CN103996646B - Structure of chip bearing discs - Google Patents
Structure of chip bearing discs Download PDFInfo
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- CN103996646B CN103996646B CN201410223154.7A CN201410223154A CN103996646B CN 103996646 B CN103996646 B CN 103996646B CN 201410223154 A CN201410223154 A CN 201410223154A CN 103996646 B CN103996646 B CN 103996646B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
Abstract
The invention provides a structure of chip bearing discs. The structure is used for containing a plurality of chips. The chip bearing discs are provided with a plurality of inversed alignment pieces, the inversed alignment pieces of the chip bearing disc containing the multiple chips are matched with the inversed alignment pieces of the chip bearing disc without the chips, and the chip bearing disc containing the multiple chips can be overturned to be inversely arranged on the other chip bearing disc so that the chips can be overturned to be really inversely arranged into the other chip bearing disc; in addition, the chip bearing discs are further provided with a plurality of stacking alignment pieces, the stacking alignment pieces are arranged on the chip bearing discs in an asymmetric mode to assist in stacked alignment of the multiple bearing discs, and the stacking direction of the stacked bearing discs is limited.
Description
Technical field
The invention relates to a kind of chip bearing disc, it is espespecially a kind of to be conducive to the chip of upside-down mounting para-position and storehouse para-position
The structure of carrier.
Background technology
In general chip (IC) processing procedure, it will usually use carrier and put chip, carrier there are multiple storage tanks with
Chip placement, so chip bearing disc (IC Tray) is on chip backend flow and transport chip is tool weight in client
The support container of the property wanted.
Glass flip chip (Chip on Glass；COG) it is a kind of Advanced Packaging for being connected with each other chip and substrate,
Using flip (Flip Chip) technology, with anisotropic conductive film (ACF) as intermediary interface, length there is into the chip engagement of golden projection
On substrate；When being applied to liquid crystal display, because substrate is glass, therefore it is referred to as COG.Chip processing procedure comprising grinding, cutting,
Choose pick up, visual examination and packaging.Grinding processing procedure be chip thinning processing procedure, grinding processing procedure be chip back is carried out rough lapping and
2 operations of fine lapping, with thinned chip, it belongs to mechanical polishing.
Cutting processing procedure is that wafer is cut into into chip, and with sharp back segment crystal grain (Die bond) and routing engagement (Wire are engaged
) and flip bond.Choose that to pick up be to choose chip from wafer and be placed on chip bearing disc, finally again by the chip chosen,
Visual examination is carried out according to the specification of client, and chip bearing disc is positioned in the packaging material of customer requirement, be packaged as finished product shipment.
Chip pressing is carried out when substrate, such as electro-conductive glass first takes out chip from chip bearing disc, then by chip pressing
In substrate.However, different press equipment pressing chips can be different in the direction of substrate, the golden projection of such as chip must be upward
And the golden projection for being pressed on substrate or chip must be pressed on substrate down, therefore when chip is positioned over the side of chip bearing disc
To press equipment pressing chip is not met when the direction of substrate, operating personnel first must will be positioned over all of chip bearing disc
Chip overturns and is inverted in chip bearing disc, and such efficiency is very poor and time-consuming.Based on this problem, existing dealer develops two-sided core
Piece carrier, but the expense of two-sided chip carrier is costly compared with one side chip bearing disc.
For the ease of transporting and save space, chip bearing disc can storehouse mutually, but chip bearing disc must be according to spy
Determine storehouse direction and storehouse together, known chip bearing disc has special risk management, to prevent storehouse anisotropy, institute
To be susceptible to the anisotropy of chip bearing disc storehouse, and easily cause pressing chip and exception occurs when substrate.In addition, putting
Chip is put after chip bearing disc, a protection sheet can be positioned over chip bearing disc top and cover chip, such as Tai Weike paper, with
Protection chip, but known chip bearing disc does not have the structure of fixed protection sheet, so protection sheet easily offsets, if protection
It is bad that paper skew then easily causes chip bearing disc storehouse.
From the foregoing, known chip bearing disc has a following points shortcoming, first point：Operating personnel is not easy from known
One side chip bearing disc turning-over of chip and be inverted in chip bearing disc, and fault rate is high, and if having using special smelting expense is increased
With；Second point：The expense of two-sided chip carrier is costly compared with one side chip bearing disc, two-sided chip carrier not only mould
Costly, two-sided chip carrier buying expenses is also high, and two-sided chip carrier process stability is poor；Thirdly, it is known
Chip bearing disc has no the risk management in particular restriction storehouse direction, so the direction for easily causing chip bearing disc storehouse is wrong
By mistake；4th point, known chip bearing disc cannot fix protection sheet so that protection sheet easily offsets, and easily cause chip bearing
Disk storehouse is bad.
In view of the shortcoming of above-mentioned known techniques, the present invention is further changed for the structure of known chip bearing disc
It is good, and a kind of structure of chip bearing disc is invented, the present invention provides a kind of chip bearing disc, has on the chip bearing disc many
Individual upside-down mounting para-position part and multiple storehouse para-position parts, the chip that those upside-down mounting para-position parts are easy to operating personnel's upset storing and have chip holds
Load plate is inverted in this another chip bearing disc in another chip bearing disc, with turning-over of chip, so improves chip upside down
Success rate, in addition those storehouse para-position parts be arranged in an asymmetrical fashion on chip bearing disc, to reach the limit in storehouse direction
System, and protection sheet can be fixed, to avoid protection sheet from offseting.
The content of the invention
An object of the present invention, is to provide a kind of chip bearing dish structure, its be easy to overturn a chip bearing disc and
Another chip bearing disc is inverted in, the chip upset in chip bearing disc is inverted in this another chip bearing disc, such as
This can reduce being inverted the labour cost of chip, and really by chip upside down in chip bearing disc, and improve job success
Rate.
An object of the present invention, is to provide a kind of chip bearing dish structure, and it has the structure for limiting storehouse direction,
To increase the accuracy of chip bearing disc storehouse.
An object of the present invention, is to provide a kind of chip bearing dish structure, and it can fix the protection of protection chip
Paper, to avoid protection sheet placement location from offseting, and avoids the bad situation of chip bearing disc storehouse.
The invention discloses a kind of structure of chip bearing disc, it is mainly comprising multiple chip containing grooves and multiple upside-down mountings pair
Position part, those upside-down mounting para-position parts are arranged at the upper surface of the chip bearing disc.Additionally, the chip bearing disc further includes multiple storehouses
Para-position part, those storehouse para-position parts are arranged at the chip bearing disc, and those storehouse para-position parts are in asymmetric geometry.
The invention discloses a kind of structure of chip bearing disc, it is applied to turning-over of chip, to be inverted chip, the chip bearing
Disk mainly comprising one first carrier and one second carrier, first carrier include multiple first upside-down mounting para-position parts with it is multiple
First chip containing groove, second carrier includes multiple second upside-down mounting para-position parts and multiple second chip containing grooves, and those the
Two upside-down mounting para-position parts correspondence those the first upside-down mounting para-position parts, those the second upside-down mounting para-position parts of second carrier be matched with this
Those the first upside-down mounting para-position parts of one carrier, first carrier overturns with second carrier and after inversion, is positioned over this
Multiple chips of those the first chip containing grooves of the first carrier are reversed, and be inverted in second carrier those
In two chip containing grooves.
The invention discloses the structure of another kind of chip bearing disc, it limits the storehouse direction of chip bearing disc, and it is mainly wrapped
Containing one first carrier and one second carrier, first carrier includes multiple first storehouse para-position parts and multiple first cores
Piece storage tank, those the first storehouse para-position parts are arranged at the upper surface of first carrier, and in asymmetric geometry, and this second holds
Load plate includes multiple second storehouse para-position parts and multiple second chip containing grooves, those the second storehouse para-position parts correspondences those first
Storehouse para-position part, and the bottom surface of second carrier is arranged at, those the second storehouse para-position parts of second carrier are matched with
Those the first storehouse para-position parts of first carrier, and second carrier is stacked over first carrier.
Furthermore, a protection sheet is set on those first chip containing grooves, the protection sheet is arranged at those the first storehouses pair
Between the part of position, the protection sheet is fixed on those first chip containing grooves.
Description of the drawings
Figure 1A：It is the illustrative view one of the storehouse carrier of the first embodiment of the present invention；
Figure 1B：It is the illustrative view two of the storehouse carrier of the first embodiment of the present invention；
Fig. 2：It is the schematic diagram of the fixed protection sheet of the first embodiment of the present invention；
Fig. 3：It is the structural representation of the second embodiment of the present invention；
Fig. 4 A：It is the illustrative view one of the inversion chip of the third embodiment of the present invention；
Fig. 4 B：It is the illustrative view two of the inversion chip of the third embodiment of the present invention；
Fig. 4 C：It is the illustrative view three of the inversion chip of the third embodiment of the present invention；
Fig. 4 D：It is the illustrative view four of the inversion chip of the third embodiment of the present invention；
Fig. 5：It is the structural representation of the fourth embodiment of the present invention；
Fig. 6 A：It is the illustrative view one of the storehouse carrier of the fifth embodiment of the present invention；
Fig. 6 B：It is the illustrative view two of the storehouse carrier of the fifth embodiment of the present invention；And Fig. 6 C：It is this
The illustrative view of the inversion chip of the 5th embodiment of invention.
【Figure number is to as directed】
10 first carriers
110 first substrates
120 first frameworks
1210 first chip containing grooves
1220 second framework storage tanks
130 first storehouse para-position parts
140 the 3rd storehouse para-position parts
20 second carriers
210 second substrates
220 second frameworks
2210 second chip containing grooves
2220 first framework storage tanks
230 second storehouse para-position parts
240 the 4th storehouse para-position parts
30 pairs of parallactic angles
40 protection sheets
50 chips
11 first carriers
111 first substrates
121 first frameworks
1211 first chip containing grooves
131 first upside-down mounting para-position parts
132 upside-down mounting para-position parts
141 the 3rd storehouse para-position parts
21 second carriers
211 second substrates
221 second frameworks
2211 second chip containing grooves
231 second storehouse para-position parts
241 second upside-down mounting para-position parts
242 the 4th storehouse para-position parts
Specific embodiment
In order that the architectural feature of the present invention and the effect reached have a better understanding and awareness, spy is with preferably
Embodiment and cooperation detailed description, are described as follows：
During the present invention is to solve known techniques, the problem of chip bearing dish structure is related to, in pressing chip in substrate
In processing procedure, the chip being positioned in chip bearing disc needs to be reversed and be inverted in chip bearing disc sometimes, if manually
One by one then fault rate is high for turning-over of chip, and expends the time, and utilizes the expense that two-sided chip carrier chip placement then spent
Height, and the degree of stability of the processing procedure of two-sided chip carrier is poor, in addition, known chip bearing disc prevents storehouse anisotropy
Mechanism is not enough, and the protection sheet that known chip bearing disc cannot be on fixed chip carrier, to overcome above-mentioned variety of problems, this
Invention provides a kind of structure of chip bearing disc.
First, Figure 1A and Figure 1B is referred to, it is the illustrative view of the storehouse carrier of the first embodiment of the present invention
One with illustrative view two；As illustrated, this embodiment be performance one second carrier 20 be stacked over one first carrier 10 it
On, it is matched with multiple second heaps of second carrier 20 through multiple first storehouse para-position parts 130 of first carrier 10
Stack para-position part 230, makes second carrier 20 be stacked on first carrier 10.
First carrier 10 is comprising a first substrate 110, one first framework 120 and those the first storehouse para-position parts
130, first framework 120 is disposed on the first substrate 110, and first framework 120 is less than the first substrate 110,
And first framework 120 has multiple first chip containing grooves 1210, and those asymmetric settings of the first storehouse para-position part 130
On the periphery of first framework 120；And second carrier 20 is stacked on first carrier 10, this second holds
Load plate 20 is comprising a second substrate 210, a second framework 220 and those the second storehouse para-position parts 230, the second framework 220
It is disposed on the second substrate 210, the second framework 220 is less than the second substrate 210, and the second framework 220
With multiple second chip containing grooves 2210, and corresponding those the first storehouse para-position parts 130 of those the second storehouse para-position parts 230,
And be arranged at the bottom surface of the second substrate 210, that is, it is arranged at the bottom surface of second carrier 20.Above-mentioned asymmetric setting is referred to
Identical structure is not provided with the relative position of the carrier.As shown in Figure 1A, it is arranged at the left and right two of first framework 120
The position of those the first storehouse para-position parts 130 of side periphery simultaneously differs, i.e., positioned at the left and right two of first carrier 10
Those the first storehouse para-position parts 130 of side periphery are not symmetrical, that is, those the first storehouse para-position parts 130 are in asymmetric
Arrangement.
The present invention first carrier 10 have asymmetric setting those the first storehouse para-position parts 130, and this second
Carrier 20 has those the second storehouse para-position parts 230 of those the first storehouse para-position parts 130 of correspondence, when second carrier 20
When being intended to be stacked on first carrier 10, according to those the first storehouse para-position parts 130 and those the second storehouse para-position parts 230
Position in correspondence with each other carry out storehouse, because those the second storehouse para-position parts 230 must be respectively cooperating with those the first storehouses pair
Position part 130, second carrier 20 just can be stacked on first carrier 10, be so stacked over second carrier 20
The storehouse direction of first carrier 10 is restricted.
Those above-mentioned the first storehouse para-position parts 130 of the present invention are male member, then corresponding to those the first storehouse para-position parts 130
Those the second storehouse para-position parts 230 be female members, but the present invention be not intended to limit those the first storehouse para-position parts 130 with those second
Storehouse para-position part 230 is necessary for respectively male member and female members, and it can be the combination of female members, male member or male member and female members, and those first
Storehouse para-position part 130 can be incorporated into those the second storehouse para-position parts 230 in modes such as chimeric, fixed or cooperations.
Also, the bottom surface of the second substrate 210 of second carrier 20 arranges one first framework storage tank 2220, those the
Two storehouse para-position parts 230 are arranged in the first framework storage tank 2220, those the first storehouse para-position parts 130 be matched with those
Two storehouse para-position parts 230, in addition first framework 120 be placed in the first framework storage tank 2220, so increase this first
Storehouse steadiness between carrier 10 and second carrier 20.
Furthermore, first carrier 10 further arranges multiple 3rd storehouse para-position parts 140, those the 3rd storehouse para-position parts
140 bottom surfaces for being disposed on the first substrate 110, those the 3rd storehouse para-position parts 140 are non-right corresponding to institute on another carrier
Claim the plural storehouse para-position part for arranging, this another carrier is identical or is similar to second carrier 20, so when this first holds
When load plate 10 is intended to be stacked on this another carrier, those the 3rd storehouse para-position parts 140 of first carrier 10 must be right
Should on this another carrier asymmetric setting those storehouse para-position parts, it is another that first carrier 10 can just be stacked over this
On carrier.From the foregoing, the present invention uses asymmetrical those storehouse para-position parts on those carriers, hold those
Storehouse direction between load plate is restrictive.The present invention be not intended to limit those the 3rd storehouse para-position parts 140 for male member, female members or
The combination of male member and female members, those the 3rd storehouse para-position parts 140 are to be fitted together to mutually, fix or match somebody with somebody with corresponding storehouse para-position part
The modes such as conjunction are combined.
Further the bottom surface of first carrier 10 arranges a second framework storage tank 1220, those the 3rd storehouse para-positions
Part 140 is arranged in the second framework storage tank 1220, and those the 3rd storehouse para-position parts 140 are matched with answering for another carrier
Storehouse para-position part is counted, then the framework of another carrier is placed in the second framework storage tank 1220, to increase by first carrying
Storehouse steadiness between disk 10 and another carrier.
Additionally, second carrier 20 further arranges multiple 4th storehouse para-position parts 240, those the 4th storehouse para-position parts
240 be it is non-be symmetricly set on the periphery of the second framework 220, those the 4th storehouse para-position parts 240 correspond to another carrier
Bottom asymmetric setting plural storehouse para-position part, this another carrier is identical or is similar to first carrier 10, such as
This when this another carrier is intended to be stacked on second carrier 20, those storehouse para-positions of the bottom of this another carrier
Part necessarily correspond to second carrier 20 asymmetric setting those the 4th storehouse para-position parts 240, this another carrier is
Can be stacked on second carrier 20, there is storehouse direction between second carrier 20 and this another carrier and limit
Property.The present invention is not intended to limit the combination that those the 4th storehouse para-position parts 240 are male member, female members or male member and female members, and those the 4th
Storehouse para-position part 240 is combined in the mode such as chimeric, fixed or cooperation mutually with corresponding storehouse para-position part.
The present invention second carrier 20 be stacked on first carrier 10, first carrier 10 this first
Substrate 110 is stacked over the second substrate 210 of second carrier 20.Additionally, a corner of the first substrate 110 is used as one
A pair of parallactic angles 310, and a corner of the second substrate 210 is used as one second pair of parallactic angle 320, the shape of second pair of parallactic angle 320
To should first pair of parallactic angle 310 shape, when second carrier 20 is intended to be stacked on first carrier 10, this first
Parallactic angle 310 and second pair of parallactic angle 320 are used to being easy to operating personnel directly visually learn first carrier 10 with this
The storehouse direction of two carriers 20.In one embodiment of the invention, first pair of parallactic angle 310 is with second pair of parallactic angle 320 all
For corner cut.
From described above and diagram, in one embodiment of the invention, the structure of second carrier 20 is same as
The structure of first carrier 10, is so easy to mold developing with production carrier, it is only necessary to can produce this using same mould
The carrier of invention, and reduce expense.Additionally, those the first storehouse para-position parts 130 positioned at first carrier 10 not must
Must be arranged on the periphery of first framework 120, it can also be arranged on the periphery of the first substrate 110, or is arranged at
On the periphery of first framework 120 and on the periphery of the first substrate 110, or other are arranged at according to use demand
Correct position.Those the 4th storehouse para-position parts 240 positioned at second carrier 20 can also be arranged at the second substrate 210
On periphery.In other words, those the first storehouse para-position parts 130 and those the 4th storehouse para-position parts 240 of the invention are to be respectively provided with
In the upper surface of first carrier 10 and second carrier 20, and those the second storehouse para-position parts 230 and those the 3rd heaps
Stack para-position part 140 is respectively arranged on the bottom surface of second carrier 20 and first carrier 10.
In addition, seeing also Fig. 2, it is the schematic diagram of the fixed protection sheet of the first embodiment of the present invention；As schemed
Show, the present invention further arranges a protection sheet 40 on those first chip containing grooves 1210, the protection sheet 40 is to arrange
Between those the first storehouse para-position parts 130, because those the first storehouse para-position parts 130 are arranged at those the first chip containing grooves
Around 1210, and the protection sheet 40 is limited to those the first storehouse para-position parts 130, and those the first storehouse para-position parts 130 are matched somebody with somebody
Those the second storehouse para-position parts 230 are closed, so protection sheet 40 is then restricted on first chip containing groove 1210, makes guarantor
Shield paper 40 is difficult skew, and protects chip really, and does not result in the bad problem of chip bearing disc storehouse.Wherein, the protection
Paper 40 is Tai Weike paper.
Fig. 3 is seen also, it is the structural representation of the second embodiment of the present invention；As illustrated, in the present embodiment
In, those the first storehouse para-position parts 130 are strip male member with those the 4th storehouse para-position parts 240, and those the second storehouse para-positions
Part 230 is strip female members with those the 3rd storehouse para-position parts 140.Figure 1A is referred to, those the first storehouse para-positions shown in Figure 1A
Part 130 is cylinder male member with those the 4th storehouse para-position parts 240, and those the second storehouse para-position parts 230 and those the 3rd storehouses
Para-position part 140 is cylinder female members, it may thus be appreciated that the present invention does not limit the shape of those storehouse para-position parts.Those first storehouses pair
The shape of position part 130 corresponds to the shape of those the second storehouse para-position parts 230, and with the side such as chimeric, fixed or cooperation mutually
Formula is combined, and the combination of those storehouse para-position parts corresponding thereto of the 3rd storehouse para-position part 140, it is also to be chatted with this paragraph
The modes such as chimeric mutually, the fixed or cooperation stated are combined, those storehouse para-position parts corresponding thereto of the 4th storehouse para-position part 240
Combination, also with describe mutually chimeric, fixed of this paragraph or the mode such as coordinate to combine.
Fig. 4 A to Fig. 4 D are referred to, it is the illustrative view one of the inversion chip of the third embodiment of the present invention to signal
Figure four；As illustrated, this embodiment is performance upset is placed in the complex chip 50 of one first carrier 11, and it is inverted in one the
In two carriers 21.It is multiple with second carrier 21 through multiple first upside-down mounting para-position parts 131 of first carrier 11
Second upside-down mounting para-position part 241 cooperates, and first carrier 11 is may be reversed and is inverted in second carrier 21, makes
Multiple first chip containing grooves 1211 of first carrier 11 are housed corresponding to multiple second chips of second carrier 21
Groove 2211, being so placed in those chips 50 of those the first chip containing grooves 1211 can be reversed and be inverted in this and second hold
In those second chip containing grooves 2211 of load plate 21.Wherein, those the second upside-down mounting para-position parts 241 pairs of second carrier 21
Should in those the first upside-down mounting para-position parts 131 of first carrier 11, and those the first upside-down mounting para-position parts 131 can be same as it is aforementioned
Those the first storehouse para-position parts 130 of embodiment.
First carrier 11 is comprising a first substrate 111, one first framework 121 and those the first upside-down mounting para-position parts
131, first framework 121 is disposed on the first substrate 111, and first framework 121 has those first chips
Storage tank 1211, and those the first upside-down mounting para-position parts 131 are asymmetric is arranged on the periphery of first framework 121, those first
Upside-down mounting para-position part 131 also may be disposed on the periphery of the first substrate 111, or be arranged at the periphery of first framework 121 with
And the periphery of the first substrate 111；Those chips 50 are placed in respectively in those first chip containing grooves 1211.This second holds
Load plate 21 is comprising a second substrate 211, a second framework 221 and those the second upside-down mounting para-position parts 241, the second framework 221
It is disposed on the second substrate 211, and the second framework 221 is with those second chip containing grooves 2211, and those
Second upside-down mounting para-position part 241 corresponds to those the first upside-down mounting para-position parts 131 and is arranged on the periphery of the second framework 221.
When upset is placed in those chips 50 of first carrier 11 and is inverted in second carrier 21, first such as
Shown in Fig. 4 A, according to second carrier 21 those the second upside-down mounting para-position parts 241 and first carrier 11 those first
The correspondence position of upside-down mounting para-position part 131, overturns second carrier 21 on first carrier 11, makes those the second chips
Storage tank 2211 corresponds to those first chip containing grooves 1211, and allows those second chip containing grooves 2211 to correspond to and be placed on
Those chips 50 of those the first chip containing grooves 1211.Afterwards, as shown in Figure 4 B, first carrier 11 second is held with this
After load plate 21 overturns together, i.e., as shown in Figure 4 C, first carrier 11 is then inverted on second carrier 21, those cores
Piece 50 i.e. can from those first chip containing grooves 1211 of first carrier 11 be inverted in second carrier 21 those
In two chip containing grooves 2211.Finally, first carrier 11 is rotated from second carrier 21, such as Fig. 4 D institutes
Show, that is, the action for completing those chips 50 of upset and being inverted in second carrier 21.
From the above, chip bearing disc of the invention can be used in inversion chip, first being somebody's turn to do second carrier 21
A little second upside-down mounting para-position parts 241 are pointed to those the first upside-down mounting para-position parts 131 of first carrier 11, overturn afterwards this second
On first carrier 11, those first chip containing grooves 1211 of so first carrier 11 i.e. can be right for carrier 21
Should continue in those second chip containing grooves 2211 of second carrier 21, then carry out flipping upside down between the two, make this
A little chips 50 are inverted in those second chip containing grooves 2211.Above-mentioned mode is prevented the labour cost of chip upside down, and
The job success ratio of increase chip upside down, and compared to the expense for being spent using two-sided chip carrier in the past also more just
Preferably, and the processing procedure of two-sided chip carrier degree of stability it is poor.
Those above-mentioned the first upside-down mounting para-position parts 131 of the present invention are male member, then corresponding to those the first upside-down mounting para-position parts 131
Those the second upside-down mounting para-position parts 241 be female members, but the present invention be not intended to limit those the first upside-down mounting para-position parts 131 with those second
Upside-down mounting para-position part 241 is necessary for respectively male member and female members, and both can be the combination of female members, male member or male member and female members, and those the
One upside-down mounting para-position part 131 can be incorporated into those the second upside-down mounting para-position parts 241 in modes such as chimeric, fixed or cooperations.
Fig. 5 is seen also, it is the structural representation of the fourth embodiment of the present invention；As illustrated, in the present embodiment
In, those the first upside-down mounting para-position parts 131 include strip male member and female members, and those the second upside-down mounting para-position parts 241 also include strip
Male member and female members, so that both work in coordination.Refer to Fig. 4 A, those the first upside-down mounting para-position parts 131 shown in Fig. 4 A and those
Second upside-down mounting para-position part 241 is respectively cylinder male member and cylinder female members, it may thus be appreciated that the present invention does not limit those upside-down mounting para-positions
The shape of part, the shape of those the first upside-down mounting para-position parts 131 be with the shape of those the second upside-down mounting para-position parts 241 in correspondence with each other,
And combined in the mode such as chimeric, fixed or cooperation mutually.
See also Fig. 6 A to Fig. 6 C, its be the storehouse carrier of the fifth embodiment of the present invention illustrative view with
It is inverted the illustrative view of chip；As illustrated, the present embodiment and 3rd embodiment (Fig. 4 A) difference are second carrier
21 further arrange multiple second storehouse para-position parts 231, and those the second storehouse para-position parts 231 correspond to those the first upside-down mounting para-positions
Part 131, and the bottom surface of the second substrate 211 is arranged at, those the second storehouse para-position parts 231 are matched with those the first upside-down mounting para-positions
Part 131, enables second carrier 21 to be stacked on first carrier 11.From the foregoing, those the first upside-down mounting para-positions
Part 131 has stack function, and the stack function of those the first storehouse para-position parts 130 being same as shown in Figure 1A.
Furthermore, first carrier 11 further arranges multiple 3rd storehouse para-position parts 141, those the 3rd storehouse para-position parts
The 141 asymmetric bottom surfaces for being arranged at the first substrate 111, and second carrier 21 further arranges multiple 4th storehouses pair
Position part 242, corresponding those the 3rd storehouse para-position parts 141 of those the 4th storehouse para-position parts 242, and it is arranged at the second framework 221
Periphery on, those the 4th storehouse para-position parts 242 can coordinate those the 3rd storehouse para-position parts 141, as shown in Figure 6B so as to which it is same
It is stacked on second carrier 21 in other carriers of first carrier 11.
In addition, arranging multiple upside-down mounting para-position parts 132 in the first carrier 11, those upside-down mounting para-position parts 132 correspond to this
Those the 4th storehouse para-position parts 242 of second carrier 21, i.e. those upside-down mounting para-position parts 132 coordinate those the 4th storehouse para-position parts
242, so as shown in Figure 6 C, the second carrier 21 may be reversed and be inverted on first carrier 11.Afterwards, according to Fig. 4 B
Shown action, overturns the carrier 21 of the first carrier 11 and second.As shown in Figure 4 C, first carrier 11 is inverted in
On second carrier 21, i.e., those second chip containing grooves 2211 of second carrier 21 correspond to first carrier
11 those first chip containing grooves 1211, so i.e. upset is located at the chip of those the first chip containing grooves 1211, and is inverted
In those second chip containing grooves 2211.
From the foregoing, those the first upside-down mounting para-position parts 131 of first carrier 11 are except with the work(for being inverted para-position
Can be outer, it may have the function of storehouse para-position, and those the 4th storehouse para-position parts 242 of second carrier 21 are except with storehouse
Outside the function of para-position, it may have be inverted the function of para-position.Can be learnt with diagram by described above, first carrying of this embodiment
Disk 11 is same as second carrier 21, and convenient production.
In sum, the present invention provides a kind of structure of chip bearing disc, and it has multiple upside-down mounting para-position parts, when being intended to put
When being placed in the complex chip upset of a carrier and being inverted in another carrier, those of a carrier of those chips are placed with
Upside-down mounting para-position part cooperates with those upside-down mounting para-position parts for another carrier for not being placed with chip so that storing has those cores
The carrier of piece can be reversed and be inverted on this another carrier, and so those chips can be reversed, and be inverted really
In another carrier.The chip bearing disc of the present invention can be used for turning-over of chip to be inverted chip, and it reduces being inverted chip
Expense, and increase the job success ratio and efficiency for being inverted chip.
Additionally, the chip bearing disc of the present invention has further included multiple storehouse para-position parts, those storehouse para-position parts are in asymmetric
Carrier is arranged at, when the second carrier is intended to be stacked on the first carrier, those storehouse para-position parts of the second carrier must
Those storehouse para-position parts of the first carrier must be matched with, the second carrier can be smoothly stacked on the first carrier, by
In those storehouse para-position parts in asymmetric geometry, so those storehouse para-position parts limit the storehouse direction of two carriers, so
Avoid two carriers that the mistake in storehouse direction is produced when storehouse, and there is the function of limiting storehouse direction.
Furthermore, protection sheet is provided with the complex chip storage tank of carrier, protection sheet is disposed on those storehouses pair
Between the part of position, those storehouse para-position parts can fix the protection sheet of protection chip, so protection sheet is restricted to those the first cores
On piece storage tank, and avoid protection sheet from deviating from those chip containing grooves, and then avoid causing chip bearing disc storehouse bad
Problem.
Above is only presently preferred embodiments of the present invention, not for limit the present invention enforcement scope, Fan Yibenfa
The impartial change carried out by shape, construction, feature and spirit described in bright right and modification, all should be included in the present invention
Right in.
Claims (19)
1. a kind of structure of chip bearing disc, is suitable to upside-down mounting and is arranged on another chip bearing disc, it is characterised in that it is included：
Multiple chip containing grooves；And
Multiple first upside-down mounting para-position parts, are arranged at the upper surface of the chip bearing disc；
The upper surface of wherein another chip bearing disc has multiple second upside-down mounting para-position parts, when the upper surface of the chip bearing disc
When relative with the upper surface of another chip bearing disc, those the first upside-down mounting para-position parts are right each other with those the second upside-down mounting para-position parts
Should, so that the upper surface of the chip bearing disc is fixed on separately by those the first upside-down mounting para-position parts and those the second upside-down mounting para-position parts
The upper surface of one chip bearing disc.
2. the structure of chip bearing disc as claimed in claim 1, it is characterised in that further include:
One substrate；And
One framework, is arranged at the substrate, and those chip containing grooves are arranged at the framework；
Wherein, those the first upside-down mounting para-position parts are arranged at the substrate and/or the framework.
3. the structure of chip bearing disc as claimed in claim 2 a, it is characterised in that wherein corner of the substrate is a para-position
Angle.
4. the structure of chip bearing disc as claimed in claim 1, it is characterised in that wherein those the first upside-down mounting para-position parts are in non-
Symmetric arrays.
5. the structure of chip bearing disc as claimed in claim 1, it is characterised in that further include:
Multiple storehouse para-position parts, are arranged at the chip bearing disc, and those storehouse para-position parts are in asymmetric geometry.
6. the structure of chip bearing disc as claimed in claim 5, it is characterised in that wherein more enter on those chip containing grooves
One step arranges a protection sheet, and the protection sheet is arranged between those storehouse para-position parts.
7. a kind of structure of chip bearing disc, it is characterised in that it is included：
One first carrier, comprising multiple first upside-down mounting para-position parts and multiple first chip containing grooves, those the first upside-down mounting para-positions
Part is arranged at the upper surface of first carrier；And
One second carrier, comprising multiple second upside-down mounting para-position parts and multiple second chip containing grooves, those the second upside-down mounting para-positions
Part corresponds to those the first upside-down mounting para-position parts, and those the second upside-down mounting para-position parts are arranged at the upper surface of second carrier, when this
The upper surface of one carrier in the face of the upper surface of second carrier when, those the first upside-down mounting para-position parts and those second upside-down mountings pair
Position part corresponds to each other；
Wherein, those the second upside-down mounting para-position parts of second carrier are matched with those the first upside-down mounting para-positions of first carrier
Part, first carrier overturns with second carrier and after inversion, is positioned over those first chips appearances of first carrier
The multiple chips for putting groove are reversed, and are inverted in those second chip containing grooves of second carrier, and
The upper surface of first chip bearing disc is fixed on by those the first upside-down mounting para-position parts and those the second upside-down mounting para-position parts
The upper surface of second chip bearing disc.
8. the structure of chip bearing disc as claimed in claim 7, it is characterised in that wherein first carrier is further included:
One first substrate；And
One first framework, is arranged at the first substrate, and those first chip containing grooves are arranged at first framework；
Wherein, those the first upside-down mounting para-position parts are arranged at the first substrate and/or first framework；
Second carrier is further included:
One second substrate；And
One second framework, is arranged at the second substrate, and those second chip containing grooves are arranged at the second framework；
Wherein, those the second upside-down mounting para-position parts are arranged at the second substrate and/or the second framework.
9. the structure of chip bearing disc as claimed in claim 7, it is characterised in that wherein those the first upside-down mounting para-position parts with should
A little second upside-down mounting para-position parts are in asymmetric geometry.
10. the structure of chip bearing disc as claimed in claim 7, it is characterised in that wherein second carrier is further
Comprising multiple storehouse para-position parts, those storehouse para-position parts to should the first carrier those the first upside-down mounting para-position parts, and arrange
In the bottom surface of second carrier, those storehouse para-position parts of second carrier be matched with first carrier those first
Upside-down mounting para-position part, and second carrier is stacked over first carrier.
The structure of 11. chip bearing discs as claimed in claim 7, it is characterised in that wherein first carrier further includes many
Individual storehouse para-position part, those storehouse para-position parts are arranged at the bottom surface of first carrier, and in asymmetric geometry.
12. a kind of structures of chip bearing disc, it is characterised in that it is included：
One first carrier, comprising multiple first storehouse para-position parts and multiple first chip containing grooves, those the first storehouse para-positions
Part is arranged at the upper surface of first carrier, and in asymmetric geometry；And
One second carrier, comprising multiple second storehouse para-position parts and multiple second chip containing grooves, those the second storehouse para-positions
Part corresponds to those the first storehouse para-position parts, and is arranged at the bottom surface of second carrier；
Wherein, those the second storehouse para-position parts of second carrier are matched with those the first storehouse para-positions of first carrier
Part, and second carrier is stacked over first carrier.
The structure of 13. chip bearing discs as claimed in claim 12, it is characterised in that wherein first carrier is further included:
One first substrate；And
One first framework, is arranged at the first substrate, and those first chip containing grooves are arranged at first framework；
Wherein, those the first storehouse para-position parts are arranged at the first substrate and/or first framework；
Second carrier is further included:
One second substrate；And
One second framework, is arranged at the second substrate, and those second chip containing grooves are arranged at the second framework；
Wherein, those the second storehouse para-position parts are arranged at the bottom surface of the second substrate.
The structure of 14. chip bearing discs as claimed in claim 12, it is characterised in that wherein first carrier is further
Comprising multiple 3rd storehouse para-position parts, those the 3rd storehouse para-position parts are arranged at the bottom surface of first carrier, and in non-right
Claim arrangement.
The structure of 15. chip bearing discs as claimed in claim 12, it is characterised in that wherein second carrier is further
Comprising multiple 4th storehouse para-position parts, those the 4th storehouse para-position parts are arranged at the upper surface of second carrier, and in non-
Symmetric arrays.
The structure of 16. chip bearing discs as claimed in claim 15, it is characterised in that wherein first carrier is further wrapped
Containing multiple upside-down mounting para-position parts, those upside-down mounting para-position parts of first carrier are arranged at the upper surface of first carrier, and right
Should be in those the 4th storehouse para-position parts of second carrier, and second carrier further includes multiple upside-down mounting para-position parts,
Those upside-down mounting para-position parts of second carrier are arranged at the upper surface of second carrier, and corresponding to first carrier
Those the first storehouse para-position parts, those upside-down mounting para-position parts of second carrier are matched with those first heaps of first carrier
Stack para-position part, and those upside-down mounting para-position parts of first carrier are matched with those the 4th storehouse para-positions of second carrier
Part, after first carrier flips upside down with second carrier, those first chips for being positioned over first carrier are housed
Multiple chips of groove are reversed, and are inverted in those second chip containing grooves of second carrier.
The structure of 17. chip bearing discs as claimed in claim 12, it is characterised in that wherein second carrier is further wrapped
Containing multiple upside-down mounting para-position parts, those upside-down mounting para-position parts are arranged at the upper surface of second carrier, second carrier those
Upside-down mounting para-position part corresponding to first carrier those the first storehouse para-position parts, those upside-down mounting para-position parts be matched with those first
Storehouse para-position part, after first carrier and second carrier flip upside down, be positioned over first carrier those first
Multiple chips of chip containing groove are reversed, and are inverted in those second chip containing grooves of second carrier.
The structure of 18. chip bearing discs as claimed in claim 12, it is characterised in that wherein those first chip containing grooves it
On a protection sheet is further set, the protection sheet is arranged between those the first storehouse para-position parts.
The structure of 19. chip bearing discs as claimed in claim 12, it is characterised in that a wherein corner of first carrier
For one first pair of parallactic angle, and a corner of second carrier is one second pair of parallactic angle, and the shape of second pair of parallactic angle is to should
The shape of first pair of parallactic angle.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410223154.7A CN103996646B (en) | 2014-05-23 | 2014-05-23 | Structure of chip bearing discs |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410223154.7A CN103996646B (en) | 2014-05-23 | 2014-05-23 | Structure of chip bearing discs |
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| CN103996646A CN103996646A (en) | 2014-08-20 |
| CN103996646B true CN103996646B (en) | 2017-05-10 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104307768B (en) * | 2014-10-29 | 2017-07-11 | 李志红 | The method and apparatus detected to bulk article |
| CN108318799B (en) * | 2017-01-17 | 2020-10-27 | 崇碁科技股份有限公司 | Chip burning test equipment and method |
| CN114324396A (en) * | 2021-12-31 | 2022-04-12 | 上海世禹精密机械有限公司 | Automatic chip sorting machine |
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| US6029427A (en) * | 1999-04-05 | 2000-02-29 | Lucent Technologies, Inc. | Method and apparatus for handling semiconductor chips |
| US6071056A (en) * | 1998-11-13 | 2000-06-06 | International Business Machines Corporation | Shipping tray backside location |
| US6139243A (en) * | 1997-07-09 | 2000-10-31 | Systemation Engineering | Method and system for flipping a tray of parts |
| CN102881621A (en) * | 2012-10-19 | 2013-01-16 | 无锡尚实电子科技有限公司 | Inverting and aligning method and device |
| CN203910771U (en) * | 2014-05-23 | 2014-10-29 | 矽创电子股份有限公司 | Structure of chip carrying plates |
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|---|---|---|---|---|
| US6139243A (en) * | 1997-07-09 | 2000-10-31 | Systemation Engineering | Method and system for flipping a tray of parts |
| US6071056A (en) * | 1998-11-13 | 2000-06-06 | International Business Machines Corporation | Shipping tray backside location |
| US6029427A (en) * | 1999-04-05 | 2000-02-29 | Lucent Technologies, Inc. | Method and apparatus for handling semiconductor chips |
| CN102881621A (en) * | 2012-10-19 | 2013-01-16 | 无锡尚实电子科技有限公司 | Inverting and aligning method and device |
| CN203910771U (en) * | 2014-05-23 | 2014-10-29 | 矽创电子股份有限公司 | Structure of chip carrying plates |
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| CN103996646A (en) | 2014-08-20 |
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