CN104053352B - Component carrier for recognizing vibrations during component assembly - Google Patents
Component carrier for recognizing vibrations during component assembly Download PDFInfo
- Publication number
- CN104053352B CN104053352B CN201410095574.1A CN201410095574A CN104053352B CN 104053352 B CN104053352 B CN 104053352B CN 201410095574 A CN201410095574 A CN 201410095574A CN 104053352 B CN104053352 B CN 104053352B
- Authority
- CN
- China
- Prior art keywords
- component carrier
- assembling
- vibration
- height
- clamping device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H13/00—Measuring resonant frequency
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automatic Assembly (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
A method for characterizing the vibration behavior of a component carrier (190) is described. The method comprises the following steps: (a) positioning a plurality of components (180) on a component carrier (190); (b) determining a respective mounting height at which each component (180) is placed on the component carrier (190) so as to obtain a plurality of mounting height values; (c) the vibration behavior of the component carrier (190) is characterized on the basis of a plurality of assembly heights in order to approximately determine at least one vibration position of the component carrier (190) which exhibits such a vibration behavior. Furthermore, a corresponding system for characterizing the vibration behavior of the component carrier (190) is described. Furthermore, a pick-and-place machine (100) having such a system is described, as well as a method for loading a component carrier with components in a pick-and-place machine (100). Furthermore, this document also describes a computer program for carrying out the method.
Description
Technical field
Present invention relates in general to the technical field of mounting technology.The invention particularly relates to a kind of method and system, is used for
The state of component carrier is characterized in assembling element.Moreover, it relates to a kind of be used in automatic assembling machine to element
The method of carrier assembling element, a kind of a kind of system, automatic dress with this system for characterizing the state of component carrier
With machine and a kind of computer program for implementing methods described.
Background technology
In so-called surface mounting technology (SMT) give component carrier assembling element when, element by assembly head from element-
Pick up in the take-off location of feeding mechanism, and be sent in assembly area and be placed in set in advance on component carrier
In element-installation site.
" component carrier " this concept can be regarded as in this document various assembling objects, especially circuit board.Unit
Part carrier can be in more or less rigidity, even flexible.Additionally, component carrier can both have rigid region, it may have
Flexure region.
" element " this concept can be regarded as in this document all assembling elements, and they can be positioned at element load
On body.Element enables in particular to the SMT- elements or the element of other highly integrated planes for being the two poles of the earth or multipole, such as ball bar battle array
Row, bare chip and upside-down mounting welding core.Additionally, " element " this concept can also include mechanical organ, for example connecting pin, plug,
Socket or the like body or photoelectric cell, such as light emitting diode or photodiode.Additionally, " element " this concept can also be wrapped
Containing the so-called RFID chip for so-called transceiver.
Because electronic building brick is increasingly miniaturized, and due to the price pressure on electronic market, both in assembly precision or
Very high requirement is proposed to modern automatic assembling machine in terms of assembling speed.In order to reach high assembling speed, by assembling
Pickup, transmission and the installation course that head is implemented must be carried out quickly certainly for all elements.
But when to component carrier assembling element, the moment for encountering component carrier in element occurs certain impulse force, it
It is applied on component carrier by element.Typically, the impulse force is also especially high when assembling speed is very high.When assembling speed it is relatively low
When or when element is lentamente placed on component carrier, the impulse force also always have certain value.
This impulse force (may be combined also, described other impulsive contact forces are that occur when other elements are installed with other impulsive contact forces
) undesirable vibration may be caused to related elements carrier.For the element for having placed, this vibration can cause
Inertia force comes into force on element, and this mounted element is for example maintained on their position by sticking soldering paste.Root
According to the design of element size and component carrier, the adhesion of soldering paste may be exceeded especially when vibrating stronger, so that related
Element come off undesirably from component carrier or at least from desired installation site.Therefore, the element by mistake is obvious
Increase the ratio of defects of assembly technology.
In order to mitigate the undesirable vibration of component carrier, it is known that be bearing in component carrier in assembling process
On appropriate position.In order to realize such supporting, the pin manually or automatically placed can be used, it abuts in related elements
On the bottom side of carrier.Additionally, for supporting member carrier, it is known that vacuum adsorption base, so-called grid matrix and brush.Only when
When related support tool is abutted in the lower edge of component carrier, all known support tools just can come into force.Although
Supporting is obtained, but the component carrier for arching upward upward still can evoke vibration.So as to improve the ratio of defects of assembly technology.
The content of the invention
The purpose of the present invention is to reduce ratio of defects when to component carrier automatic assembling element.
This purpose is achieved by the content of independent claims.Having for the present invention is described in the dependent claims
The embodiment of profit.
By the content of a first aspect of the present invention, a kind of side for characterizing the Vibration Condition of component carrier is which depict
Method.Described method has：A () is positioned at multiple element on component carrier；B () determines that each element is placed on component carrier
On corresponding setting height(from bottom), so as to obtain it is multiple assembling height values；And (c) is characterized on the basis of numerous assembling height
The Vibration Condition of component carrier, at least one approx to determine component carrier illustrates the vibration position of this Vibration Condition
Put.
Methods described is based on the recognition that assembling that is, actual on the component carrier of vibration depends highly on vibration
State.Actual assembling height particularly depends on related rigging position or the relevant position of component carrier is current inclined with zero-bit
Turn amount, in zero position, the component carrier is completely in static or does not vibrate.If respectively assembling is highly different from each other, then
It can be seen that, the vibration of component carrier is exist.Difference between assembling height is bigger, then tend to the amplitude of the vibration
It is bigger.
" characterizing the Vibration Condition of component carrier " this statement can be regarded as in this document various expression component carriers
The information over time of at least one of height and position.The upper level position over time can be by arbitrary
Vibration, vibration and/or fluctuation cause, and they can be coordinated or non-coordinating.In the vibration of non-coordinating, component carrier
The deflection of at least one regional area is not strictly to implement by sinusoidal or cosine shape.
The Vibration Condition is only detected in the simplest situations, if there is at least one regional area of component carrier
It is mobile.But it is still possible that the amplitude of vibration is determined when the sign is carried out.If the amplitude has exceeded ginseng set in advance
Amplitude is examined, then therefrom can be drawn, the ratio of defects of assembling is no longer received, it is necessary to take appropriate action to mitigate component carrier
Vibration.
The vibration of the component carrier of sign can be the simple bending of component carrier, the component carrier it is relative by two and
The fringe region put is clamped in the assembly area of automatic assembling machine.If being applied to support pin, the vibration is also possible to bag
Higher mode (higher modes) containing flexural vibrations.
" assembling height " this concept is especially appreciated that in this document as a position along the Z direction, element in assembling or
Along the position movement when being placed on component carrier.The Z-direction is preferably perpendicular to the surface of the component carrier of element to be assembled.
Specific assembling height is considered as any possible Z location in which can standardize.For example, zero position along the Z direction
The upper end position of the so-called Z-axis transmission device of assembly head, installation course of the Z-axis transmission device in related elements can be referred to
In effect be make element-clamping device (such as siphon pipe) relative to assembly head base move.The assembling height just may be used
Refer to such height, i.e. upper contact on the downside here height of related elements with component carrier.It is determined that the assembling of correlation
During height, it can be considered that the height of related elements and related elements-clamping device length along the Z direction.Therefore, it is right both to have made
For the element of differing heights and/or the element-clamping device of different length, correct assembling height or assembling are also can determine that
Height and position.
By another embodiment of the present invention, multiple element is positioned at into component carrier by the assembly head of automatic assembling machine
On, its mode is：Element-clamping device is elapsed along the Z direction relative to the base of assembly head.Additionally, by distance-measurement system
System assembles height, distance-measuring system measuring cell-displacement of the clamping device relative to base along the Z direction to determine.
The assembling height can determine that the measuring system is present in many known automatic assemblings by measuring system
In machine and it is normally located on assembly head, so that when element drops on component carrier, the element is smooth but still soft
Be placed on component carrier.This can be accomplished by known manner, i.e., related element is in the first via
Relatively quickly be moved to the surface of component carrier to be assembled in journey, and the decrease speed of element will collide it is to be installed
Reduce before the surface of the component carrier with element.In order to know that element will at short notice in time in the installation course of element
On the surface of the component carrier for arriving at element to be assembled and thus the decrease speed of element should be able to reduce, then with known side
Formula application distance-measuring system.Certainly, if (downside) height of element is determined on the surface of component carrier, except whole
Beyond the geometry (height and position of the assembly head on component carrier to be assembled) of individual assembling, it is also contemplated that related elements
The length of height and the element-clamping device for fixing element.
Distance-the measuring system can in a known way have the encoder of optics and/or machinery, and it can have 1
Position resolution in micron even half micrometer range.Therefore, the position for being measured by distance-measuring system or the precision of height
In such scope, the accuracy rating is substantially less than the typical amplitude of the component carrier in component carrier assembling element.
Therefore the measuring error of distance-measuring system almost can be ignored.
According to another embodiment of the present invention, height, the sensing are assembled to determine by the inductor of distance-measuring system
Device detects the terminal location of element-clamping device when element is assembled on component carrier.
The inductor can be optical sensor, such as grating.Additionally, the inductor can be current inductor, it
Element-clamping device has detected along the Z direction electric actuator (especially linear horse (when element is laid) during mobile end
Up to) coiler part electric current change.
The inductor can also be the power inductor of distance-measuring system, and it is detected works as component placement in component carrier
The power occurred when upper.The power inductor can be mechanical, such as power inductor with spring.Alternatively or in combination, such as
The Z- motions of fruit linear actuating device are interrupted suddenly related elements are placed on component carrier, when component placement in element
The power occurred when on carrier also can be measured electrically by current inductor.
Intuitively expression is that in element-clamping device when moving downward, the power inductor is supervised by driving means adjuster
Control.When inductor is spoken of, know that accurate pickup height (especially accurately assemble high by here by distance-measuring system
Degree).Therefore, practical set height of the element on component carrier is known by this way.
By another embodiment of the present invention, if other elements are positioned on component carrier, the element-clamping device
(it makes another element move up in the side of component carrier) direct speed to reduce before assembling height is reached is moved
Dynamic, the assembling height is corresponding with the swing position that at least one of component carrier almost determines.Therefore, it is possible to favourable side
Formula reduces impulsive contact force, and the impulsive contact force applies when other elements are positioned on component carrier.
By another embodiment of the present invention, on the basis of at least several specific assembling height of statistical analysis unit is characterized
The Vibration Condition of part carrier.
In order to realize such statistical analysis, can using it is all assembling height or it is therein at least several, they be
Detect when assembling the element being placed in default assembly area to component carrier.Certainly in the detection (as above
As describing) the possible difference of the possible different length of element-clamping device and/or the element of placement can also be considered
Highly.This point can be realized by appropriate standardization.
When this standardization is carried out, the mean value of specific assembling height is subordinated to the quiet of the component carrier of assembling element
Only (height) position.Furthermore it is possible to detect the assembling height of (a) minimum (minimum) and the assembling height of (b) maximum (highest)
Between spacing or difference, as the full swing amplitude of component carrier.
By another embodiment of the present invention, the statistical analysis includes：By the assembling set for different elements highly counting
Calculate the average Oscillation Amplitude of component carrier.
Intuitively expression is, by the different riding positions on the surface of component carrier, from different assembling height and unit
Average vibration amplitude is calculated in single deviation between the inactive state of part carrier.Therefore, the average wobble amplitude is
Average height tolerance between component carrier and its inactive state.Because average wobble amplitude is for example led to relative to single
It is firm to cross the abnormal value (Ausrei β ern) that measuring error causes, so it can be used as appropriate variable, with
Just the intensity or amplitude of the vibration of component carrier are reliably determined.If average wobble amplitude has exceeded threshold set in advance
Value, then enable in particular to from the component carrier of vibration draw.
Average wobble amplitude MA for example can determine by below equation (I)：
Here, N represents the quantity of the element being placed on component carrier.Variable δiRepresent the element of assembling height and vibration
The inactive state or zero-bit height and position of carrierBetween deviation.The inactive state or zero-bit height and positionCan be such as
Determine by below equation (II)：
It should be noted that the average height deviation of average wobble amplitude described herein as or component carrier is not average standard
Deviation.It is determined that average standard deviation interval, due to the integration (Quadratur) of the single deviation for measuring, single abnormal value
For example because measuring error becomes extremely important when it is determined that assembling height.
By another angle of the present invention, a kind of side in automatic assembling machine to component carrier assembling element is described
Method.Described method includes：A () gives component carrier assembling element in the first operational mode；If the vibration of (b) component carrier
Amplitude exceeded the reference value set in advance for allowing, then by said method characterizing the Vibration Condition of component carrier；(c)
Automatic assembling machine, the wherein amplitude of the vibration of component carrier and the first operational mode phase are run in the second operational mode of amendment
Than reducing.
The theory that the assembly method is based on is, it is above-mentioned it is illustrating by different embodiments, for characterizing component carrier
The method of Vibration Condition can be implemented in common component mounting process, without thus delaying the assembling process.If from
The assembly head of dynamic assembly machine is equipped with distance-measuring system, and its measuring cell-clamping device is perpendicular to (plane) component carrier
Surface or the normal vector parallel to the surface displacement, then this point be suitable for certainly.Because the Vibration Condition of component carrier
Characterize and spend without the need for extra instrument and normal assembling process need not be postponed, so in the normal assembling element of component carrier
It is capable of the Vibration Condition of monitoring element carrier.If put all recognized at any time, component carrier so consumingly vibrates, with
Cause have impact on assembling reliability of operation, then correct the following only appearance of the assembly mode, i.e. component carrier as follows less
Vibration.The measure of the vibration for exemplarily elaborating that component carrier can be reduced below.
By embodiments of the invention, compared with the first operational mode, the component carrier in the second operational mode of amendment
Support by the configuration for having changed of at least one supporting arrangement.At least one supporting arrangement enables in particular to be manual or oneself
The dynamic pin placed, it is abutted on the downside of related elements carrier.
The configuration of at least one supporting arrangement enables in particular to change in the following manner, i.e., in the amendment of automatic assembling machine
The second operational mode in or period improve the quantity of supporting arrangement used.If the component carrier is removed in the first operational mode
Do not supported by this supporting arrangement beyond the clamping of the fringe region of component carrier, then there is also such raising.
The configuration of at least one supporting arrangement enables in particular to change in the following manner, i.e., in the second operation mould of amendment
In formula or period, component carrier is bearing on the positions different from the first operational mode towards at least one supporting arrangement.
The change of the configuration of one supporting arrangement or multiple supporting arrangements is especially in so-called high yield manufacture
In be suitable for, the assembling of wherein component carrier needs high speed.
Intuitively expression is to avoid not allowing for component carrier in the following manner in so-called high yield manufacture
Vibration, i.e., most preferably support component carrier to be assembled as much as possible.In practice, (exist in case of an error
In the case of recognizing too strong vibration) production is stopped, and select the configuration of the change of at least one supporting arrangement.Cause
This, component carrier assembling element is given in the supporting configuration by change, so that production is again proceeded with.The process can be again
The multiple so long time, until the permission vibration for confirming component carrier does not exceed again.
By another embodiment of the present invention, compared with the first operational mode, with reduction in the second operational mode of amendment
Speed give the component carrier assembling element.Here is especially it should be noted that speed of the component placement on component carrier is able to
Reduce, and therefore to be applied to the collision impact on component carrier less.Speed that element is taken out from element-feeding mechanism with
The element for taking out is identical from the speed that element-feeding mechanism is sent to assembly area, therefore element to be assembled will not be carried
The vibration of body produces impact.The mode of this vibration for reducing component carrier is that especially have in so-called low yield fabrication scheme
Profit, wherein assembling power is not extremely important.In this context, " assembling power " is for example interpreted as, in each time list
First potential energy is positioned at the maximum quantity of the element on component carrier.
Intuitively expression is after the too strong circuit board of vibration is recognized, to continue in so-called urgent operation-pattern
Production, wherein in order to the speed for reducing collision impact element to reduce is placed on component carrier.By applying bigger creep
Path (Schleichwege), to realize this point before on the element collision to component carrier.The creep paths being capable of basis
The wobble amplitude of the prior acquisition of component carrier is determining.In the case of the efficiency that tolerance is reduced, can be with by the method
High technology stability continues to produce electronic building brick.
By another angle of the present invention, a kind of system for characterizing the Vibration Condition of component carrier is described.Described
System has：A () assembly head, it is used for that multiple element is placed on component carrier；B () distance-measuring system, it is used for really
Fixed each element is placed on the corresponding setting height(from bottom) on component carrier, to obtain the value of multiple assembling height；And (c) is commented
Estimate device, the Vibration Condition of component carrier is characterized on the basis of numerous assembling height.
The understanding that the described system for characterizing the Vibration Condition of component carrier is based on is, many by being accurately determined
The assembling height of the individual element being placed on component carrier, can determine whether component carrier vibrates and how strong the vibration is
It is strong.It is contemplated that to different elements exist according to the current phase place of the vibration of component carrier i.e. when component carrier vibrates
Collide on component carrier on different height and positions.Additionally, according to the vibration mode of component carrier, assembling height is also depended on
Rigging position of each element on component carrier.
By another angle of the present invention, a kind of automatic assembling machine is described, for giving component carrier assembling element.Described
Automatic assembling machine has said system, for characterizing the Vibration Condition of component carrier.
Computer program is described by another angle of the present invention, if the computer program is by computing device, comes real
Apply the above-mentioned method for characterizing the Vibration Condition of component carrier, and/or for implement it is above-mentioned in automatic assembling machine to
The method of component carrier assembling element.
In the meaning of this document, address and program element and/or the matchmaker of embodied on computer readable of this computer program
The concept of Jie is identical, and it includes the instruction for control computer system, for coordinating the system or method by rights
Working method, so as to the effect for reaching with link together in the present inventive method.
The computer program can as the instruction code of embodied on computer readable with each appropriate program language such as JAVA,
C++ etc. is performing.The computer program can be stored in computer-readable storage medium (CD-Rom, Blu-ray Disc, interim
Or memory, the memory/processor that installs additional of non-provisional etc.).The instruction code can this be to computer or other are programmable
Equipment (as be used for automatic assembling machine control device) programming, that is, implement desired function.Additionally, the computer program can
There is provided in network (such as internet), the computer program can be downloaded when needed by user from network.
The present invention also (can exist by computer program (i.e. software) by one or more special electronic circuits
In hardware) or with arbitrary mixed form (i.e. by software and hardware) realization.
Being characterized in that for the invention for describing in this document, it is of the invention to make in conventional automatic assembling machine
With, and without the need for extra device cost, the conventional automatic assembling machine has assembly head, the assembly head has is used for element-folder
Hold the distance-measuring system of (movement) motion of device.Thus, for example the automatic assembling machine in running status can pass through
The appropriate invention and associated advantage for realizing describing in this document of more newly arriving of control software.
It is noted that embodiments of the invention are described with reference to the different content of the invention.Particularly depict the present invention's
Several embodiments with device claim, and describe the other embodiments with claim to a method of the present invention.
Can appreciate immediately that when this application is read for professional, if without other detailed description, except these
Belong to beyond the combinations of features of this kind of content of the invention, it is also possible to realize any combination of these features, these arbitrary feature groups
Conjunction belongs to the other types of content of the invention.
The other advantages and features of the present invention draw from the following exemplary description of presently preferred embodiment.The application
Single accompanying drawing simply meaning property and ratio is incorrect.
Description of the drawings
Fig. 1 shows automatic assembling machine, and it has the system of the Vibration Condition for characterizing component carrier, the component carrier
By equipment machine assembling electronic element automatically.
Fig. 2 shows the statistical analysis of assembling height by the accompanying drawing of element, and the element is put on different assembling height
Put on the component carrier of vibration.
Fig. 3 a show element-clamping device along the rate curve of vertical Z-direction, wherein by element-clamping device
The element of holding is collided in advance on component carrier due to the vibration of component carrier.
Fig. 3 b show element-clamping device along the rate curve of vertical Z-direction, wherein due in running section
Creep paths are expanded on end, so reducing the collision impact on component carrier.
Figure number explanation:100 automatic assembling machines；110 assembly heads；120 distances-measuring system；122 linear actuating devices；
122a signal conductors；124 scales；130 supports；132 inductors/power inductor；132a signal conductors；134 elements-clamping dress
Put/siphon pipe；140 apparatus for evaluating；150 component carriers-clamping device；180 elements；190 component carriers/circuit board；390a is fast
Write music line；390b rate curves；392 positioning with low terminal velocity/creep section；Vfa, vfb impact velocity.
Specific embodiment
It is noted that the feature or part of different embodiments (they are identical with the individual features of embodiment or part or extremely
Few function phase is same) identical reference marker or different reference markers are provided with, the different reference marker is at it
The reference marker of the suitable part of the feature suitable from (functionally) or (functionally) is different on first letter.In order to avoid not
Necessary repetition, the feature or part for illustrating by previously described embodiment is no longer elaborated later.
Additionally, it is noted that embodiment described below is simply elected from the possible embodiment of the present invention.Especially
It is possible that the feature of single embodiment combination with one another by rights, therefore by detailed herein for professional
The embodiment of thin description just can regard substantially disclosed as many different embodiments.
Fig. 1 is shown by the automatic assembling machine 100 of embodiments of the invention.The automatic assembling machine 100 have it is known from
The typical component of dynamic assembly machine, they are clearly not shown in FIG to allow view.This typical part is, for example, bottom
Seat, the Gantry Crane System for moving assembly head 110, element, feeding mechanism and camera, the camera is used for optically surveying
Amount element and component carrier to be assembled.Component carrier 190 to be assembled is fixed on certainly by component carrier-clamping device 150
In the assembly area of dynamic assembly machine 100.
As shown in figure 1, the assembly head 110 is equipped with so-called Z axis, it is configured to the siphonal energy of element-clamping device 134
Enough bases by the Z axis along vertical Z-direction relative to assembly head 110 are moved.It should be understood that clicking here the reality of description
An assembly head 110 is applied with multiple respectively with the Z axis of element-clamping device.But in order that view is clear, only illustrate in FIG
One in these Z axis.
The Z axis include linear actuating device 122, and it can be moved along scale 124 along vertical Z-direction.The scale
124 is a part for distance-measuring system 120, and by it the current Z- positions of the support 130 of Z axis can be detected.By this
Embodiment shown in place, power inductor 132 is located between support 130 and element-clamping device 134.Once by element-clamping dress
The element 180 for putting 134 clampings is forced on the surface of component carrier 190 when support 130 declines with certain placement, then the power
Inductor is sent signal on apparatus for evaluating 140 by signal conductor 132a.So stick to it in element 180 to preset
Installation site on after, the effect of the signal is the activity stopping for making linear actuating device 122, the support 130 and element-folder
Hold device 134 to be moved upwardly by again together (there are currently no element 180).
Shown embodiment is clicked here, apparatus for evaluating 140 is recognized by signal conductor 122a, linear actuating device 122
Current Z- positions what kind of is.Therefore, apparatus for evaluating 140 can be when signal be received by signal conductor 132a
It is determined that, linear actuating device 122 or support 130 drop to more deeply, until element 180 encounters component carrier 190.
Go out the assembling height of meeting strong variations certainly on the component carrier 190 of vibration, in FIG by component carrier
Dotted line above and below in the of 190 has marked the terminal location of this possible vibration.Certain types of unit with non-uniform thickness
Part has the assembling height of judder in the inside of component carrier 190, and the element is by length identical element-clamping device
134 assembling.According to the oscillating curve of component carrier 190, the assembling height in the range of Zmax and Zmin is generated.By dress
Statistical analysis with height, can be inferred that the component carrier 190 of vibration.
Fig. 2 shows the statistical analysis of assembling height by the accompanying drawing of element, and the element is put on different assembling height
Put on the component carrier of vibration.For this purpose, being occurred when equipping element to component carrier in machining area it is preferred that detecting
Assembling height, and by consider element-clamping device possible different length and possible different elements highly come reality
Now standardize.Inactive states of the mean value Zmean of assembling height equivalent to component carrier.Minimum assembling height Zmin and most
Spacing between big assembling height Zmax is equivalent to maximum vibration amplitude Amax.
Click here the embodiment for illustrating, average vibration amplitude Amean is calculated in the single deviation from around inactive state
Out.Because average vibration amplitude is firm for single abnormal value, the enforcement for illustrating is clicked here
Example applies the numerical value, the numerical value to be used for determining the maximum allowable vibration of component carrier.This vibration of component carrier is to assembling
The impact of security is significantly depending upon electronic building brick each to be manufactured.According to component carrier and the component type of assembling
Size and thickness, the vibration of the permission of component carrier is change.Therefore, the average vibration amplitude Amean of the permission should
Parameter can be provided by user.
The embodiment for illustrating is clicked here, if more than Mean Oscillation amplitude A mean in the machining area of component carrier,
Then user is carried out according to manufacture (high yield-low mixing or low product-height mixing) in two possibilities (A) and (B)
Select：
(A) in the manufacture of high yield, assembling speed can not be reduced, and the assembling of otherwise related automatic assembling machine is imitated
Rate may be too little.Therefore, the vibration of component carrier must be prevented by the optimal support of component carrier.In error situation
Under, for example recognize it is this there is the vibration of at least one certain vibration amplitude when, production can stop, and improve unit
The supporting configuration of part carrier, to relax Vibration Condition.The process repeats long period, until confirm component carrier allow shake
Move till not exceeding again.
(B) in low-producing manufacture, after the component carrier for recognizing vibration, produce in urgent operation-mould
Proceed in formula.In order to reduce collision impact, element is placed on component carrier here with the speed for reducing.By applying court
The bigger creep paths (Schleichweg) of the element-clamping device of lower motion, carry in the element collision for keeping to element
This point was realized before on body.The length of the creep paths can determine according to the vibration amplitude for obtaining.By the method, though
Power is so reduced, but being capable of the other electronic building bricks of process safety ground production.
Fig. 3 a show the rate curve 390a of element-clamping device, downwardly directed as carrying out on component carrier
Lay the function of Z- positions when moving.Due to the vibration of component carrier, the element is collided in advance with of a relatively high speed vfa
To on component carrier.Associated high impact can aggravate vibration according to the phase place of the vibration of component carrier.
Fig. 3 b show the rate curve 390b of element-clamping device, downwardly directed as carrying out on component carrier
Lay the function of Z- positions when moving.In order to avoid or at least reduce evoke component carrier not by desired vibration, directly
Speed is reduced by the collision of the element fixed by component carrier.Element-clamping device is transported hence along creep section 392
Dynamic, its speed substantially diminishes compared with speed Vfa of Fig. 3 a.
Totally it is concluded that：According to the inventive embodiment for describing in this document, automatic assembling machine can be by
The device (Z axis unit, it has the induction technology for identification terminal position) for having existed is recognizing in the dress for truly reaching
With the existing circuit board-vibration on height.As long as reducing the vibration by adequate measures, then can significantly improve dress
Reliability with technique.The loading error caused by wrong components thus, it is possible to avoid in an efficient way, the wrong components
It is to be caused by the circuit board for vibrating.
Claims (12)
1. it is a kind of to be used for characterizing component carrier（190）Vibration Condition method, the method has：By multiple element（180）It is fixed
Position is in component carrier（190）On；Determine each element（180）It is placed on component carrier（190）On corresponding setting height(from bottom), with
Just the value of multiple assembling height is obtained；Component carrier is characterized on the basis of numerous assembling height（190）Vibration Condition, so as to
Approx determine component carrier（190）At least one vibration position for illustrating this Vibration Condition.
2. the method according to the claims 1, wherein by automatic assembling machine（100）Assembly head（110）Will be multiple
Element（180）It is positioned at component carrier（190）On, its mode is：Element-clamping device（134）Relative to assembly head（110）'s
Base is elapsed along the Z direction, and by distance-measuring system（120）To determine assembling height, the distance-measuring system
Measuring cell-clamping device（134）Relative to base displacement along the Z direction.
3. the method according to the claims 2, wherein by distance-measuring system（120）Inductor（132）Come
It is determined that assembling height, the inductor is element（180）It is assembled to component carrier（190）Element-clamping device was detected when upper
（134）Terminal location.
4. the method according to the claims 2, if wherein by other elements（180）It is positioned at component carrier（190）
On, the element-clamping device（134）The direct speed to reduce is moved before assembling height is reached, the element-folder
Holding device makes another element（180）In component carrier（190）Side move up, assembling height and component carrier（190）'s
At least one swing position for almost determining is corresponding, and to reduce impulsive contact force, the impulsive contact force is other elements（180）Positioning
In component carrier（190）Applied when upper.
5. the method according to the claims 3, if wherein by other elements（180）It is positioned at component carrier（190）
On, the element-clamping device（134）The direct speed to reduce is moved before assembling height is reached, the element-folder
Holding device makes another element（180）In component carrier（190）Side move up, assembling height and component carrier（190）'s
At least one swing position for almost determining is corresponding, and to reduce impulsive contact force, the impulsive contact force is other elements（180）Positioning
In component carrier（190）Applied when upper.
6. the method according to any one of the claims 1 to 5, wherein at least several specific assemblings of statistical analysis
Component carrier is characterized on the basis of height（190）Vibration Condition.
7. the method according to the claims 6, wherein statistical analysis includes：Carry out computing element by assembling height to carry
Body（190）Average Oscillation Amplitude, assembling height is for different elements（180）For be to determine.
8. it is a kind of to be used in automatic assembling machine（100）In give component carrier（190）The method of loading member, the method is included：
Component carrier is given in first operational mode（190）Assembling element；If the amplitude of the vibration of component carrier has exceeded the pre- of permission
The reference value for first setting, then by the method according to any one of the claims 1 to 6 characterizing component carrier
（190）Vibration Condition；Automatic assembling machine is run in the second operational mode of amendment（100）, wherein component carrier（190）
The amplitude of vibration reduce compared with the first operational mode.
9. the method according to the claims 8, wherein compared with the first operational mode, in the second operational mode of amendment
In the component carrier（190）Support by the configuration for having changed of at least one supporting arrangement.
10. the method according to the claims 8 or 9, wherein compared with the first operational mode, in the second operation of amendment
The component carrier in pattern（190）Carry out assembling element by the speed for reducing.
A kind of 11. systems, it characterizes component carrier by the method as any one of the claims 1 to 7（190）
Vibration Condition, the system has：Assembly head（110）, it is used for multiple element（180）It is placed in component carrier（190）On；
Distance-measuring system（120）, it is used for determining each element（180）It is placed on component carrier（190）On corresponding installation it is high
Degree, to obtain the value of multiple assembling height；And apparatus for evaluating（140）, it characterizes unit on the basis of numerous assembling height
Part carrier（190）Vibration Condition.
A kind of 12. automatic assembling machines, it is used for automatically to component carrier（190）Assembling element（180）, the automatic assembling equipment
Have it is as described in the claims 11, for characterizing component carrier（190）Vibration Condition system.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013204590.5 | 2013-03-15 | ||
| DE201310204590 DE102013204590B3 (en) | 2013-03-15 | 2013-03-15 | Method for characterizing vibration characteristic of component support, involves placing multiple components on component support, and determining corresponding assembly height |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104053352A CN104053352A (en) | 2014-09-17 |
| CN104053352B true CN104053352B (en) | 2017-04-12 |
Family
ID=51064678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410095574.1A Active CN104053352B (en) | 2013-03-15 | 2014-03-14 | Component carrier for recognizing vibrations during component assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104053352B (en) |
| DE (1) | DE102013204590B3 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015106224B4 (en) * | 2015-04-22 | 2022-09-01 | Asm Assembly Systems Gmbh & Co. Kg | Process for repeated measurement of a component carrier located in a placement area of a placement machine, as well as placement machine and computer program for carrying out this method |
| JP6916903B2 (en) * | 2017-12-19 | 2021-08-11 | 株式会社Ｆｕｊｉ | Board vibration detector, electronic component mounting machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1191832A2 (en) * | 2000-09-25 | 2002-03-27 | Matsushita Electric Industrial Co., Ltd. | Automatic electronic parts mounting apparatus |
| CN1362007A (en) * | 1999-07-16 | 2002-07-31 | 西门子公司 | Method and device for supporting substrates in automated machines implanting components, base plate and support rod |
| JP2003069292A (en) * | 2001-08-29 | 2003-03-07 | Nec Machinery Corp | Control method for driving of working arm |
| US6543668B1 (en) * | 1998-04-09 | 2003-04-08 | Taiyo Yuden Co., Ltd. | Mounting method and mounting apparatus for electronic part |
| JP2008215903A (en) * | 2007-03-01 | 2008-09-18 | Matsushita Electric Ind Co Ltd | Device and method for measuring substrate surface height, working device, and working method |
| JP2010010463A (en) * | 2008-06-27 | 2010-01-14 | Juki Corp | Electronic component mounting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4014271B2 (en) * | 1998-01-09 | 2007-11-28 | 富士機械製造株式会社 | Printed circuit board support method, printed circuit board support device manufacturing method, and production jig |
-
2013
- 2013-03-15 DE DE201310204590 patent/DE102013204590B3/en active Active
-
2014
- 2014-03-14 CN CN201410095574.1A patent/CN104053352B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6543668B1 (en) * | 1998-04-09 | 2003-04-08 | Taiyo Yuden Co., Ltd. | Mounting method and mounting apparatus for electronic part |
| CN1362007A (en) * | 1999-07-16 | 2002-07-31 | 西门子公司 | Method and device for supporting substrates in automated machines implanting components, base plate and support rod |
| EP1191832A2 (en) * | 2000-09-25 | 2002-03-27 | Matsushita Electric Industrial Co., Ltd. | Automatic electronic parts mounting apparatus |
| JP2003069292A (en) * | 2001-08-29 | 2003-03-07 | Nec Machinery Corp | Control method for driving of working arm |
| JP2008215903A (en) * | 2007-03-01 | 2008-09-18 | Matsushita Electric Ind Co Ltd | Device and method for measuring substrate surface height, working device, and working method |
| JP2010010463A (en) * | 2008-06-27 | 2010-01-14 | Juki Corp | Electronic component mounting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104053352A (en) | 2014-09-17 |
| DE102013204590B3 (en) | 2014-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7325459B2 (en) | Identifying unit for working machine and pressure apparatus | |
| CN103256891B (en) | Contact type probe | |
| EP2616761B1 (en) | Method and apparatus for controlling a surface scanning coordinate measuring machine | |
| CN102340979B (en) | Method and device for controlling board stopping position | |
| EP2498047A1 (en) | Surface texture measuring apparatus | |
| US20120156320A1 (en) | Manufacturing-process equipment | |
| CN104053352B (en) | Component carrier for recognizing vibrations during component assembly | |
| KR101962888B1 (en) | Wire bonding apparatus and wire bonding mehtod | |
| CN101688963B (en) | Solid immersion lens holder | |
| KR102353097B1 (en) | Position-measuring device | |
| KR20130058080A (en) | Bonding device | |
| CN108603783A (en) | Method and apparatus for the Oscillation Amplitude for determining cutter | |
| CN103159024A (en) | Determining the height position of a component relative to a component pick-up device pneumatically | |
| CN102576151A (en) | Micromechanical projection device and method for producing a micromechanical projection device | |
| CN106068073A (en) | Repeated measurement of component carriers in the assembly area of an automatic assembly machine | |
| US20120117796A1 (en) | Device mounting method and apparatus using the method | |
| JP6368275B2 (en) | Component mounting machine, component mounting method | |
| CN101014847B (en) | Shear test device | |
| KR100950017B1 (en) | Laser drilling manufacturing method | |
| US9009957B2 (en) | Method for placing a component on a substrate | |
| CN116847974A (en) | Bonding test equipment | |
| KR101350760B1 (en) | Manufacturing-process equipment | |
| CN112771653A (en) | Compliant die attach tool, die attach system, and methods of use thereof | |
| CN202582492U (en) | Auxiliary device for measuring performance parameters of semiconductor machine platform | |
| JP2007057308A (en) | Contact type probe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |