CN104022329B - 一种3dB电桥 - Google Patents
一种3dB电桥 Download PDFInfo
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- CN104022329B CN104022329B CN201410137886.4A CN201410137886A CN104022329B CN 104022329 B CN104022329 B CN 104022329B CN 201410137886 A CN201410137886 A CN 201410137886A CN 104022329 B CN104022329 B CN 104022329B
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- 230000008878 coupling Effects 0.000 claims abstract description 73
- 238000010168 coupling process Methods 0.000 claims abstract description 73
- 238000005859 coupling reaction Methods 0.000 claims abstract description 73
- 238000009413 insulation Methods 0.000 claims abstract description 10
- 230000005611 electricity Effects 0.000 claims description 2
- 238000002955 isolation Methods 0.000 abstract description 7
- 125000006850 spacer group Chemical group 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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CN201410137886.4A CN104022329B (zh) | 2014-04-08 | 2014-04-08 | 一种3dB电桥 |
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CN201410137886.4A CN104022329B (zh) | 2014-04-08 | 2014-04-08 | 一种3dB电桥 |
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CN104022329A CN104022329A (zh) | 2014-09-03 |
CN104022329B true CN104022329B (zh) | 2017-11-14 |
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CN201410137886.4A Active CN104022329B (zh) | 2014-04-08 | 2014-04-08 | 一种3dB电桥 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101308946A (zh) * | 2007-05-16 | 2008-11-19 | 中国科学院电子学研究所 | 一种基于新型缺陷地结构的宽带微带耦合器 |
CN101755363A (zh) * | 2007-04-25 | 2010-06-23 | 斯宾纳有限公司 | 具有低介电损耗的高频构件 |
CN102263315A (zh) * | 2011-05-31 | 2011-11-30 | 苏州大学 | 基于交指结构的3dB双分支定向耦合器 |
CN202759011U (zh) * | 2012-08-09 | 2013-02-27 | 成都市大富科技有限公司 | 一种空气带状线电桥 |
CN203039074U (zh) * | 2013-01-09 | 2013-07-03 | 东莞洲亮通讯科技有限公司 | 一种3dB电桥 |
CN203218431U (zh) * | 2013-05-10 | 2013-09-25 | 宜兴亚泰科技有限公司 | 腔体电桥 |
CN203910950U (zh) * | 2014-04-08 | 2014-10-29 | 罗琛 | 一种3dB电桥 |
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2014
- 2014-04-08 CN CN201410137886.4A patent/CN104022329B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101755363A (zh) * | 2007-04-25 | 2010-06-23 | 斯宾纳有限公司 | 具有低介电损耗的高频构件 |
CN101308946A (zh) * | 2007-05-16 | 2008-11-19 | 中国科学院电子学研究所 | 一种基于新型缺陷地结构的宽带微带耦合器 |
CN102263315A (zh) * | 2011-05-31 | 2011-11-30 | 苏州大学 | 基于交指结构的3dB双分支定向耦合器 |
CN202759011U (zh) * | 2012-08-09 | 2013-02-27 | 成都市大富科技有限公司 | 一种空气带状线电桥 |
CN203039074U (zh) * | 2013-01-09 | 2013-07-03 | 东莞洲亮通讯科技有限公司 | 一种3dB电桥 |
CN203218431U (zh) * | 2013-05-10 | 2013-09-25 | 宜兴亚泰科技有限公司 | 腔体电桥 |
CN203910950U (zh) * | 2014-04-08 | 2014-10-29 | 罗琛 | 一种3dB电桥 |
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CB03 | Change of inventor or designer information | ||
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Inventor after: Zhong Mingle Inventor before: Lan Xiaoling |
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TA01 | Transfer of patent application right |
Effective date of registration: 20170914 Address after: 525024 Guangdong province Maoming city Xintian Town Mansion Maonan slope village six group No. 206 Applicant after: Zhong Mingle Address before: Wencheng County of Wenzhou City, Zhejiang province 325300 Rocky Mountain Village town of Guangxi Applicant before: Lan Xiaoling |
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Effective date of registration: 20171010 Address after: 400056 Baihe Village, Banan District, Chongqing Applicant after: Chongqing silver packing material Co., Ltd. Address before: 525024 Guangdong province Maoming city Xintian Town Mansion Maonan slope village six group No. 206 Applicant before: Zhong Mingle |
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Effective date of registration: 20180126 Address after: 401320 Banan District, Banan District, Chongqing, No. 8-29, Yu Nan Road, No. 8-29 Patentee after: Chongqing Boshi Intellectual Property Service Co., Ltd. Address before: 400056 Baihe Village, Banan District, Chongqing Patentee before: Chongqing silver packing material Co., Ltd. |
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Effective date of registration: 20201124 Address after: 226000 No. 33 Xinkang Road, Gangzhao District, Nantong City, Jiangsu Province, 15 blocks Patentee after: NOVACO MICROELECTRONICS TECHNOLOGIES Ltd. Address before: 401320 No. 249 Yunan Avenue, Banan District, Chongqing, 8-29 Patentee before: Chongqing Boshi Intellectual Property Service Co.,Ltd. |
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