CN104047057B - A kind of semi-insulating inp crystal growth preparation formula - Google Patents

A kind of semi-insulating inp crystal growth preparation formula Download PDF

Info

Publication number
CN104047057B
CN104047057B CN201310079877.XA CN201310079877A CN104047057B CN 104047057 B CN104047057 B CN 104047057B CN 201310079877 A CN201310079877 A CN 201310079877A CN 104047057 B CN104047057 B CN 104047057B
Authority
CN
China
Prior art keywords
inp
semi
diboron trioxide
crystal growth
purity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310079877.XA
Other languages
Chinese (zh)
Other versions
CN104047057A (en
Inventor
关活明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangmen Xinyi Crystal Technology Co ltd
Original Assignee
Electro-Optical Technology Inc (us) 62 Martin Road Concord Massachusetts 017 Of Huaxing Of Taishan City
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro-Optical Technology Inc (us) 62 Martin Road Concord Massachusetts 017 Of Huaxing Of Taishan City filed Critical Electro-Optical Technology Inc (us) 62 Martin Road Concord Massachusetts 017 Of Huaxing Of Taishan City
Priority to CN201310079877.XA priority Critical patent/CN104047057B/en
Publication of CN104047057A publication Critical patent/CN104047057A/en
Application granted granted Critical
Publication of CN104047057B publication Critical patent/CN104047057B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The present invention relates to a kind of semi-insulating inp crystal growth preparations to be formulated, which is formed by raw material weight percentage are as follows: InP polycrystal material 97.00~98.50%, diboron trioxide 0.75~1.50%, red phosphorus 1.00~1.50%, iron 0.02~0.03%.The present invention can obtain high quality, major diameter InP monocrystalline, and high production efficiency, at the same the uniform stabilization of the performance on chip and the service life it is long,<100>the InP monocrystalline and single-chip prepared is by testing its resistivity 107Ω cm or more.

Description

A kind of semi-insulating inp crystal growth preparation formula
Technical field:
The invention belongs to semiconductor material preparation fields, and in particular to a kind of semi-insulating inp crystal growth preparation is matched Side.
Background technique
Indium phosphide (InP) is important one of III-V compound semiconductor material, is new after silicon, GaAs Generation electronic functional material.Compared with GaAs (GaAs), superiority essentially consists in high saturation electric field drift velocity, thermally conductive Property good and stronger capability of resistance to radiation etc., therefore InP chip manufactures commonly used in novel microelectronic, photoelectron element.
InP monocrystal material is mainly divided by electrical properties mixes sulphur N-type InP;Mix zinc p-type InP;It mixes iron or undoped annealing half is exhausted Edge InP monocrystalline.N-shaped InP monocrystalline is used for photoelectric device, long wavelength (1.3-1.55 μm) light emitting diode of InP-base, laser and Detector has been used for optical fiber telecommunications system.High speed, high frequency, broadband, low noise microwave, milli can be made in semi-insulating InP substrate Metric wave electronic device.
The fusing point of InP is 1062 DEG C, is lower than GaAs.But dissociation pressure (25~27.5atm) of the P at fusing point is very high.By Yu Qigao dissociation pressure, so that In and P are difficult to as Ga and As the direct synthesised polycrystalline in single crystal growing furnace.It therefore, generally will be in height The pressure interior high purity indium of furnace and high-purity red phosphorus synthesize InP polycrystal material first, then carry out crystal growth work again.
As other semiconductor materials, InP material is difficult to avoid that thermal stress effect, stoicheiometry during the growth process Deviation, component segregation, impurity contamination etc., thereby result in the generation of defect and the destruction of perfection of lattice.To avoid defect, improve Material integrity and electrical properties, and then photoelectron and microelectronic component Performance And Reliability are improved, need strict control chemical Proportion.
Summary of the invention
According to above situation, the purpose of the present invention is to provide a kind of semi-insulating inp crystal growth preparations to be formulated, by The InP substrate that the InP crystal that the formula generates obtains is for low noise and wideband microwave device, terminal guidance and anti-interference millimeter wave Device and integrated optoelectronic circuit.
The technical scheme is that being realized by following measures: a kind of semi-insulating inp crystal growth preparation is matched Side, it is characterised in that formed by raw material weight percentage are as follows: InP polycrystal material 97.00~98.50%, diboron trioxide 0.75~ 1.50%, red phosphorus 1.00~1.50%, iron 0.02~0.03%.
The InP polycrystal material repeatedly boils cleaning through deionized water, to remove the oxide and residual impurity on surface, it is ensured that Degree of purity needed for experiment.
The diboron trioxide is high-purity dehydration diboron trioxide, and dewatered diboron trioxide water content generally exists 500ppm magnitude.
The red phosphorus reaches 6N degree of purity.
The iron reaches 6N degree of purity.
According to above-mentioned formula provided by the invention, high quality, major diameter InP monocrystalline, and high production efficiency can be obtained, together When chip on the uniform stabilization of performance and the service life it is long.
Specific embodiment
Semi-insulating inp crystal growth preparation formula is formed by raw material weight percentage: InP polycrystal material 97.00~ 98.50%, diboron trioxide 0.75~1.50%, red phosphorus 1.00~1.50%, iron 0.02~0.03%.
According to above-mentioned formula provided by the invention, high quality, major diameter InP monocrystalline, and high production efficiency can be obtained, together When chip on the uniform stabilization of performance and the service life it is long.
Embodiment 1, semi-insulating inp crystal growth preparation formula are made of following raw material weight percentage: InP is more Crystalline substance material 97.06%, diboron trioxide 1.46%, red phosphorus 1.46%, iron 0.02%.
<100>InP monocrystalline and single-chip that embodiment 1 is prepared are by testing its resistivity 5.6 × 107Ω· cm。
Embodiment 2, semi-insulating inp crystal growth preparation formula are made of following raw material weight percentage: InP is more Crystalline substance material 98.10%, diboron trioxide 0.78%, red phosphorus 1.09%, iron 0.03%.
<100>InP monocrystalline and single-chip that embodiment 2 is prepared are by testing its resistivity 6.8 × 107Ω· cm。
Embodiment 3, semi-insulating inp crystal growth preparation formula are made of following raw material weight percentage: InP is more Crystalline substance material 97.50%, diboron trioxide 0.98%, red phosphorus 1.50%, iron 0.02%.
<100>InP monocrystalline and single-chip that embodiment 3 is prepared are by testing its resistivity 1.2 × 108Ω· cm。
Embodiment 4, semi-insulating inp crystal growth preparation formula are made of following raw material weight percentage: InP is more Crystalline substance material 98.22%, diboron trioxide 0.75%, red phosphorus 1.00%, iron 0.03%.
<100>InP monocrystalline and single-chip that embodiment 4 is prepared are by testing its resistivity 9.6 × 107Ω· cm。

Claims (1)

1. a kind of semi-insulating inp crystal growth preparation method is suitable for production for low noise and wideband microwave device, end The InP substrate of guidance and anti-interference millimetric wave device and integrated optoelectronic circuit, which is characterized in that formed by raw material weight percentage Are as follows: InP polycrystal material 97.00~98.22%, diboron trioxide 0.75~1.50%, red phosphorus 1.00~1.50%, iron 0.02~ 0.03%;The InP polycrystal material repeatedly boils cleaning through deionized water, to remove the oxide and residual impurity on surface;It is described Diboron trioxide is high-purity dehydration diboron trioxide, and dewatered diboron trioxide water content is generally in 500ppm magnitude;It is described Red phosphorus reaches 6N degree of purity;The iron reaches 6N degree of purity.
CN201310079877.XA 2013-03-12 2013-03-12 A kind of semi-insulating inp crystal growth preparation formula Active CN104047057B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310079877.XA CN104047057B (en) 2013-03-12 2013-03-12 A kind of semi-insulating inp crystal growth preparation formula

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310079877.XA CN104047057B (en) 2013-03-12 2013-03-12 A kind of semi-insulating inp crystal growth preparation formula

Publications (2)

Publication Number Publication Date
CN104047057A CN104047057A (en) 2014-09-17
CN104047057B true CN104047057B (en) 2019-04-02

Family

ID=51500436

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310079877.XA Active CN104047057B (en) 2013-03-12 2013-03-12 A kind of semi-insulating inp crystal growth preparation formula

Country Status (1)

Country Link
CN (1) CN104047057B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115424921B (en) * 2022-11-07 2023-03-24 苏州长光华芯光电技术股份有限公司 Method for growing semi-insulating iron-doped InP epitaxial layer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1499587A (en) * 2002-11-11 2004-05-26 中国科学院半导体研究所 Method for preparing half insulated substrate by using non-adulterated indium phosphide through high temperature annealing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1499587A (en) * 2002-11-11 2004-05-26 中国科学院半导体研究所 Method for preparing half insulated substrate by using non-adulterated indium phosphide through high temperature annealing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
富磷熔体中生长的Φ100mm掺硫InP单晶研究;周晓龙等;《固体电子学研究与进展》;20040229;第134-137页

Also Published As

Publication number Publication date
CN104047057A (en) 2014-09-17

Similar Documents

Publication Publication Date Title
Høiaas et al. GaN/AlGaN nanocolumn ultraviolet light-emitting diode using double-layer graphene as substrate and transparent electrode
Hsieh et al. Electroluminescence from ZnO/Si-nanotips light-emitting diodes
KR101416663B1 (en) Laser diode using zinc oxide nanorods and manufacturing method thereof
CN104047055B (en) A kind of n type inp crystal growth preparation formula
CN103681969A (en) Photoconductive switch manufacturing method based on SiC substrate
CN107313110B (en) Preparation formula and preparation method of P-type indium phosphide single crystal
CN103114332A (en) Method for preparing gallium nitride monocrystal substrate by surface modification auto-separation
CN104047057B (en) A kind of semi-insulating inp crystal growth preparation formula
Xu et al. Thermodynamics of ion-cutting of β-Ga2O3 and wafer-scale heterogeneous integration of a β-Ga2O3 thin film onto a highly thermal conductive SiC substrate
CN102140680A (en) Method for preparing gallium nitride single crystal
SG176276A1 (en) Method of bonding using a bonding layer based on zinc, silicon and oxygen and corresponding structures
Liu et al. Heteroepitaxial growth and interface band alignment in a large-mismatch CsPbI 3/GaN heterojunction
CN105239162A (en) Aluminum oxide-gallium oxide mixed-crystal material for wide-band-gap semiconductors
Iliyev et al. A surface study of Si doped simultaneously with Ga and Sb
Yao et al. Interface-induced enhancement of THz generation and modulation in hexagonal boron nitride/Si mixed-dimensional Van Der Waals heterostructure
CN105442045A (en) Semi-insulating GaN single crystal with low impurity concentration and preparation method and application thereof
US9099597B2 (en) Light emitting diode element with porous SiC emitting by donor acceptor pair
CN106328774A (en) Epitaxial growth method and application of GaN film
CN103715325B (en) The preparation method of single ZnO micro wire homojunction LED
WO2016009660A1 (en) Gaas crystal
RU2647209C1 (en) METHOD FOR OBTAINING A MULTI-LAYER HETEROEPITAXIAL P-I-N STRUCTURE IN THE AlGaAs SYSTEM BY THE LIQUID PHASE EPITAXY METHOD
KR20130091871A (en) Growth method of iii-nitride-based epi on si substrates and the semiconductor substrates
Deng et al. Ultraviolet electroluminescence from nanostructural SnO2-based heterojunction with high-pressure synthesized Li-doped ZnO as a hole source
Lian The pros and cons of gan family of materials compared with other alternatives regarding optoelectronic applications
RU2610388C2 (en) Method of simultaneous production of p-i-n structure of gaas with p, i and n area in one epitaxial layer

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20240415

Address after: 529000, Building 9, No. 6 Jianda South Road, Pengjiang District, Jiangmen City, Guangdong Province

Patentee after: Jiangmen Xinyi Crystal Technology Co.,Ltd.

Country or region after: China

Address before: 529341 No. 61 Shihua Road, Taicheng, Taishan City, Guangdong Province

Patentee before: TAISHAN HUAXING PHOTOELECTRIC TECHNOLOGY CO.,LTD.

Country or region before: China