CN104045979B - A kind of method of improving back lining materials sound absorbing capabilities based on graphene oxide - Google Patents
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Abstract
A method of improving back lining materials sound absorbing capabilities based on graphene oxide, belongs to material technology field. In order to solve interface energy problem high between W powder and Epoxy, make W powder and Epoxy obtain good compatible result, described method one is: one, the compound powder of preparation W/Epoxy; Two, preparation W/Epoxy/GO compound powder; Three, preparation W/Epoxy/GO/Epoxy compound powder; Four, preparation W/Epoxy/GO/Epoxy complex thin film. Described method two is: one, preparation W/GO compound powder; Two, preparation W/GO/Epoxy compound powder; Three, preparation W/GO/Epoxy complex thin film. The present invention is by the layer assembly of W, Epoxy and GO, form W/Epoxy/GO/Epoxy complex thin film or W/GO/Epoxy complex thin film, and improve the preparation technology of traditional back lining materials matrix W and Epoxy, prepare the complex thin film back lining materials of middle impedance, high decay.
Description
Technical field
The invention belongs to material technology field, relate to a kind of based on graphene oxide (GO) improvement back lining materials sound absorbing capabilitiesNew method.
Background technology
Back lining materials in ultrasonic probe mainly contains two purposes: one, mate with piezoelectric crystal material, reduce waferVibration number, thereby improve probe frequency bandwidth; Two, the sound wave that absorption pressure electroceramics is launched dorsad, reduces clutter dorsadOn the impact of probe, improve the reliability detecting. We know, the acoustic impedance of back lining materials and piezoelectric ceramics is more approaching, and sound declinesSubtract greatlyr, the ultrasonic wave that piezoelectric ceramics inspires can the most effectively enter back lining materials, is then absorbed, and the frequency band of probe just moreWide, resolution ratio is just better. So lot of domestic and international scholar is devoted to prepare the back lining materials of high impedance, high decay at present, butAlthough the probe that this back lining materials prepares has advantages of that pulse is short, bandwidth, the sensitivity of probe is fallen greatlyLow. This is because the ultrasonic wave major part that piezoelectric ceramics inspires is absorbed by back lining materials, thereby causes the sensitivity of probeSignificantly reduce. Sensitivity and resolution ratio are all to prepare two key factors of ultrasonic transducer reference, highly sensitive in order to obtainDegree and high-resolution, a kind of solution of compromise is: the high decay of preparation, the relatively low back lining materials of acoustic impedance.
At present, epoxy resin/tungsten powder composite has obtained grinding widely as the back lining materials of ultrasonic transducerStudy carefully, by regulating and controlling the proportioning of tungsten powder and epoxy resin, and in epoxy resin, introduce the inorganic filler of various different proportionings,Utilize various drawing method can obtain the material of corresponding high impedance and high decay. But the inorganic fill of micro/nano-scaleDifferent because of interfacial property between thing and high polymer epoxy resin, compatibility is very poor. Such as micron order tungsten powder is difficult in epoxy resinReach dispersed, this is because nanometer tungsten particle surface can be high, in thermodynamics unsteady state, very easily assemble agglomerating, noEasily fully mix with high polymer, and there is no stronger adhesion between micron order tungsten particle and high polymer, easily cause tungsten powder particlesDepart from polymeric system, the inhomogeneities that thin-film material disperses is had a greatly reduced quality the sound absorbing capabilities of material.
The people such as professors An Deliehaimu in 2004 peel off and have obtained Graphene from graphite flake. Graphene is super because havingHigh electric conductivity, extremely strong mechanical strength and larger specific area, become the study hotspot of new material. Kong Min etc.People mixes Graphene in high molecular polymer, finds that material no longer merely relies on the damped motion of sound wave and material to reduce and makes an uproarSound, and may be to absorb after the energy of sound wave due to material, relies on the resonant interaction of molecule and electric conductivity to consume sound waveEnergy.
Back lining materials manufacture craft difficult point is the dispensing mode of matrix material and batching at present, as the two can not be organicallyCombine to produce and cohere or air bubble problem, bring very large obstacle, nature will to homogeneity and the final molding of sampleAlso affected its sound absorbing capabilities. Such as tungsten particle surface can be high, density is large, and the interfacial energy between itself and epoxy resin is very high,Very easily occur to assemble and sedimentation, cannot realize tungsten powder at epoxy resin body dispersed in mutually.
Summary of the invention
In order to solve interface energy problem high between W powder and epoxy resin (Epoxy), W powder and Epoxy are obtained fineCompatible result, the invention provides a kind of new method of improving back lining materials sound absorbing capabilities based on graphene oxide, intend passing throughThe layer assembly of W, Epoxy and GO, forms W/Epoxy/GO/Epoxy complex thin film or W/GO/Epoxy complex thin film, andImprove the preparation technology of traditional back lining materials matrix W and Epoxy, prepare the complex thin film backing material of middle impedance, high decayMaterial.
The object of the invention is to be achieved through the following technical solutions:
Technical scheme one: the preparation of W/Epoxy/GO/Epoxy complex thin film back lining materials, its key step is as follows:
One, the compound powder of preparation W/Epoxy:
Get EpoxyA glue and add in centrifuge tube, add a small amount of ethanolic solution, agitation and dilution, then add EpoxyB glue, continueContinuous stirring; After stirring, add W powder, at 30 ~ 60 DEG C, continue to stir, mixture is solidified after ethanol volatilization to the greatest extent; To consolidateCompound is taken out and is ground through 400 ~ 600 order sub-sieve sievings, obtains W/Epoxy compound powder, and this powder is double-layer structure, at WPowder outer wrapping Epoxy layer, controlling W powder content is 20 ~ 70wt.% of W/Epoxy/GO/Epoxy complex thin film, Epoxy layer containsAmount is 1 ~ 10wt.% of W/Epoxy/GO/Epoxy complex thin film, Epoxy by EpoxyA glue and EpoxyB glue according to 3:1'sMass ratio composition.
Two, preparation W/Epoxy/GO compound powder:
W/Epoxy compound powder is mixed in the GO aqueous solution, after being dried, pulverize, divide through 400 ~ 600 ordersThe sieving of sample sieve, obtains W/Epoxy/GO compound powder, and this powder is three-decker, and the W/Epoxy preparing in step 1 answersCompound powder outer wrapping GO layer, controlling GO layer content is 1 ~ 10wt.% of W/Epoxy/GO/Epoxy complex thin film.
Three, preparation W/Epoxy/GO/Epoxy compound powder:
Get EpoxyA glue and add in centrifuge tube, add a small amount of ethanolic solution, agitation and dilution, then add EpoxyB glue, continueContinuous stirring; After stirring, add W/Epoxy/GO compound powder, at 30 ~ 60 DEG C, continue to stir, make mixture at ethanolAfter volatilization to the greatest extent, solidify; Solidfied material is taken out and ground through 400 ~ 600 order sub-sieve sievings, obtain W/Epoxy/GO/Epoxy compound powderBody, this powder is four-layer structure, the W/Epoxy/GO compound powder outer wrapping Epoxy layer of preparing in step 2 is controlledEpoxy layer content is the 1wt.% of W/Epoxy/GO/Epoxy complex thin film.
Four, preparation W/Epoxy/GO/Epoxy complex thin film:
Get EpoxyA glue and add in centrifuge tube, add a small amount of ethanolic solution, agitation and dilution, then add EpoxyB glue, continueContinuous stirring; After stirring, add W/Epoxy/GO/Epoxy compound powder, after stirring, vacuumize 5-10min, at oneselfSo under condition, solidify 4 ~ 6h, after solidifying completely, through the thickness of sand papering to 1 ~ 2mm, obtain W/Epoxy/GO/Epoxy compoundFilm.
Technical scheme two: the preparation of W/GO/Epoxy complex thin film back lining materials, its key step is as follows:
One, preparation W/GO compound powder:
W powder is mixed in GO solution, after being dried, pulverize, through 400 ~ 600 order sub-sieve sievings, obtain W/GO multipleCompound powder, this powder is double-layer structure, at W powder outer wrapping GO layer, controlling W powder content is W/GO/Epoxy complex thin film20 ~ 70wt.%, GO layer content is 1 ~ 10wt.% of W/GO/Epoxy complex thin film;
Two, preparation W/GO/Epoxy compound powder:
Get EpoxyA glue and add in centrifuge tube, add a small amount of ethanolic solution, agitation and dilution, then add EpoxyB glue, continueContinuous stirring; After stirring, add W/GO compound powder, at 30 ~ 60 DEG C, continue to stir, make mixture in ethanol volatilization to the greatest extentRear solidifying; Solidfied material is taken out and ground through 400 ~ 600 order sub-sieve sievings, obtain W/GO/Epoxy compound powder, this powder isThree-decker, the W/GO compound powder outer wrapping Epoxy layer of preparing in step 1, controlling Epoxy layer content is W/GO/The 1wt.% of Epoxy complex thin film;
Three, preparation W/GO/Epoxy complex thin film:
Get EpoxyA glue and add in centrifuge tube, add a small amount of ethanolic solution, agitation and dilution, then add EpoxyB glue, continueContinuous stirring; After stirring, add W/GO/Epoxy compound powder, after stirring, vacuumize 5-10min, in natural conditionsSolidify down 4 ~ 6h, after solidifying completely, through the thickness of sand papering to 1 ~ 2mm, obtain W/GO/Epoxy complex thin film.
Fig. 1-6 have provided preparation process and the optical photograph thereof of W/Epoxy/GO/Epoxy complex thin film.
The present invention proposes the coated mentality of designing of supermolecule, mentality of designing one: consider graphene oxide surface withHydroxyl, carboxyl and epoxide group, and there is the weak interactions such as hydrogen bond between the oxygen-containing functional group of epoxy resin load; In addition,Tungsten powder belongs to transition metal, has d and f unoccupied orbital, may with the sp of graphene oxide2Between hybrid electron, there is d-p conjugation to doWith, be conducive to the compatible of tungsten powder and epoxy resin so wrap up in advance one deck graphene oxide at tungsten powder surface. Another designThinking is first to wrap up in advance one deck epoxy resin at tungsten powder surface, and the booster action of recycling graphene oxide is realized tungsten powder and ringThe compatible result of epoxy resins, preparation scheme as shown in Figure 7.
Preparation is taking GO/Epoxy as filling the film of powder, by the GO/Epoxy complex thin film to different GO contentSound absorbing capabilities is investigated, and the optimum filling amount that draws GO is 3.5%, and the W/Epoxy that wraps up different proportionings with a certain amount of GO solution is multipleCompound, for ensureing finally to fill the consistent of powder gimmick, then at powder surface parcel one deck thin layer Epoxy, forms W/Epoxy/GO/Epoxy compound, by this powder filled enter in a certain amount of Epoxy, the content that the content that makes W is 60%, GO is 3.5%,The content of outer Epoxy is 1%, regulates and controls the percentage of Epoxy between W and GO, makes the 60%W/ of a series of different Epoxy covering amountsEpoxy%/3.5%GO/1%Epoxy film, by acoustical testing, show that the best parcel amount of Epoxy is 5%. Enter on this basisRow orthogonal experiment, with the W of best 5%Epoxy parcel amount and 3.5%GO parcel amount parcel different content, makes a series of W and containsMeasure the W%/5%Epoxy/3.5%GO/1%Epoxy complex thin film at 20% ~ 70%, by acoustical testing, draw 45%W/5%The complex thin film best performance of Epoxy/3.5%GO/1%Epoxy more, this complex thin film under 10MHz frequency, acoustic impedanceReach 6.42MRayl, acoustic attenuation coefficient reaches 47.1 ± 3.8dB/cm*MHz. Test result as Figure 8-9.
The present invention has following advantage:
1, improve the separation process of preparing graphene oxide in Hummers method, the graphene oxide of reporting in document pointFrom first centrifugal 10min under the speed of 8000r/min of process need, then under the speed of 10000r/min centrifugal 20min, abilityGraphene oxide is dissociated out, and the time consuming time is long, and efficiency is low. And the present invention utilizes heating, ultrasonic, different meshes sub-sieve sieveThe method of filter, the disposable graphene oxide of isolating lot of pure of energy, provides prerequisite for being applied to back lining materials.
2, carry out supermolecule at tungsten powder surface in advance and be coated, reduced interface energy high between tungsten powder particles, tungsten powder is difficult for groupGather and coagulation. The thin-film material of preparing disperses homogeneous more, and the acoustics of material is more stable.
3, graphene oxide is introduced to tungsten powder and epoxy systems, utilized the coated W powder of graphene oxide and W/Epoxy compoundMethod, realize the propagation loss of sound wave between tungsten powder and graphene oxide, the thin-film material of preparing is between thickness 1-2mmCan absorb a large amount of sound waves.
4, by the content of W, Epoxy and GO in regulation and control W/Epoxy/GO/Epoxy complex thin film, can locate and prepareThe back lining materials of different impedances and pad value, can mate different piezo-electric crystals, prepares the ultrasonic transducer of different performance.
5, graphene oxide (GO) is introduced to traditional back lining materials system, by oversubscription attached bag is carried out in the surface of W powderCover, improve the uniformity of dispersion of materials and improve the sound absorbing capabilities of back lining materials, prepared under 10MHz frequency 6.42The middle impedance of MRayl, the height of 47.1 ± 3.8dB/cm*Hz decay back lining materials.
Brief description of the drawings
Fig. 1 contrasts photo before and after W/Epoxy powder adds the GO aqueous solution;
Fig. 2 is the dry front photo of W/Epoxy/GO solution;
Fig. 3 is the photo of wearing into 400 order powder after W/Epoxy/GO compound is dried;
Fig. 4 is the photo of W/Epoxy/GO/Epoxy complex thin film;
Fig. 5 is the low power optical photograph of W/Epoxy/GO/Epoxy complex thin film;
Fig. 6 is the high power optical photograph of W/Epoxy/GO/Epoxy complex thin film;
Fig. 7 is that the Graphene sound absorption laminated film using in the present invention is prepared scheme;
Fig. 8 is that the attenuation coefficient of 60%W/Epoxy%/3.5%GO/1%Epoxy complex thin film is with Epoxy parcel amountChange;
Fig. 9 is that the attenuation coefficient of W%/5%Epoxy/3.5%GO/1%Epoxy complex thin film is with the variation of W content;
Figure 10 is the impedance system that is respectively the film that obturator prepares with 99%W/1%Epoxy, 95%W/5%EpoxyNumber relatively;
Figure 11 is the decay system that is respectively the film that obturator prepares with 99%W/1%Epoxy, 95%W/5%EpoxyNumber relatively;
Figure 12 is the impedance factor of 95%GO/5%Epoxy complex thin film;
Figure 13 is the attenuation coefficient of 95%GO/5%Epoxy complex thin film.
Detailed description of the invention
Below in conjunction with embodiment, technical scheme of the present invention is further described, but is not limited to this, every rightTechnical solution of the present invention is modified or is equal to replacement, and does not depart from the spirit and scope of technical solution of the present invention, all should containCover in protection scope of the present invention. Embodiment mainly comprises W/Epoxy complex thin film, GO/Epoxy complex thin film, W/GO/Epoxy complex thin film, W/Epoxy/GO/Epoxy complex thin film.
Embodiment 1:
Contain the complex thin film of 60%W with the compound powder preparation of 95%W/5%Epoxy:
Epoxy is made up of EpoxyA glue and the EpoxyB glue of 3:1. Suppose that the W powder taking out is 3g, take out 0.118gEpoxyA glue adds in large capacity centrifuge tube, adds a small amount of ethanolic solution, agitation and dilution, then add 0.0394gEpoxyBGlue, continues to stir. After stirring, add 3gW powder, at 30 ~ 45 DEG C, continue to stir, make mixture solid after ethanol volatilization to the greatest extentChange. Solidfied material is taken out and ground through 400 order sub-sieve sievings, obtain the compound powder of 95%W/5%Epoxy. Weigh this powderQuality, is assumed to be Xg, X95%=Y60%, and Y is the actual quality of preparing film. Calculate (Y-X) 0.75, be and addThe quality of EpoxyA glue, (Y-X) 0.25 is the quality that adds EpoxyB glue, pours the compound powder of 95%W/5%Epoxy intoBody, stirs, and vacuumizes 5min and removes the bubble of sneaking into. Under field conditions (factors) solidify 4h, completely solidify after through sand paperingTo the thickness of 1 ~ 2mm.
Prepare thin as 20-70% of a series of W content taking 95%W/5%Epoxy compound powder as inserts with the methodFilm, prepares a series of W content taking 99%W/1%Epoxy compound powder as inserts film as 20-70%, acoustic impedance equallyWith acoustic attenuation and the contrast of pure W system, obtain Figure 10-11 effect. Can find out that the W powder wrapping up through Epoxy is in the identical feelings of W powder contentUnder condition, impedance promotes to some extent, and decay declines to some extent, and the film of preparing with W/Epoxy compound powder, the increasing of its W powder contentLittle on the impact of material fade performance greatly.
Embodiment 2:
Contain the film of 3%GO with the compound powder preparation of 95%GO/5%Epoxy:
The preparation of GO: 1. get the expansible graphite of 1 ~ 1.2g and the potassium nitrate of 1 ~ 1.2g mixes, put into beaker, andBeaker is placed in to ice bath, under the speed of 400 ~ 800r/min, slowly stirs, pour 20 ~ 25ml concentrated sulfuric acid into, stirring reaction 10 ~After 15min, slowly add 6 ~ 10g potassium permanganate, so far whole mixture stirs 0.5 ~ 4h in ice bath, continuous in whipping processAdd ice cube. 2. mixture is taken out from ice bath, be heated to 30 ~ 40 DEG C, continue stirring reaction 2 ~ 5h. 3. mixture is continuedBe heated to 85 ~ 100 DEG C, and keep 0.5 ~ 1.5h, get 50 ~ 100ml deionized water and dropwise splash in mixture, solution colour is by palm fibreBrown becomes glassy yellow; For neutralizing excessive potassium permanganate, add several 30% hydrogen peroxide until solution colour no longer change intoOnly. 4. continue to add 200 ~ 500ml deionized water dilute solution, suction filtration while hot, with 60 ~ 80 DEG C of deionized water washing suction filtration things,Suction filtration repeatedly, until pH value is greater than 6; 5. glassy yellow material suction filtration being gone out is dissolved in 200 ~ 500ml deionized water, is heated to 85~ 100 DEG C, stir and keep 0.5 ~ 1h, along with the increase solution colour of degree of oxidation is deepened. 6. solution ultrasonic 10 after taking out ~20min, then pour in 100 ~ 200 order sub-sieves and grind sieve sample, be GO by the faint yellow thick liquid of sieve aperture, remove unreactedExpanded graphite. For purification GO, by it again through 400 ~ 600 object sub-sieve sievings, by the pure clear viscous fluid of color and luster of sieve apertureBody is the GO after purification.
First, by the GO solution preparing drying and forming-film in 45 ~ 80 DEG C of vacuum drying chambers, grinding is pulverized, and divides through 400 ordersThe sieving of sample sieve, obtains GO powder. Suppose preparation 1g95%GO/5%Epoxy compound powder, take out 0.0375gEpoxyA glueAdd in large capacity centrifuge tube, add a small amount of ethanolic solution, agitation and dilution, then add 0.0125gEpoxyB glue, continue to stirMix. After stirring, add 0.95gGO powder, at 30 ~ 45 DEG C, continue to stir, mixture is solidified after ethanol volatilization to the greatest extent. WillSolidfied material takes out and grinds through 400 order sub-sieve sievings, obtains the compound powder of 95%GO/5%Epoxy. 4g is containing 3%GO in wish preparationFilm, weigh 43%/95%=0.126g95%GO/5%Epoxy compound powder, add (4-0.126) 0.75=2.906gEpoxyA glue, 0.969gEpoxyB glue, stirs, and vacuumizes 5min and removes the bubble of sneaking into. At natural barUnder part, solidify 4h, after solidifying completely through the thickness of sand papering to 1 ~ 2mm. According to the sound absorption effect under the different GO content in Figure 12-13Really, determine that best GO content is 3.5%.
Embodiment 3:
The preparation of 60%W/3.5%GO/1%Epoxy complex thin film: first take out the quantitative GO aqueous solution, bone dryAfter mass metering again, measure the concentration of the GO aqueous solution, actual concentrations hypothesis is decided to be 7mg/g. Get 3gW powder, put into (33.5)/(600.007) in=25gGO aqueous solution, stir, after oven dry, be rolled into powder, through 400 order sub-sieve sievings, obtain W/GO multipleCompound powder. The method of again powder being pressed to embodiment mono-obtains the powder of surface parcel 1%Epoxy, and weighing its quality is Xg.Want to be made into the thin-film material containing 60%W, (X60)/63.5=Y60%, the quality that wherein Y is film. Add (Y-X) 0.75EpoxyA glue and (Y-X) 0.25 EpoxyB glue, mix with W/GO/1%Epoxy compound powder, after stirring,Vacuumize 5min and remove the bubble of sneaking into, solidify under field conditions (factors) 4h, after solidifying completely through sand papering thick to 1mm ~ 2mmDegree.
Embodiment 4:
The preparation of 60%W/5%Epoxy/3.5%GO/1%Epoxy complex thin film: the W/ that first prepares W:Epoxy=60:5Epoxy compound, supposes to get 3gW powder, first gets the EpoxyA glue of (350.75)/60=0.188g in large capacity centrifuge tubeIn, add a small amount of ethanolic solution, agitation and dilution, then add 0.0625gEpoxyB glue, stir. At 30 ~ 45 DEG C, continueStir, mixture is solidified after ethanol volatilization to the greatest extent. Solidfied material is taken out and ground through 400 order sub-sieve sievings, obtain W/Epoxy multipleCompound powder, in this powder, the content of W is 60/65=92.31%. Take out GO solution with the proportioning of W:GO=60:3.5 again, by W/Epoxy compound powder stirs in GO solution, after being dried, is rolled into powder again, through 400 order sub-sieve sievings, obtains W/Epoxy/GO compound powder, is made as 2.5g, gets 0.01875gEpoxyA glue in large capacity centrifuge tube, adds a small amount of ethanolSolution, agitation and dilution, then add 0.00625gEpoxyB glue, stir. At 30 ~ 45 DEG C, continue to stir, make mixtureAfter ethanol volatilization to the greatest extent, solidify, solidfied material is taken out and ground through 400 order sub-sieve sievings. Now W/Epoxy/GO/Epoxy is compoundIn powder, the content of W is 87.59%, and establishing this compound is 2g, put in 0.69gEpoxyA and 0.23EpoxyB glue,Making W content is 60%, after stirring, vacuumizes 5min, solidifies under field conditions (factors) 4 ~ 6h, after solidifying completely, beats through sand paperBe milled to the thickness of 1 ~ 2mm.
Claims (10)
1. improve a method for back lining materials sound absorbing capabilities based on graphene oxide, it is characterized in that described method step asUnder:
One, the compound powder of preparation W/ epoxy resin:
Extracting epoxy resin A glue adds in centrifuge tube, adds a small amount of ethanolic solution, agitation and dilution, then add epoxy resin B glue,Continue to stir; After stirring, add W powder, at 30 ~ 60 DEG C, continue to stir, mixture is solidified after ethanol volatilization to the greatest extent; WillSolidfied material takes out and grinds through 400 ~ 600 order sub-sieve sievings, obtains W/ epoxy resin composite powder, and this powder is double-layer structure,At W powder outer wrapping epoxy resin layer, control W powder content and be 20 of W/ epoxy resin/GO/ epoxy resin composite film ~70wt.%, epoxy resin layer content is 1 ~ 10wt.% of W/ epoxy resin/GO/ epoxy resin composite film;
Two, preparation W/ epoxy resin/GO compound powder:
W/ epoxy resin composite powder is mixed in GO solution, after being dried, pulverize, through 400 ~ 600 order sub-sievesSieving, obtains W/ epoxy resin/GO compound powder, and this powder is three-decker, the W/ epoxy resin of preparing in step 1Compound powder outer wrapping GO layer, control GO layer content and be 1 of W/ epoxy resin/GO/ epoxy resin composite film ~10wt.%；
Three, preparation W/ epoxy resin/GO/ epoxy resin composite powder:
Extracting epoxy resin A glue adds in centrifuge tube, adds a small amount of ethanolic solution, agitation and dilution, then add epoxy resin B glue,Continue to stir; After stirring, add W/ epoxy resin/GO compound powder, at 30 ~ 60 DEG C, continue to stir, mixture is existedAfter ethanol volatilization to the greatest extent, solidify; Solidfied material is taken out and ground through 400 ~ 600 order sub-sieve sievings, obtain W/ epoxy resin/GO/ epoxy treeFat complexes powder, this powder is four-layer structure, W/ epoxy resin/GO compound powder outer wrapping ring of preparing in step 2Epoxy layer, control loop epoxy layer content is the 1wt.% of W/ epoxy resin/GO/ epoxy resin composite film;
Four, preparation W/ epoxy resin/GO/ epoxy resin composite film:
Extracting epoxy resin A glue adds in centrifuge tube, adds a small amount of ethanolic solution, agitation and dilution, then add epoxy resin B glue,Continue to stir; After stirring, add W/ epoxy resin/GO/ epoxy resin composite powder, after stirring, vacuumize 5-10min, solidifies 4 ~ 6h under field conditions (factors), after solidifying completely through the thickness of sand papering to 1 ~ 2mm, obtain W/ epoxy resin/GO/ epoxy resin composite film.
2. the method for improving back lining materials sound absorbing capabilities based on graphene oxide according to claim 1, is characterized in thatDescribed W powder content is the 60wt.% of W/ epoxy resin/GO/ epoxy resin composite film.
3. the method for improving back lining materials sound absorbing capabilities based on graphene oxide according to claim 1, is characterized in that WPowder content is the 45wt.% of W/ epoxy resin/GO/ epoxy resin composite film.
4. the method for improving back lining materials sound absorbing capabilities based on graphene oxide according to claim 1, is characterized in thatThe epoxy resin layer content of described W powder and GO interlayer is the 5wt.% of W/ epoxy resin/GO/ epoxy resin composite film.
5. the method for improving back lining materials sound absorbing capabilities based on graphene oxide according to claim 1, is characterized in thatDescribed GO layer content is the 3.5wt.% of W/ epoxy resin/GO/ epoxy resin composite film.
6. the method for improving back lining materials sound absorbing capabilities based on graphene oxide according to claim 1, is characterized in thatThe mass ratio of described epoxy resin A glue and epoxy resin B glue is 3:1.
7. improve a method for back lining materials sound absorbing capabilities based on graphene oxide, it is characterized in that described method step asUnder:
One, preparation W/GO compound powder:
W powder is mixed in GO solution, after being dried, pulverize, through 400 ~ 600 order sub-sieve sievings, obtain W/GO compoundPowder, this powder is double-layer structure, at W powder outer wrapping GO layer, controlling W powder content is W/GO/ epoxy resin composite film20 ~ 70wt.%, GO layer content is 1 ~ 10wt.% of W/GO/ epoxy resin composite film;
Two, preparation W/GO/ epoxy resin composite powder:
Extracting epoxy resin A glue adds in centrifuge tube, adds a small amount of ethanolic solution, agitation and dilution, then add epoxy resin B glue,Continue to stir; After stirring, add W/GO compound powder, at 30 ~ 60 DEG C, continue to stir, mixture is volatilized at ethanolTo the greatest extent, solidify; Solidfied material is taken out and ground through 400 ~ 600 order sub-sieve sievings, obtain W/GO/ epoxy resin composite powder, this powderBody is three-decker, the W/GO compound powder outer wrapping epoxy resin layer of preparing in step 1, and control loop epoxy layer containsAmount is the 1wt.% of W/GO/ epoxy resin composite film;
Three, preparation W/GO/ epoxy resin composite film:
Extracting epoxy resin A glue adds in centrifuge tube, adds a small amount of ethanolic solution, agitation and dilution, then add epoxy resin B glue,Continue to stir; After stirring, add W/GO/ epoxy resin composite powder, after stirring, vacuumize 5-10min, at oneselfSo under condition, solidify 4 ~ 6h, after solidifying completely, through the thickness of sand papering to 1 ~ 2mm, obtain W/GO/ epoxy resin composite thinFilm.
8. the method for improving back lining materials sound absorbing capabilities based on graphene oxide according to claim 7, is characterized in thatDescribed W powder content is the 60wt.% of W/GO/ epoxy resin composite film.
9. the method for improving back lining materials sound absorbing capabilities based on graphene oxide according to claim 7, is characterized in thatDescribed GO layer content is the 3.5wt.% of W/GO/ epoxy resin composite film.
10. the method for improving back lining materials sound absorbing capabilities based on graphene oxide according to claim 7, is characterized in thatThe mass ratio of described epoxy resin A glue and epoxy resin B glue is 3:1.
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