CN104037493A - Multilayer multi-turn structure for high-efficiency wireless communication - Google Patents

Abstract

The invention provides a multilayer multi-turn structure for high-efficiency wireless communication. The structure for the wireless communication comprises multiple conductor layers, an insulator layer separating each conductor layer from another, and at least one connector for connecting two conductor layers in the conductor layers. When electric signals are induced in a resonator at a predetermined frequency, the resistance is reduced.

Description

For the multilayer multi-turn structure of efficient wireless communication

Technical field

This theme relates generally to design, operates and manufacture method, system and the equipment of wireless power and/or data transmission and/or communication system, and more specifically, relate to design, operate and manufacture the efficient configuration near field wireless power and/or data transmission and/or communication system.

Background technology

In recent years, adopt near field wireless power and/or data to send and/or the application of communication system (as, business electronic, medical system, military system, high frequency transformer, the microelectronics that comprises nanoscale power and/or data transmission or its MEMS (micro electro mechanical system) (MEMS), industry, science, medical treatment (ISM) frequency band receiver, wireless sensor etc.) aspect acquisition Optimal performance, be restricted, because the antenna using in these systems has relatively low quality factor.

The high electrical resistance loss that the relatively low quality factor of these wireless transmissions and/or communication system cause mainly due to the phenomenon that is called as " skin effect ".Conventionally, skin effect is the trend that alternating current (AC) distributes in conductor, and current density is played a leading role near conductive surface, and all the other electric conductors ' do not use ' with respect to electric current.Because current density is typically with decaying with conductive surface distance apart, all the other electric conductors ' do not use ' with respect to electric current.Electric current almost flows near surface entirely, is called as " skin becomes " of " conductor ".The degree of depth on current distance surface is called as " skin depth "." skin depth " defined send and/or communication in active electrical signal conduction path, and conductor be defined as can conducting electrical signals main body.

In the system that adopts wireless power and/or data to send and/or to communicate by letter, skin effect phenomenon causes energy loss conventionally in the time that electric current flows through antenna lead (wire) and circuit.Most of electronic equipments or the right problem of device surface in the high electrical resistance loss of high frequency.Skin effect becomes more general in the time that operating frequency improves.Along with frequency gets higher, the electric current of the whole cross section of the lead-in wire of this antenna of formation of conventionally flowing through becomes and is confined to its surface.As a result, the effective resistance of lead-in wire is with similar compared with the effective resistance of ligament, instead of similar with can the distribute effective resistance of lead-in wire of actual diameter of process of electric current.The lead-in wire that shows tolerable resistance at low frequency for effective performance changes the lead-in wire with unacceptable resistance at high frequency.Power and/or data that transformation from tolerable resistance to unacceptable resistance is transformed to poor efficiency send and/or communication system, cannot conduct the needed signal of telecommunication in application-specific.Therefore, current Antenna Design cannot solve these inefficiencies, in some cases, has aggravated wireless power and/or data and has sent and/or communication system inefficiencies.Although be not exhaustive, the typical case application that is subject to the restriction of current antenna technology comprise such as radio-frequency (RF) identification (RFID), battery charging and recharge, telemetry, sensing, communicate by letter, asset tracking, patient monitoring, data input and/or retrieval etc.These system components are overheated, speed, the transmission range constraint of the speed of data retrieval and precision, energy transmission and send misalignment restriction be wireless power and/or data send and/or communications applications in other Tough questions.

The application of implantable medical equipment (IMD) (as, pacemaker, defibrillator, nerve regulation or neuromuscular stimulation equipment) in, the expectation minimization battery recharge time.For example, the battery recharge time has been reduced patient's discomfort, the duration of inconvenience and injured possibility faster.If antenna has less resistance loss, can be from a distance of farther distance, and realize battery recharge with the misalignment to antenna or the higher tolerance of getting lost in the situation that not damaging performance.Knownly be difficult to realize accurate pointing and aligning, especially for fat patient.In addition and/or alternatively, if can be in keeping successful system operation desired properties characteristic design the actual structure of manufacturing smaller szie, can reduce the overall dimensions of IMD.

Apply at RFID (as, supply chain management, product certification and asset tracking) in, need to increase read range, improve reading rate, improve system reliability and also improve system accuracy.For example, at high frequency, read range is at most three feet, and this is generally inadequate for tray is followed the tracks of.Hyperfrequency reader has been realized the larger distance that reads of eight to ten feet, but they have introduced other performance issues, as metallic reflection or water absorption signal or show not readable, at the blind spot reading in field.The read range increasing needs concentration power to promote to be reflected back signal to obtain better performance, thereby more effective structure can contribute to address these problems.

In the application of (need to keep resonance under exacting terms) of the effective low-loss coil of needs, can there is deformation in traditional antenna based on lead-in wire.Be well known that, any deformation of lead-in wire cross section will cause the change of inductance and possible resistance, then will change the resonance frequency of antenna, and thereby can increase the resistance of whole system.Improved manufacture reduces the method for the structure of these types of the possibility that jeopardizes deformation can eliminate this problem.This instruction comprises that manufacture comprises that fine structure design and fixing flexible structure design the method for the two.

In the cut-and-try process addressing the above problem, partly develop twisted wire (Litz wire).But twisted wire is generally not enough to for frequency applications, thereby in the application with the above operating frequency of about 3MHz, not generally of great use.Twisted wire is the lead-in wire that comprises the multiple independent insulation magnetic lead-in wire that is wound around or is woven into unified pattern, makes per share lead-in wire be easy to occupy all possible positions in the cross section of whole conductor.This multiply configuration or twisted configuration are designed to minimize the power loss showing in the solid conductor causing due to " skin effect ".Twisted wire structure is attempted not enlarge markedly conductor size by the amount of increase surface area and is offset this effect.But, even if compatibly construct, because the restriction that is twisted into thigh causes twisted wire still to show some skin effects.Be intended to generally need for the lead-in wire of lower frequency range the thigh of more fine gauge sizes, instead of same cross-sectional area but comprise the twisted wire of less and larger strand.It is about 3MHz that the provider of twisted wire provides the highest frequency of the configuration that can raise the efficiency.Do not exist at present for operating frequency in the maximum solution of application more than limit frequently of this 3MHz.

Thereby, need improved efficient Antenna Design and reduce the intrinsic resistance loss of structure, especially reduce structure at high frequency intrinsic resistance loss to realize the manufacture method of high quality factor.

Summary of the invention

The instruction is here amassed by the electric guide face that utilizes multilayer lead-in wire concept to increase in structure, has alleviated one or more the problems referred to above of the high electrical resistance loss at high frequency that causes more low-quality factor.Multilayer lead-line configuration has caused reducing and the raising of the quality factor of structure of conductor losses.This instruction is applied to wireless transmission and/or the communication for near-field energy transmission, power transmission, data transmission or its combination.More specifically, this instruction is applied to for the wireless transmission of near-field energy network, power network or data network (comprising arbitrary and whole combination of these networks) and/or communicates by letter.

Wireless energy transfer or wireless power send without interconnecting line, electric energy from power source to electric loading and send.For the wireless transmission of energy, power or data, efficiency is important parameter, because transmitted signal must arrive one or more receivers to realize system applies.The wireless transmission of the most common form that relates to energy, power or data transmission is carried out in the direct induction of following with resonance magnetic induction.The additive method of considering at present comprises electromagnetic radiation, such as but not limited to microwave or laser.

In addition, wireless energy reception or wireless power receive without interconnecting line, receive electric flux from power source.For the wireless receiving of energy, power or data, efficiency is important parameter, because the reception of signal must receive to realize system applies from one or more transmitters.Like this, can and there is microwave or the wireless receiving of the form that comprises energy, power or data is carried out in the electromagnetic radiation of laser form with direct induction, resonance magnetic induction.

In addition, embodiments of the invention can carry out without lead-in wire the radio communication of electric energy, electrical power and/or data.Radio communication comprises synchronously or independently transmission and/or the reception of electric energy, electrical power and/or data.

The one side of this instruction is a kind of resonator for wireless power and/or data transmission or reception, wherein by the useful conductor cross sectional area in lead-in wire cross section is maximized the minimum resistive losses in resonator.In one embodiment, resonator, by introduce non-conduction dielectric layer in its lead-in wire, to produce the structure that comprises that conduction (conducting) material layer and non-conductive material layer replace, reduces unnecessary high frequency skin effect.Described structure provides the surface that increases quantity effectively, and each surface has its feature skin depth, and all surface electrical connection.The scope of skin depth can be from the approximate half of the conductor degree of depth to approximating greatly the conductor degree of depth.The scope of the conductor degree of depth can be the twice of skin depth to skin depth.But, depending on available techniques, cost and application, the conductor degree of depth can be 20 times or more times of skin depth.

Resonator comprises the coil with at least one circle, and its coil is made up of multilayer lead-in wire.Multilayer lead-in wire can comprise the first and second conductive layers by layers of insulating material separate.Conduction (conductive) layer can have essentially identical thickness and/or the degree of depth, and the scope of wherein said thickness and/or the degree of depth can be the twice from skin depth to skin depth.But, depending on available techniques, cost and application, conductor thickness and/or the degree of depth can be 20 times or more times of skin depth.Each conductive layer can use at least one interconnecting method (such as but not limited to hole, scolder, joint, lead-in wire, pin or rivet) to be electrically connected to each other.

An object of non-conducting shell is to make two different conducting shell insulation.The Basic Design of non-conducting shell is in the ideal case and actual allow equally thin of manufacture process, but still enough insulation characterisitics is provided.For example, in PCB technology, carry out the thickness of marker by " core thickness " and " prepreg thickness ".In another design, select the thickness of non-conducting shell to revise the electric behavior of structure.

Resonator can have the quality factor that are greater than 100.Preferably, quality factor are greater than 300.More preferably, quality factor are greater than 600.Those skilled in the art will it is evident that, need the system of two resonators can have the resonator that has equal and even similar quality factor.In addition, those skilled in the art will it is evident that, need the system of two resonators can utilize such resonator, and one of them resonator has the basic quality factor different from another resonator.The quality factor of each resonator are selected to depend on that the design specification of application, each resonator and the purpose of each resonator are used.Will be understood that, the system utilization of traditional inductance coupling high has the resonator of quality factor about 30.In addition, those skilled in the art will it is evident that, the quality factor of resonator can depend on used environment, thereby the resonator for example in air with quality factor 100 may only have 50 quality factor in the time implanting the mankind or animal tissue.In any given environment, MLMT structure described herein should be better than traditional resonator.

Thereby, the internal resistance that the reduction resonator of loss in lead-in wire significantly reduces can be realized efficiently, compact wireless system spreading range, that consume energy still less, have long running time more and simplify the operation, and can not produce the hazardous events such as overheated.

In one example, a kind of structure for wireless transmission or wireless receiving is disclosed.Described structure is designed to wireless transmission and/or receives electric flux, electromagnetic energy and/or electrical power.In addition, described structure can realize electronic data transmission.In addition, described structure can send and/or receive or send discretely and/or receive the combination of electric flux, electromagnetic energy, electrical power and electronic data together.

Described structure can comprise: multiple conductor layers; Separate the insulator layer of each conductor layer; And connect at least one connectors of two or more conductor layers.Each in multiple conductor layers can have at least one circle, and can be with parallel towards placement.Can form each conductor layer by conduction (electrically conductive) material.Electric conducting material can comprise copper, titanium, platinum and platinum/iridium alloy, tantalum, niobium, zirconium, hafnium, Nitinol (nitinol), Co-Cr-Ni alloy, stainless steel, gold, billon, palladium, carbon, silver, noble metal or biocompatible material and combination in any thereof.Conductor layer can have the shape of cross section such as but not limited to circular cross section, rectangular cross section, square cross section, triangular cross section or oval cross section.The connector of bonding conductor layer can be but be not limited to hole, scolder, joint, lead-in wire, pin or rivet.

Described structure can have the planform such as but not limited to the tubular configuration of circular helical, the tubular configuration of square helical, the configuration of round screw thread shape, the configuration of square spiral shape, rectangular arrangement, triangular arrangement, the tubular configuration of round screw thread-helical, the tubular configuration of square spiral-helical and the tubular configuration of conformal helical.Other configurations can be for revising the electrical characteristics of this structure.

When signal induced electricity, can reduce the resistance in structure in resonator in a frequency.Can in the frequency range from about 100kHz to 10GHz, select this frequency.In addition, this frequency can be frequency band from about 100kHz to about 10GHz or at about 1MHz in the scope of about 10GHz.The signal of telecommunication can be electric current, voltage, digital data signal or its combination in any.

In another example, disclose a kind of structure for radio communication, having comprised: multiple conductor layers; Separate the insulator layer of each conductor layer; And connect at least one connectors of two or more conductor layers, and making when be in this structure signal induced electricity in a frequency, resistance is diminishbb.Conductor layer can comprise at least one in conductive strips, bus and plated metal.In some instances, can in the frequency range from about 100kHz to about 3MHz, select described frequency.In other examples, described frequency can be to arrive the frequency band in the scope of about 3MHz at about 100kHz.In another example, can in the frequency range from about 3MHz to about 10GHz, select described frequency.In another example, described frequency can be to arrive the frequency range in the scope of about 10GHz at about 3MHz.

Each in multiple conductor layers can have parallel towards.The number of multiple conductor layers can be less than or equal to the sum of layer, and can in parallel be electrically connected.Multiple conductor layers of electrical connection in parallel can be electrically connected in series with the one or more conductor layers in more than second conductor layer being connected in parallel.The signal of telecommunication can comprise at least one in energy signal, power signal and data-signal.The signal of telecommunication can comprise at least one in electric current, voltage or digital data signal.Described structure can have the quality factor that are greater than 100.Described structure also comprises the circuit element of selecting the group from comprising resistor, inductor and capacitor.Conductor layer can comprise shape of cross section, and wherein said shape of cross section comprises at least one in circular cross section, rectangular cross section, square cross section, triangular cross section or oval cross section.Described connector can comprise at least one in hole, scolder, joint, lead-in wire, pin, rivet etc.

Described structure can have planform, and described planform can comprise at least one in the tubular configuration of circular helical, the tubular configuration of square helical, the configuration of round screw thread shape, the configuration of square spiral shape, rectangular arrangement, triangular arrangement, the tubular configuration of round screw thread-helical, the tubular configuration of square spiral-helical and the tubular configuration of conformal helical.Described multiple conductor layer can have at least one circle.Can form at least one conductor layer by electric conducting material, electric conducting material comprises at least one in copper, titanium, platinum and platinum/iridium alloy, tantalum, niobium, zirconium, hafnium, Nitinol, Co-Cr-Ni alloy, stainless steel, gold, billon, palladium, carbon, silver, noble metal and biocompatible material.Form at least one insulator layer by electrical insulating material, electrical insulating material comprises air, foamed polystyrene, silicon dioxide, applicable bio-compatible pottery or has any similar dielectric of low-k, has at least one in non-conductive dielectric and the Ferrite Material of high-k.Described structure can be included in there is resonator, at least one equipment and Medical Devices in antenna, RFID label, RFID transponder.

In another example, a kind of resonator for wireless transmission or wireless receiving is disclosed.Described resonator is designed to wireless transmission and/or receives electric flux, electromagnetic energy and electrical power.In addition, described resonator can be realized transmission or the reception of electronic data.In addition, described resonator can send and/or receive or send discretely and/or receive the combination of electric flux, electromagnetic energy, electrical power and electronic data together.

Described resonator can comprise multiple conductors, and each conductor has conductor length, conductor height, the conductor degree of depth and has the conductive surface of skin depth.The scope of skin depth can be from the approximate half of the conductor degree of depth to approximating greatly the conductor degree of depth.The scope of the conductor degree of depth can be the twice of skin depth to skin depth.But, depending on available techniques, cost and application, the conductor degree of depth can be 20 times or more times of skin depth.Multiple conductor layers can have at least one circle.In addition, each in multiple conductor layers can have or can not have essentially identical conductor length, conductor height or the conductor degree of depth.Can form conductor layer by electric conducting material.Electric conducting material can comprise copper, titanium, platinum and platinum/iridium alloy, tantalum, niobium, zirconium, hafnium, Nitinol, Co-Cr-Ni alloy, stainless steel, gold, billon, palladium, carbon, silver, noble metal or biocompatible material and combination in any thereof.

Multiple conductors can be arranged to formation resonator body.Resonator body can have resonator body length, the resonator body width resonator main body degree of depth.When by resonator body signal induced electricity, propagation of electrical signals is by having the conduction surfaces of skin depth.The signal of telecommunication can be electric current, voltage, digital data signal or its combination in any.

Multiple conductors in resonator can comprise the first conductor layer and the second conductor layer that separate by insulator layer, and wherein the first conductor layer is connected with the second conductor layer or more conductor layers by least one connector.Conductor can have the shape of cross section such as but not limited to circular cross section, rectangular cross section, square cross section, triangular cross section or oval cross section.Described resonator can have the planform such as but not limited to the tubular configuration of tubular, the square helical of circular helical, the configuration of round screw thread shape, the configuration of square spiral shape, rectangular arrangement, triangular arrangement, the tubular configuration of round screw thread-helical, the tubular configuration of square spiral-helical or the tubular configuration of conformal helical.

At least one at least one comprised conductive strips, bus and plated metal in multiple conductor layers.The signal of telecommunication can comprise at least one in energy signal, power signal and data-signal.The signal of telecommunication can also be at least one in electric current, voltage or digital data signal.Described resonator has about 100 quality factor.Form at least one insulator layer by electrical insulating material, electrical insulating material includes but not limited to air, foamed polystyrene, silicon dioxide, applicable bio-compatible pottery or has any similar dielectric of low-k, has at least one in non-conductive dielectric and the Ferrite Material of high-k.

By using the resonator body of at least one frequency, can signal induced electricity.In some instances, can in the frequency range from about 100kHz to about 3MHz, select described frequency.In other examples, described frequency can be to arrive the frequency band in the scope of about 3MHz at about 100kHz.In another example, can in the frequency range from about 3MHz to about 10GHz, select described frequency.In another example, described frequency can be to arrive the frequency range in the scope of about 10GHz at about 3MHz.In another example, can in the frequency range from about 100kHz to about 10GHz, select described frequency.In another example, described frequency can be to arrive the frequency band in the scope of about 10GHZ at about 100kHz.Described resonator also comprises the circuit element of selecting the group from comprising resistor, inductor and capacitor, and can be included in there is resonator, at least one equipment and Medical Devices in antenna, RFID label, RFID transponder.

A kind of circuit for wireless transmission or wireless receiving is also disclosed.Described circuit is designed to wireless transmission and/or receives electric flux, electromagnetic energy and/or electrical power.In addition, described circuit can be realized the transmission of electronic data.In addition, described circuit can send and/or receive or send discretely and/or receive the combination of electric flux, electromagnetic energy, electrical power and electronic data together.

Circuit in high frequency uses passive component widely, as inductor, capacitor etc.Some examples of sort circuit configuration include but not limited to that band is logical, high pass and low pass filter; Mixer (for example, Gilbert unit); Oscillator such as Colpitts, Pierce, Hartley and Clap; And amplifier such as difference, push-and-pull, feedback and radio frequency (RF).Particularly, inductor is used for coupling and the feedback of LNA electrical equipment (LNA) as source negative feedback component.Lumped inductance device is also the key element in RF circuit and monolithic integrated microwave circuit (MMIC).Lumped inductance device is for matching network on sheet, and wherein transmission line structure can have excessive length.Conventionally, they allow bias current to offer circuit, simultaneously at RF frequency and the above broadband high impedance that provides also as RF choke.That desirable RF mems switch, matching network and variable capacitance diode also needs high Q inductor for reconfigurable network, antenna and subsystem.Note, passive electric circuit element and the lamped element such as lumped inductance device can exchange use, and passive electric circuit element is the term of broad sense more.Passive electric circuit element can be inductor, capacitor, resistor, or just lead-in wire of passive electric circuit element.In nearly all above-mentioned non-limiting examples of circuits, expect that passive block is lowest loss.

Suppose that the circuit in high frequency exceedingly uses the passive component such as inductor and capacitor, provides the embodiment of inductor, but is not limited to this.Particularly, consider inductor, design should make to obtain maximum Q, obtains the inductance value of expecting simultaneously.In other words, need to minimize the resistance loss in inductor.Depend on usable area, application and technology on operating frequency, substrate, inductor can be implemented as TEM/ transmission line, conducting ring or multiple shape (such as but not limited to, circle, rectangle, ellipse, square or irregular configuration) spirality/helical tubular/combining structure, but be not limited to this.Can realize all these non-limiting examples with the sandwich construction in the present invention.

In another example, resonator is discussed, as a part for larger circuit.Resonator is to show device or the system of resonance (, vibration) in one or more characteristic frequency or one or more frequency band (being called resonance frequency).At one or more resonance frequencys or one or more frequency bands place, there is the minimum impedance of vibration.In the context of circuit, exist minimum resistance anti-in one or more resonance frequencys or one or more frequency bands place.MLMT structure of the present invention can be used as resonator under two primary conditions: (1) is when designing MLMT structure in the environment at it without any additional electronic components when at one or more characteristic frequency or one or more frequency bands place resonance; (2) when its in conjunction with other assemblies (such as but not limited to, capacitor, capacitor group, capacitor and/or inductor network) environment in design MLMT structure with when one or more characteristic frequency or the one or more frequency bands place resonance.Therefore, resonator can be a part for larger circuit, and resonator behavior can be designed as at one or more frequencies or one or more frequency band or has one or more frequencies of one or more specific bandwidth or one or more frequency bands place occurs.Also can add add-on assemble (for example, resistance) to change bandwidth.

A kind of system for wireless transmission or wireless receiving is also disclosed.Described system is designed to wireless transmission and/or receives electric flux, electromagnetic energy and electrical power.In addition, described system can realize the transmission of electronic data.In addition, described system can send or send discretely the combination of electric flux, electromagnetic energy, electrical power and electronic data together.

Described system can comprise: the first resonator, and described the first resonator comprises multiple the first conductors, each the first conductor has the first conductor length, the first conductor height, the first conductor degree of depth and has the first conductive surface of the first skin depth.Multiple the first conductors can be arranged to form there is the first resonator body length, the first resonator body of the first resonator body width and the first resonator body degree of depth.Described system can also comprise the second resonator, and described the second resonator comprises multiple the second conductors, and each the second conductor has the second conductor length, the second conductor height, the second conductor degree of depth and has the second conductive surface of the second skin depth.Multiple the second conductors can be arranged to form there is the second resonator body length, the second resonator body of the second resonator body width and the second resonator body degree of depth.The first skin depth and the second skin depth can be that the approximate half of the conductor degree of depth is to approximating greatly the conductor degree of depth.The first and second conductors can have at least one circle, and each in multiple the first and second conductor layers can have or can not have essentially identical conductor length, conductor height or the conductor degree of depth.The scope of the first conductor degree of depth and the second conductor degree of depth can be the twice of skin depth to skin depth.But, depending on available techniques, cost and application, the first conductor degree of depth and the second conductor degree of depth can be 20 times or more times of skin depth.Can form the first and second conductor layers by electric conducting material, electric conducting material is such as but not limited to copper, titanium, platinum and platinum/iridium alloy, tantalum, niobium, zirconium, hafnium, Nitinol, Co-Cr-Ni alloy, stainless steel, gold, billon, palladium, carbon, silver, noble metal or biocompatible material and combination in any thereof.

In the time that propagation of electrical signals is passed through the first resonator body, propagation of electrical signals, by having the first conduction surfaces of skin depth, is also inducted by the signal of telecommunication of the second resonator body.The signal of telecommunication of inducting propagates through the second conduction surfaces in skin depth.The signal of telecommunication can be electric current, voltage and digital data signal or its combination.

Multiple the first conductors can comprise the first conductor layer and the second conductor layer that separate by insulating barrier, and wherein the first conductor layer is connected with the second conductor layer or more conductor layers by least one connector.The connector of bonding conductor layer can be such as but not limited to hole, scolder, joint, lead-in wire, pin or rivet.The first conductor can have the first shape of cross section, and the second conductor can have the second shape of cross section.The first and second shape of cross sections are nonrestrictive, and can be one of circular cross section, rectangular cross section, square cross section, triangular cross section or oval cross section.

The first resonator can have the first planform, and the second resonator can have the second planform.The first and second planforms are nonrestrictive, and can be the tubular configuration of circular helical, the tubular configuration of square helical, the configuration of round screw thread shape, the configuration of square spiral shape, rectangular arrangement, triangular arrangement, the tubular configuration of round screw thread-helical, the tubular configuration of square spiral-helical or the tubular configuration of conformal helical.

In addition, the method for a kind of manufacture for the structure of wireless transmission or wireless receiving disclosed.For the manufacture of described method create can wireless transmission and/or receive the structure of electric flux, electromagnetic energy and electrical power.In addition the structure producing, can realize transmission or the reception of electronic data.In addition the structure producing, can send and/or receive or send discretely and/or receive the combination of electric flux, electromagnetic energy, electrical power and electronic data together.

Described method can comprise step: create multiple conductor layers, between each conductor layer, have insulator; And form at least one connection between two conductor layers of multiple conductor layers.The connector of bonding conductor layer can be hole, scolder, joint, lead-in wire, pin or rivet, but is not limited to this.Can create conductor layer by the deposition through mask.Create multiple conductor layers and can also comprise the following steps in the step between each conductor layer with insulator: on the second conductive layer, placing the first conductive layer, and utilize the first insulator by the first conductive layer and the second conductive layers apart.In addition the step that, forms at least one connection between two conductors in multiple conductors can comprise the following steps: at least two conductor layers in bonding conductor layer, include but not limited to hole, scolder, joint, lead-in wire, pin or rivet.Can form conductor layer by electric conducting material.Electric conducting material can comprise copper, titanium, platinum and platinum/iridium alloy, tantalum, niobium, zirconium, hafnium, Nitinol, Co-Cr-Ni alloy, stainless steel, gold, billon, palladium, carbon, silver, noble metal or biocompatible material and combination in any thereof.

Also disclose a kind of for operating structure so that the method for wireless transmission or wireless receiving to be provided.Said method comprising the steps of: providing can wireless transmission and/or the structure of wireless receiving electric flux, electromagnetic energy and/or electrical power.In addition, described method provides following steps: provide and can realize the structure that electronic data sends or receives.In addition, described method provides following steps: the structure that can send together and/or receive or send discretely and/or receive the combination of electric flux, electromagnetic energy, electrical power and electronic data is provided.

Said method comprising the steps of: multiple conductors are provided, and each conductor has conductor length, conductor height, the conductor degree of depth and has the conductive surface of skin depth.In addition, described method comprises step: provide scope in the approximate half of the conductor degree of depth to the skin depth approximating greatly in the conductor degree of depth.The scope of the conductor degree of depth is the twice of skin depth to skin depth.But, depending on available techniques, cost and application, the conductor degree of depth can be 20 times or more times of skin depth.Multiple conductor layers can be arranged to formation resonator body, and described resonator body has resonator body length, the resonator body width resonator main body degree of depth; And at least one of multiple conductors signal induced electricity, the conduction surfaces that makes the signal of telecommunication pass through skin depth is propagated.The signal of telecommunication can be electric current, voltage, digital data signal or its combination in any.

Described method can also comprise the following steps: more than second conductor is provided, each the second conductor has the second conductor length, the second conductor height, the second conductor degree of depth and has the second conductive surface of the second skin depth, wherein multiple the second conductors are arranged to form the second resonator body, and described the second resonator body has the second resonator body length, the second resonator body width and the second resonator body degree of depth.In the time that the signal of telecommunication is propagated by resonator body, propagation of electrical signals, by the conduction surfaces of skin depth, is also inducted by the signal of telecommunication of the second resonator body, and signal induced electricity propagates through the second conduction surfaces with the second skin depth.

Multiple conductors can comprise the first conductor layer and the second conductor layer that separate by insulator layer, and wherein the first conductor layer is connected with the second conductor layer by least one connector.In addition, at least one connection of at least two conductor layers in bonding conductor layer includes but not limited to hole, scolder, joint, lead-in wire, pin or rivet.Conductor can have the shape of cross section that is not limited to circular cross section, rectangular cross section, square cross section, triangular cross section and oval cross section.Multiple conductor layers can have at least one circle, and each in multiple conductor layers can have or can not have essentially identical conductor length, conductor height and the conductor degree of depth.Can form conductor layer by electric conducting material.Electric conducting material can comprise copper, titanium, platinum and platinum/iridium alloy, tantalum, niobium, zirconium, hafnium, Nitinol, Co-Cr-Ni alloy, stainless steel, gold, billon, palladium, carbon, silver, noble metal or biocompatible material or its combination in any.

Resonator can have the planform that is not limited to the tubular configuration of circular helical, the tubular configuration of square helical, the configuration of round screw thread shape, the configuration of square spiral shape, rectangular arrangement, triangular arrangement, the tubular configuration of round screw thread-helical, the tubular configuration of square spiral-helical or the tubular configuration of conformal helical.To partly propose in the following description other advantages and new feature, its part will it will be apparent to those skilled in the art that and can know by the generation of example or operation in the time checking following content and accompanying drawing.Can be by putting into practice or using the various aspects of the method, means and the combination that propose in detailed example discussed below to realize and obtain the advantage of this instruction.

Brief description of the drawings

Accompanying drawing has been described according to the one or more execution modes that are only not intended to this instruction of restriction as example.In the accompanying drawings, similarly reference number is indicated same or similar element.

Fig. 1 shows by the AC CURRENT DISTRIBUTION of the stable state unidirectional current of homogeneity conductor;

Fig. 2 shows the AC CURRENT DISTRIBUTION at the frequency place of improving causing due to skin effect;

Fig. 3 is the diagram of skin depth relative frequency;

Fig. 4 shows the high level illustration of the structure of transmitting for wireless power;

Fig. 5 A shows the example of the antenna in the tubular configuration of circular helical;

Fig. 5 B shows the example of the antenna in the tubular configuration of square helical;

Fig. 5 C shows the example of the antenna in the configuration of round screw thread shape;

Fig. 5 D shows the example of the antenna in the configuration of square spiral shape;

Fig. 5 E shows the example of the antenna in the configuration of multilayer square spiral shape;

Fig. 5 F shows the example of the antenna in the tubular configuration of round screw thread-helical;

Fig. 5 G shows the example of the antenna in the tubular configuration of square spiral-helical;

Fig. 5 H shows the example of the antenna in the tubular configuration of conformal helical;

Fig. 6 A shows the example of the single turn circular coil with N layer;

Fig. 6 B shows the example of the two circle round screw thread-helical tubular coil of N layer;

Fig. 7 A shows the example of the antenna with circular cross section;

Fig. 7 B shows the example of the antenna with rectangular cross section;

Fig. 7 C shows the example of the antenna with square cross section;

Fig. 7 D shows the example of the antenna with triangular cross section;

Fig. 7 E shows the example of the antenna with oval cross section;

Fig. 7 F shows the rectangular cross section of antenna;

Fig. 8 A shows the stacked antenna with circular cross section;

Fig. 8 B shows the stacked antenna with rectangular cross section;

Fig. 9 A shows the single turn antenna with 1 layer;

Fig. 9 B shows the single turn antenna with 11 layers;

Fig. 9 C shows the single turn antenna with 20 layers;

Fig. 9 D shows the single turn antenna with 26 layers;

Figure 10 shows the diagram with the figure of merit value of frequency change;

Figure 11 A shows resistance and the inductance diagram with the relative changes of the number of plies;

Figure 11 B shows the diagram for the given number of plies, the quality factor that produce at 10MHz;

Figure 12 A shows the diagram with the quality factor of frequency change;

Figure 12 B shows the diagram with the inductance about 16 layer line circles of frequency change;

Figure 12 C shows the diagram with the resistance about 16 layer line circles of frequency change;

Figure 13 A shows the diagram with the quality factor of frequency change;

Figure 13 B shows the diagram with the inductance of frequency change;

Figure 13 C shows the diagram with the resistance of frequency change;

Figure 14 A shows the diagram with the quality factor of the coil with 1mm metal band width of frequency change;

Figure 14 B shows the diagram of the relative increase of the quality factor of the coil with 1.5mm metal width;

Figure 14 C shows the diagram of the relative increase of the quality factor of the coil with 2mm metal width;

Figure 15 shows the high level block diagram of near-field energy network;

Figure 16 A shows receiving element and transmitting element and has the diagram of identical resonance frequency and the narrow situation of wave band;

Figure 16 B shows receiving element and transmitting element and has the diagram of different resonance frequencys and the narrow situation of wave band;

Figure 16 C shows the diagram that receiving element and transmitting element have different resonance frequencys and have the situation of wide resonance;

Figure 16 D shows receiving element and transmitting element and has the diagram of the situation that different resonance frequencys and transmitting apparatus damage;

Figure 16 E shows receiving element and transmitting element and has the diagram of the situation that the resonance frequency of wide apart and transmitting element and receiving element all damage;

Figure 16 F shows receiving element and transmitting element and has the diagram of the situation that approaching resonance frequency and transmitting element and receiving element all damage;

Figure 17 shows the high level block diagram of the near-field energy network with repeater;

It is stacked that Figure 18 shows typical PCB;

Figure 19 is the stacked table of making of 6 layers of pcb board obtaining from established PCB manufacturer;

Figure 20 shows the equivalent circuit diagram of any MLMT structure;

Figure 21 shows the equivalent circuit diagram as the MLMT structure of inductor operation (condition 1);

Figure 22 A shows the equivalent circuit diagram as the MLMT structure of the self-resonance device operation (Class1) in circuit;

Figure 22 B shows the equivalent circuit diagram as the MLMT structure of independent self-resonance device operation (Class1);

Figure 23 A shows equivalent circuit diagram MLMT structure, that show series capacitor interpolation;

Figure 23 B shows equivalent circuit diagram MLMT structure, that show shunt capacitor interpolation;

Figure 24 A shows the equivalent circuit diagram as the MLMT structure of the resonator operation in circuit, wherein realizes resonance by adding shunt capacitor;

Figure 24 B shows the equivalent circuit diagram as the MLMT structure of independent resonator operation, wherein realizes resonance by adding series capacitor to circuit;

Figure 24 C shows the equivalent circuit diagram as the MLMT structure of independent resonator operation, wherein realizes resonance by adding shunt capacitor to circuit.

Embodiment

In the following description, by example, various specific detail are proposed, so that the thorough understanding to relevant teachings to be provided.But, it will be apparent to one skilled in the art that and can put into practice this instruction without these details.In other examples, with relatively high-rise and without its details known method, process, assembly and/or circuit have been described, to avoid the unnecessarily each side of fuzzy instruction.

Various technology disclosed herein relates generally to design, operates and manufacture method, system and the equipment of wireless transmission and/or wireless receiving system, and more specifically, relate to design, operate and manufacture the efficient configuration near field wireless power and/or data transmission and/or communication system.

Wireless transmission can comprise the wireless transmission of electric flux, electromagnetic energy and electrical power, for example embodiment.In addition, wireless transmission can comprise the transmission of numerical data and information.In another embodiment, can send together or send discretely the combination of electric flux, electromagnetic energy, electrical power, electronic data and information, as the embodiment discussing in energy network.Also anticipation, this wireless transmission can occur simultaneously or occur on the period in the time interval.The embodiment of the wireless transmission of following part discussion in energy network, power network, data network and near field power and data-transmission system.

Wireless receiving can comprise the wireless receiving of electric flux, electromagnetic energy and electrical power, for example embodiment.In addition, wireless receiving can comprise the reception of numerical data and information.In another embodiment, can receive together or receive discretely the combination of electric flux, electromagnetic energy, electrical power, electronic data and information, as the embodiment discussing in energy network.Also anticipation, this wireless receiving can occur simultaneously or occur on the period in the time interval.The embodiment of the wireless receiving of following part discussion in energy network, power network, data network and near field power and data-transmission system.

Radio communication can comprise wireless transmission and the reception of electric flux, electromagnetic energy and electrical power, for example embodiment.In addition, radio communication can comprise the sending and receiving of numerical data and information.In another embodiment, sending and receiving or the discretely combination of sending and receiving electric flux, electromagnetic energy, electrical power, electronic data and information together, as the embodiment discussing in energy network.Also anticipation, this wireless transmission and reception can occur simultaneously or occur on the period in the time interval.The embodiment of the radio communication of following part discussion in energy network, power network, data network and near field power and data-transmission system.

Antenna is generally to send or receive electromagnetic conductor by it.Antenna can include but not limited to lead-in wire or lead-in wire set.Resonator is generally random devices or the material that resonance occurs, and comprises any system that resonance occurs.Resonator can be the means that occur for detect characteristic frequency by resonance, can also be any circuit with this frequecy characteristic.In addition, resonator can be to reach the mode combination capacitor of maximum amplitude and the electronic circuit of inductance according to periodicity electric oscillation meeting.As it will be understood to those of skill in the art that, antenna is conventionally in the time of self-resonance for example or serve as resonator in the time being coupled to realize resonance with another reactance component such as capacitor.Like this, term antenna resonator is conventionally exchanged and is used at this, and is commonly referred to as structure (for example, multilayer multi-turn structure).

" skin effect " is generally that alternating current concentrates on conductor outside or near " skin " trend.As shown in Figure 1, for passing through the stable state unidirectional current of homogeneity conductor, CURRENT DISTRIBUTION is generally uniform on cross section; That is to say, current density is a little identical on cross section.

In the situation that using alternating current, along with frequency increases, increasing electric current moves to surface.This electric current does not effectively utilize whole cross sections of conductor.Therefore, the effective cross section of conductor reduces, so compared with value for equally distributed electric current, resistance and energy dissipation increase.In other words, as shown in Figure 2, due to skin effect, current density is maximum near conductive surface (also referred to as " skin "), and to cross-section center exponential damping.

The effective resistance of lead-in wire significantly improves with frequency.In a preferred embodiment, the scope of this frequency is from about 100kHz to about 3MHz, more preferably, and from about 3MHz to about 10GHz.In the embodiment of large antenna structure that need to be operated in 120KHz, using lead-in wire/material establishment MLMT structure of large specification is more useful to realize efficient performance.

For example, for the copper lead-in wire of 1mm (0.04 inch) diameter, the resistance of 1MHz frequency is four times of dc value at the most." skin depth " or " penetration depth " δ is frequently for assessment of the result of skin effect.Conventionally accept the degree of depth below the conductive surface of about 1/e (about 37%) that current density is reduced to its value in surface.Term " skin depth " thereby be described to current density and drop to the degree of depth in peaked about 37% cross section.This concept is applied to plane entity, and the radius of curvature that still can expand to conductive surface is slightly larger than other shapes of δ.For example, at 60Hz frequency place, the penetration depth in copper is 8.5mm (0.33 inch); Be only 6.6 × 1 at 10GHz place ^0-7m.Skin depth is the majorant of frequency, increases and reduces with frequency.This phenomenon shows in the diagram shown in Fig. 3.

The basic conception of multilayer lead-in wire is the available current density maximizing on whole lead-in wire cross section, thereby reduces the intrinsic resistance of lead-in wire.By using its thickness to be about the conductive layer of the twice of skin depth, guaranteed in lead-in wire current density be a little more than or equal to maximum possible current density (in surface)～37%.By using other layer thicknesses, will obtain different base current density.For example, by using the layer thickness of 4 times of about skin depths, will guarantee current density be more than or equal to maximum possible current density (in surface)～14%.Similarly, for the conductor degree of depth of 6 times of about skin depths, current density is more than or equal to 5%.

Although keep high current density extremely important at conductive layer, simultaneously, untapped cross-sectional area (, insulating barrier) entirety is as far as possible little also extremely important.Use above-mentioned theory, the desirable proposed arrangement of multilayer lead-in wire comprises that thickness/degree of depth is approximately conductive layer and the technical thin as far as possible insulating barrier of skin depth twice.It will be understood by those skilled in the art that MLMT structure can obtain following skin depth in an embodiment: be the effective conductive region in radio communication, scope is from the approximate half of the conductor degree of depth to approximating greatly the conductor degree of depth.On the other hand, the restriction that more given manufacture methods apply, design MLMT structure also can cause the following conductor degree of depth in an embodiment: can conducted signal, but along with operating frequency increases, might not use the twice of scope from skin depth to skin depth completely.

Therefore, the waveguide resonant cavity inner surface using in microwave frequency is coated with high conductivity material (as, silver) conventionally, to reduce energy loss, because almost all electric current all concentrates on surface.Suppose that cladding material is thick compared with δ, conductor is equally good with the solid conductor of coating material." quality factor " are generally accepted as the index (measuring numeral) of the efficiency of measuring the device such as antenna, circuit or resonator.The conduction that hole is defined as from one deck to another layer at this connects.

Twisted wire is generally by with the lead-in wire being wound around and the unified pattern bundle of braiding length or the independent film insulator pin that weaves together form.

Now in detail with reference to example shown in the drawings and that be discussed below.Fig. 4 shows for example, high level illustration for the resonator (, antenna) of wireless power and/or data transmission.This resonator comprises coil 100 and multilayer lead-in wire 101.The shape of coil 100 can be circle, rectangle, triangle, some other polygons or conformal, to be assemblied in limited volume.Fig. 4 shows an exemplary configuration of the coil of the shape with circular coil 100.The configuration of coil 100 can be that helical is tubular, spiral or spiral-helical is tubular.Helical tubular coil is followed helical curve, and this helical curve has multiturn, and each circle has identical radius.Spiral coil configuration can have multiturn, and described multiturn has the radius that increases gradually or reduce.The tubular coil configuration of spiral-helical is the combination of spirality and the tubular configuration of helical.Also can configure to form this coil with well known by persons skilled in the art other.

Fig. 5 A-5H shows the example of operable different antennae configuration.Fig. 5 A shows the example of antenna in the tubular configuration 102 of circuit helical.Fig. 5 B shows the example of antenna in the tubular configuration 103 of square helical.Fig. 5 C shows the example of antenna in the configuration 104 of round screw thread shape.Fig. 5 D shows the example of antenna in the configuration 105 of square spiral shape.Be appreciated that and can also use other helical configuration, for example rectangle or triangular shaped.Fig. 5 E shows the example of antenna in the configuration 106 of multilayer square spiral shape.Although it is two-layer to should be noted that Fig. 5 E only shows, is appreciated that and can uses Arbitrary Digit target zone.As will be described below, in the time using multiple layers, can use but be not limited to hole (via), scolder, joint (tab), lead-in wire, pin or rivet to connect multiple layers.In one embodiment, multiple conductor layers are less than or equal total number of plies, can in parallel be electrically connected.In addition, in another embodiment, multiple conductor layers of electrical connection in parallel can be electrically connected in series with the one or more conductor layers in more than second conductor layer of parallel connection electrical connection.These connectors are at least for following two objects: (1) connector connects the antenna stack of stacked antenna; And (2) connector is received a linkage of stacked antenna the second circle of stacked antenna.For example, for two circle antennas, at least there is a hole from the first circle to the second circle.Connector can also be used for other object.

For each antenna, there is the optimal number of connector and the optimum position for each connector.Owing to this be there is no to closed solutions analytic solution, so optimum position preferably obtains by iterative model building.But, provide the basic norm for optimizing at this:

Preferably, there are at least 2 connectors of all trace layer that are connected to form single conductor.In the ideal case, these two connectors are two ends (input and the output of multilayer lead-in wire) of multilayer lead-in wire.

Preferably, should with the demand of application-specific considerably, select the sum of connector.Connector more than optimal number will increase current path, and this can cause, electric capacity increases, resistance increases, quality factor reduce and bandwidth uprises.Should also be noted that when total length when connector (highly, the degree of depth) is greater than the optimum value at particular job frequency place, ghost effect meeting becomes more outstanding.The length of connector is substantially the height of connector, and should be remained and be less than approximately (effective wavelength)/20, although according to application, holds it in wavelength/10 and also can cause the embodiment that can work.The reason of these restrictions is, between the different layers that the connector length of increase goes between the multilayer used, introduces significant phase difference.These phase differences between different layers will cause harmful capacity effect, and this will reduce actually self-resonant frequency and increase loss.Should be mentioned in that, for example, for not using add-on assemble (, capacitor) and structure be used as the embodiment of self-resonance resonator, the connector (such as, but be not limited to hole) that the degree of depth can be greater than to (effective wavelength)/10 is incorporated in the design of antenna.

The form that hole can have normally used form in printed circuit board (PCB) (PCB) technology (for example, through hole, buried via hole, blind hole) or use in semiconductor or MEMS technology.Alternatively, hole can be but be not limited to any electric conducting material of laser fusion, fusion, printing, welding, brazing, sputtering sedimentation, wire-bonded etc., to be at least electrically connected any two layers and/or all layers.

Fig. 5 F shows the example of antenna in the tubular configuration 107 of round screw thread-helical.Fig. 5 G shows the example of antenna in the tubular configuration 108 of square spiral-helical.Fig. 5 H shows the example of antenna in the tubular configuration 109 of conformal helical.Antenna in conformal configuration can have but be not limited to the shape of circle or rectangular solenoid shape or the shape of circle or rectangular coil shape.Native system can use any antenna configuration shown in Fig. 5 A-5H.

The coil 100 of Fig. 4 can have multiturn 110.Circle can be but be not limited to the bending in lead-in wire, folding or camber line, make lead-in wire complete rotation around the center axis point of coil 111.Circle can have and the same or similar shape of coil configuration, such as, but be not limited to circle, rectangle, triangle, some other polygons or conformal, to be assemblied in limited volume.Fig. 6 A shows the single turn circular coil with N layer, and wherein " N " is equal to or greater than 1 number.Fig. 6 B shows the circular helical tubular coil of two circles of N layer.

Conventionally,, for any induction antenna, inductance is according to T ^xincrease, and resistance is according to T ^yincrease, wherein T is the number of turn.In desirable conductor, x and y are respectively 2 and 1.There are other factors that affect inductance and resistance (therefore affecting quality factor), make x and y be less than respectively 2 and 1.With reference to Figure 13, three kinds of example performance are provided.Figure compares 32 layers of-2 circle antenna and 32 layers of-1 circle antenna and 64 layers of-1 circle antenna.In frequency range 1MHz-200MHz, the inductance of 32 layers of-2 circle antenna and resistance increase respectively 3-3.5 and 1.7-3 doubly with respect to 32 layers of-1 circle antenna.This increase is very approaching with the value of estimating according to simplification analytic relationship, and in simplification analytic relationship, resistance is similar to T, and inductance is similar to T ².

Multilayer lead-in wire 101 in Fig. 4 can have but be not limited to circle, rectangle, square or triangular cross-sectional shape.In addition, also can use other shape well known by persons skilled in the art.Fig. 7 A-7E shows the example of operable lead-in wire cross section in the design of antenna.Fig. 7 A shows the example of the antenna with circular cross section 401.Fig. 7 B shows the example of the antenna with rectangular cross section 402.Fig. 7 C shows the example of the antenna with square cross section 403.Fig. 7 D shows the example of the antenna with triangular cross section 404.Fig. 7 E shows the example of the antenna with oval cross section 405.Fig. 7 F shows the rectangular cross section of the antenna with the first conductive layer 410 and the second conductive layer 420.Except above-described embodiment, multilayer lead-in wire 101 can comprise precise lead structure, fixing flexible pin configuration or its combination.

Insulating material 430 separates ground floor 410 with the second layer 420.Ground floor 410 is connected by the hole 440 of crossing insulating material 430 with the second layer 420.Conductive layer 410,420 can be the band/bar/sheet/blade of conduction or the layer of plated metal, has metal thickness and metal band width.The metal thickness of ground floor 410 is identified by line A-A, and the metal band width of ground floor 410 is identified by line B-B.In one example, the metal thickness of layer can be approximated to be the twice of skin depth (skin depth).Skin depth extremely approximates the scope of the conductor degree of depth greatly in the approximate half from the conductor degree of depth (conductor depth).Every one deck in circle has almost identical metal thickness and metal band width.

The thickness of insulating material can be the demand that is enough to meet application, or equals the minimum thickness that available manufacturing technology is possible.In addition, overall structure feasibility depends on frequency (as shown in the figure of Fig. 1), the relevant cost of work and the manufacturing technology being used.Conventionally,, in PCB technology, the thickness of layer is by " core thickness (core thickness) " and prepreg (pre-preg) thickness regulation.In other design, select the thickness of non-conductive layer with the electric behavior of amendment structure.

The stacked alternating layer that comprises core and prepreg of typical case PCB.Core generally includes Copper Foil and is bonded on the thin dielectric of both sides.Glass fibre-epoxy resin that core dielectric normally solidifies.Glass fibre-epoxy resin that prepreg is normally uncured.Prepreg solidifies (, hardening) in heating and when compacting.Outermost layer normally Copper Foil be bonded on outside (surperficial paper tinsel) prepreg.As shown in figure 18, stacked normally about the center of plank, along vertically axisymmetric, to avoid the mechanical stress in plank under thermal cycle.

For the application at 13.56MHz place, provide conductor and thickness of insulating layer and equal an embodiment of the minimum thickness that available manufacturing technology is possible.At 13.56MHz place, skin depth is approximately 17.8 microns.In the ideal case, the conductor degree of depth should be approximately 35.6 microns, and insulation thickness should be as far as possible little.But, as shown in figure 19, actually, using and utilize PCB manufacture method standard, established low-cost technologies, the manufacture that obtains for 6 layers of pcb board is stacked is about 71 microns, is approximately 4 times of skin depth.In addition, insulating barrier is greater than 3 times of conductive layer.Advanced PCB technology (obviously higher cost) may allow less conductor and the insulation degree of depth.For example, can allow to be low to moderate the electric conducting material (for example, copper) of 5 microns and the insulation dielectric of about 39 microns in the PCB of conceptual phase technology at present.Other technologies such as semiconductor manufacture and MEMS manufacturing technology can allow thinner layer thickness, obtain more approaching desirable performance.If use semiconductor or MEMS to manufacture, the thickness of conductive layer and insulating barrier can be as thin as hundreds of nanometer, or thinner.In a preferred embodiment, dielectric layer thickness is less than 200 microns, and preferably insulation as much as possible, has the dielectric constant that is less than 10.

Similarly, dielectric layer can be made up of different materials, and can have various configurations.For example, some application may need extremely low parasitic capacitance.In these cases, the non-conductive dielectric of the possible minimum dielectric of tool is preferred.In addition, may wish to increase thickness of insulating layer with minimum parasitic effects.Another example can be for needing Ferrite Material to increase the application of inductance and/or increase magnetic screen.In this case, dielectric layer can be replaced by the configuration/material of ferrite membrane/piece or like attribute.

Therefore, it will be apparent to one skilled in the art that insulating material can have a thickness, this thickness in the practical capacity of the manufacturing technology for the manufacture of this resonator, and with this resonator for the efficiency requirements compatibility of application.

The material of conductive layer can be copper or gold, but other materials is also fine.In order to strengthen conductivity, also can use copper or the gold with one deck depositing silver.Implanted and may be exposed to body fluid in the situation that at antenna, should use known biocompatible material conventionally, comprise the additive for strengthening conductivity.These materials can be including, but not limited to being selected from the electric conducting material of the group that comprises the following: titanium, platinum and platinum/iridium alloy, tantalum, niobium, zirconium, hafnium, Nitinol, Co-Cr-Ni alloy (for example MP35N, Havar eligiloy ), stainless steel, gold and various alloy thereof, palladium, carbon or other noble metal arbitrarily.Depend on application, insulating material can be (i) air, (ii) dielectric that has a low-k (for example, foamed polystyrene, silicon dioxide or any suitable biocompatible pottery), (iii) there is the non-conductive dielectric of high-k, (iv) Ferrite Material, or (v) combination of material listed above.The selection of material or the combination of material can be according to the factors such as manufacture process, cost and Technology Need.For example, if need high capacitance effect to affect the low self-resonant frequency of antenna, high dielectric constant dielectric may be preferred, or comprises that the combination of the material of ferrite membrane or ferrite block may be preferred, to increase the self-induction of antenna.The performance of lifting can be provided with ferrite core in addition.

Fig. 8 A-Fig. 8 B shows the example of different multilayer lead-in wire cross-sectional configuration.Fig. 8 A shows the multilayer lead-in wire with circular cross section 510.Fig. 8 B shows the multilayer lead-in wire with rectangular cross section 520.In Fig. 8 B, the hole 530 of connecting conductive layer 540 is positioned at port or input 550 places as the beginning of lead-in wire.According to specific application, the location in the hole 530 of connecting conductive layer can affect the performance of antenna.For example, inadequate hole may cause the phase difference between different layers.On the contrary, sufficient hole may cause additional circulating current path, and this can increase resistance loss.Hole can be positioned at the beginning (for example, port, input etc.) of lead-in wire to be located, or is positioned at along one or more positions of lead-in wire.In addition, comprise hole between a set of two or more conductive layers can be positioned at from comprise two or more conductive layers another gather different positions.Should be appreciated that, according to application and system, multiple modification is possible.Can use the technology of standard for the technology of using for the manufacture of multilayer multi-turn structure to carry out manufacturing hole.In other cases, can realize hole by solder technology, for example, by using electric welding, welded joint, laser fusion tack welding or other known electric connection technology, connect multiple layers in the position in hole.

As described herein, preferably utilize high quality factor (QF) to carry out designing antenna, to realize effective transmission of power, reduce the intrinsic resistance loss of the antenna of high frequency treatment.Quality factor are energy of storing of equipment and the ratio of the energy of equipment loss.Therefore, the QF of antenna is the ratio of the energy loss of antenna and the energy of storage.The source device (for example, antenna) of carrying changing currents with time has the energy that can be divided into three components: 1) resistance energy (W _res), 2) emittance (W _rad), and 3) reactance energy (W _rea).The in the situation that of antenna, the energy of storing is reactance energy, and the energy of loss is resistance and emittance, and wherein, the quality factor of antenna are by equation Q=W _rea/ (W _res+ W _rad) represent.

In near-field communication, equipment (in this case, being antenna) environment release of radiation and resistance energy towards periphery.For example, when must be in the time having between the equipment of limited power memory (, having the battery powered equipment of dimension constraint) transferring energy, too much power loss can greatly reduce the performance effect of equipment.Therefore, near-field communication equipment is designed to minimum resistance and emittance, maximizes reactance energy simultaneously.In other words, near-field communication is benefited from and is maximized Q.

For example, the efficiency of the energy between the equipment in the system of inductance coupling high and/or data transmission be based on transmitter in the coupling coefficient (κ) between quality factor (Q2) and two antennas of antenna in the quality factor (Q1), receiver of antenna.The efficiency of energy transmission becomes according to following relation: eff ∝ κ ²q ₁q ₂.The energy loss of higher quality factor marker antenna is lower with the energy of storing.On the contrary, the energy loss of lower quality factor marker antenna and the energy stored is higher.Coupling coefficient (κ) is illustrated in the degree of coupling existing between two antennas.

In addition, for example, the quality factor of induction antenna become according to following relation: wherein f is operating frequency, and L is inductance, and R is all-in resistance (ohm+radiation).Because QF and resistance are inversely proportional to, so higher electric resistance changing is lower quality factor.

Can realize higher quality factor by the multilayer in multilayer lead-in wire for single-turn circular coil.Can also increase by the number of turn in increase coil the quality factor of structure.For the design at constant frequency place, may there is the best number of plies, to reach maximum quality factor.Once reach this maximum,, along with increasing more layer, quality factor decrease.Can comprise for the design variable of multilayer multi-turn structure:

A. metal band width w _n(for example, w _l: the width of the first conductive layer, w _k: the width of k conductive layer.) also referred to as metal width or strip width

B. the number N of the conductive layer of every circle _n(for example, the number of plies N in the first circle ₁)

C. the thickness d of each conductive layer _n(for example, d _l: the thickness of ground floor, d _k: the thickness of k layer)

D. insulation thickness di _n(for example, di _l: the insulation thickness under ground floor), di _k: the insulation thickness under k layer)

E. number of turn T

F. connect the number in the hole of different conductive layers in each circle

G. connect the position in the hole of different conductive layers in each circle

H. shape (circle, rectangle, certain polygon; Depend on application; For example, can be conformal, outer or interior to be just assemblied in certain equipment or assembly)

I. configuration (helical is tubular, spirality, spiral-helical are tubular etc.)

J. dimension (length, width, internal diameter, external diameter, diagonal etc.)

Exemplary multilayer multiturn design based on above-mentioned parameter is described below.

In one example, antenna can be the single turn circular coil with multilayer lead-in wire, as shown in Fig. 9 A-9D.Single-turn circular coil comprises single turn, and can comprise the metal thickness of the metal band width of approximate 1.75mm, approximate 0.03mm, the approximate insulating barrier of 0.015mm and the external diameter of approximate 5mm.Lead-in wire can have the layer between 5 to 60, for example 5,11,20,26,41 or 60 layers.For example, Fig. 9 A shows the single turn antenna with 1 layer, and Fig. 9 B shows the single turn antenna with 11 layers, and Fig. 9 C shows the single turn antenna with 20 layers, and Fig. 9 D shows the single turn antenna with 26 layers.Although Fig. 9 A-9D shows particular example, should be appreciated that, lead-in wire can have and is less than 5 layers or more than 60 layers, to realize high quality factor.Can be between approximate 0.2mm to 3mm for the corresponding coil thickness of 5 to 60 layers of scope, be for example respectively 0.2,0.5,1,1.25,2.05 or 3mm.As mentioned above, be appreciated that the number of plies, the number of turn, metal thickness and metal band width in going between by change, can obtain higher quality factor.For example, for 1 layer of single-turn circular coil of metal band width with 0.03mm metal thickness and 1.75mm, the quality factor at 10MHz place are approximately 80.The number of plies is increased to 11 and keep the metal thickness of 0.03mm and the metal band width of 1.75mm, quality factor to increase to approximate 210 from 1.Conventionally, the increase of the number of plies of every circle causes the increase of quality factor, until reach maximum, then, quality factor start to reduce.This reduction may become when suitable with its radius and occur in the total height of antenna.For electronic building brick, for example, start deterioratedly because ghost effect (, electric capacity and proximity effect) greatly increases, and ghost effect increase is because multilayer causes.In this example, layer is increased to 20,26,41 and 60 and causes respectively approximate 212,220,218 and 188 quality factor.

In order to show the benefit of this instruction with respect to prior art scheme, form the model of this instruction, to compare with known coil.Suppose and use solid lead-in wire (solid wire) to make prior art model.For the circular coil with radius r, lead-in wire radius a, circle N, inductance (L) and resistance (R _ohmand R _radiation) provided by following equation:

$L={\mathrm{\μ}}_0{N}^{2}r\ln [\left(\frac{8r}{a}\right)-2]$

$R_{\mathrm{ohmic}}=\sqrt{\frac{{\mathrm{\μ}}_0\mathrm{\ρ\ω}}{2}\frac{\mathrm{Nr}}{a}}$

$R_{\mathrm{radiation}}=\frac{\mathrm{\π}}{6}{\mathrm{\η}}_0{N}^2{\left(\frac{\mathrm{\ωr}}{c}\right)}^4$

Consider two kinds of antenna configurations, its details is provided in table 1 below and table 2.Result instruction, this instruction allows the QF far above solid lead-in wire.In the time using other known configuration method, improvement in performance shown in this article is also suitable for.

Table 1

Table 2

Be also to be understood that and can increase metal band width to realize higher quality factor.Figure 10 provides the figure of the value of the quality factor that become with frequency.Figure 11 A shows resistance and the inductance diagram along with the relative changes of the number of plies.Figure 11 B shows the quality factor that 10MHz place obtains.Should be noted that the A-B for Figure 11, the data point on figure is corresponding as follows: data point 1 is for 1 layer, and data point 2 is for 11 layers, and data point 3 is for 20 layers, and data point 4 is for 26 layers, and data point 5 is for 41 layers, and data point 6 is for 60 layers.Flow through all layers of structure in order to ensure signal, preferably, for any multilayer lead-in wire and/or structure, comprise at least two holes.Preferably, these two holes are positioned at the port of lead-in wire/structure.From Figure 10 and 11A-B, for the antenna configuration with 26 layers and 1 circle, realize the optimum performance for 10MHz.For this antenna configuration, near 35MHz, obtained peak value quality factor, and peak value quality factor are approximately 1100.

In another example, antenna can be the single turn circular coil of multilayer lead-in wire, and can have the metal thickness of the metal band width of approximate 1mm, approximate 0.01mm, the approximate insulating barrier of 0.005mm and the external diameter of approximate 5mm.Lead-in wire can have the layer between 16 and 128, for example 16,32,64 or 128 layers.But, be appreciated that lead-in wire can have and be less than 16 layers or more than 128 layers, to realize high quality factor.Can be between approximate 0.25mm to 2mm for the corresponding coil thickness of 16 to 128 layers of scope, be for example respectively 0.25,0.5,1 or 2mm.In this example, quality factor are improved along with the increase of the number of plies, realize larger quality factor at upper frequency place.For example, at the frequency place of 10MHz, be respectively approximate 127,135,140 and 185 for the quality factor of 16,32,64 and 128 layers.Under these design parameters, peak value quality factor are increased to and approach 2900 at approximate 450MHz place.Relative resistance may be that the frequency place of about skin depth twice is minimum at conductor thickness.In this example, this frequency is 160MHz.

Figure 12 A-C shows the diagram of performance parameter and trend.Figure 12 A shows the figure of the quality factor that become with frequency.Figure 12 B shows the diagram of the inductance about 16 layer line circles becoming with frequency.Figure 12 C shows the diagram of the resistance about 16 layer line circles becoming with frequency.From Figure 12 A, quality factor, along with the number of plies increases and improves, have larger quality factor relatively at upper frequency place.This further shows in Figure 12 B-C, wherein shows inductance along with frequency relatively constant (compared with 16 layer of 1 circle coil), and resistance is along with frequency increases and reduces, as shown near recess 100MHz in Figure 12 C.Peak value quality factor rise to approximate 2900 near 450MHz.

In another example, except the number of turn is double, all design parameters, with identical for the preceding example of 32 layers of lead-in wire, obtain two circle circular coils.In the frequency range of 1MHz to 200MHz, these 32 layers, the inductance of two circle antennas and resistance increases to respectively 3-3.5 doubly with respect to 32 layers of single turn antenna and 1.7-3 doubly.Figure 13 A-C shows with 32 in preceding example and compares with 64 layers of single turn antenna, these 32 layers, the performance parameter of two circle antennas and the diagram of trend.Figure 13 A shows the diagram of the quality factor that become with frequency.Figure 13 B shows the diagram of the inductance becoming with frequency.Figure 13 C shows the diagram of the resistance becoming with frequency.From Figure 13 A-C, for 32 layers, two circle antenna at the frequency place under about 200MHz, inductance is almost constant, and resistance is followed and the similar trend of single turn antenna.At the frequency place higher than 200MHz, due to the contribution of parasitic capacitance, the equal fast rise of inductance and resistance (making an explanation below).Even if quality factor keep higher at the frequency place higher than 200MHz, due to ghost effect, also may have significant electric field, and this may be unacceptable in some applications.

As mentioned above, antenna may demonstrate ghost effect.The parasitic capacitance being associated with antenna is frequency dependence, and its contribution to total impedance increases along with frequency.As the result of parasitic capacitance, there is the self-resonant frequency for antenna, at the frequency place that exceeds self-resonant frequency, antenna is just equally worked to capacitor.For fear of the appearance of parasitic capacitance, can designing antenna, make inductance almost constant near operating frequency.Preferably, the slope of a curve of reactance relative frequency is near almost linear (operating frequency), has slope: (wherein, X is reactance, and L is designed inductance).Operational antennas has been guaranteed to remain minimum by the parasitic couplings of electric field by this way.Be appreciated that due to other effects, for example current crowding, close on and skin effect, the relative ω of X may not be completely linear.

It will also be appreciated that, other designs can be for antenna, to realize higher quality factor.For example, for may have between 16 and 128 layer (for example, 16,32,64 or 128 layers) the single turn circular coil of multilayer lead-in wire, coil can comprise the metal thickness of the metal band width of approximate 1mm, approximate 0.01mm, the approximate insulating barrier of 0.01mm and the external diameter of approximate 10mm.The width that increases metal has reduced resistance and inductance, obtains higher quality factor.Due to the overall large scale (external diameter～10mm) of antenna, the less increase of width (w) can not reduce inductance.Should be noted that for compared with miniature antenna, for example have the antenna of approximate 5mm external diameter, the identical increase of metal width can obtain the reduction of larger inductance.Figure 14 A-C shows the diagram that is respectively the quality factor this example, that become with frequency of approximate 1mm, 1.5mm and 2mm for metal band width.In this example, the quality factor at 379MHz place are approximately 1425 for the metal band width of 1mm.Metal band width is increased to 1.5mm and 2mm makes quality factor be increased to respectively approximate 1560 and 1486.

Should be noted that above for all QF values described in inductance (conductivity=0, relative dielectric constant=1) in free space.The existence of estimating real world environment will affect QF.For example, have the antenna of QF～400 in free space in the time being placed near human body, QF may change into about 200-300.In addition, if antenna is placed in human body, have seldom or the covering of almost not insulating, QF may further change into lower than 200.Before being placed in human body, apply enough thick lid or be enclosed in the QF change that may reduce antenna in enough large encapsulation.The similar change of estimating QF characteristic will appear in any medium, and near of any material, depend on the electric attribute of material/medium and distance with it with departing from of free space.

As discussed herein, use near-field communication to be applicable to energy, power or data network for wireless transmission/reception.

energy network

Can instruct forming energy delivery network according to this.Figure 15 shows the high level block diagram of near-field energy network 10.Network 10 comprises multiple equipment 11 _a-d(being referred to as equipment 11).Each equipment 11 can comprise transceiver.Transceiver can comprise transmitting element 12 _a-dwith receiving element 14 _a-d, for radio communication.Although each transceiver can comprise transmitting element 12 and receiving element 14, be appreciated that transceiver can enter to comprise transmitting element 12 or only comprise receiving element 14.In addition, be appreciated that transmitting element 12 in transceiver and receiving element 14 can share some or all circuit units, or can have and separate and different circuit units.In addition, transmitting element and/or receiving element 14 can be coupled with load 16.Load 16 can comprise the assembly outside assembly, the equipment 11 in equipment 11 or equipment 11 is interior and the combination of assembly outward.

Each transmitting element 12 comprises transmitting antenna 13.Transmitting antenna 13 has resonance frequency omega, and preferably has minimum resistance and radiation loss.Load 16 can comprise drive circuit, drives transmitting antenna 13 for generation of signal.According to receiving signal, transmitting antenna 13 can produce the near field of (in omnirange) in all directions, or produces the near field of target towards specific direction (orientation).Can by shielding, for example, produce target near field by Ferrite Material.Certainly, it will be understood by those skilled in the art that and can provide target near field with other material.

Each receiving element 14 comprises reception antenna 15.Single antenna can for reception antenna 15 and transmitting antenna 13 the two, or can use with transmitting antenna 13 antenna separating for reception antenna 15.Each antenna 13,15 has resonance frequency and (is called ω _a-ω _d).If use the sending and receiving antenna separating, preferably, the resonance frequency of reception antenna 15 equals the resonance frequency of transmitting antenna 13.

For example, when receiving element 14 (, the equipment 11 of an equipment 11 _breceiving element 14 _b) be placed on transmitting antenna 12 (for example, the equipment 11 of another equipment 11 _atransmitting antenna 12 _a) near field in time, transmitting antenna 12 _athe electromagnetic field producing will with receiving element 14 _balternately.For example, if receiving element 14 (, has resonance frequency omega _bequipment 11 _breceiving element 14 _b) resonance frequency and transmitting element 12 (for example, there is resonance frequency omega _aequipment 11 _atransmitting element 14 _a) resonance frequency identical, transmitting element 11 _areactance electromagnetic field will be at receiving element 14 _bin the alternating current of inducting.The electric current of inducting can be for to load 16 _bpower or transfer of data are provided.As a result, equipment 11 _bcan be from equipment 11 _aabsorb energy.What be appreciated that arbitrary number has and resonance frequency (for example, the ω of transmitting apparatus _b) equipment of equal resonance frequency can add near-field energy network to, and draw energy from transmitting apparatus, as long as transmitting element 12 _aresonance frequency can be due to the load effect of added equipment significantly change.

For example, if receiving element 14 (, has resonance frequency omega _cequipment 11 _creceiving element 14 _c) resonance frequency and transmitting element 12 (for example, there is resonance frequency omega _aequipment 11 _atransmitting element 12 _a) resonance frequency difference, receiving element 14 _cfor transmitting element 12 _ato there is high impedance, and from transmitting element 12 _adraw less energy.

Be appreciated that from transmitting element 12 _abe delivered to receiving element 14 _cthe amount of energy depend on many factors, comprise transmitting element 12 _awith receiving element 14 _cin intrinsic loss and for example, to other equipment (, receiving element 14 _b) the transmission of energy.ω in each equipment _awith ω _cto close on the width of resonance wave band be also significant.Figure 16 A-F has illustrated to illustrate how various factors affects the diagram of the transmission of energy.

Figure 16 A shows ω _aand ω _cthe situation identical and wave band is narrow.This represents the situation of desirable scene and maximum power transmission efficiency.Figure 16 B shows ω _aand ω _cthe situation that difference and wave band are narrow.In this scene, there is no energy transmission.Figure 16 C shows ω _aand ω _cdifference and receiving element 14 _cthere is the situation of wide resonance.When wider resonance wave band appears at antenna and has high electrical resistance and radiation loss.Receiving element 14 _cfor ω _ahave higher than the impedance in situation shown in Figure 16 B, but still can be from transmitting apparatus 11 _aabsorb some energy.Figure 16 D shows ω _aand ω _cdifference and transmitting apparatus 11 _ait is the situation damaging.Transmitting apparatus 11 _ain resistance and radiation loss cause wide resonance wave band.The smaller portions of antenna energy can be used for being passed to receiving element 14 _c.Figure 16 E shows ω _aand ω _caway from and transmitting element 12 _awith receiving element 14 _cbe the situation damaging.Therefore, there is no energy from transmitting element 12 _abe delivered to receiving element 14 _c.Figure 16 F shows ω _aand ω _cnear and transmitting element 12 _awith receiving element 14 _cbe the situation damaging.Energy is at transmitting element 12 _awith receiving element 14 _cbetween transmit, but due to high loss, system is poor efficiency.

Most everyday objects are conduction (for example, steel cabinet and automobile), and have and scheme receiving element 14 in * 16C _csimilarly frequency response (but wider due to larger resistance loss).These objects therefore can be from transmitting element 12 _aabsorb some energy, and loss in construction system.But, so far, general energy transmission is only discussed, the use meeting of energy changes according to application, and extensively, can be the transmission of power or the transmission of data.

power network

Can instruct to form power delivery network according to this.When receiving element 14 _bbe placed on transmitting element 12 _anear field in and receiving element 14 _bresonance frequency (, ω _b) be approximately equal to transmitting element 12 _aresonance frequency (ω _a) time, energy is from transmitting element 12 _abe delivered to receiving element 14 _b.If all there is the transmitting element of equaling 12 _aresonance frequency (, ω _a) multiple receiving equipments (for example, 11 of resonance frequency _b-11 _d) be placed near field each receiving equipment (for example, 11 _b-11 _d) by the form with alternating current from transmitting element 12 _aabsorb energy.Receiving equipment 11 _a-11 _dcan comprise transducer, transducer can use the alternating current of inducting for example to store the energy in, in power storage devices (, battery or electric capacity).Alternatively, transducer can use the alternating current of inducting, directly for example, in receiving equipment or be coupled to receiving equipment (, 11 _b-11 _d) electronic building brick power supply.

Being appreciated that can not for example, by all transmitting and receiving device (, 11 _b-11 _d) be all placed on transmitting element 12 _anear field in.As shown in figure 17, for example, for (, the receiving equipment 11 of the receiving equipment 11 outside near field _e) transferring energy, can use one or more repeaters 18.One or more repeaters 18 can comprise be tuned to ω _aantenna 20.Repeater 18 can, via antenna 20, draw energy with the form of induced current from transmitting element 12.One or more repeaters 18 can use induced current, to produce the second energy field with antenna 20.Alternatively, can produce the second energy field with the second antenna (not shown).The second energy field can be at receiving element 14 _ein the alternating current of inducting.Receiving element 14 _ecan comprise transducer, transducer can use the alternating current of inducting, for example, in power storage devices (, battery or electric capacity) stored energy.Alternatively, transducer can use the alternating current of inducting, to receiving element 14 _einterior electronic building brick power supply.Be appreciated that the near field that antenna 20 or the second antenna (not shown) can produce (in omnirange) in all directions, or produce the near field of target towards specific direction (orientation).

data network

Can instruct to form data delivery network according to this.The signal that transmitting apparatus sends in network can be that the modulation time varying signal of carrying data, transmitting designed network for data can be similar with previously described power network.For data network, there is multiple possible general layout.

An example of data network layout comprises one or more receiving elements (14 _b-d) be placed on transmitting element 12 _anear field in.Each receiving element (14 _b-d) can with transmitting element 12 _aand/or other receiving elements 14 are communicated by letter.Being appreciated that can be in the manner described above, uses one or more repeaters 18 to arrive the receiving element outside the near field of transmitting element 12.In another example, receiving element 14 can be placed on the far field of transmitting element 12, and communicates by letter by the radiation field of transmitting element 12.To realize this near-field communication with mode like near-field communication technology type well known by persons skilled in the art.

Equipment 11 in network can be designed as deal with data transmission in many ways.For example, equipment 11 and antenna 13,15 thereof can be designed as (1) and only receive data; (2) only send data; Or (3) receive and send data, share antenna for receiving and send to use, or separate and special antenna for receiving with sending to use.In addition, equipment 11 can be designed as deal with data and power transmission.In this case, each equipment 11 can be designed as: (1) only transmits data; (2) transmitted power only; (3) transmit data and power, wherein each equipment 11 can use the combination in any of sending/receiving data and sending/receiving power, each equipment 11 has the shared antenna for data transmission and power transmission, or each equipment 11 has the dedicated antenna separating of transmitting with power for data transmission.

Each receiving element 14 can have the electronic mark (ID) unique for this receiving element 14 on network 10.ID is used as the identifier of the specific receiving element 14 on network, and allows other receiving elements 14 on receiving element 14 recognition networks 10 on network to communicate by letter.In order to initiate data transfer session, transmitting apparatus utilizes ID to identify receiving equipment, and starts to communicate by letter with initiation instruction.Use certain modulation schemes, will produce data transmission.Can guarantee that the data of equipment transmission and the data of device storage are safe by security protocol, and the unauthorized device not occurring in designed network 10 cannot be accessed these data.

Periodic data communication may occur between transmitting element 12 and one or more receiving element 14, or between receiving element 14 and one or more other receiving elements 14.In the communication of transmitting element-receiving element, transmitting element 12 can be identified specific receiving element 14 according to ID, and initiates communication session.Alternatively, receiving element 14 can be identified transmitting element 12 according to ID, and initiates communication session.Communication session can be stopped by transmitting element 12 or receiving element 14.

In the communication of receiving element-receiving element, two receiving elements 14 can directly be connected to each other in direct-connected communication.Alternatively, two receiving elements 14 can use transmitting element 12 as medium, are connected to each other.In this case, each receiving element 14 can be connected with transmitting element 12, and transmitting element 12 will and be sent to another receiving element 14 by information from a receiving element 14 reception information.In another alternative, two receiving elements 14 can be communicated by letter with one or more repeaters 18, and wherein, one or more repeaters 18 receive signal and signal is sent to another receiving element 14 from receiving element 14.One or more repeaters 18 can be one or more isolated resonant antennas, or can be irrelevant with any circuit.

Can in various application, use shown in Figure 15 and Figure 17 for the system and method for transferring energy between two or more equipment effectively, so that operation: household electrical appliance, for example vacuum cleaner, flatiron, TV, computer peripheral, mobile device; Military Application, for example, investigate equipment, night observation device, sensor node and equipment; Communications and transportation application, for example, be designed for and monitor automobile or train performance and safe transducer; Aerospace applications, for example, control wing, rudder or take-off and landing device; Space technology; Maritime applications, for example application to unmanned ship power supply; Traffic control application, for example road surface embedded type sensor; Commercial Application; Such as the asset tracking of RFID and transponder; Robot network; And Medical Devices.

general near field power and data-transmission system

As this training centre understanding, near field power and data transmission are to derive from identical physical principle.In the time using together, near field power and data transmission provide the chance that creates various systems.General-purpose system near field power and data transmission is below described.

Near field power and data network (at this also referred to as " NF-PDAT ") can comprise multiple sending and receivings unit.For simplicity, consider to comprise the simpler network of single transmitting element 12 and single receiving element 14.Below describe and follow from transmitting element 12 to receiving element 14 and to the energy path of the load being coupled with receiving element 14.

At first, must obtain and derive the required energy of PDAT network from original source.Original source can be main 50/60Mz wall socket, standard cell, the rechargeable battery that can be connected with wall socket or have the rechargeable battery indirectly recharging.Wall socket is a kind of method for optimizing that obtains energy, because the original source of this form is very sufficient.The situation that cannot be connected with wall socket at equipment is to card, or needs, in portable situation, can use battery.In addition, can use rechargeable battery.In the time that the stored energy of rechargeable battery drops to lower than a capacity, can supplement rechargeable battery.Known recharging can be used in following equipment battery: this equipment consuming cells very fast, has for the battery of suitable size and the space of Yan Tai little, or change battery limited.In rechargeable battery, can use original power source, for example wall socket or another battery, supplement battery life.In most equipment, typically for example, realize and recharging by battery being connected to a bit of time of wall socket (, kneetop computer or cell phone).(for example, the Medical Devices of implantation) in some applications, it is impossible being directly attached to power line.In this case, use indirect recharge method, for example, with external power source inductance coupling high.Be appreciated that and can realize and recharging by additive method.For example, if there is clearly sight line between energy source and equipment, can carry out transferring energy with optical link, laser or high orientation radio frequency beam.

Can come system power supply with alternative energy source, or energy (for example,, to battery recharge) is provided to intrasystem assembly.These alternative energy sources can comprise that by a kind of power conversion of form be electric energy.A this example is that kinetic energy is converted to electric energy.This can realize by motion is converted to energy.For example, the equipment that the is attached to main body electric rotating machine that can the main consuming body moves, makes generator produce alternating current.Another example is to be electric energy by transform light energy.For example, be placed on outer photovoltaic cell and sunlight or room light around can be converted to energy.In another example, the change of pressure can be converted to electric energy.For example, can use the piezoelectrics that are suitably placed on equipment, pressure change (for example, air pressure change or by the directed pressure contacting) is converted to electric current.In another example, thermal gradient can be converted to electric energy.For example, can use the thermoelectric generator (TEG) in the equipment of being placed on, the temperature gradient on equipment is converted to electric energy.It is useful that this TEG produces in hot equipment during operation, for example, a part for heat energy can be converted to electric energy.

This instruction also comprises a kind of method that is used in the design multilayer multiturn antenna in efficient wireless power and data telemetry systems.Suppose special operating frequency, the one or more steps that can follow in following steps are carried out design specialized antenna:

1. carry out analytical Calculation and system-level emulation, to obtain the required inductance of minimum for enough coupling coefficients

2. for example, according to analytical Calculation (, for coupling coefficient, induced potential etc.), select the required number of turn of suitable inductance

3. select conductor layer thickness to be: 2 times of about skin depth or according to the admissible minimum value of manufacturing technology; High that in the two.

4. select insulation thickness to be: the admissible minimum value of manufacturing technology, or larger thickness, to realize required performance.

5. select feasible maximized surface long-pending (depending on application).It is square or circular that this area needs not be.Can be the arbitrary shape in accordance with total system, and can wriggle around other assemblies.

6. select based on manufacturing technology and the feasible maximum number of plies of application.

7. at numerical modeling instrument (for example, according to the combination of MoM or FDTD or FEM or MLFMM or other instrument or these instruments), utilize the number of turn of step 1 and 2, design multilayer multiturn antenna, and optimize (step 3-6) number of plies and other parameters.

A. guarantee to obtain quality factor peak value at institute's selected frequency whereabouts

B. guarantee to be more than or equal to (according to system-level constraint) admissible minimum value for the inductance of these quality factor

If c. needed, by keeping, parasitic capacitance effect is lower guarantees to minimize E field (referring to part above)

This instruction also comprises a kind of method of manufacturing antenna after having designed antenna.Stacked antenna uses metal band, can be by carrying out plated metal band such as, but be not limited to PCB/ ceramic/metal printing process or the special mask (mask) in semiconductor foundry.The method of alternative manufacture antenna can be used the band/bar/sheet/blade of conduction, has one or more band/bar/sheet/blades to be placed on top of one another, separated by insulating barrier, and by making multiple band short circuits at the hole site place scolder of specifying.Another manufacture method of antenna be from conducting strip or " blade (leaf) " (for, for example gold or copper blade) cut out out given shape, and with for the similar subsequent step of conductive strips/bar.Except metal deposition process, such as physical vapour deposition (PVD), thin film deposition, thick film deposition etc., can also be used three dimensional printing process (process that for example Eoplex technology provides).

The semiconductor fabrication that this instruction is suitable for being incorporated to the current manufacturing technology for multi-sheet printed terminal block, printed circuit board (PCB) and has multilayer interconnection.Along with the progress of manufacturing technology, expectation multilayer multiturn antenna may greatly be benefited from this improvement.This and compatibility traditional manufacturing technology makes relatively easily these antenna to be incorporated in traditional circuit board.This progress can also provide accurate repeatability and little feature dimension (, high-resolution).

As mentioned above, the design of native system and structure allow the scope (, the separating distance between sending and receiving wireless antenna) of expansion.The increase of scope makes transmitted power in larger distance, allows transmitter receiver further away from each other.For example, in the application such as RFID, be not more than 3 feet for the label read range of high frequency interrogator, for example, for some application (, tray track), 3 feet is inadequate.The concentration power that the wireless antenna of native system need to be used for promoting to reflect the required interrogator signal of better expansion read-range performance by transmitting application-specific, provides the improvement for the tray track via RFID.Other application (for example military system) in, spreading range provided by the present invention can be difficult to arrive position equipment or to the equipment transmitted power in uncultivated environment.In consumption electronic product, spreading range allows user from position more easily to equipment charge or transferring energy.

Native system can also be realized the multiple operational requirements that are derived from single design concept (being multilayer multiturn antenna).Native system can be used as receiver antenna, source antenna, transceiver (serving as source and receiver) and repeater antenna.Alternatively, this design can be only for inductor design, for example, as the lamped element of (, in RF filter circuit, RF match circuit in) in circuit.

MLMT structure of the present invention can be embodied in various circuit design embodiment.Figure 20 has provided the equivalent circuit diagram of MLMT antenna.It comprises following parameter:

L _m=intrinsic inductance

C _m=intrinsic capacity

R _m=intrinsic resistance

The characteristic of MLMT antenna embodiment depends on L _m, R _mand C _mdesign load, work centre frequency and be placed on terminal 1 and terminal 2 on add-on assemble.

The angular frequency of supposing work is ω.The input impedance Z of MLMT antenna embodiment _inputbriefly provided by the equation 1 (c) based on 1 (a) and 1 (b). $Z1=\frac{1}{j\·\mathrm{\ω}\·C_M}$ Equation 1 (a)

Z2=R _m+ j ω L _mequation 1 (b) $Z_{\mathrm{input}}=\frac{Z1\·Z2}{Z1+Z2}$ Equation 1 (c)

MLMT antenna structure of the present invention can be embodied in various circuit design embodiment.For example, MLMT antenna structure can be operated under three kinds of patterns:

Pattern 1: in the time meeting the condition 1 that equation 2 (a) provides, as inductor, for example, be embodied in lumped-circuit unit, obtain equation 2 (b).Figure 21 has provided equivalent circuit diagram.

Z1 > > Z2 equation 2 (a)

Z _input≈ Z2 equation 2 (b)

Pattern 2: as resonator, be for example embodied in independent accumulator or be embodied in HF and/or RF circuit in, wherein, resonator is one of two types:

Class1: in the time meeting the given condition 2 of equation 3, as self-resonance device.

Figure 22 A and 22B have provided equivalent circuit diagram.

ω ²l _mc _m≈ 1 equation 3

Type 2: as resonator, wherein add capacitor C by serial or parallel connection _aDDEDrealize resonance.Figure 23 A and 235B have provided the equivalent circuit diagram that illustrates that capacitor in series and parallel adds.Figure 24 A, 24B and 24C have provided the circuit diagram of pattern 2 types 2.

In Class1 and type 2, L _pickupand L _feedrefer to respectively and pick up inductor and feedback inductance device.These are coils that inductance is less than the inductance value of MLMT structure, and have certain coupling to MLMT structure.Be coupled variable, to realize remainder transmitted power from from MLMT structure to system or the required matching condition from the remainder of system to MLMT structure transmitted power.For simple and verify that concept, embodiment described herein provide single capacitor C _aDDEDto realize the example of resonance, for the object of illustrating.In side circuit, can use the more complicated circuit that comprises multiple capacitors and/or inductor and/or resistor.Can use all embodiment shown in Figure 22 and 24 at the sender side of system and/or receiver side.

Mode 3: in the time meeting the condition 3 that equation 4 provides, as capacitor

ω ²l _mc _m> 1 equation 4

Compared with existing designing technique, the layout of the unique layer in native system and the lead-in wire segmentation of customization are showing improved systematic function aspect similar and less encapsulation volume, as shown in the quality factor of as high in the quality factor than prior art realized 2 times.By material is combined with particular community, the order of designated shape, length and thickness definition layer, native system allows inductance and quality factor and application-specific pairing, to realize best desirable response, including, but not limited to wirelessly organizing that emulation, wireless remote sensing prospecting technique, wireless module recharge, wireless nondestructive testing, wireless sensor and wireless energy or power management.

Another certain benefits of native system is that it can be by reducing the conductor losses (owing to being called the phenomenon of skin effect) joining with the frequency dependence increasing, for be equal to or less design volume in power and/or data transmission, the more effective means of near field magnetic coupling (NFMC) is provided.The system proposing also provides a solution, this solution can for example, relatively easily realize by existing manufacturing technology (multi-sheet printed terminal block), and therefore can be for example, with other circuit units (, IC, resistor, capacitor, surface mount component etc.) integrated.Other advantages of native system comprise reduction power consumption, thereby the battery life of more being grown (applicable in the situation that), reduce the Joule heating of antenna, reduce the consumption of the environmental resource of facility/equipment, and any other benefit deriving from more effective energy device.

Other application that can benefit from these wireless systems is implantable including, but not limited to medical treatment, medical treatment is not implantable, geographical sensing, oil exploration, syndrome check, portable electron device, military defense and Medical Devices in business, military affairs, space flight, industry and other electronic equipments or device application.Be appreciated that scope of the present invention not only contains any application of benefiting from efficiency increase, and contain any application that may need to use inductance unit.

Although more than described optimal mode and/or other examples, be appreciated that and can carry out various amendments, and can realize theme disclosed herein with various forms and example, and can in various application, apply instruction, only disclose some instructions wherein herein.Be intended to fall into any and all application, amendment and the modification in the true scope of this instruction by paid claim protection.

Claims (16)

1. for a structure for radio communication, comprising:

Multiple conductor layers;

The insulator layer that each conductor layer is separated; And

At least one connector of two or more conductor layers in bonding conductor layer;

Wherein, when be in described structure signal induced electricity in a frequency, resistance can reduce.

2. structure according to claim 1, wherein conductor layer comprises at least one in conductive strips, bus and plated metal.

3. structure according to claim 1 and 2, wherein selects described frequency in the frequency range from 100kHz to 10GHz.

4. according to the structure described in any one in claim 1-3, wherein said frequency is 100kHz to the frequency band in the scope of 10GHz.

5. according to the structure described in any one in claim 1-4, wherein each in multiple conductor layers have parallel towards.

6. according to the structure described in any one in claim 1-5, wherein the number of multiple conductor layers is less than or equal to the sum of layer, and electrical connection in parallel.

7. according to the structure described in any one in claim 1-6, wherein multiple conductor layers of electrical connection in parallel and one or more being electrically connected in series in more than second conductive layer being connected in parallel.

8. according to the structure described in any one in claim 1-7, the wherein said signal of telecommunication comprises at least one in energy signal, electric current, voltage, power signal and data-signal.

9. according to the structure described in any one in claim 1-8, there are the quality factor that are greater than 100.

10. according to the structure described in any one in claim 1-9, also comprise the circuit element of selecting the group from comprising resistor, inductor and capacitor.

11. according to the structure described in any one in claim 1-10, and wherein said conductor layer has shape of cross section, and described shape of cross section is at least one in circular cross section, rectangular cross section, square cross section, triangular cross section and oval cross section.

12. structures according to claim 1, wherein said connector comprises at least one in hole, scolder, joint, lead-in wire, pin, rivet etc.

13. structures according to claim 1, have planform, described planform comprises at least one in the tubular configuration of circular helical, the tubular configuration of square helical, the configuration of round screw thread shape, the configuration of square spiral shape, rectangular arrangement, triangular arrangement, the tubular configuration of round screw thread-helical, the tubular configuration of square spiral-helical and the tubular configuration of conformal helical.

14. structures according to claim 1, wherein multiple conductor layers have at least one circle.

15. structures according to claim 1, wherein form at least one conductor layer by electric conducting material, form at least one insulator layer by electrical insulating material.

16. structures according to claim 1, can also be included at least one the device comprising in resonator, antenna, RFID label, RFID transponder and Medical Devices.