CN104051486B - The seal ring structure with fillet for semiconductor devices - Google Patents
The seal ring structure with fillet for semiconductor devices Download PDFInfo
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- CN104051486B CN104051486B CN201410087676.9A CN201410087676A CN104051486B CN 104051486 B CN104051486 B CN 104051486B CN 201410087676 A CN201410087676 A CN 201410087676A CN 104051486 B CN104051486 B CN 104051486B
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Abstract
The invention provides the angle junction seal ring structure with round angle knot or including polygon.Generally rectangular semiconductor devices of the sealing ring around such as integrated circuit, imaging sensor and other devices.Sealing ring includes the structure on two groups of generally parallel sides staggered relatively, and angle knot is knot, and neighbouring vertical seal ring side connects at the knot.In various embodiments, sealing ring is groove structure or the groove structure of filling.Tie at the angle that circle is formed by the camber line or a plurality of line segment to link together at different angles of bending.The angle knot of polygon including one or more closing includes polygon, and at least one polygon edge of the polygon is formed by one in sealing ring side.
Description
The cross reference of related application
This application claims on March 13rd, 2013 U.S. Provisional Patent Application submitted the 61/780,154th it is preferential
Power, entire contents are hereby expressly incorporated by reference.
Technical field
The present invention relates generally to semiconductor devices and imaging sensor and its manufacture method, and more particularly, to
Seal ring structure used in this device.
Background technology
Seal ring structure is generally used for surrounding IC-components including the figure of preceding illuminated and back side illumination image sensor part
As senser element and form other semiconductor devices on silicon or other semiconductor chips.Seal ring structure internally or
External rings so as to isolation of semiconductor devices and protect it from other around including the silicon of semiconductor devices or other semiconductor chips
The influence of the stress energy of part.If there is no sealing ring, then the stress in the part outside semiconductor chip be able to can expand
The semiconductor devices being scattered on semiconductor chip and the semiconductor devices destroyed on semiconductor chip.
One example of seal ring structure is the groove extended around the periphery of chip, and another example is in semiconductor
The groove of extension around the periphery of chip, but fill the material of the groove and the material of substrate（It is typically silicon or other conjunctions
Suitable material）It is different.
Semiconductor chip is manufactured on a semiconductor substrate, and the semiconductor chip has rectangular shape.This rectangle shape
Shape enables one single chip to be separated in vertical direction along straight-line pass cutting-up.Drawn along the line between chip
Cut.Rectangle is shaped as and because sealing ring extends around semiconductor chip due to semiconductor chip, so sealing ring
Shape is also rectangle.It is perpendicular corners in the corner of the sealing ring of these rectangular shapes.Due to their shape and structure, this
A little right angle corners are easily stressed the influence with charge concentration., should when seal ring structure is exposed to stress and charge concentration
Power and charge concentration can cause seal ring structure to be broken in these corners.Any fracture or space in sealing ring are all
The path for reaching semiconductor chip itself is provided to external stress and electric charge.This can cause device destruction.
It is expected to provide the seal ring structure not influenceed by stress effect and local charge concentration enhancing.
The content of the invention
To solve the problems of the prior art, the invention provides a kind of structure, including：Semiconductor devices, it is arranged on lining
On bottom；And sealing ring, at least partly about tube core for including the semiconductor devices, the shape of the sealing ring are usually
Rectangle, the rectangle have positioned at the rectangle vertical edges between at least one angle knot, wherein, the outermost edge at turning with
The vertical edges form on-right angle.
In said structure, wherein, the sealing ring is entirely around the tube core.
In said structure, wherein, at least one angle knot includes：Connect the more of the vertical edges of the sealing ring
Bar straightway.
In said structure, wherein, at least one angle knot includes：Connect the more of the vertical edges of the sealing ring
Bar straightway；The neighbouring straightway of a plurality of straightway is connected to each other at the knot including obtuse angle knot.
In said structure, wherein, the sealing ring is entirely around the tube core；The sealing ring it is described at least one
Each angle knot in the knot of angle includes on-right angle knot.
In said structure, wherein, at least one angle knot includes：Connect the more of the vertical edges of the sealing ring
Bar straightway；The neighbouring straightway of a plurality of straightway is connected to each other at knot, and wherein, at least one knot is
First knot at obtuse angle is extended inwardly to form, and at least one knot is the second knot to stretch out.
In said structure, wherein, at least one angle knot includes：Connect the more of the vertical edges of the sealing ring
Bar straightway；The neighbouring straightway of a plurality of straightway is connected to each other at knot, and wherein, at least one knot is
First knot at obtuse angle is extended inwardly to form, and at least one knot is the second knot to stretch out；It is described to stretch out
Second knot forms obtuse angle.
In said structure, wherein, at least one angle knot includes：Connect the more of the vertical edges of the sealing ring
Bar straightway；The a plurality of straightway forms the outer perimeter of the angle knot, and at least one line segment is formed as being arranged on
The a line of the polygon of closing at the angle knot.
In said structure, wherein, each angle knot is camber line.
In said structure, wherein, the sealing ring is the groove structure extended in the substrate.
In said structure, wherein, the substrate is formed by the first material, and the sealing ring is by the second material shape
Into.
In said structure, wherein, the semiconductor devices includes imaging sensor.
According to another aspect of the present invention, there is provided a kind of structure, including：Semiconductor devices, it is arranged on semiconductor lining
On bottom, sealing ring, around the semiconductor devices, the sealing ring is the groove structure extended in the substrate, and institute
Stating sealing ring has the two groups of parallel lines structures staggered relatively for forming the side of the sealing ring and being linked together in Jiao Jiechu,
Wherein, at least one angle knot includes the polygon of at least one closing of the part as angle knot, the closing
At least one polygon edge of polygon formed by one in the side.
In said structure, wherein, first jiao of knot of angle knot by it is described while first while be connected to the of the side
Two sides, described first while and it is described second while generally vertical, and at least one bag of the polygon of at least one closing
Include at least one polygon edge of the one end for extending to first side.
In said structure, wherein, the sealing ring includes the semiconductor devices around tube core, the tube core, and
At least first jiao knot of angle knot includes a plurality of straightway, a plurality of straightway by it is described while first while be connected to described in
While second while and form the circumference of the sealing ring.
In said structure, wherein, the sealing ring includes the semiconductor devices around tube core, the tube core, and
At least first jiao knot of angle knot includes a plurality of straightway, a plurality of straightway by it is described while first while be connected to described in
While second while and form the circumference of the sealing ring；First jiao of knot includes at least one polygon, at least one
One polygon edge of the polygon is formed by one in the line segment.
According to a further aspect of the invention, there is provided a kind of structure, including：Imaging sensor, establish on tube core, institute
State the part that tube core is formed as Semiconductor substrate；And sealing ring, around described image sensor, the sealing ring is usually
Rectangular shape with four edges, the neighbouring side of the four edges is generally vertical and is linked together in Jiao Jiechu, each
The angle knot has circumference, wherein, the neighbouring side is connected as on-right angle.
In said structure, wherein, described image sensor is back side illumination image sensor, and each angle knot bag
Include a plurality of line segment being connected to each other.
In said structure, wherein, described image sensor is back side illumination image sensor, and each angle knot bag
Include a plurality of line segment being connected to each other；The line segment links together at knot, and each knot includes obtuse angle knot.
In said structure, wherein, described image sensor is back side illumination image sensor, and each angle knot bag
Include a plurality of line segment being connected to each other；The line segment links together at knot, and each knot includes obtuse angle knot；At least
One knot includes the knot that extends internally, and at least one knot includes the knot that stretches out, and angle knot is also
Including at least one polygon, the polygon edge of at least one polygon is formed by one in the line segment.
Brief description of the drawings
When reading in conjunction with the accompanying drawings, the present invention may be better understood from following detailed description.It should be emphasized that root
According to common practice, all parts in accompanying drawing are not necessarily to scale.On the contrary, for purposes of clarity, the size of all parts
Arbitrarily it can increase or reduce.In entire disclosure and accompanying drawing, similar label represents similar part.
Fig. 1 is show Semiconductor substrate on semiconductor devices, chip and the sealing ring of line embodiment one
The plan divided；
Fig. 2 is the sectional view of the embodiment with the imaging sensor for forming the sealing ring groove in line；And
Fig. 3 A to Fig. 3 G are the top views of the fillet for the sealing ring for showing each embodiment according to the present invention.
Embodiment
The invention provides available for such as integrated circuit, imaging sensor（Sensed including back-illuminated type and preceding illuminated image
Device）And the seal ring structure in the various semiconductor devices of various other semiconductor devices.Sealing ring is generally around semiconductor
Device and generally rectangular semiconductor chip periphery around extend, on the semiconductor chip formation semiconductor devices and
The semiconductor chip is separated by ruling.In certain embodiments, seal ring structure is formed in line, and in other embodiment
In, form seal ring structure in the position of inwardly neighbouring line.Each semiconductor devices and chip（It is formed on semiconductor device
Part）With being typically rectangle in shape as the sealing ring generally around semiconductor devices.Although in certain embodiments, this hair
Bright sealing ring also includes the sealing ring with multiple separate sections, but most of sealing rings include multigroup staggered relatively lead to
Chang Pinghang side and angle tie（corner junctions）The intersecting neighbouring side in place.It is close even in sealing ring embodiment
Seal ring includes the part of multiple separation, and the part of the separation includes usual vertical edges neighbouring, in Jiao Jiechu connections.However,
The sealing ring of the present invention is characterised by having and be crossed to form by substantially vertical, the neighbouring linear edges of two of sealing ring
Not simple right angle corner angle knot.More precisely, the sealing ring of each sealing ring embodiment provided by the invention
Knot between neighbouring side is characterised by that two generally vertical sides of sealing ring have the knot for becoming bending, by each knot
The a plurality of line segment of place's connection forms knot and/or one or more closed polygon structures by being formed in Jiao Jiechu form knot.
Fig. 1 is the plan for showing chip 2, and chip 2 is generally rectangular and is formed in a part for substrate, and core
Piece 2 is separated by line 4.Each chip 2 includes semiconductor devices 6, and chip 2 is alternatively referred to as tube core.In each reality
Apply in example, semiconductor devices 6 occupies all or most of area of chip 2.In certain embodiments, semiconductor devices 6 is
Integrated circuit or other semiconductor circuits, and in other embodiments, semiconductor devices 6 is the image sensing for including pel array
Device.In certain embodiments, image sensor chip is with pictorial element（That is, pixel）The preceding illuminated image sensing of array
Device, and in other embodiments, imaging sensor is back side illumination image sensor.Back side illumination image sensor（Also referred to as dorsal part
Illumination（BSI or BI）Sensor）It is a type of digital image sensor, it is caught using the arrangement of image-forming component with increasing light
The amount of obtaining and thereby the low optical property of raising.Back side illumination image sensor part includes many first with preceding illuminated image sensor identical
Part, but wiring is oriented in photocathode layer by overturning silicon substrate during manufacture（photocathode layer）Below,
Then its dorsal part of skiving, so that light can hit photocathode layer without through wiring layer.This change improves capture
Input the efficiency of photon.
In one embodiment, sealing ring is formed in substrate or formed the groove knot in the base material of chip 2
Structure.In another embodiment, sealing ring is material structure, and forms the material of sealing ring and pass through the circular chip of sealing ring
Material（For example, silicon）It is different.
Again referring to Fig. 1, chip 2 is generally rectangular and arranges and is of the same size in row and column.Line 4 is in chip
Extend between 2.Each chip 2 includes semiconductor devices 6.In embodiment " A ", by entirely around semiconductor devices 6 and chip 2
And the sealing ring 10 in line 4 is arranged on around semiconductor devices 6.Although sealing ring 10 include two groups it is staggered relatively parallel
While and it is generally vertical with another side neighbouring while, but each angle knot 13 is not the neighbouring linear edges 14 by sealing ring 10
The simple right angle being crossed to form.In certain embodiments（It will show in subsequent figure）, angle knot 13 is including being connected to one
The a plurality of line segment risen, and in certain embodiments（It will show in subsequent figure）, angle knot 13 include closing polygon.
In other embodiment, angle knot 13 is bending, circular part.In certain embodiments, angle knot 13 include link together with
Produce round corners effect（rounding effect）A plurality of line segment and also include closing polygon.
In one embodiment, angle knot 13 can be described generally as the circular knot with one or more arch sections.
In some embodiments, circle is essentially due to many short sections and linked together at multiple knots to connect the neighbouring of sealing ring 10
Side 14, so as to produce fillet.In other words, the outer perimeter of the sealing ring at angle knot 13（That is, outer rim）Including multiple flex points.
In another embodiment, angle knot 13 includes one or more polygonized structures, and according to each embodiment, result is from one
It is neighbouring when 14 Dao another is neighbouring 14 smoother transition, so as to neighbouring be hung down by what single right angle connected by eliminating
Straight flange 14 and reduce stress and charge concentration.In certain embodiments, angle knot 13 have generally circular circumference and including
The structure or other polygonized structures of one or more closings at angle knot 13.
In embodiment " B ", chip 2 includes semiconductor devices 6, and sealing ring 10 is around semiconductor devices 6 but is located at core
Without around chip 2 in piece 2.Sealing ring 10 extends substantially around semiconductor devices 6 and including staggered relatively by two groups
The fixed shape of parallel margin, and sealing ring 10 includes four angle knots 13, and the neighbouring side 14 of sealing ring 10 is at angle knot 13
Connection.Each angle knot 13 represents a kind of structure, and this structure is different from the shape between the usual vertical adjacent side 14 of sealing ring 10
Into single right angle.
In embodiment " C ", chip 2 includes semiconductor devices 6.However, in embodiment " C ", sealing ring 12 is included altogether
With ground entirely around the inside and outside of semiconductor device 6 and chip 2.Each peripheral position of chip 2 and semiconductor devices 6
At least one part peripherally set including sealing ring 12.In other embodiments, sealing ring 12 includes such as sealing ring
10 two sealing rings, and it is each entirely around chip 2.In yet another embodiment, a sealing ring 10, which is arranged on, partly leads
Around body device 6 and in chip 2, and another sealing ring of such as sealing ring 10 is peripherally arranged on around chip 2 and line 4
In.Each angle knot 13 of sealing ring 12（That is, be not sealing ring 12 two sides between simple right angle knot）As above
It is described.The further details of angle knot 13 will be shown in subsequent figure.
Fig. 2 is the sectional view of one embodiment of semiconductor devices 6.Fig. 2 shows that semiconductor devices 6 is back side illumination image
The embodiment of sensor.Back side illumination image sensor includes pel array 20 and black-level alignment part 22 in chip 2.In silicon
Semiconductor devices 6 is formed in chip 2 on 26, silicon 26 is also extended into line 4.In certain embodiments, silicon 26 is Silicon Wafer
（That is, substrate）Part, and silicon 26 represents to form layer square on a semiconductor substrate, but it is used as semiconductor devices now
6 basalis.In this embodiment, silicon 26 forms the base material of chip 2, but in other embodiments, will be with silicon not
Same material is used as base material.Again referring to Fig. 2, pel array 20 includes the lens 28 formed above corresponding pixel 30.
In certain embodiments, pixel 30 includes red, green and blue color filter, but in other embodiments, it can also use
Other arrangements.In the illustrated embodiment, pel array 20 includes ARC（Antireflection is coated with）Layer 32, cushion 34 and dielectric
36.In other embodiments, using other materials layer and other arrangements.In dielectric 36 is the metal in pel array 20
The part of grid 38, and metallic shield 40 is located in black-level alignment part 22.Silicon 26 is arranged on interlayer dielectric（ILD44）On
Side, ILD44 extend through semiconductor devices 6 and line 4.In other embodiments, using other materials and other arrangements.
In the illustrated embodiment, it is silicon 26 and groove 46 in line 4, groove 46 extends downward into ILD44.In some realities
Apply in example, the depth of groove 46 is equally big with the thickness 27 of silicon 26, and thickness 27 represents the substrate material of semiconductor devices 6 and chip 2
The thickness of material.In plan view, groove 46 completely or at least partially prolongs around the chip 2 and semiconductor devices 6 in line 4
Stretch and be used as sealing ring.In other embodiments, groove 46 is filled with the material different from silicon 26, and groove 46 is completely or extremely
Partially extend around the chip 2 and semiconductor devices 6 in line 4 and be used as sealing ring.In certain embodiments, it is different
Material be dielectric material, but in other embodiments, such as polymer or air can also be used（That is, it is not filled with groove
46）Various other suitable materials.In the illustrated embodiment, semiconductor devices 6 and chip 2 show as occupying identical
Real estate（real estate）, but in other embodiments, semiconductor devices 6 is formed in chip 2, and chip 2 includes
Peripheral buffering area, the peripheral buffering area do not include semiconductor devices 6.
Although being described with reference to the silicon 26 in Fig. 2, in other embodiments, chip 2 can be by such as half
The SiGe or other base materials of other materials used in conductor manufacture is formed, and semiconductor devices 6 can be formed such as
On the SiGe or other base materials of other materials used in semiconductor fabrication.
Although semiconductor devices 6 is imaging sensor, passed especially in conjunction with the back side illumination image shown in line 4 and groove 46
Sensor, wherein, the sealing ring that groove 46 is formed in Fig. 2 view, but in other embodiments, semiconductor devices 6 represents it
Other semiconductor devices of his imaging sensor or such as various integrated circuits.
Fig. 3 A to Fig. 3 G show different turnings（That is, the angle knot 13 of Fig. 1）Embodiment.Embodiment 3A's to 3G is each equal
Show that angle is tied（That is, the position of the adjacent side connection of sealing ring）Plan.Fig. 3 A to Fig. 3 G represent various types of sealing rings,
Including but not limited to groove and use and semiconductor devices（That is, chip 2）Material it is different material filling groove.Although Fig. 3 A
To Fig. 3 G it is each in illustrate only an angle knot 13, but each sealing ring can include one, two, three or four angle
Knot, the angle become shown in Fig. 3 A to Fig. 3 G or described herein circular or polygon corner in any one.
Fig. 3 A show embodiment, wherein, the neighbouring and usual of the sealing ring of at least partly about semiconductor devices is hung down
Tying on straight side 50（That is, angle knot 13）Place's connection.Each edge 50 is linear and by three of the connection at corresponding knot
Line segment 52 connects, and in the illustrated embodiment, turning 54,56,58 and 60 represents tying（Formed between line segment 52）Locate shape
Into turning.In the embodiment shown in this, every line segment 52 is straightway, but the arrangement of line segment 52 produces fillet effect
Fruit and the circumference for forming sealing ring.Conversely, it should be noted that side 50 is not connected to a little at 62, is put and is expressed as 90 ° at 62（I.e., such as
Shown in dotted line 64, if extending side 50, the right angle knot formed between adjacent side 50）.In figure 3 a, each turning 54,
56th, 58 and 60 is about the same, but in other embodiments, line segment 52 is connected to each other at the knot with different angle.
In the embodiment shown, each line segment 52 is respectively provided with about the same length, but in other embodiments, each line segment 52 wraps
Include different length.
Fig. 3 B are according to invention shows another embodiment of the non-perpendicular angles knot 13 of sealing ring.By forming sealing ring
Three line segments 70,72 and 74 of outer perimeter link together side 50.Three line segments 70,72 and 74 include different length and that
This connects and side 50 is connected at corresponding knot.Turning 76,78,80 and 82 is represented on line segment 70,72 and 74 and side 50
Between the turning that is formed at the knot that is formed.Turning 78 and 80 is the obtuse angle formed at the knot to extend internally.The arrangement produces angle
Knot 13, the angle knot 13 are not the direct turning connected vertically for being expressed simply as neighbouring linear edges 50.
Fig. 3 C show that five line segments 90,92,94,96 and 98 of the outer perimeter by forming sealing ring connect at angle knot 13
The side 50 being connected together.Side 50 is linked together by five line segments intersected at corresponding knot, and in the embodiment shown
In, turning 100,102,104,106,108 and 110 is formed at corresponding knot.Turning 100,102,108 and 110 be located to
Obtuse angle at the knot of outer extension, and turning 104,106 be at the knot to extend internally respectively line segment 92,94 and line segment 94,
The obtuse angle formed between 96.Dotted line 64 is represented if without fillet provided by the present invention, how side 50 may connect with point 62
For right angle.
In various embodiments, connection while 50 line segment quantity, connection while 50 the length of line segment, line segment it is relative
Length and the turning formed at the knot between connecting the line segment on side 50 are different.In certain embodiments, by smooth, bending
Camber line and unseparated line segment formed angle knot 13 outer perimeter.
Fig. 3 D to Fig. 3 G show various other arrangements, wherein, the neighbouring vertical edges 50 of sealing ring are at turning（Only include
It is connected as the side 50 at right angle）In be not attached to together.Fig. 3 D show the pentagon 120 for the closing being arranged at angle knot 13.It is close
Seal ring when 50 form two of pentagons 120.Fig. 3 E are shown at the knot between side 50（That is, at angle knot 13）Formed
Hexagon 124.The hexagon 124 of closing is included by sealing ring at 50 formed two.Line segment 126 connect side 50 and
Round corners effect is produced in this embodiment including polygon 124.Fig. 3 F show the implementation of the polygon including two closings
Example.In the illustrated embodiment, the polygon 130,132 of closing is mutual mirror image and symmetrical on line segment 134, but at it
In his embodiment, other arrangements can also be used.The polygon 130,132 each closed is quadrangle, and quadrangle 130,
132 share a line, i.e. share line segment 134.Although the side 50 of sealing ring connects at point 136 and formed really at point 136
Right angle, but extra line segment be present in each corner to form the polygon 130,132 of closing, and side 50 is only including
Intersect each other and be not connected to for the corner on the side 50 at right angle.In other embodiments, one or more envelopes at angle knot 13 be present
The polygon closed, and in various embodiments, the polygon includes different trapezoidal, triangles, hexagon or other are polygon
Shape.
Fig. 3 G show four line segments 142,144,146 and 148 on the side 50 that sealing ring is connected at angle knot 13.Line segment
142nd, 144,146 connected with 148 at corresponding knot, and in the illustrated embodiment, turning 150,152,154,156 and 158
The turning formed at knot is represented, wherein, knot is formed between line segment 142,144,146 and 148 and side 50.Turning 150,152,
154 and 156 each is the obtuse angle formed at knot between the knot to stretch out, and turning 158 is formed in inwardly
The obtuse angle at knot between the knot of extension, wherein the knot to extend internally is formed between line segment 144 and 146.
It is in many examples, close at angle knot 13 although having used different arrangements in various embodiments
The fillet of the circumference of seal ring is attributable to that single line wherein is connected as into obtuse angle（That is, angle is between 90 ° and 180 °）'s
Arrangement.
According to an aspect of the present invention, a kind of structure includes：The semiconductor devices being arranged on substrate；And at least portion
Divide the sealing ring of tube core of the ground around semiconductor devices is included, the sealing ring is generally rectangular in shape, and the rectangle, which has, to be located at
At least one angle knot between the vertical edges of rectangle, wherein, the ragged edge at turning forms on-right angle by vertical edges.
In certain embodiments, sealing ring is entirely around tube core, and each angle of at least one angle knot of sealing ring is tied
Outermost edge including on-right angle.
In certain embodiments, at least one angle knot includes a plurality of straightway for connecting the vertical edges of sealing ring.
In certain embodiments, the neighbouring straightway of a plurality of straightway is connected to each other at the knot including obtuse angle knot.
In certain embodiments, each angle knot of at least one angle knot of sealing ring includes on-right angle knot.
In certain embodiments, a plurality of straightway is connected to each other at each knot including obtuse angle.
In certain embodiments, the neighbouring straightway of a plurality of straightway is connected to each other at knot, and wherein, at least one
Individual knot is the first knot for extending inwardly to form obtuse angle, and wherein, at least one knot is the second knot to stretch out.
In certain embodiments, the second knot to stretch out forms obtuse angle.
In certain embodiments, a plurality of straightway forms the outer perimeter of angle knot, and at least one line segment is formed and is arranged on
One side of the polygon of closing at the knot of angle.
In certain embodiments, each angle knot is camber line.
In certain embodiments, sealing ring is the groove structure extended in substrate.
In certain embodiments, substrate is formed by the first material, and sealing ring is formed by the second material.
In certain embodiments, semiconductor devices includes imaging sensor.
According to another aspect of the present invention, a kind of structure includes：Semiconductor devices on a semiconductor substrate is set；Ring
Around the sealing ring of the semiconductor devices, sealing ring be the groove structure that extends in substrate and with the side for forming sealing ring and
The structure of the two groups of parallel lines staggered relatively to be linked together at the knot of angle, wherein, at least one angle knot includes being used as one portion
The polygon of at least one closing divided, at least one polygon edge of the polygon of the closing are formed by one in side.
In certain embodiments, first jiao of knot of angle knot by while first while be connected to while second while, the first side and the
Two sides are generally vertical, and the polygon of at least one closing it is at least one including extending to the one end on the first side at least one
Bar polygon edge.
In certain embodiments, sealing ring is around the tube core for including semiconductor devices, and at least first jiao of angle knot is tied
Including by while first while be connected to while second while and formed sealing ring circumference a plurality of straightway.
In certain embodiments, first jiao of knot includes at least one polygon, the polygon edge of at least one polygon
Formed by one in line segment.
According to another aspect of the present invention, a kind of structure includes：Establish the imaging sensor on tube core, the tube core shape
Into a part for Semiconductor substrate；And the sealing ring around imaging sensor, the sealing ring are usually the square with four edges
Shape shape, the neighbouring side of four edges is generally vertical and is linked together in Jiao Jiechu, and each angle knot has circumference, wherein,
Neighbouring side is connected as on-right angle.
In certain embodiments, imaging sensor is back side illumination image sensor, and each angle knot includes being connected to each other
A plurality of line segment.
In certain embodiments, line segment links together at knot, and each ties and include obtuse angle knot.
In certain embodiments, at least one knot includes the knot to extend internally, and at least one knot includes stretching out
Knot, and wherein, angle knot also includes at least one polygon, and the polygon edge of at least one polygon is by one in line segment
Bar is formed.
Foregoing merely illustrates the principle of the present invention.It is therefore to be understood that those of ordinary skill in the art can design
Although being not explicitly described or shown herein, embody the principle of the present invention and be included in various in its spirit and scope
Arrangement.In addition, all main purpose for being clearly intended only for teaching of all examples and conditional statement set forth herein and help
Understand the principle of the present invention and to promote the concept made contributions of this area development, and be interpreted as being not limited to such specific old
The example and condition stated.Moreover, principle of the invention set forth herein, aspect and all statements of embodiment and its instantiation
Being intended to, which includes its 26S Proteasome Structure and Function, is equal.In addition, it is this it is equivalent expected include currently known equivalent and future by exploitation etc.
Together, i.e. regardless of its structure, implement any element of the exploitation of identical function.
It is expected that reading this description to exemplary embodiment with reference to the figure in accompanying drawing, accompanying drawing is considered as entirely to write
Part for specification.In the description, such as " bottom ", " top ", " horizontal ", " vertical ", " ... on ",
" ... below ", " upward ", " downward ", " top " and " bottom " relative terms and its derivative words（For example, " flatly ", " to
Lowerly ", " up " etc.）It is construed as referring to the orientation shown in accompanying drawing described at that time or discussion.These are relative
Term be for the ease of description purpose and not claimed apparatus with specific azimuth configuration or operation.Except being separately expressly recited,
" connection " and " interconnection " refers to that one of structure is tied directly or by insertion on the term that is attached, connects etc.
Structure is indirectly fixed or is bonded to the relation of another structure and both moveable or rigid engagement or relation.
Although describing the present invention in a manner of exemplary embodiment, the invention is not restricted to this.On the contrary, appended by reply
People in the art in the case that claim should be construed broadly to be included in the equivalent scope without departing substantially from the present invention
Other changes of the invention and embodiment that member can make.
Claims (15)
1. a kind of semiconductor structure, including：
Semiconductor devices, it is arranged on substrate；And
Sealing ring, at least partly about tube core for including the semiconductor devices,
The sealing ring is generally rectangular in shape, and the rectangle has at least one between the vertical edges of the rectangle
Angle is tied, wherein, the outermost edge at turning forms on-right angle with the vertical edges, and at least one angle knot includes connecting described hang down
The a plurality of straightway of straight flange, wherein, the neighbouring straightway of a plurality of straightway is connected to each other at knot, at least one described
Knot extends internally towards the tube core and forms obtuse angle, and at least one knot stretches out away from the tube core
Second knot, wherein, second knot to stretch out forms obtuse angle.
2. semiconductor structure according to claim 1, wherein, the sealing ring is entirely around the tube core.
3. semiconductor structure according to claim 2, wherein, it is each at least one angle knot of the sealing ring
Individual angle knot includes on-right angle knot.
4. semiconductor structure according to claim 1, wherein, a plurality of straightway forms the outer perimeter of the angle knot,
And at least one line segment is formed as being arranged on a line of the polygon of the closing at the angle knot.
5. semiconductor structure according to claim 1, wherein, each angle knot is camber line.
6. semiconductor structure according to claim 1, wherein, the sealing ring is the groove knot extended in the substrate
Structure.
7. semiconductor structure according to claim 1, wherein, the substrate is formed by the first material, and the sealing
Ring is formed by the second material.
8. semiconductor structure according to claim 1, wherein, the semiconductor devices includes imaging sensor.
9. a kind of semiconductor structure, including：
Semiconductor devices, set on a semiconductor substrate,
Sealing ring, the semiconductor devices is surround,
The sealing ring is the groove structure extended in the substrate, and the sealing ring has and forms the sealing ring
Side and the two groups of parallel lines structures staggered relatively to be linked together in Jiao Jiechu, wherein, at least one angle knot includes making
For the polygon of at least one closing of a part for angle knot, at least one polygon edge of the polygon of the closing by
A formation in the side of the sealing ring；
Wherein, first jiao of knot of angle knot by the sealing ring while first while be connected to the sealing ring side second
Side, described first while and it is described second while it is generally vertical, and the polygon of at least one closing it is at least one including
At least one polygon edge of the one end on first side is extended to,
Also, the polygon also includes a plurality of inner side straightway towards the side of the semiconductor devices, wherein, it is described a plurality of
The neighbouring inner side straightway of inner side straightway is connected to each other at knot, it is at least one it is described knot towards the semiconductor devices to
It is interior to extend and form obtuse angle, and at least one knot is the second knot to stretch out away from the semiconductor devices, its
In, second knot to stretch out forms obtuse angle.
10. semiconductor structure according to claim 9, wherein, the sealing ring includes described around tube core, the tube core
Semiconductor devices, and at least first jiao knot of angle knot includes a plurality of straightway, a plurality of straightway is by the sealing
Ring while first while be connected to the sealing ring while second while and form the circumference of the sealing ring.
11. semiconductor structure according to claim 10, wherein, first jiao of knot includes at least one described polygon
Shape, a polygon edge of at least one polygon are formed by one in the line segment.
12. a kind of semiconductor structure, including：
Imaging sensor, establish on tube core, the tube core is formed as a part for Semiconductor substrate；And
Sealing ring, described image sensor is surround,
The sealing ring is usually the rectangular shape with four edges, and the neighbouring side of the four edges is generally vertical and at angle
Being linked together at knot, each angle knot has circumference, wherein, the neighbouring side is connected as on-right angle, each angle
Knot includes a plurality of line segment being connected to each other, and the neighbouring line segment of a plurality of line segment is connected to each other at knot, at least one described
Knot extends internally towards the tube core and forms obtuse angle, and at least one knot stretches out away from the tube core
Second knot, wherein, second knot to stretch out forms obtuse angle.
13. semiconductor structure according to claim 12, wherein, described image sensor is back side illumination image sensor,
And each angle knot includes a plurality of line segment being connected to each other.
14. semiconductor structure according to claim 13, wherein, the line segment links together at knot, and each
The knot includes obtuse angle knot.
15. semiconductor structure according to claim 14, wherein, at least one knot includes the knot to extend internally, and
And at least one knot includes the knot that stretches out, and angle knot also includes at least one polygon, described at least one
The polygon edge of individual polygon is formed by one in the line segment.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361780154P | 2013-03-13 | 2013-03-13 | |
| US61/780,154 | 2013-03-13 | ||
| US14/166,878 | 2014-01-29 | ||
| US14/166,878 US9530813B2 (en) | 2013-03-13 | 2014-01-29 | Seal ring structure with rounded corners for semiconductor devices |
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| CN104051486A CN104051486A (en) | 2014-09-17 |
| CN104051486B true CN104051486B (en) | 2017-12-19 |
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| CN201410087676.9A Active CN104051486B (en) | 2013-03-13 | 2014-03-11 | The seal ring structure with fillet for semiconductor devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106910752B (en) * | 2015-12-23 | 2020-01-03 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor device, manufacturing method thereof and electronic device |
| CN109119813A (en) * | 2017-06-22 | 2019-01-01 | 中航光电科技股份有限公司 | A kind of rectangular insert and its sealing ring |
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| CN1577811A (en) * | 2003-07-25 | 2005-02-09 | 台湾积体电路制造股份有限公司 | Semiconductor device with anchor type seal ring and producing method thereof and semiconductor assembling structure |
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| CN1783494A (en) * | 2004-11-08 | 2006-06-07 | 台湾积体电路制造股份有限公司 | Semiconductor wafer |
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