has for the formation of the transmission region 204 of liquid storage tank and the transmission region 205 of fluid channel that is connected with liquid storage tank.The other end of this fluid channel 205 is ports of export of fluid, and port of export tip take two angles as the line composition of 90 degree, and namely runner exit end is a right angle at rectangle micro-fluid chip just, is used as electron spray.Certainly, also can form other transmission regions on this mask, it can be used as other prime pretreatment fluid channel and is connected with electron spray fluid channel.
Mask plate 202 only has the transmission region of three cross 203.This mask plate is used for defining the rectangular area be not exposed in silicon chip 100 exposure process, can form rectangular recess at developing process subsequently.
Consult Fig. 3, processing step performs according to order from left to right, from top to bottom.
During making, sol evenning machine can be used to rotate with fast speed, after thin shape liquid photoresist being thrown on silicon chip 100 a thinner thickness, litho machine exposes with the photoresist 300 on mask plate 201 pairs of silicon chips 100, enter developing ring joint after exposure, remove and blocked and unexposed photoresist part by mask plate 201.
Whirl coating again, slightly reduces sol evenning machine rotary speed to increase the thickness of photoresist 301, exposes, develop after exposure again after whirl coating with mask plate 202.Next whirl coating increases the thickness of photoresist 302 again, again exposes with mask plate 202, then develops.Repeatedly to reach photoresist 303 thickness of expection.
High polymer material can adopt dimethyl silicone polymer (Polydimethylsiloxane, PDMS).The curing agent of PDMS prepolymer mixes with 1:5 ratio with solvent, can obtain the good PDMS polymer of intensity, improves runner forming degree and non-deformability.
The PDMS polymer mixed pours in culture dish, puts into be in advance covered with to obtain PDMS mother metal 103 from silicon chip 100 stripping bottom culture dish after the silicon chip 100, PDMS of above-mentioned process solidifies.
Culture dish can be circular, the transparent circular colloid 401 that it is diameter that PDMS mother metal 103 then after solidification has with culture dish internal diameter, i.e. base part, thickness is 1 ~ 1.5cm about, circular colloid 401 there is an outstanding rectangular area defined by mask plate 202 outline, it only accounts for the sub-fraction of whole PDMS mother metal 103 center, and rectangular mask version 202 makes this part form a PDMS rectangular boss layer 402.
In order to obtain PDMS rectangular core lamella 400, need to cut the circular colloid 401 of PDMS.Because PDMS colloid has certain pliability, the deformation of structure near the line of force can be caused during cutting to cause cutting inaccurate, so leave certain surplus during the circular base portion of diced chip, cut in a distance from PDMS rectangular boss layer 402 border.Even if the base profile that cutting is formed is slightly larger than boss, the ejection of right angle fluid channel electron spray also can not be affected.
By plasma bonding method, the PDMS film 105 not containing runner is bonded together with the PDMS rectangular core lamella 400 containing fluid channel, forms final micro-fluid chip.For increasing chip bulk strength, using slide 104 as substrate, in PDMS film 105 side, chip entirety can be supported.
Liquid storage tank and fluid channel quantity and size can design as required, and the micro-fluid chip drawn thus can be used as mass spectrometric a kind of ion gun and mass spectrograph coupling, can carry out pretreatment, electrophoretic separation, applying high pressure, form electron spray sample.
The feature in specific embodiment is further illustrated below in conjunction with accompanying drawing.
Two pieces of mask plates as shown in Figure 2, mask plate 201 is containing the transmission region 204,205 for the formation of liquid storage tank and fluid channel, and it is for the exposure of bottom photoresist.Mask plate 202 overall dimensions can be equal to or less than mask plate 201, for the exposure of upper strata photoresist, forms the rectangular boss part of chip structure.In one example, the wide 40mm of mask plate 201, high 45mm, liquid storage tank diameter 2mm, the long 18mm of fluid channel, wide 75 microns, the wide 35mm of mask plate 202, high 40mm; The all long 1.5mm of each arm of cross 203, wide 0.1mm.When two pieces of mask plates are by after three cross 203 positioned in alignment, the right angle, bottom right of mask plate 202 overlaps just with the fluid channel transparent area outlet right-angle edge of mask plate 201, after this just makes photoresist expose, fluid channel outlet is just in rectangle right angle, ensure that the realization of chip core structure.
Photoresist can adopt SU-8 glue, it is a kind of negativity, near ultraviolet ray photoetching glue, and namely Ultraviolet radiation part can produce cross-linking reaction, and developing process can remain, form the lucky complementary structure of the raceway groove spatially needing with chip to make, it is suitable for the micro-structural of super thick processed, high-aspect-ratio.
Whirl coating process can comprise three steps: oven dry, whirl coating, front baking.First 3 cun of silicon chip wafers 100 are placed on hot plate and dry 20 minutes with 95 DEG C; Be fixed on after air cooling to room temperature on the vacuum cup of sol evenning machine, with dropper, appropriate thin shape SU-8 glue dropped in crystal circle center, with rotating speed 2500 revs/min of whirl coatings 30 seconds; Go to after hot plate dries 5 minutes with 65 DEG C and dry 10 minutes with 95 DEG C, complete front baking, air cooling is to room temperature.
Exposure process can comprise two steps: exposure, rear baking.Put on the silicon wafer stage of ultraviolet lithography machine by the silicon chip wafer 100 after front baking air cooling, be placed with gently on photoresist by mask plate 201, keep silicon chip wafer 100 and mask plate 201 roughly centering, arranging the time for exposure after clamping is 30 seconds, starts exposure; Carefully silicon chip wafer 100 is gone on hot plate after completing, dry 10 minutes with 95 DEG C again after drying 15 minutes with 65 DEG C, baking process after completing.
Developing process: transferred to by the silicon chip wafer 100 of cooling and fill in the large culture dish of developer solution, ensures developer solution energy submergence silicon chip completely, develops after 2 minutes and take out, clean with alcohol flushing.
So far, the whirl coating of mask plate 201, exposure, developing process are completed, the mould that what it produced is for the formation of the liquid storage tank in chip and fluid channel, and three cross 203.
The whirl coating of mask plate 202, exposure, developing process substantially can be consistent with above-mentioned process.But in order to obtain thicker photoresist layer, whirl coating speed can reduce to 1000 revs/min; Then that mask plate 202 is positioned on photoresist in exposure process, utilize on it three cross 203 with on silicon chip wafer 100 the photoresist cross 203 of crosslinking curing aim at, can ensure that the groove right angle produced overlaps with fluid channel tip just, thus the fluid channel in ensure that the PDMS chip that the demoulding is made is drawn from chip right angle just.
As shown in Figure 3, the making of mask plate 201 correspondence only completes whirl coating, exposure, developing process, and preferably, the manufacturing process of mask plate 202 correspondence completes three whirl coatings, exposure, developing process.Make chip fluid channel itself keep reduced size like this, as thick about 40 microns, and the upper wall of fluid channel reaches adequate thickness, as thick about 180 microns.In Fig. 1, Fig. 3, Fig. 4 a and Fig. 4 d, the sectional view for the formation of the reserve part after the photoresist first time development of fluid channel and fluid channel is just schematic.
As shown in Fig. 4 a to Fig. 4 d, the PDMS rectangular boss layer 402 after shaping is connected together with layer circular around, and the top of PDMS rectangular boss layer 402 is formed with liquid storage tank 403 and fluid channel 404.Under can placing it in microscope, cut with the outline line of blade along distance rectangular boss layer 402 outline about 1mm, PDMS rectangular boss layer 402 is cut down from whole circular colloid 401, obtains PDMS rectangular core lamella 400.The right-angle side generation deformation that this method can not cause fluid channel to export.
As shown in Fig. 5 a to Fig. 5 b, PDMS rectangular film 105 can be made, make itself and PDMS rectangular core lamella 400 bonding form PDMS chip.Carry out whirl coating with PDMS mixture, whirl coating speed 500 revs/min, the PDMS film of thick about 500 microns can be obtained.PDMS rectangular film 105 does not bring convenience containing fluid channel to cutting out rectangle, does not need to consider runner distortion.Obtained PDMS rectangular film 105, PDMS rectangular core lamella 400, slide 104 can be put into oxygen plasma cleaning appts oxidation 3 minutes, taking-up after completing, again PDMS rectangular film 105 is alignd by right-angle side with PDMS rectangular core lamella 400, be pressed on together, then be pressed together overall for PDMS chip with slide 104, relative position is as shown in Fig. 5 a, 5b.Doing so avoids the impact that slide 104 exports fluid channel.Micro-fluid chip after shaping carries with slide, and nozzle stretches out slide 104 edge, like this under the prerequisite ensureing micro-fluid chip intensity, ensure that the independence of nozzle simultaneously.
As shown in Figure 6, the micro-fluid chip completed has fluid channel 601 and nozzle 602, by integrated for the micro-fluid chip preseparating structure 600 based on EOF, be placed on the electric spray ion source platform of mass spectrograph 603, namely utilized chip carries out pre-treatment, pre-separation, applying high pressure to sample, produces electron spray and analyzes for mass spectrograph.
Above content combines concrete/preferred embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.Such as, the invention is not restricted to use two pieces of mask plates.For general technical staff of the technical field of the invention; without departing from the inventive concept of the premise; its embodiment that can also describe these makes some substituting or modification, and these substitute or variant all should be considered as belonging to protection scope of the present invention.
Claims (13)
1. a preparation method for electron spray micro-fluid chip, is characterized in that, comprises the following steps:
A. on substrate, the first photoresist layer is covered, by the first mask plate, described first photoresist layer is exposed, develop after exposure, remove and blocked and unexposed photoresist part by described mask plate, wherein said first mask plate has the transmission region for the formation of the liquid storage tank in micro-fluid chip and fluid channel;
B. on described first photoresist layer through development, photoresist layer is covered further, exposed by the photoresist layer of the second mask plate to described further covering, develop after exposure, remove and blocked and unexposed photoresist part by described second mask plate, form groove, there is in described groove the remainder of described first photoresist layer be retained because of the transmission region exposure through described first mask plate, the overlay area of wherein said second mask plate is identical with the overlay area of described first mask plate or be in the overlay area of described first mask plate, and the region of the transmission region for the formation of described fluid channel that described second mask plate corresponds to described first mask plate is lighttight or printing opacity or partial light permeability, described first mask plate and described second mask plate have right angle on the position of correspondence, the transmission region for the formation of described fluid channel of described first mask plate extends facing to the right angle of described first mask plate, and at least extends to the position corresponding to the top of the horn at the right angle of described second mask plate of described first mask plate,
C. high polymer mother metal is solidify to form with the substrate through step b process for mould, chip layer is obtained from described high polymer mother metal, described chip layer comprises the chip part by described recess defining, and described chip part contains the liquid storage tank and fluid channel that are defined by described remainder;
D. another biopolymer layer and described chip layer are bonded together, form the inner micro-fluid chip with fluid channel.
2. preparation method as claimed in claim 1, it is characterized in that, described first mask plate and described second mask plate are rectangle.
3. preparation method as claimed in claim 1, is characterized in that, described first mask plate and described second mask plate printing opacity on the position of correspondence, to provide telltale mark when arranging described second mask plate above described first photoresist layer through development.
4. preparation method as claimed in claim 2, it is characterized in that, described first mask plate and described second mask plate printing opacity on the position at other three right angles except described right angle of its rectangle, to provide telltale mark when arranging described second mask plate above described first photoresist layer through development.
5. preparation method as claimed in claim 4, it is characterized in that, the shape of printing opacity is cross.
6. the preparation method as described in any one of claim 1 to 5, is characterized in that, adopts rotation whirl coating mode to cover photoresist layer, the degree of depth making described groove reach predetermined by multiple whirl coating, exposure and development in step b.
7. the preparation method as described in any one of claim 1 to 5, it is characterized in that, in steps d, the high polymer mother metal solidify to form has base part and the chip part by described recess defining, described chip section is divided into the boss layer be shaped on described base part, the described vertical projection profile according to described chip part is cut described base part in the mode leaving certain surplus, obtains described chip layer.
8. the electron spray micro-fluid chip using the method described in claim 1 to 7 to make, is characterized in that, the outlet of the fluid channel in described electron spray micro-fluid chip is on a right angle of described electron spray micro-fluid chip.
9. electron spray micro-fluid chip as claimed in claim 8, it is characterized in that, described electron spray micro-fluid chip take high polymer material as material of main part.
10. electron spray micro-fluid chip as claimed in claim 9, it is characterized in that, described high polymer material is dimethyl silicone polymer.
11. 1 kinds of mask plate equipment for electron spray micro-fluid chip, it is characterized in that, comprise the first mask plate and the second mask plate, described first mask plate has the transmission region for the formation of the liquid storage tank in micro-fluid chip and fluid channel, the overlay area of described second mask plate is less than the overlay area of described first mask plate, and the region of the transmission region for the formation of described fluid channel that described second mask plate corresponds to described first mask plate is lighttight or printing opacity or partial light permeability, described first mask plate and described second mask plate have right angle on the position of correspondence, the transmission region for the formation of described fluid channel of described first mask plate extends facing to the right angle of described first mask plate, and at least extend to the position corresponding to the top of the horn at the right angle of described second mask plate of described first mask plate.
12. electron spray micro-fluid chips as claimed in claim 11, it is characterized in that, described first mask plate and described second mask plate are rectangle, described first mask plate and described second mask plate printing opacity on the position at other three right angles except described right angle of its rectangle, to provide telltale mark when arranging described second mask plate above described first photoresist layer through development.
13. electron spray micro-fluid chips as claimed in claim 12, is characterized in that, the shape of printing opacity is cross.
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| CN104326433B (en) * | 2014-10-31 | 2016-05-18 | 中国科学院光电技术研究所 | A kind ofly receive runner preparation method based on template-mediated be full of cracks effect |
| CN105013550B (en) * | 2015-07-09 | 2016-08-24 | 清华大学深圳研究生院 | Micro-fluidic chip clamp and micro-fluidic chip |
| CN105233890B (en) * | 2015-10-16 | 2017-04-26 | 武汉工程大学 | Droplet jet microfluid mixed chip and machining method |
| CN105797791B (en) * | 2016-03-16 | 2017-11-03 | 清华大学深圳研究生院 | A kind of microfluid ion source chip and preparation method thereof |
| CN105879938B (en) * | 2016-04-05 | 2017-12-15 | 中国水稻研究所 | PMMA chips for proteomic image on-line analysis and preparation method thereof |
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| CN102251212A (en) * | 2011-06-13 | 2011-11-23 | 中国科学院长春光学精密机械与物理研究所 | High-power semiconductor laser array mask device |
| CN102556957A (en) * | 2012-03-19 | 2012-07-11 | 大连理工大学 | Method for manufacturing ion aggregation device of micro electro mechanical system (MEMS) air amplifier |
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