CN104019388A - Three-dimensional light-emitting diode device and LED lamp good in heat conduction effect - Google Patents
Three-dimensional light-emitting diode device and LED lamp good in heat conduction effect Download PDFInfo
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- CN104019388A CN104019388A CN201410208846.4A CN201410208846A CN104019388A CN 104019388 A CN104019388 A CN 104019388A CN 201410208846 A CN201410208846 A CN 201410208846A CN 104019388 A CN104019388 A CN 104019388A
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Abstract
The invention discloses a three-dimensional light-emitting diode device and an LED lamp good in heat conduction effect. The three-dimensional light-emitting diode device comprises a support, wherein the support comprises a plurality of light-emitting faces used for installing wafers, heat conductive plates and circuits are arranged on the light-emitting faces respectively, and the wafers are arranged on the heat conductive plates and electrically connected with the circuits. The LED lamp comprises a lamp cap, wherein a radiator is arranged on the lamp cap, the three-dimensional light-emitting diode device is arranged on the upper end face of the radiator, and the circuits are electrically connected with a driving power source and the lamp cap. As is shown in one purpose, the three-dimensional light-emitting diode device is simple in structure, light is emitted through multiple faces, direct heat conduction is achieved, stability and reliability of an LED light source body can be improved, the service life of the LED light source body is further prolonged, and the heat conduction effect of the three-dimensional light-emitting diode device is good. As is shown in the other purpose, the LED lamp good in heat conduction effect comprises the three-dimensional light-emitting diode device.
Description
Technical field
The present invention relates to a kind of Three-dimensional LED device, the invention still further relates to a kind of LED lamp of the good heat conduction effect that comprises above-mentioned Three-dimensional LED device.
Background technology
Existing LED encapsulation is generally plane mode, and it is only unidirectional that this pattern is sent, even if there is the product of three-dimensional multiaspect, but its structure is processed into mainly with substrate, and substrate is used aluminium base conventionally, aluminium base thermal resistance is large, heat conduction is slow, thereby strengthens LED light decay, affect the LED life-span.
So existing LED device awaits further perfect.
Summary of the invention
The object of the invention is in order to overcome weak point of the prior art, provide a kind of simple in structure, the direct heat conduction of multifaceted light-emitting, can improve stability, the reliability of LED light source body, further extend LED light source body service life, the Three-dimensional LED device of good heat conduction effect;
Another object of the present invention is to provide a kind of LED lamp of the good heat conduction effect that comprises above-mentioned Three-dimensional LED device.
In order to achieve the above object, the present invention adopts following scheme:
A kind of Three-dimensional LED device, include support, it is characterized in that: described support includes multiple for the light-emitting area of wafer is installed, and is respectively equipped with heat-conducting plate and circuit in described light-emitting area, on described heat-conducting plate, be provided with wafer, described wafer is electrically connected with circuit.
A kind of Three-dimensional LED device as above, it is characterized in that described heat-conducting plate is conductive and heat-conductive plate, on described heat-conducting plate, offer short slot, in described short slot, divide and be separated with conductive and heat-conductive sheet, described conductive and heat-conductive sheet forms described circuit, described wafer is electrically connected with conductive and heat-conductive sheet, and described wafer is fixed on conductive and heat-conductive plate.
A kind of Three-dimensional LED device as above, is characterized in that being provided with concave surface cup on described heat-conducting plate, and described wafer is arranged in described concave surface cup.
A kind of Three-dimensional LED device as above, is characterized in that being provided with insulator between described heat-conducting plate and circuit.
A kind of Three-dimensional LED device as above, is characterized in that being provided with PCB circuit board on described light-emitting area inner surface, and described circuit is arranged on PCB circuit board.
A kind of Three-dimensional LED device as above, is characterized in that being provided with pin holes on described heat-conducting plate, and the contact pin that described circuit is arranged in pin holes by insulation forms, and described wafer is electrically connected with contact pin; Described heat-conducting plate can be insulating heat-conductive plate, and described contact pin is directly fixed on insulating heat-conductive plate; Described heat-conducting plate also can be conductive and heat-conductive plate, now, is provided with insulating barrier in pin holes, and described contact pin is by insulating barrier and conductive and heat-conductive plate mutually insulated.
A kind of Three-dimensional LED device as above, is characterized in that being provided with pin holes on described conductive and heat-conductive sheet, is provided with the contact pin that can be connected with external power source in described pin holes, and described wafer is electrically connected with contact pin.
A kind of Three-dimensional LED device as above, is characterized in that described support is cylinder stent, is provided with sealing surface in described cylinder stent upper end, and the manufacture craft of the support in described heat-conducting plate and circuit and the first embodiment is similar.
A kind of Three-dimensional LED device as above, is characterized in that being provided with connecting thread in described cylinder stent lower end.
A kind of LED lamp of good heat conduction effect, include lamp holder, on described lamp holder, be provided with radiator, it is characterized in that: be provided with Three-dimensional LED device in described radiator upper surface, described Three-dimensional LED device, include support, on described support, be provided with multiple light-emitting areas for diode installed wafer, in described light-emitting area, be respectively equipped with heat-conducting plate and circuit, on described heat-conducting plate, be provided with wafer, described wafer is electrically connected with circuit, and described circuit is electrically connected with driving power and lamp holder.
In sum, beneficial effect of the present invention:
In the present invention, on support, be provided with heat-conducting plate, wafer is fixed on directly heat conduction on heat-conducting plate, reduces thermal resistance, extends the light source body life-span.Meanwhile, wafer can be fixed in multiple light-emitting areas, makes LED Lighting Design more flexibly and summary.
Brief description of the drawings
Fig. 1 is schematic perspective view of the present invention;
Fig. 2 is expansion schematic diagram of the present invention;
Fig. 3 is the schematic diagram of heat-conducting plate of the present invention, circuit and pin holes;
Fig. 4 is the schematic diagram of heat-conducting plate of the present invention and circuit;
Fig. 5 is the schematic diagram that heat-conducting plate of the present invention is connected with wafer;
Fig. 6 is the schematic diagram that insulator is set between heat-conducting plate of the present invention and circuit;
Fig. 7 is the schematic diagram that concave surface cup is set on heat-conducting plate;
Fig. 8 is the schematic diagram that PCB circuit board is set on heat-conducting plate in the present invention;
Fig. 9 arranges one of schematic diagram of contact pin in pin holes in the present invention;
Figure 10 be in the present invention, in pin holes, arrange contact pin schematic diagram two;
Figure 11 is that wafer tandem is connected to the schematic diagram on circuit;
Figure 12 is wafer tandem and is connected in parallel on the schematic diagram on circuit;
Figure 13 is one of schematic diagram of cylinder stent;
Figure 14 be cylinder stent schematic diagram two;
Figure 15 is the schematic diagram of LED lamp of the present invention.
Detailed description of the invention
Below in conjunction with brief description of the drawings and detailed description of the invention, the present invention is described further:
As shown in Fig. 1 to 14, a kind of Three-dimensional LED device, include support 1, described support 1 includes multiple for the light-emitting area 3 of wafer 2 is installed, in described light-emitting area 3, be respectively equipped with heat-conducting plate 4 and circuit 5, on described heat-conducting plate 4, be provided with wafer 2, described wafer 2 is electrically connected with circuit 5.
The first embodiment of the present invention, as shown in Fig. 1-12, described heat-conducting plate 4 is conductive and heat-conductive plate, on described heat-conducting plate 4, offer short slot 41, in described short slot 41, divide and be separated with conductive and heat-conductive sheet 42, described conductive and heat-conductive sheet 42 forms described circuit 5, and described wafer 2 is electrically connected with conductive and heat-conductive sheet 42, and wafer is fixed on conductive and heat-conductive plate.Support 1 described in the present invention is by copper material punch forming, scale copper strikes out cross scale copper, wherein cross scale copper comprises middle heat-conducting plate 4 and is connected to the heat-conducting plate 4 on 4 four limits of intermediate thermal conductivity plate, on described cross scale copper, form some short slots 41, in described short slot 41, divide and be separated with conductive and heat-conductive sheet 42, by welding or other packaging technology, wafer 2 is arranged on described conductive and heat-conductive plate, described wafer 2 is electrically connected with conductive and heat-conductive sheet 42, the mode that described each wafer 2 can combine according to serial or parallel connection or series and parallel connections connects, then make support become the support of a solid to same direction bending the heat-conducting plate 4 on cross bracket intermediate thermal conductivity plate 4 and four limits, wherein wafer 2 is arranged on heat-conducting plate 4 outsides, thereby form the stereo luminous diode component of energy, gapped between conductive and heat-conductive sheet 42 and conductive and heat-conductive plate in the present invention, thereby diode component inner air and outer air is communicated with, reach better radiating effect.In the present invention, adopt copper material as heat-conducting plate 4, wafer 2 is set directly on copper material heat-conducting plate, can realize direct heat conduction, can improve stability, the reliability of LED light source body, further extends LED light source body service life.
As shown in Figure 9, in the present invention, on described conductive and heat-conductive sheet 42, be provided with pin holes 9, be provided with the contact pin 10 that can be connected with external power source in described pin holes 9, described wafer 2 is electrically connected with contact pin 10.
The second embodiment of the present invention, as shown in Figure 7, it has the structure identical with the first embodiment, on described heat-conducting plate 4, be provided with concave surface cup 6 in addition, described wafer 2 is arranged in described concave surface cup 6, and wafer 2 contacts tightr with heat-conducting plate 4, and radiating effect is better.Concave surface cup 6 in the present invention forms in punching course, easy to process.
In the present invention, between described heat-conducting plate 4 and circuit 5, be provided with insulator 7, thereby make mutually to cut off between heat-conducting plate 4 and circuit 5, described insulator 7 can be served as by encapsulation glue; In the present invention, can also make between heat-conducting plate 4 and circuit 5 point used outside insulated mutually gap is set between heat-conducting plate 4 and circuit 5.
The third embodiment of the present invention as shown in Figure 8, is provided with PCB circuit board 8 on described light-emitting area 3 inner surfaces, and described circuit 5 is arranged on PCB circuit board 8.
The 4th kind of embodiment of the present invention, as shown in figure 10, on described heat-conducting plate 4, be provided with pin holes 9, the contact pin 10 that described circuit 5 is arranged in pin holes 9 by insulation forms, described wafer 2 is electrically connected with contact pin 10, described heat-conducting plate can be insulating heat-conductive plate, and described contact pin is directly fixed on insulating heat-conductive plate; Described heat-conducting plate also can be conductive and heat-conductive plate, now, is provided with insulating barrier in pin holes, and described contact pin is by insulating barrier and conductive and heat-conductive plate mutually insulated.Contact pin 10 described in present embodiment stretches out described heat-conducting plate 4 inner surfaces, and the mode that the contact pin 10 corresponding with wafer 2 the two poles of the earth combines according to serial or parallel connection or series and parallel connections respectively connects.
Support 1 described in the present invention is cylinder stent, is provided with sealing surface in described cylinder stent upper end.The manufacture craft of the support in described heat-conducting plate and circuit and the first embodiment is similar.Described cylinder stent can be that cylinder-shaped bracket can be also square tube shape support.
The another kind of embodiment of support 1 described in the present invention, described support 1 is stage body support, described stage body support is Rotary-table support or cone table support.
In the present invention, be provided with connecting thread 11 in described cylinder stent lower end.Wherein said connecting thread 11 can be internal thread, can be also external screw thread, can be screwed in the radiator upper surface of LED lamp by connecting thread 11 cylinder stents are set.
Support described in the present invention can be that closed type support can be also open-type support.
Shown in Figure 15, the LED lamp of a kind of good heat conduction effect of the present invention, include lamp holder 12, on described lamp holder 12, be provided with radiator 13, be provided with Three-dimensional LED device 100 in described radiator 13 upper surfaces 14, described Three-dimensional LED device, include support 1, on described support 1, be provided with multiple for the light-emitting area 3 of wafer 2 is installed, in described light-emitting area 3, be respectively equipped with heat-conducting plate 4 and circuit 5, on described heat-conducting plate 4, be provided with wafer 2, described wafer 2 is electrically connected with circuit 5, in described support 1, be provided with driving power, described circuit 5 is electrically connected with driving power and lamp holder 12, wherein between circuit 5 and driving power and lamp holder 12, can be electrically connected by contact pin 10, also can be electrically connected by alternate manner.
In the present invention, be respectively equipped with pin holes 9 at described conductive and heat-conductive sheet 42 with conductive and heat-conductive plate upper end, be provided with contact pin 10 in described pin holes 9 insulation, described wafer 2 is electrically connected with contact pin 10, and described contact pin 10 can be electrically connected with lamp holder 12.
More than show and described general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that in above-described embodiment and description, describes just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (10)
1. a Three-dimensional LED device, include support (1), it is characterized in that: described support (1) includes multiple for the light-emitting area (3) of wafer (2) is installed, in described light-emitting area (3), be respectively equipped with heat-conducting plate (4) and circuit (5), on described heat-conducting plate (4), be provided with wafer (2), described wafer (2) is electrically connected with circuit (5).
2. a kind of Three-dimensional LED device according to claim 1, it is characterized in that described heat-conducting plate (4) is conductive and heat-conductive plate, on described heat-conducting plate (4), offer short slot (41), in described short slot (41), divide and be separated with conductive and heat-conductive sheet (42), described conductive and heat-conductive sheet (42) forms described circuit (5), described wafer (2) is electrically connected with conductive and heat-conductive sheet (42), and wafer is fixed on conductive and heat-conductive plate.
3. a kind of Three-dimensional LED device according to claim 1 and 2, it is characterized in that being provided with concave surface cup (6) on described heat-conducting plate (4), described wafer (2) is arranged in described concave surface cup (6).
4. a kind of Three-dimensional LED device according to claim 1 and 2, is characterized in that being provided with insulator (7) between described heat-conducting plate (4) and circuit (5).
5. a kind of Three-dimensional LED device according to claim 1, it is characterized in that being provided with PCB circuit board (8) on described light-emitting area (3) inner surface, described circuit (5) is arranged on PCB circuit board (8).
6. a kind of Three-dimensional LED device according to claim 1, it is characterized in that being provided with pin holes (9) on described heat-conducting plate (4), the contact pin (10) that described circuit (5) is arranged in pin holes (9) by insulation forms, and described wafer (2) is electrically connected with contact pin (10).
7. a kind of Three-dimensional LED device according to claim 2, it is characterized in that being provided with pin holes (9) on described conductive and heat-conductive sheet (42), be provided with the contact pin (10) that can be connected with external power source in described pin holes (9), described wafer (2) is electrically connected with contact pin (10).
8. a kind of Three-dimensional LED device according to claim 1, is characterized in that described support (1) is cylinder stent, is provided with sealing surface in described cylinder stent upper end.
9. a kind of Three-dimensional LED device according to claim 8, is characterized in that being provided with connecting thread (11) in described cylinder stent lower end.
10. the LED lamp of a good heat conduction effect, include lamp holder (12), on described lamp holder (12), be provided with radiator (13), it is characterized in that: be provided with Three-dimensional LED device (100) in described radiator (13) upper surface (14), described Three-dimensional LED device, include support (1), on described support (1), be provided with multiple for the light-emitting area (3) of wafer (2) is installed, in described light-emitting area (3), be respectively equipped with heat-conducting plate (4) and circuit (5), on described heat-conducting plate (4), be provided with wafer (2), described wafer (2) is electrically connected with circuit (5), described circuit (5) is electrically connected with driving power and lamp holder (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410208846.4A CN104019388B (en) | 2014-05-16 | 2014-05-16 | A kind of Three-dimensional LED device and LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410208846.4A CN104019388B (en) | 2014-05-16 | 2014-05-16 | A kind of Three-dimensional LED device and LED |
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| Publication Number | Publication Date |
|---|---|
| CN104019388A true CN104019388A (en) | 2014-09-03 |
| CN104019388B CN104019388B (en) | 2016-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410208846.4A Active CN104019388B (en) | 2014-05-16 | 2014-05-16 | A kind of Three-dimensional LED device and LED |
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| CN (1) | CN104019388B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108730782A (en) * | 2018-06-20 | 2018-11-02 | 魏展生 | A kind of LED light source body and LED light |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202629725U (en) * | 2012-06-12 | 2012-12-26 | 丁增科 | LED (Light Emitting Diode) lamp |
| CN202674883U (en) * | 2012-04-06 | 2013-01-16 | 王龙漾 | Lamp bulb with heat dissipated easily |
| CN204042485U (en) * | 2014-05-16 | 2014-12-24 | 魏展生 | A kind of Three-dimensional LED device of good heat conduction effect and LED |
-
2014
- 2014-05-16 CN CN201410208846.4A patent/CN104019388B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202674883U (en) * | 2012-04-06 | 2013-01-16 | 王龙漾 | Lamp bulb with heat dissipated easily |
| CN202629725U (en) * | 2012-06-12 | 2012-12-26 | 丁增科 | LED (Light Emitting Diode) lamp |
| CN204042485U (en) * | 2014-05-16 | 2014-12-24 | 魏展生 | A kind of Three-dimensional LED device of good heat conduction effect and LED |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108730782A (en) * | 2018-06-20 | 2018-11-02 | 魏展生 | A kind of LED light source body and LED light |
| CN108730782B (en) * | 2018-06-20 | 2024-03-29 | 魏展生 | LED light source body and LED lamp |
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| Publication number | Publication date |
|---|---|
| CN104019388B (en) | 2016-08-24 |
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