CN102776496B - Tin layer anti-blushing agent for high-temperature backflow as well as preparation method and use method of tin layer anti-blushing agent - Google Patents
Tin layer anti-blushing agent for high-temperature backflow as well as preparation method and use method of tin layer anti-blushing agent Download PDFInfo
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- CN102776496B CN102776496B CN201210118268.6A CN201210118268A CN102776496B CN 102776496 B CN102776496 B CN 102776496B CN 201210118268 A CN201210118268 A CN 201210118268A CN 102776496 B CN102776496 B CN 102776496B
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Abstract
The invention discloses a tin layer anti-blushing agent for high-temperature backflow. The tin layer anti-blushing agent for high-temperature backflow comprises the following ingredients in the content: 30 to 100g/L of sodium hydroxide, 40 to 80g/L of ethylene diamine tetraacetic acid, 30 to 120ml/L of phosphoric acid and the balance water, and the pH value is 4.0 to 5.0. The tin layer anti-blushing agent for high-temperature backflow provided by the invention has the advantages that the anti-blushing and corrosion prevention effects are excellent; safety and environment protection are realized, the recipe substances completely conform to the environment protection requirement, the product is stable, and the treatment of wastes generated in the use process is also very convenient; and the process is simple, the cost is low, and the use is convenient.
Description
Technical field
The present invention relates to the anti-toner in a kind of metallic surface, particularly tin layer anti-blushing agent and preparation method thereof for a kind of high temperature reflux.
Background technology
After zinc-plated the completing of the former device of electronic product such as semiconductor packages, pcb board printing, Passive components, in high temperature (265 ℃) Reflow Soldering, deposit in process, can there is metachromatism (yellow) because of the impact of multiple extraneous factor (particularly temperature, humidity etc.) in tin layer, thereby can affect the outward appearance of product and weldability etc., so product generally all needs to carry out corresponding aftertreatment technology.
At present, World PCB industry production value reaches 45,000,000,000 dollars every year, is only second to semicon industry in electron trade, and the rate of growth of China has cost and the market advantage.PCB industry, due to the impact that shifted by cost and downstream industry, is transferred to China just gradually, and worldwide China is the PCB market of tool growth.Meanwhile, due to the unique status of PCB in electronics basic industry, become most active industry in contemporary electronic component industry.
CPU and other ultra-large type unicircuit are at development, and the packing forms of unicircuit is also constantly made corresponding adjustment and changed, and the progress of packing forms will promote chip technology to advance conversely.The development of semiconductor packages impels the demand rapid growth of tin layer anti-blushing agent.
Passive components comprises resistance, electric capacity, inductance, coil and magnetics etc., and the output value in recent years has reached 22,000,000,000 dollars.The high growth of Passive components has further promoted the demand of tin layer anti-blushing agent.As can be seen here, the market demand of tin layer anti-blushing agent is huge.
At present the product of the outstanding tin anti-blushing agent basic Shi You U.S. and German Ji Jia offshore company occupies principal market, and core technology is also to rest in their hand.At present domesticly substantially with tertiary sodium phosphate, carry out the effect that alkaline neutralizing treatment reaches the anti-variable color of tin layer, but effect is undesirable, and is difficult for cleaning up the alkaline matter of remained on surface, so that product is subject to certain impact at the aspects such as weldability in later stage.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides tin layer anti-blushing agent for a kind of high temperature reflux, satisfactory for result, be easy to clean, can anti-backflow after product variable color, molten tin, extend shelf-time of product, improve the corrosion resistance nature of coating.
Technical scheme: for solving the problems of the technologies described above, the technical solution used in the present invention is: tin layer anti-blushing agent for a kind of high temperature reflux, it is characterized in that: after being mixed by sodium hydroxide, ethylenediamine tetraacetic acid (EDTA), phosphoric acid and water, form, its each component concentration is: sodium hydroxide 30～100g/L, ethylenediamine tetraacetic acid (EDTA) 40～80g/L, phosphoric acid 30～120ml/L, all the other are water.
Described high temperature reflux is 4.0～5.0 with tin layer anti-blushing agent pH.
The present invention also provides the preparation method of described high temperature reflux with tin layer anti-blushing agent, and its feature is comprising the following steps: the water that adds 2/3 amount in container; In situation about stirring, add sodium hydroxide, to dissolving completely; In situation about stirring, at the uniform velocity add ethylenediamine tetraacetic acid (EDTA), to dissolving completely, continue to stir 5～10 minutes; In situation about stirring, at the uniform velocity add phosphoric acid, after completing, continuation is stirred 5～10 minutes; Moisturizing, to aequum, stirs.
The present invention also provides the using method of described high temperature reflux with tin layer anti-blushing agent, first described high temperature reflux is diluted with water to 4～12 times with tin layer anti-blushing agent, then product is put into, and soaks 10-90 and takes out after second, cleans and dries.
Beneficial effect: high temperature reflux of the present invention adopts unique huge legendary turtle to close inhibition principle and becomes membranization principle with tin layer anti-blushing agent, reaction forms the synthetic film mixed system of huge legendary turtle, during tin coating aftertreatment, need only a small amount of solution soak at room temperature 10-90 second of using anti-blushing agent, make product surface form special huge legendary turtle and close rete, clean and to dry the nondiscoloration when doing high temperature (265 ℃) reflow soldering and bad storage condition (as high in temperature, high humidity etc.) of rear tin coating, there is splendid anti-variable color, anticorrosion ability; Safety and environmental protection, the refuse that formula material meets that environmental requirement, product are stable completely, produce in use procedure is processed also very convenient; Technique is simple, and low cost is easy to use.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
Embodiment 1: prepare tin layer anti-blushing agent for high temperature reflux
In following ratio, carry out the proportioning of each component: sodium hydroxide 30g/L, ethylenediamine tetraacetic acid (EDTA) 40g/L, phosphoric acid 30ml ml/L, surplus is water.
The preparation process of this embodiment is: according to said components content, add the water of 2/3 amount in container; In situation about stirring, add sodium hydroxide, to dissolving completely; In situation about stirring, at the uniform velocity add ethylenediamine tetraacetic acid (EDTA), to dissolving completely, continue to stir 5～10 minutes; In situation about stirring, at the uniform velocity add phosphoric acid, after completing, continuation is stirred 5～10 minutes; Moisturizing, to aequum, stirs.
The using method of this embodiment is: first described high temperature reflux is diluted with water to 4 times with tin layer anti-blushing agent, then product is put into, soak and take out afterwards for 10 seconds, clean and dry.Test effect is that huge legendary turtle is closed even film layer densification, and it is good that product is deposited anti-color changeable effect, Reflow Soldering nondiscoloration in 5 minutes.
Embodiment 2-5
By each component concentration of appointment in following table 1, repeat the method for EXPERIMENTAL EXAMPLE 1, obtain the tin layer anti-blushing agent for high temperature reflux of different components, experimental result is as shown in table 1.
Table 1 embodiment tests design parameter
From the test result shown in table 1, can find out, high temperature reflux provided by the invention can done high temperature (265 ℃) reflow soldering with tin layer anti-blushing agent, and nondiscoloration during bad storage condition (as high in temperature, high humidity etc.), there is splendid anti-variable color, anticorrosion ability.
When using this product, should avoid acidity or basic solution to bring into, after operation, should wash one's hands, working space and storage repository must be ventilated, and should avoid and skin contact, or splash in eyes.In use, according to analysis, add, or when the pH of solution value is greater than 5, add stoste.Generally, according to output, safeguard, suggestion is changed once weekly.Waste liquid with in alkali and after, can normally be disposed to wastewater treatment place.
Claims (4)
1. tin layer anti-blushing agent for high temperature reflux, it is characterized in that: by sodium hydroxide, ethylenediamine tetraacetic acid (EDTA), phosphoric acid and water, formed, its each component concentration is: sodium hydroxide 30-100 g/L, ethylenediamine tetraacetic acid (EDTA) 40-80 g/L, phosphoric acid 30-120 ml/L, all the other are water.
2. tin layer anti-blushing agent for high temperature reflux according to claim 1, is characterized in that: high temperature reflux is 4.0-5.0 by the pH value of tin layer anti-blushing agent.
3. a preparation method for tin layer anti-blushing agent for high temperature reflux described in claim 1 or 2, its feature is comprising the following steps: the water that adds 2/3 amount in container;
In situation about stirring, by proportioning, add sodium hydroxide, to dissolving completely;
In situation about stirring, by proportioning, at the uniform velocity add ethylenediamine tetraacetic acid (EDTA), to dissolving completely, continue to stir 5～10 minutes;
In situation about stirring, by proportioning, at the uniform velocity add phosphoric acid, after completing, continuation is stirred 5～10 minutes;
Moisturizing, to aequum, stirs.
4. the using method of tin layer anti-blushing agent for high temperature reflux described in claim 1 or 2, it is characterized in that comprising the following steps: first by 4～12 times of tin layer anti-blushing agent dilute with waters for described high temperature reflux, then product is put into, soak at room temperature 10-90 took out after second, cleaned and dried.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210118268.6A CN102776496B (en) | 2012-04-20 | 2012-04-20 | Tin layer anti-blushing agent for high-temperature backflow as well as preparation method and use method of tin layer anti-blushing agent |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210118268.6A CN102776496B (en) | 2012-04-20 | 2012-04-20 | Tin layer anti-blushing agent for high-temperature backflow as well as preparation method and use method of tin layer anti-blushing agent |
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| CN102776496A CN102776496A (en) | 2012-11-14 |
| CN102776496B true CN102776496B (en) | 2014-03-05 |
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| CN201210118268.6A Active CN102776496B (en) | 2012-04-20 | 2012-04-20 | Tin layer anti-blushing agent for high-temperature backflow as well as preparation method and use method of tin layer anti-blushing agent |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105696033B (en) * | 2016-03-04 | 2018-03-02 | 昆山艾森半导体材料有限公司 | A kind of electrotinning additive and preparation method thereof and application method |
| CN111636083B (en) * | 2020-06-05 | 2022-08-12 | 江苏艾森半导体材料股份有限公司 | Protective agent for preventing high-temperature reflow soldering from tin gathering, and preparation method and use method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW561192B (en) * | 1999-06-22 | 2003-11-11 | Hon Hai Prec Ind Co Ltd | Post treatment process for electroplated tin or tin-lead alloy |
| CN1924091A (en) * | 2005-08-22 | 2007-03-07 | 罗门哈斯电子材料有限公司 | Aqueous solution for surface treatment of tin films and method for preventing discoloration of a tin film surface |
| CN101104932A (en) * | 2007-08-09 | 2008-01-16 | 武汉钢铁(集团)公司 | Tin plate sheet chromium-free deactivation liquid |
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2012
- 2012-04-20 CN CN201210118268.6A patent/CN102776496B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW561192B (en) * | 1999-06-22 | 2003-11-11 | Hon Hai Prec Ind Co Ltd | Post treatment process for electroplated tin or tin-lead alloy |
| CN1924091A (en) * | 2005-08-22 | 2007-03-07 | 罗门哈斯电子材料有限公司 | Aqueous solution for surface treatment of tin films and method for preventing discoloration of a tin film surface |
| CN101104932A (en) * | 2007-08-09 | 2008-01-16 | 武汉钢铁(集团)公司 | Tin plate sheet chromium-free deactivation liquid |
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Address after: Huangpu Road, Qiandeng Town Kunshan city Suzhou City, Jiangsu Province, No. 1647 215000 Patentee after: Jiangsu Essen semiconductor materials Limited by Share Ltd Address before: No. 999 Huangpu River Road, Kunshan, Jiangsu Province Patentee before: ASEM (Suzhou) Electronic Material Co., Ltd. |