CN104032295B - A kind of copper bar plastics processing method - Google Patents
A kind of copper bar plastics processing method Download PDFInfo
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- CN104032295B CN104032295B CN201410200065.0A CN201410200065A CN104032295B CN 104032295 B CN104032295 B CN 104032295B CN 201410200065 A CN201410200065 A CN 201410200065A CN 104032295 B CN104032295 B CN 104032295B
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- copper bar
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Abstract
1), cleaning oil removing the invention discloses a kind of copper bar plasticizing process that increases copper cable and epoxy resin adhesion that is applied to, comprise step:: the dirty and grease to copper bar surface is removed; 2), microetch: by chemical method, microetch is carried out in copper bar surface, increase the response area of copper bar and plasticiser; 3), plasticizing: passing through copper bar surface deposition one deck BTA of microetch and 2,4-dichloro benzyl benzimidazole and react with copper the azoles copper mixture of generation, having stronger adhesion between this layer of azoles copper mixture and epoxy resin. Can be directly and epoxy resin pressing through the copper bar of processing of the present invention, compared with traditional blasting craft, save water power, reduce a large amount of artificial uses, improve production efficiency, and avoided dust and noise pollution.
Description
Technical field
The present invention relates to a kind of copper bar plastics processing method that increases copper cable and epoxy resin adhesion that is applied to.
Background technology
Nowadays, growing along with electrical equipment cable industry, there is higher requirement functional, appearance requirement, antiseptic power and the environmental protection aspect of market to industrial products, so to also having proposed the higher requirement for copper bar and epoxy resin adhesion in the technique in copper cable external pressure cyclization epoxy resins. General way is sandblast on copper bar at present, and the roughness that increases copper bar surface with this is for improving the adhesion of copper bar and epoxy resin, and this technique can cause a large amount of dust and noise pollution. Therefore, a kind of environment-friendly type technique that can meet copper bar and epoxy resin adhesion and can reduce again pollution of market active demand.
Summary of the invention
The object of the present invention is to provide a kind of environment-friendly type copper bar plastics processing technique that can meet copper bar and epoxy resin adhesion.
A kind of copper bar plastics processing method of the present invention, comprises the steps:
(1) copper bar cleans oil removing: adopt a pair of copper bar of mixed solution of sulfuric acid, polyvinylbenzenesulfonic acid, citric acid and pure water to clean oil removing;
(2) copper bar microetch: use the mixed solution two of sodium peroxydisulfate, sulfuric acid and pure water to carry out microetch to copper bar; Adopt chemical method to carry out microetch to copper bar surface;
(3) copper bar plasticizing: use acetic acid, BTA, 2, the mixed solution three of 4-dichloro benzyl benzimidazole, HEDTA and pure water plastifies copper bar.
The weight of the described mixed solution one of preferred steps (1) consists of: 3%-5% sulfuric acid, 1%-5% polyvinylbenzenesulfonic acid, 1%-10% citric acid, all the other are pure water; And in described mixed solution one, contain 1.3%-2.6% polyvinylbenzenesulfonic acid the best, deoiling effect the best of copper bar can be made in this scope, and chemical residues can not be increased.
The weight of the described mixed solution two of preferred steps (2) consists of: 5%-20% sodium peroxydisulfate, 1%-20% sulfuric acid, all the other are pure water.
The weight of the described mixed solution three of preferred steps (3) consists of: 1%-10% acetic acid, 1%-5% BTA, 1%-5%2,4-dichloro benzyl benzimidazole, 0.1%-2%HEDTA(N-beta-hydroxy ethyl-3-acetic acid ethylenediamine), all the other are pure water; And preferred, the weight of described mixed solution three consists of: 1%-10% acetic acid, 2%-2.5% BTA, 2%-2.5%2, and 4-dichloro benzyl benzimidazole, 0.4%-0.6%HEDTA, all the other are pure water; The plasticizing even film layer that can make copper bar in this scope, adhesion is better, and HEDTA can be at utmost and complexing of metal ion, can make not to be subject to metal ion disturbance in the plasticizing process of copper bar.
Described 2, the weight ratio of 4-dichloro benzyl benzimidazole and BTA is preferably 1:1.2-1.2:1, can make the plasticizing even film layer of copper bar, adhesion the best in this scope.
Preferably, clean after oil removing and first wash carrying out step (1), and then carry out step (2), after the described copper bar of step (2) microetch, first wash, and then carry out step (3), after the described copper bar plasticizing of step (3), first wash, and then carry out drying and processing.
The processing method that described copper bar cleans oil removing, copper bar microetch and the plasticizing of copper bar all refer to normal temperature, in corresponding mixed solution immersion treatment, the processing time was at 0.5 ~ 6 minute.
The present invention mainly comprises step (1), cleans oil removing: the dirty and grease to copper bar surface is removed; Step (2), microetch: by chemical method, microetch is carried out in copper bar surface, increase the response area of copper bar and plasticiser; And step (3), plasticizing: react generation copper azole compounds with copper at the copper bar surface deposition one deck BTA and 2, the 4-dichloro benzyl benzimidazole that pass through microetch, between itself and epoxy resin, have stronger adhesion.
Reaction principle of the present invention: first clean oil removing on copper face, again copper face is carried out to microetch, to increase response area, finally make BTA and 2 by plasticizing solution, 4-dichloro benzyl benzimidazole is combined with copper and is generated copper azole compounds, itself and epoxy resin have good compatibility, have good adhesion in pressing process.
Method of the present invention can the method with chemical deposition deposit last layer copper and organic binder course on copper bar, this binder course is when copper is combined closely also can have good compatibility with epoxy resin, thereby copper and epoxy resin are combined closely in the process of die casting, reach required adhesion and meet electric property requirement. Adopt processing copper bar plasticizing process of the present invention, compared with traditional blasting craft, reduced water power consumption, reduced human cost simultaneously, improved production efficiency, and avoided dust and noise pollution.
Detailed description of the invention
Following embodiment is further illustrating using the explaination as to the technology of the present invention content for content of the present invention; but flesh and blood of the present invention is not limited in described in following embodiment, those of ordinary skill in the art can and should know any simple change or replacement based on connotation of the present invention all should belong to protection domain of the presently claimed invention.
Embodiment 1
In implementing copper bar plasticizing process processing copper cable bar, generally all need through cleaning oil removing → washing → microetch → washing → plasticizing → washing → several steps such as oven dry, 25 DEG C of the treatment temperatures of each step, 5 minutes processing times. Concrete treatment process is as follows:
(1) copper bar cleans oil removing: adopt the copper bar cleaning degreaser (being mixed solution one) of sulfuric acid, polyvinylbenzenesulfonic acid, citric acid and pure water to clean oil removing to copper bar; Then wash 1-3 time with pure water;
(2) copper bar microetch: use the copper bar micro-etching agent (being mixed solution two) of sodium peroxydisulfate, sulfuric acid and pure water to carry out microetch to copper bar; Then wash 1-3 time with pure water;
(3) copper bar plasticizing: use acetic acid, BTA, 2, the copper bar plasticiser (being mixed solution three) of 4-dichloro benzyl benzimidazole, HEDTA and pure water plastifies copper bar; Then wash 1-3 time with pure water;
The copper bar using cleans degreaser, and concrete consumption sees the following form shown in 1.
Table 1
| Component | Consumption | Kind and effect |
| Sulfuric acid | 50g/L | Activation |
| Polyvinylbenzenesulfonic acid | 25g/L | Clean |
| Citric acid | 74g/L | Clean |
The copper bar micro-etching agent using, concrete consumption sees the following form shown in 2.
Table 2
| Component | Consumption | Kind and effect |
| Sodium peroxydisulfate | 120g/L | Micro-etching agent |
| Sulfuric acid | 176g/L | H ion is provided |
The copper bar plasticiser using, concrete consumption sees the following form shown in 3.
Table 3
| Component | Consumption | Kind and effect |
| Acetic acid | 60g/L | PH adjusting agent |
| BTA | 20g/L | Plasticiser |
| 2,4-dichloro benzyl benzimidazole | 20g/L | Plasticiser |
| HEDTA | 5ml/L | Complexing agent |
After finishing dealing with, pass through again epoxy resin pressing, (adhesion grade is divided into 0-5 level to reach 0 grade with the adhesion of ASTMD3359-87 standard detection copper bar and epoxy resin, 0 grade best), and adopting the first sandblast of conventional copper bar again when the mode of pressing epoxy resin, the adhesion that detects copper bar and epoxy resin is 2 grades.
Embodiment 2
Adopt embodiment 1 treatment process, difference is the composition difference that copper bar cleans degreaser, copper bar micro-etching agent, copper bar plasticiser, each step specifically composed as follows:
The copper bar using cleans degreaser, and concrete consumption sees the following form shown in 4.
Table 4
| Component | Consumption | Kind and effect |
| Sulfuric acid | 30g/L | Activation |
| Polyvinylbenzenesulfonic acid | 45g/L | Clean |
| Citric acid | 20g/L | Clean |
The copper bar micro-etching agent using, concrete consumption sees the following form shown in 5.
Table 5
| Component | Consumption | Kind and effect |
| Sodium peroxydisulfate | 160g/L | Micro-etching agent |
| Sulfuric acid | 100g/L | H ion is provided |
The copper bar plasticiser using, concrete consumption sees the following form shown in 6.
Table 6
| Component | Consumption | Kind and effect |
| Acetic acid | 20g/L | PH adjusting agent |
| BTA | 40g/L | Plasticiser |
| 2,4-dichloro benzyl benzimidazole | 40g/L | Plasticiser |
| HEDTA | 12ml/L | Complexing agent |
After finishing dealing with, pass through again epoxy resin pressing, (adhesion grade is divided into 0-5 level to reach 1 grade with the adhesion of ASTMD3359-87 standard detection copper bar and epoxy resin, 0 grade best), and adopting the first sandblast of conventional copper bar again when the mode of pressing epoxy resin, the adhesion that detects copper bar and epoxy resin is 2 grades.
Claims (6)
1. a copper bar plastics processing method, comprises the steps:
(1) copper bar cleans oil removing: a pair of copper of mixed solution that adopts sulfuric acid, polyvinylbenzenesulfonic acid, citric acid and pure waterBar cleans oil removing;
(2) copper bar microetch: use the mixed solution two of sodium peroxydisulfate, sulfuric acid and pure water to carry out microetch to copper bar;
(3) copper bar plasticizing: use acetic acid, BTA, 2,4-dichloro benzyl benzimidazole, HEDTA and pure waterMixed solution three plastifies copper bar;
The weight of the described mixed solution one of step (1) consists of: 3%-5% sulfuric acid, 1.3%-2.6% polyvinyl benzeneSulfonic acid, 1%-10% citric acid, all the other are pure water;
The weight of the described mixed solution two of step (2) consists of: 5%-20% sodium peroxydisulfate, 1%-20% sulfuric acid, itsRemaining is pure water;
The weight of the described mixed solution three of step (3) consists of: 1%-10% acetic acid, 1%-5% BTA,1%-5%2,4-dichloro benzyl benzimidazole, 0.1%-2%HEDTA, all the other are pure water.
2. copper bar plastics processing method as claimed in claim 1, is characterized in that, the weight composition of described mixed solution threeFor: 1%-10% acetic acid, 2%-2.5% BTA, 2%-2.5%2,4-dichloro benzyl benzimidazole, 0.4%-0.6%HEDTA, all the other are pure water.
3. copper bar plastics processing method as claimed in claim 1 or 2, is characterized in that, described 2,4-dichloro benzyl benzo miaowThe weight ratio of azoles and BTA is 1:1.2-1.2:1.
4. copper bar plastics processing method as claimed in claim 1, is characterized in that, after the described cleaning oil removing of step (1) firstWash, and then carry out step (2).
5. copper bar plastics processing method as claimed in claim 1, is characterized in that, after the described copper bar of step (2) microetch firstWash, and then carry out step (3).
6. copper bar plastics processing method as claimed in claim 1, is characterized in that, after the described copper bar plasticizing of step (3) firstWash, and then carry out drying and processing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410200065.0A CN104032295B (en) | 2014-05-13 | 2014-05-13 | A kind of copper bar plastics processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410200065.0A CN104032295B (en) | 2014-05-13 | 2014-05-13 | A kind of copper bar plastics processing method |
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| CN104032295A CN104032295A (en) | 2014-09-10 |
| CN104032295B true CN104032295B (en) | 2016-05-18 |
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Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
| US6423200B1 (en) * | 1999-09-30 | 2002-07-23 | Lam Research Corporation | Copper interconnect seed layer treatment methods and apparatuses for treating the same |
| CN100497751C (en) * | 2005-12-28 | 2009-06-10 | 无锡华润安盛科技有限公司 | Weak corrosive agent of external lead wire of electronic device |
| CN102523680B (en) * | 2011-12-27 | 2014-03-19 | 深圳市华傲创表面技术有限公司 | Organic solderability preservative (OSP) on surface of printed circuit board and presoaking stock and method for manufacturing OSP |
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Effective date of registration: 20180821 Address after: 514329 Jintian Road, Tang Keng Town, Fengshun County, Meizhou, Guangdong Patentee after: Fengshun County Da Sen Technology Co., Ltd. Address before: 230088 Room 403, building 4, software park, Tian Tong Road, Hefei, Anhui, China, 14 Patentee before: Hefei Aofu Surface Treatment Technology Co., Ltd. |
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Effective date of registration: 20191211 Address after: Room 309, building 02, northwest area, Suzhou nano City, No. 99, Jinjihu Avenue, Suzhou Industrial Park, Suzhou, 215224, Jiangsu Province Patentee after: Suzhou Megina Nanomaterials Technology Co., Ltd. Address before: 514329 Jintian Road, Tang Keng Town, Fengshun County, Meizhou, Guangdong Patentee before: Fengshun County Da Sen Technology Co., Ltd. |