CN104036845A - PCB (Printed Circuit Board) silver paste and manufacturing method thereof - Google Patents
PCB (Printed Circuit Board) silver paste and manufacturing method thereof Download PDFInfo
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- CN104036845A CN104036845A CN201410197300.3A CN201410197300A CN104036845A CN 104036845 A CN104036845 A CN 104036845A CN 201410197300 A CN201410197300 A CN 201410197300A CN 104036845 A CN104036845 A CN 104036845A
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 35
- 239000004332 silver Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title abstract description 4
- 239000000843 powder Substances 0.000 claims abstract description 27
- 239000011521 glass Substances 0.000 claims abstract description 16
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 10
- HIQIXEFWDLTDED-UHFFFAOYSA-N 4-hydroxy-1-piperidin-4-ylpyrrolidin-2-one Chemical compound O=C1CC(O)CN1C1CCNCC1 HIQIXEFWDLTDED-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 7
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims abstract description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 235000002906 tartaric acid Nutrition 0.000 claims abstract description 7
- 239000011975 tartaric acid Substances 0.000 claims abstract description 7
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000002002 slurry Substances 0.000 claims description 38
- 239000000428 dust Substances 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 claims description 9
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 6
- 229920001661 Chitosan Polymers 0.000 claims description 6
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 6
- 229910021538 borax Inorganic materials 0.000 claims description 6
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 6
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000010977 jade Substances 0.000 claims description 6
- 229910052664 nepheline Inorganic materials 0.000 claims description 6
- 239000010434 nepheline Substances 0.000 claims description 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004328 sodium tetraborate Substances 0.000 claims description 6
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 6
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 3
- 229940015043 glyoxal Drugs 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 abstract 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract 1
- WRYLYDPHFGVWKC-SNVBAGLBSA-N 4-Terpineol Natural products CC(C)[C@]1(O)CCC(C)=CC1 WRYLYDPHFGVWKC-SNVBAGLBSA-N 0.000 abstract 1
- WRYLYDPHFGVWKC-UHFFFAOYSA-N 4-terpineol Chemical compound CC(C)C1(O)CCC(C)=CC1 WRYLYDPHFGVWKC-UHFFFAOYSA-N 0.000 abstract 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 abstract 1
- 229920002101 Chitin Polymers 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007613 slurry method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011267 electrode slurry Substances 0.000 description 1
- 239000011440 grout Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a PCB silver paste. The PCB silver paste is manufactured by the following raw material by weight, glass powder 8 to 10, 10 to 15mum flake silver powder 40 to 50, nanoscale flake silver powder 15 to 20, silver coated nickel powder 10 to 15, bisphenol F-type epoxy resin 8 to 12, isopropyl myristate 1 to 2, tartaric acid 1 to 2, sebacic acid 2 to 3, nano chitin 0.3 to 0.5, polyvinyl alcohol 1 to 2, terpineol 4 to 6, 2-methyl imidazole 0.3 to 0.5, butylcarbitol 4 to 6, methyl cellosolve 3 to 5, and butyl carbitol acet 3 to 5. According to the silver paste of the invention, through using flake silver powder different in particle sizes, contact is tight, and conductive performance is good; the cost is saved through using the silver coated nickel powder; the production technology is unique, and silver powder can be prevented from being aggregated to influence the conductvie performance; and the printing performance is good, the circuit board yield is high, falling is not easy, and the use time is long.
Description
Technical field
The invention belongs to electric slurry technical field, relate in particular to a kind of PCB printed circuit board (PCB) silver slurry and preparation method thereof.
Background technology
In modern microelectronics industry, people require more and more higher to electronic devices and components, produce and adopt procedures, standardization to carry out reducing costs more, printed circuit board (PCB) (PCB) is exactly that this demand that is applicable to microelectronics industry is born, the electric slurries such as corresponding conductor paste, electrode slurry, dielectric paste and resistance slurry with regard to the new requirement of demand, grout slurry and printed circuit board (PCB) (PCB) match, and the research of carrying out new conductor paste is also just imperative.
In general, the main component of electric slurry includes function mutually as metal, noble metal powder etc., and inorganic binder is as glass powder, oxide powder etc., organic binder bond, other solvent and additive.Conventionally, function in electric slurry plays electric action mutually, have good electric conductivity, generally by metal dust or noble metal powder, is served as, conventional metal dust has copper powder, aluminium powder, zinc powder, nickel powder etc., and conventional precious metal powder has bronze, silver powder, platinum powder, palladium powder etc.Inorganic binder plays fixedly electric slurry and, to base material, generally by oxide powder and glass powder, is served as, but this composition is lower at the proportion of electric slurry, and what have does not even have; Organic binder bond mainly plays a part to make slurry to have certain shape, is easy to printing or coating, mainly containing macromolecule resin, little molecule resin etc. serves as, along with this part effect in electric slurry of the progress of chemical industry technology is more and more outstanding, especially when being applied to silk screen printing, the composition that changes organic binder bond just can change the printing of electric slurry, dry, sintering character.
In existing electric slurry field, it is high that silver is that slurry has conductance, and stable performance, with the feature such as substrate bond strength is large, is widely used in the production of the electronic devices and components such as integrated circuit, multi-chip module, thin film switch.But silver is precious metal, cost is higher, and the silver powder major part in existing silver paste is micron-sized powder, and the thicknesses of layers of the slurry that it is made, printing performance etc. have significant limitation for present high-end precision instrument; On the other hand, printed circuit board (PCB) adopted printing conductive copper slurry to make conducting wire more in the past, but it is easily oxidized to exist conductive copper paste, and in the useful life of having reduced printed circuit board (PCB), conductive copper paste can not be printed as meticulousr circuit.Therefore size, shape, the kind that need to study metal dust in electrocondution slurry reduce costs, improve conductance to realize, improve the object of printing accuracy.
Binding agent in conductive silver paste has a significant impact for the rate of finished products of circuit printing, such as volatility of viscosity, caking property, adhesive force, levelability, film forming, solvent etc., all can impact the printing performance of circuit, there is pore, the phenomenon such as open circuit, also there will be sometimes organic substance volatilized after glassy phase not yet start to melt, the phenomenon that causes conducting wire to come off from stock, scraps conducting wire, so the performance need of organic binder bond improves.
At present a lot of inorganic binders adopt glass dust, glass dust is made by materials such as metal oxide, silica, if fusing point is too high, also occur organic substance volatilized after glassy phase not yet start to melt, the phenomenon that the conducting wire that causes being obtained by conductive silver paste comes off from stock, scraps conducting wire; And in current glass dust, much contain the harmful substances such as plumbous, and unfavorable to environment, therefore need to develop the glass dust that performance is more excellent.
Summary of the invention
The object of the present invention is to provide a kind of PCB printed circuit board (PCB) silver slurry and preparation method thereof, this silver slurry good conductivity, has saved cost, and printing performance is good, and circuit board rate of finished products is high, difficult drop-off, and service time is long.
Technical scheme of the present invention is as follows:
A kind of PCB printed circuit board (PCB) silver slurry, is characterized in that being made by the raw material of following weight portion: glass dust 8-10,10-15 μ m flake silver powder 40-50, nano-grade silver powder 15-20, silver coated nickel powder 10-15, bisphenol f type epoxy resin 8-12, isopropyl myristate 1-2, tartaric acid 1-2, decanedioic acid 2-3, nano-chitosan 0.3-0.5, polyvinyl alcohol 1-2, terpinol 4-6, glyoxal ethyline 0.3-0.5, fourth carbitol 4-6, methyl cellosolve 3-5, fourth carbitol acetate 3-5;
Described glass dust is made by the raw material of following weight portion: borax 15-17, SiO
26-9, Bi
2o
320-25, A1
2o
35-8, Li
2o 3-5, MgO3-6, NaF2-4, TiO
23-6, ZnO4-7, K
2o1-2, anoxic cerium oxide 1-2, nepheline powder 2-4, nanometer jade powder 2-5; Preparation method is: by borax, SiO
2, Bi
2o
3, A1
2o
3, Li
2o, MgO, NaF, TiO
2, ZnO, K
2o, anoxic cerium oxide mix, put into crucible and become liquid 1100-1400 ℃ of heat fused, after stirring, carry out vacuum defoamation, vacuum degree is 0.10-0.14MPa, and the deaeration time is 6-9 minute, then pours in mould and shape, carry out again shrend, send in ball mill and pulverize, sieve, obtain 2-6 μ m powder, then mix with nepheline powder, nanometer jade powder, obtain.
The preparation method of described PCB printed circuit board (PCB) silver slurry, is characterized in that comprising the following steps:
(1) terpinol, fourth carbitol, polyvinyl alcohol, methyl cellosolve, fourth carbitol acetate, decanedioic acid, isopropyl myristate are mixed, add bisphenol f type epoxy resin, be heated to 80-83 ℃, being stirred to resin all dissolves, add again nano-chitosan to stir, with 500 object gauzes, filter, remove impurity and obtain organic carrier;
(2) glass dust, tartaric acid are mixed, under 5000-7000 rev/min of stirring, add 10-15 μ m flake silver powder, stir 10-20 minute, add again nano-grade silver powder, silver coated nickel powder, stir 10-20 minute, then add in organic carrier together with other residual componentss, in ball mill, mix and disperse 10-15 minute, ultrasonic dispersion 8-12 minute, obtains uniform slurry again;
(3) slurry step (2) being obtained carries out vacuum defoamation, and vacuum degree is 0.04-0.06MPa, and the deaeration time is 8-12 minute, then in three-high mill, grinds, rolling, reaches 3-5 micron to silver slurry fineness, obtains.
Beneficial effect of the present invention
Silver slurry of the present invention, by using the flake silver powder of different-grain diameter, makes contact closely, good conductivity; By using silver coated nickel powder, saved cost; The production technology of the present invention's silver slurry is unique, can prevent silver powder reunion and affect conductivity; Silver slurry printing performance of the present invention is good, and circuit board rate of finished products is high, difficult drop-off, and service time is long.
Embodiment
A kind of PCB printed circuit board (PCB) silver slurry, by following weight portion (kilogram) raw material make: glass dust 9,13 μ m flake silver powders 45, nano-grade silver powder 18, silver coated nickel powder 13, bisphenol f type epoxy resin 10, isopropyl myristate 1.5, tartaric acid 1.5, decanedioic acid 2.5, nano-chitosan 0.4, polyvinyl alcohol 1.5, terpinol 5, glyoxal ethyline 0.4, fourth carbitol 5, methyl cellosolve 4, fourth carbitol acetate 4;
Described glass dust by following weight portion (kilogram) raw material make: borax 16, SiO
27, Bi
2o
323, A1
2o
36, Li
2o 4, MgO 5, NaF 3, TiO
24, ZnO 6, K
2o 1.5, anoxic cerium oxide 1.5, nepheline powder 3, nanometer jade powder 3; Preparation method is: by borax, SiO
2, Bi
2o
3, A1
2o
3, Li
2o, MgO, NaF, TiO
2, ZnO, K
2o, anoxic cerium oxide mix, put into crucible and become liquid 1200 ℃ of heat fused, after stirring, carry out vacuum defoamation, vacuum degree is 0.13MPa, and the deaeration time is 7 minutes, then pours in mould and shape, carry out again shrend, send in ball mill and pulverize, sieve, obtain 3 μ m powder, then mix with nepheline powder, nanometer jade powder, obtain.
The preparation method of described PCB printed circuit board (PCB) silver slurry, comprises the following steps:
(1) terpinol, fourth carbitol, polyvinyl alcohol, methyl cellosolve, fourth carbitol acetate, decanedioic acid, isopropyl myristate are mixed, add bisphenol f type epoxy resin, be heated to 82 ℃, being stirred to resin all dissolves, add again nano-chitosan to stir, with 500 object gauzes, filter, remove impurity and obtain organic carrier;
(2) glass dust, tartaric acid are mixed, under 6000 revs/min of stirrings, add 13 μ m flake silver powders, stir 15 minutes, add again nano-grade silver powder, silver coated nickel powder, stir 15 minutes, then add in organic carrier together with other residual componentss, in ball mill, mix and disperse 13 minutes, ultrasonic dispersion is 10 minutes again, obtains uniform slurry;
(3) slurry step (2) being obtained carries out vacuum defoamation, and vacuum degree is 0.05MPa, and the deaeration time is 10 minutes, then in three-high mill, grinds, rolling, reaches 4 microns to silver slurry fineness, obtains.
Test data:
The silver slurry that the present embodiment is obtained is printed onto on PCB circuit board by the mode of silk screen printing, is then warming up at 630 ℃ and solidifies and form conducting wire in 6 minutes, thereby obtain conducting wire plate.The wiring width that records conducting wire is 0.5mm, average film thickness 5 μ m, and wire distribution distance is 0.7mm, resistivity is 4.8 * 10
-5Ω m.
Producing in the manner described above 1000 of conducting wire plates in batches, is combined well with PCB circuit board in conducting wire, and svelteness continuously, has the conducting wire of 2 circuit boards to come off from stock, rate of finished products 99.8%.
Claims (2)
1. a PCB printed circuit board (PCB) silver slurry, is characterized in that being made by the raw material of following weight portion: glass dust 8-10,10-15 μ m flake silver powder 40-50, nano-grade silver powder 15-20, silver coated nickel powder 10-15, bisphenol f type epoxy resin 8-12, isopropyl myristate 1-2, tartaric acid 1-2, decanedioic acid 2-3, nano-chitosan 0.3-0.5, polyvinyl alcohol 1-2, terpinol 4-6, glyoxal ethyline 0.3-0.5, fourth carbitol 4-6, methyl cellosolve 3-5, fourth carbitol acetate 3-5;
Described glass dust is made by the raw material of following weight portion: borax 15-17, SiO
26-9, Bi
2o
320-25, A1
2o
35-8, Li
2o 3-5, MgO3-6, NaF2-4, TiO
23-6, ZnO4-7, K
2o1-2, anoxic cerium oxide 1-2, nepheline powder 2-4, nanometer jade powder 2-5; Preparation method is: by borax, SiO
2, Bi
2o
3, A1
2o
3, Li
2o, MgO, NaF, TiO
2, ZnO, K
2o, anoxic cerium oxide mix, put into crucible and become liquid 1100-1400 ℃ of heat fused, after stirring, carry out vacuum defoamation, vacuum degree is 0.10-0.14MPa, and the deaeration time is 6-9 minute, then pours in mould and shape, carry out again shrend, send in ball mill and pulverize, sieve, obtain 2-6 μ m powder, then mix with nepheline powder, nanometer jade powder, obtain.
2. the preparation method that PCB printed circuit board (PCB) silver according to claim 1 is starched, is characterized in that comprising the following steps:
(1) terpinol, fourth carbitol, polyvinyl alcohol, methyl cellosolve, fourth carbitol acetate, decanedioic acid, isopropyl myristate are mixed, add bisphenol f type epoxy resin, be heated to 80-83 ℃, being stirred to resin all dissolves, add again nano-chitosan to stir, with 500 object gauzes, filter, remove impurity and obtain organic carrier;
(2) glass dust, tartaric acid are mixed, under 5000-7000 rev/min of stirring, add 10-15 μ m flake silver powder, stir 10-20 minute, add again nano-grade silver powder, silver coated nickel powder, stir 10-20 minute, then add in organic carrier together with other residual componentss, in ball mill, mix and disperse 10-15 minute, ultrasonic dispersion 8-12 minute, obtains uniform slurry again;
(3) slurry step (2) being obtained carries out vacuum defoamation, and vacuum degree is 0.04-0.06MPa, and the deaeration time is 8-12 minute, then in three-high mill, grinds, rolling, reaches 3-5 micron to silver slurry fineness, obtains.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410197300.3A CN104036845B (en) | 2014-05-12 | A kind of PCB printed circuit board (PCB) silver slurry and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410197300.3A CN104036845B (en) | 2014-05-12 | A kind of PCB printed circuit board (PCB) silver slurry and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104036845A true CN104036845A (en) | 2014-09-10 |
| CN104036845B CN104036845B (en) | 2016-11-30 |
Family
ID=
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104392765A (en) * | 2014-10-17 | 2015-03-04 | 阜阳市节源照明电器有限责任公司 | Silicon-nitride-contained oxidation-resistant conductive silver paste and manufacturing method thereof |
| CN104934096A (en) * | 2015-05-25 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Environment-friendly circuit board conductive silver paste and preparation method thereof |
| CN104952514A (en) * | 2015-05-25 | 2015-09-30 | 铜陵宏正网络科技有限公司 | Easily printed PCB (printed circuit board) silver paste and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101609850A (en) * | 2009-07-14 | 2009-12-23 | 中南大学 | Lead-free silver conductor paste for front electrode of solar cell and preparation process thereof |
| CN102222536A (en) * | 2011-03-28 | 2011-10-19 | 彩虹集团公司 | Environment-friendly silver conductive paste for surface mounting of semiconductor chips and preparation method of environment-friendly silver conductive paste |
| CN102831949A (en) * | 2012-08-24 | 2012-12-19 | 合肥中南光电有限公司 | Efficient lead-free silver paste on back of solar cell and preparation method of silver paste |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101609850A (en) * | 2009-07-14 | 2009-12-23 | 中南大学 | Lead-free silver conductor paste for front electrode of solar cell and preparation process thereof |
| CN102222536A (en) * | 2011-03-28 | 2011-10-19 | 彩虹集团公司 | Environment-friendly silver conductive paste for surface mounting of semiconductor chips and preparation method of environment-friendly silver conductive paste |
| CN102831949A (en) * | 2012-08-24 | 2012-12-19 | 合肥中南光电有限公司 | Efficient lead-free silver paste on back of solar cell and preparation method of silver paste |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104392765A (en) * | 2014-10-17 | 2015-03-04 | 阜阳市节源照明电器有限责任公司 | Silicon-nitride-contained oxidation-resistant conductive silver paste and manufacturing method thereof |
| CN104934096A (en) * | 2015-05-25 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Environment-friendly circuit board conductive silver paste and preparation method thereof |
| CN104952514A (en) * | 2015-05-25 | 2015-09-30 | 铜陵宏正网络科技有限公司 | Easily printed PCB (printed circuit board) silver paste and preparation method thereof |
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