CN104046124B - A kind of ultraviolet light polymerization solder mask and preparation method thereof - Google Patents
A kind of ultraviolet light polymerization solder mask and preparation method thereof Download PDFInfo
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- CN104046124B CN104046124B CN201410274399.2A CN201410274399A CN104046124B CN 104046124 B CN104046124 B CN 104046124B CN 201410274399 A CN201410274399 A CN 201410274399A CN 104046124 B CN104046124 B CN 104046124B
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Abstract
The invention discloses the compound method of a kind of ultraviolet light polymerization solder mask; this ink by weight is mainly made up of 30 45 parts of photosensitive resins, 28 parts of tetramethylol methane tetraacrylates and/or its derivant, 15 parts of Hydroxypropyl methacrylates and/or its derivant, 15 parts of photosensitizer, 10 20 parts of fillers, 15 parts of mill bases, 15 parts of auxiliary agents; after grinding, ink viscosity ratio is relatively low; it is suitable for being printed on the single sided board of circuit board plant, plays the effect of aesthetic appeal and protection circuit.Meanwhile, ink has fabulous flatness, insulating properties and high-fire resistance after ultraviolet light polymerization.
Description
Technical field
The present invention relates to a kind of ultraviolet light polymerization solder mask, particularly relate to a kind of there is fabulous levelability, high-fire resistance and absolutely
The solder mask of the novel environment friendly of edge.
Background technology
Poor heat resistance after traditional UV curable ink solidification, easily bubbles during scolding tin or falls oil, at the appliance circuit of high request
Requirement it is unable to reach on plate.
Summary of the invention
It is an object of the invention to provide a kind of ultraviolet light polymerization solder mask, compounding through photosensitive resin, the preparation of mill base, mix,
Dispersion, grinds, filters and divide tank working procedure processing to form.Product configuration of the present invention is easy, and printing performance is good, and high-fire resistance is with exhausted
Edge, efficiently solves the problem that conventional ultra-violet light-curable ink bubbles when circuit board soldering tin or falls oil.
It is an object of the invention to be achieved through the following technical solutions:
A kind of ultraviolet light polymerization solder mask, described ultraviolet light polymerization solder mask includes following component by weight:
Described photosensitive resin is by o-cresol formaldehyde epoxy resin F51, THPA and acrylic acid (15-40) by ratio of weight and the number of copies:
(3-8): (1-6) carries out reaction and prepare；
Described tetramethylol methane tetraacrylate and/or its derivant are from trimethylolpropane trimethacrylate, tetramethylolmethane three
Acrylate, tetramethylol methane tetraacrylate, two contracting trimethylolpropane tetra-acrylate select one or more；
Described Hydroxypropyl methacrylate and/or its derivant are from 1,6 hexanediol diacrylate, tripropylene glycol class dipropyl
Olefin(e) acid ester, isobornyl methacrylate, Hydroxypropyl methacrylate select one or more；
Described photosensitizer selects 2-ethyl-anthraquinone, Benzoinum diethyl ether, 2-hydroxy-2-methyl-1-phenylacetone, 1-hydroxyl ring
One or more in hexyl benzene ketone and 2-benzyl-2-dimethylamino-1-(4-morpholinyl phenyl)-1-butanone；
Described mill base is by pigment: photosensitive resin portion rate is 1-3:7-9, through mixing, disperse, grind and making；
Described auxiliary agent is the defoamer containing organosilicon radical and the levelling agent containing organosilicon radical.
Preferably, described photosensitive resin is by 25-35 part o-cresol formaldehyde epoxy resin F51,5-7 part THPA and 3-6 part third
Olefin(e) acid reacts at 100-110 DEG C and prepares.
Preferably, one or more in barium sulfate, Pulvis Talci and silicon dioxide of described filler.
Preferably, described tetramethylol methane tetraacrylate and/or its derivant account in described ultraviolet light polymerization solder mask formula
5-7 part.
Preferably, described Hydroxypropyl methacrylate and/or its derivant account for 2-4 in described ultraviolet light polymerization solder mask formula
Part.
Preferably, described photosensitizer accounts for 3-5 part in described ultraviolet light polymerization solder mask formula.
Preferably, described filler accounts for 15-20 part in described ultraviolet light polymerization solder mask formula.
Preferably, described mill base accounts for 1-3 part in described ultraviolet light polymerization solder mask formula.
Preferably, described auxiliary agent accounts for 0.8-2.7 part in described ultraviolet light polymerization solder mask formula, and wherein defoamer is described
Accounting for 0.4-1.2 part in ultraviolet light polymerization solder mask formula, levelling agent accounts in described ultraviolet light polymerization solder mask formula
0.4-1.5 part.
A kind of manufacture method according to above-mentioned ultraviolet light polymerization solder mask, comprises the following steps:
(1) preparation of mill base: by pigment with photosensitive resin by (1-3): the ratio of weight and number of (7-9) puts in mill base special barrel, uses
High speed dispersor is uniformly dispersed under 500-600RPM rotating speed, grinds 5 times on three-roll grinder 405 or 260；
(2) preparation of ink: by photosensitive resin, tetramethylol methane tetraacrylate and/or its derivant, Hydroxypropyl methacrylate
And/or its derivant and photosensitizer feed intake in passage, stir to 50-60 under 800-1000RPM rotating speed with high speed dispersor
After DEG C, stop stirring, add filler, mill base and auxiliary agent, stir at rotating speed 600-800RPM with high speed dispersor；
(3) grinding of ink, filtration: material scattered for step (2) is ground 2 times with 260 or 405 type three-roll grinders
To fineness less than 8 μm；By the filter screen filtration of 300 mesh, prepare ultraviolet light polymerization solder mask.
The ink filtered is carried out performance detection, qualified after carry out subpackage with the black lucifuge plastic tank of corresponding package specification,
To the printing ultraviolet light polymerization solder mask being suitable for circuit board factory single sided board.
Compared with prior art, the method have the advantages that
1. meet the requirement of environmental protection, abnormal smells from the patient is low, low VOC emission；
2., after formulation optimization, the fineness of ink can reach below 8 μm, and resolution is up to 0.5mm；By UV photocuring, ink
Surface smooths, and glossiness is high, and hardness, up to 6H, is difficult to wipe colored scratch；
3. thermostability: 280 degree non-foaming are not fallen oil 10 seconds 3 times, and PCB copper face adhesive force (hundred lattice tests) reaches 100/100.
Detailed description of the invention
In order to preferably explain the present invention, enumerate following table specific embodiment and be described further.Optimal side is optimized from each embodiment
Case.
The formula of table 1 various embodiments of the present invention
The performance of table 2 various embodiments of the present invention product
Note: 1. pencil hardness is by " paint and varnish pencil method measures hardness of paint film " GB/T 6739-2006 detection；2. temperature tolerance inspection
Survey be the model of coating solder mask is carried out 10 seconds by GB/T 4677-2002 regulation, the test of three soldering resistances can bear
Temperature data.
From Tables 1 and 2, embodiments of the invention 1, embodiment 3 and embodiment 5 and contrast are with reference to embodiment 2, enforcement
Example 4 and embodiment 6 compare, and use tetramethylol methane tetraacrylate, Hydroxypropyl methacrylate and barium sulfate and the present invention
Specific photosensitive resin is compounding makes ink, and after solidification, the hardness (pencil hardness) of insulating barrier is promoted to 6H, temperature tolerance by 3H
By 250 DEG C be promoted to 280 DEG C or more than.
Claims (9)
1. a ultraviolet light polymerization solder mask, described ultraviolet light polymerization solder mask includes following component by weight:
Described photosensitive resin is by o-cresol formaldehyde epoxy resin F51, THPA and acrylic acid (15-40) by ratio of weight and the number of copies: (3-8):
(1-6) carry out reaction to prepare；
Described photosensitizer selects 2-ethyl-anthraquinone, Benzoinum diethyl ether, 2-hydroxy-2-methyl-1-phenylacetone, 1-hydroxy-cyclohexyl
One or more in benzophenone and 2-benzyl-2-dimethylamino-1-(4-morpholinyl phenyl)-1-butanone；
Described mill base is by pigment: photosensitive resin ratio of weight and number is 1-3:7-9, through mixing, disperse, grind and making；
Described auxiliary agent is the defoamer containing organosilicon radical and the levelling agent containing organosilicon radical.
Ultraviolet light polymerization solder mask the most according to claim 1, described photosensitive resin is by 25-35 part o-cresol formaldehyde epoxy resin
F51,5-7 part THPA and 3-6 part acrylic acid react at 100-110 DEG C and prepare.
Ultraviolet light polymerization solder mask the most according to claim 1, it is characterised in that described tetramethylol methane tetraacrylate is described
Ultraviolet light polymerization solder mask formula accounts for 5-7 part.
Ultraviolet light polymerization solder mask the most according to claim 1, it is characterised in that described Hydroxypropyl methacrylate is at described purple
Outer photocuring solder mask formula accounts for 2-4 part.
Ultraviolet light polymerization solder mask the most according to claim 1, it is characterised in that described photosensitizer hinders at described ultraviolet light polymerization
Solder paste ink formulations accounts for 3-5 part.
Ultraviolet light polymerization solder mask the most according to claim 1, it is characterised in that described barium sulfate hinders at described ultraviolet light polymerization
Solder paste ink formulations accounts for 15-20 part.
Ultraviolet light polymerization solder mask the most according to claim 1, it is characterised in that described mill base is in described ultraviolet light polymerization welding resistance
Ink formulations accounts for 1-3 part.
Ultraviolet light polymerization solder mask the most according to claim 1, it is characterised in that described auxiliary agent is in described ultraviolet light polymerization welding resistance
Accounting for 1-2.7 part in ink formulations, wherein defoamer accounts for 0.4-1.2 part, levelling in described ultraviolet light polymerization solder mask formula
Agent accounts for 0.4-1.5 part in described ultraviolet light polymerization solder mask formula.
9. the manufacture method of a ultraviolet light polymerization solder mask according to claim 1, it is characterised in that comprise the following steps:
(1) preparation of mill base: by pigment with photosensitive resin by (1-3): the ratio of weight and number of (7-9) puts in mill base special barrel, with at a high speed
Dispersion machine is uniformly dispersed under 500-600RPM rotating speed, grinds 5 times on three-roll grinder 405 or 260；
(2) preparation of ink: photosensitive resin, tetramethylol methane tetraacrylate, Hydroxypropyl methacrylate, photosensitizer are fed intake logical
In road, after stirring to 50-60 DEG C under 800-1000RPM rotating speed with high speed dispersor, stop stirring, add barium sulfate, color
Slurry and auxiliary agent, stir at rotating speed 600-800RPM with high speed dispersor；
(3) grinding of ink, filtration: material scattered for step (2) is ground 2 times to carefully with 260 or 405 type three-roll grinders
Degree is less than 8 μm；By the filter screen filtration of 300 mesh, prepare ultraviolet light polymerization solder mask.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410274399.2A CN104046124B (en) | 2014-06-18 | 2014-06-18 | A kind of ultraviolet light polymerization solder mask and preparation method thereof |
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| CN201410274399.2A CN104046124B (en) | 2014-06-18 | 2014-06-18 | A kind of ultraviolet light polymerization solder mask and preparation method thereof |
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| CN104046124A CN104046124A (en) | 2014-09-17 |
| CN104046124B true CN104046124B (en) | 2016-08-17 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104311793B (en) * | 2014-09-29 | 2017-02-15 | 嘉兴市南开油墨有限公司 | Photochromic ink prepolymer and preparation method thereof as well as photochromic ink |
| CN106380929A (en) * | 2016-08-30 | 2017-02-08 | 江门市阪桥电子材料有限公司 | UV-cured liquid photosensitive solder resist soft board printing ink and preparation method thereof |
| CN106398386B (en) * | 2016-08-31 | 2019-09-10 | 江门市阪桥电子材料有限公司 | A kind of LED exposure machine solder mask and preparation method thereof |
| CN107903706A (en) * | 2017-11-24 | 2018-04-13 | 天长市天翔包装有限公司 | A kind of environmental protection UV curable ink |
| CN112094532B (en) * | 2020-11-11 | 2021-02-19 | 佛山市鑫正化工有限公司 | Preparation method of ultraviolet curing solder mask ink, product and application thereof |
| CN112194930B (en) * | 2020-12-03 | 2021-03-05 | 佛山市鑫正化工有限公司 | Solder mask ink, PCB (printed circuit board) and preparation method and application thereof |
| CN114989670A (en) * | 2022-05-23 | 2022-09-02 | 东莞市科雷明斯智能科技有限公司 | Insulating jet printing ink and preparation method thereof |
| CN115785730A (en) * | 2022-12-28 | 2023-03-14 | 东莞智炜新材料股份有限公司 | UV (ultraviolet) light-cured solder resist ink and preparation method thereof |
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| JP4882271B2 (en) * | 2005-04-28 | 2012-02-22 | Ｄｉｃ株式会社 | Resin ink resin composition |
| CN102286228B (en) * | 2011-06-20 | 2013-04-17 | 无锡广信感光科技有限公司 | Preparation method of high temperature resistant non-halogen fire resistant ultraviolet curing solder resist ink |
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Denomination of invention: Ultraviolet-curing solder resist ink and preparation method thereof Effective date of registration: 20171114 Granted publication date: 20160817 Pledgee: Bank of China Limited by Share Ltd Jiangmen branch Pledgor: Jiangmen ABQ Electronic Material Co., Ltd. Registration number: 2017110000012 |
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