CN103993273A - Dynamic/static hybrid coating system and dynamic/static hybrid coating method by utilization of dynamic/static hybrid coating system - Google Patents
Dynamic/static hybrid coating system and dynamic/static hybrid coating method by utilization of dynamic/static hybrid coating system Download PDFInfo
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Abstract
The invention relates to a coating system and a coating method, especially to a dynamic/static hybrid coating system and a dynamic/static hybrid coating method by the utilization of the dynamic/static hybrid coating system. The dynamic/static hybrid coating system comprises a static coating system and a dynamic coating system. The static coating system contains a static coating chamber, a first coating assembly and a first transmission assembly. The reciprocating scan distance is zero or any distance less than the spacing between adjacent target materials. The dynamic coating system contains a dynamic coating chamber, a second coating assembly and a second transmission assembly. The dynamic/static hybrid coating method contains two modes. The first mode is as follows: static coating comes first and dynamic coating follows; then vertical transition of a substrate is conducted and the substrate comes out in a reverse direction; and the substrate is uncoated after translation. The second mode is as follows: the substrate firstly enters the innermost chamber; static coating is conducted after vertical transition; then, the substrate comes out in a reverse direction for dynamic coating; and finally, the substrate comes out from a low vacuum chamber. By the system and the method, a substrate can be coated and coating is uniform. Electrostatic damage to an electrostatic sensitive device can be prevented.
Description
Technical field
The present invention relates to a kind of coating system and film coating method, relate in particular to a kind of sound the admixture plates the film system and utilize it to carry out the method for sound the admixture plates the film.
Background technology
The plasma body that vacuum magnetron sputtering coating film process produces can cause electrostatic damage to electrostatic sensitivity device conventionally; especially part of devices is covered by plasma body and other parts while not covered by plasma body; this can cause voltage difference between device different sites; thereby by discharge breakdown device, cause electrostatic damage.
Vacuum plating generally has two kinds of modes: static plated film: glass substrate keeps stationary state, one group of target is evenly distributed on before glass substrate, target area coverage is larger than glass substrate, in order to improve plated film homogeneity, during plated film, the bar magnet field direction of target carrys out flyback, with technology in the market,, the film equality of static coating system preferably can only reach 10% left and right; (2) dynamic plated film: glass substrate at the uniform velocity passes through before target; according to the requirement of coating film thickness; can be equipped with the target of certain number, dynamically plated film has the good superiority of uniformity coefficient (<5%), still; dynamically plated film is for the glass substrate with to the electron device of electrostatic sensitive; conventionally can cause electrostatic damage, therefore, at present to glass substrate; the static plated film of general employing, does not adopt dynamic plated film.
Large display screen is <5% to the uniformity requirement of plated film at present, and static plated film is generally difficult to meet the demands, and dynamically plated film, can not be for the glass substrate plated film to the device of electrostatic sensitive due to electrostatic damage problem.
CN103255386A (2013-8-21) discloses the substrate of a kind of Dynamic deposition magnetic control sputtering film plating device method and the method manufacture, yet the method or device can not solve the problem that electrostatic sensitivity device is caused to electrostatic damage.
Summary of the invention
One of object of the present invention be to provide a kind of to have the substrate of electron device carry out plated film and plated film uniformly, can prevent electrostatic sensitivity device to cause the sound the admixture plates the film system of electrostatic damage.
Two of object of the present invention be to provide a kind of to have the substrate of electron device carry out plated film and plated film uniformly, can prevent electrostatic sensitivity device to cause the sound the admixture plates the film system of utilizing of electrostatic damage to carry out the method for sound the admixture plates the film.
The first technical purpose of the present invention is achieved by the following technical programs:
A sound the admixture plates the film system, it comprises:
Static coating system: static coating system comprises static plated film chamber, be arranged in described static plated film chamber for the first filming assembly to substrate surface deposition plating; And be arranged on the first transmission assembly that can be used for substrate to carry out shuttle-scanning in described static plated film chamber; The distance of described shuttle-scanning is zero or any distance that is less than adjacent target spacing;
And dynamic coating system, comprise dynamic plated film chamber, be arranged on and for the substrate surface to after static plated film, carry out the second plated film assembly of plated film in described dynamic plated film chamber; And be arranged on and for the substrate to after static plated film, carry out continuously the second transmission assembly of transmission in described dynamic plated film chamber.
Static coating system of the present invention can be pure static coating system or quasistatic coating system, and when the distance of substrate shuttle-scanning is zero, system is exactly pure static schema; And carry out the shuttle-scanning of certain distance when the relative target of substrate position in coating process, system is defined as quasistatic.Described the first filming assembly and/or the second plated film assembly can be two or more targets being arranged in parallel, and described target can be rotary target material or planar targets.Target in described static coating system can be the mould material that needs deposition, realizes electrostatic protection when meeting deposition plating.Described substrate can be for example glass substrate of non-flexible substrate.
The present invention adopts Static and dynamic the admixture plates the film mode: elder generation is the very thin continuous conduction film of electron device surface coverage one deck on glass substrate in static coating system part, to electron device, can play the effect of electrostatic shielding, effectively prevent electron device electrostatic damage, then, close the target power supply of static coating system, stop static plated film, open dynamic coating system target power supply, glass starts to move and enters dynamic coating system part, at the uniform velocity pass through target, the be increased thickness of needs of the thickness of rete, this Static and dynamic the admixture plates the film mode can improve film equality, can avoid dynamic plated film problem, the problem includes: electrostatic damage problem simultaneously.
For quasistatic plated film mode, one group of target is evenly distributed on before glass substrate, and target area coverage is larger than glass substrate, and the bar magnet field direction of target inside immobilizes, glass substrate continuous sweep in target spacing range during plated film, thus realize plated film homogeneity.This method, bar magnet field direction immobilizes, and the condition of each target is identical, and equipment regulates very simple, easily realizes high evenness.
Pure static plated film mode (Fig. 5): the glass substrate with electron device keeps stationary state, one group of target is evenly distributed on before glass substrate, target area coverage is larger than glass substrate, makes whole glass substrate cover Coating Materials simultaneously, avoids causing voltage difference between device different sites.Pure static film coating method, is plated film power by changing angle [alpha] that the bar magnet field direction of target inside swings, bar magnet magneticstrength, target, target space D 1, target-substrate distance D2 etc., thereby improves plated film homogeneity.
As preferably, sound the admixture plates the film system also comprises vacuum switched system and is arranged on described static coating chamber and dynamic the first surge chamber between coating chamber, and described vacuum switched system comprises and setting gradually and interconnective rough vacuum switching chamber and high vacuum switching chamber.
Surge chamber can be used to cushion plated film atmosphere, and stable plated film air pressure.Low vacuum chamber, as charging discharge chamber, so just can or unload substrate with the shortest time dress, then gets back to the vacuum state of work.
As preferably, in described static plated film chamber and dynamically plated film chamber, comprise respectively for to the target of substrate surface deposition plating with for the well heater to described base plate heating; In described static plated film chamber and dynamically plated film chamber, be provided with to meet cold pump or the molecular pump that vacuum requires; In described rough vacuum switching chamber, be provided with and comprise import track and import and exit track and outlet for what make the turnover of described substrate.
Low vacuum chamber, as charging discharge chamber, so just can or unload glass substrate with the shortest time dress, then gets back to the vacuum state of work; Simultaneously static plated film chamber and dynamically plated film chamber all arrange to meet cold pump or the molecular pump that vacuum requires, control this base pressure of vacuum and plated film vacuum tightness, realize substrate plated film more uniformly and effectively.
As preferably, the structure of described the first transmission assembly or the second transmission assembly comprise the frame substrate carrier for supporting substrate, move on stainless steel rider or travelling belt described frame substrate carrier edge bottom, and frame substrate carrier top is by moving between friction guide deflection sheave or frictionless magnetic steering guide rail.
When frame substrate tilts, substrate also tilts; When frame substrate is vertical, substrate is also vertical.Substrate can vertical transfer, for example 1-10 ° of conveying of certain Small angle of also can tilting.Substrate tilts can make glass more stable in transmitting procedure, reduces fragmentation rate, and substrate remains parallel with target.
As preferably, described the first surge chamber comprises surge chamber, is arranged on outside and the molecular pump being connected with surge chamber or cold pump; In all possible plated film mode, in described static coating chamber, can be provided with and by transmission mechanism, substrate be realized the translating device of translation.
Translating device is set and can makes substrate carry out vertical translation, thereby oppositely directly transmit or in reverse transfer, carry out plated film at another parallel track.
As preferably, described dynamic coating chamber one end is connected with the second surge chamber, and described the second surge chamber comprises surge chamber, is arranged on outside and the molecular pump being connected with surge chamber or cold pump and by transmission mechanism, substrate realized the translating device of vertical translation.
The second technical purpose of the present invention is achieved by the following technical programs:
The first pattern is:
Utilize sound the admixture plates the film system to carry out a method for sound the admixture plates the film, comprise successively step:
1) substrate is placed on frame substrate carrier, the first transmission speed with 1-30m/min enters described static coating chamber, make the to be coated facing to the first filming assembly in static coating chamber of substrate, make substrate in static coating chamber, carry out pure static plated film or shuttle-scanning plated film;
2) make with the first transmission speed of 1-30m/min, at the uniform velocity to enter the first surge chamber through the substrate of static plated film, then with the second transmission speed of 0.5-10m/min, enter and in dynamic coating chamber, carry out continuous dynamic transmission plated film;
3) make with the second transmission speed of 0.5-10m/min, to enter the second surge chamber through the substrate of dynamic plated film, then vertical translation in described the second surge chamber, oppositely enters in described dynamic coating chamber and static coating chamber successively, and translation is plated film not later.
Adopt Static and dynamic the admixture plates the film mode: elder generation is the very thin continuous conduction film of electron device surface coverage one deck on glass substrate in static coating chamber part, to electron device, can play the effect of electrostatic shielding, effectively prevent electron device electrostatic damage, then, close the target power supply of static coating chamber, stop static plated film, open dynamic coating chamber target power supply, glass starts to move and passes through surge chamber and enters dynamic coating chamber, at the uniform velocity pass through target, the thickness of rete is increased to the thickness needing, this Static and dynamic the admixture plates the film mode can improve film equality, can avoid dynamic plated film problem, the problem includes: electrostatic damage problem simultaneously.
The comprehensive uniformity coefficient estimation case of the admixture plates the film method of the present invention: utilize the very thin conducting film of static coating system growth one deck, on the device of electrostatic sensitive, cover electro-conductive material such as metallic substance, avoid electrostatic damage, control the thicknesses of layers of static plated film at 10% of desired thickness, then, dynamic coating system all the other 90% required thickness of sputter equably; Supposing that static plated film uniformity coefficient is 10% and the total thickness (total thickness is D) of only sputter 10%, is 10%* (10%D)=1%D because static plated film causes the variation range of film thickness; Suppose that dynamic plated film uniformity coefficient can be at <5%, dynamically plated film thickness is 90%D, because dynamic plated film causes the variation range of film thickness, is 5%* (90%D)=4.5%D; After quiet dynamic the admixture plates the film D thickness, comprehensive uniformity coefficient can realize 5.5%D, than the homogeneity of static plated film 10%, significantly improves, and has solved the electrostatic damage problem of dynamic plated film simultaneously.
As preferably, substrate is passing through rough vacuum switching chamber and high vacuum switching chamber through before described static coating chamber successively with the first transmission speed of 1-30m/min, after static plated film and dynamic plated film, after the second surge chamber vertical translation, with the second transmission speed of 0.5-10m/min, oppositely enter successively after described dynamic coating chamber, the first surge chamber and static coating chamber again the first transmission speed with 1-30m/min successively by high vacuum switching chamber and rough vacuum switching chamber, and send from the outlet of rough vacuum switching chamber, whole plated film completes.
As preferably, described the first transmission speed is 25 m/min, and described the second transmission speed is 3-5m/min.
The second pattern is:
Utilize sound the admixture plates the film system to carry out a method for sound the admixture plates the film, comprise successively step:
A. substrate is placed on frame substrate carrier, the first transmission speed with 1-30m/min enters after described dynamic coating chamber, speed with 0.5-10m/min enters the first surge chamber and static coating chamber, and then in described static coating chamber, vertical translation is to plated film position, and translation is plated film not in the past;
B. after vertical translation, in described static coating system, make the to be coated facing to the plated film assembly in static coating system of substrate, make substrate in static coating system, carry out pure static plated film or shuttle-scanning plated film;
C. make with the second transmission speed of 0.5-10m/min, oppositely to enter the second surge chamber through the substrate of static plated film, then with the second transmission speed of 0.5-10m/min, enter and in dynamic coating system, carry out continuous dynamic transmission plated film.
According to two patterns of the present invention, the first pattern is first static plated film dynamic plated film again, then vertical direction translation, oppositely out (translation later not plated film); The second pattern is first to enter innermost chamber, vertical direction translation, and static plated film then, more reverse dynamic plated film out, out from low vacuum chamber finally.
As preferably, substrate is passing through rough vacuum switching chamber and high vacuum switching chamber through before described dynamic coating chamber successively with the first transmission speed of 1-30m/min, substrate carries out static plated film after vertical translation in arriving the innermost static coating chamber of coating wire, then reverse the first transmission speed with 1-30m/min enters the first surge chamber, with the second transmission speed of 0.5-10m/min, enter successively described dynamic coating chamber again and carry out dynamic plated film, with the first transmission speed of 1-30m/min, pass through successively high vacuum switching chamber and rough vacuum switching chamber again, and send from the outlet of rough vacuum switching chamber, whole plated film completes.
As preferably, substrate enters after described dynamic coating chamber and the first surge chamber successively with the second transmission speed of 0.5-10m/min, arrives the innermost static coating chamber of coating wire.
As preferably, described the first transmission speed is 25 m/min, and described the second transmission speed is 3-5m/min.
In sum, the present invention has following beneficial effect:
1, solved the electrostatic damage problem that dynamic plated film causes electron device;
2, solve the uniformity coefficient problem of static plated film, improved film equality.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of substrate in the static coating system of sound the admixture plates the film system of the present invention;
Fig. 2 is the schematic diagram of substrate in the dynamic coating system of sound the admixture plates the film system of the present invention;
Fig. 3 is the sound the admixture plates the film system of an embodiment of the present invention;
Fig. 4 is the sound the admixture plates the film system of the another kind of embodiment of the present invention;
Fig. 5 is pure static coating system schematic diagram.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
As shown in Figure 1, film coating method is the first very thin continuous conduction film of electron device surface coverage one deck on substrate in static coating system part, to electron device, can play the effect of electrostatic shielding, effectively prevent electron device electrostatic damage, then, the target power supply of closing static coating system, stops static plated film; Open dynamic coating system target power supply, as shown in Figure 2, glass starts to move and enters dynamic coating system part, at the uniform velocity pass through target, the thickness of rete can be increased to the thickness needing, this Static and dynamic the admixture plates the film mode can improve film equality, can avoid dynamic plated film problem, the problem includes: electrostatic damage problem simultaneously.
As shown in Figure 3 or Figure 4, sound the admixture plates the film system comprises static coating system 1 and dynamic coating system 2.Static coating system 1 comprises static plated film chamber 11, be arranged in static plated film chamber 11 for to substrate 3 surface depositions to form the first filming assembly 12 of continuous film; And be arranged on the first transmission assembly that can be used for substrate 3 to carry out shuttle-scanning in static plated film chamber 11; The distance of shuttle-scanning is zero or any distance that is less than adjacent target spacing; That is to say, static coating system can be pure static coating system or quasistatic coating system.
When the distance of shuttle-scanning is zero, static coating system is pure static coating system.When the distance of shuttle-scanning is while being less than the distance of adjacent target spacing, static coating system is quasistatic coating system.
Dynamically coating system 2 comprises dynamic plated film chamber 21, is arranged on the second plated film assembly 22 that plated film is carried out on substrate 3 surfaces for to after static plated film in dynamic plated film chamber 21; And the substrate 3 for to after static plated film being arranged in dynamic plated film chamber 21 carries out the second transmission assembly of transmission continuously.
For the needs of required different Coating Materials layers, the dynamic plated film chamber 21 of two above series connection can be set.
The first filming assembly 12 and/or the second plated film assembly 22 can be the target that more than two (comprising two) are arranged in parallel, and target can be rotary target material or planar targets.Target in static coating system can be the mould material that needs deposition, for example but be not restricted to molybdenum, aluminium, titanium, chromium etc. are realized electrostatic protection when meeting deposition plating.Substrate can be for example glass substrate of non-flexible substrate.
For the time with the shortest fills or unloads substrate, then get back to the vacuum state of work, system also comprises vacuum switched system 4 and is arranged on static coating system 1 and dynamic the first buffering system 5 between coating system 2, and vacuum switched system 4 comprises interconnective rough vacuum switching chamber 41 and high vacuum switching chamber 42.
Static plated film chamber 11 comprises respectively for the target 111 to substrate surface deposition plating with for the well heater 112 to base plate heating with dynamically plated film chamber 21 is interior; In static plated film chamber 11 and dynamically plated film chamber 21, be provided with to meet cold pump or the molecular pump 113 that vacuum requires; In rough vacuum switching chamber 41, be provided with for making comprising import track and import 411 and comprising exit track and outlet 412 of substrate 3 turnover, thereby can greatly enhance productivity.Rough vacuum switching chamber can connect atmospheric condition and high vacuum state, and centre is controlled with segregaion valve.
The first transmission assembly or the second transmission assembly comprise the frame substrate carrier (not illustrating in the drawings) for supporting substrate 3, move on stainless steel rider or travelling belt frame substrate carrier edge bottom, and frame substrate carrier top is by moving between friction guide deflection sheave or frictionless magnetic steering guide rail.Frame substrate carrier can be vertical with substrate, and for example 1-10 ° of certain Small angle also can tilt.Substrate tilts can make glass more stable in transmitting procedure, reduces fragmentation rate, and substrate and target are keeping parallelisms.
The first buffering system 5 comprises surge chamber 51, be arranged on molecular pump or cold pump 113 that the outside of surge chamber 51 is connected; Dynamic coating system 2 one end are provided with the second buffering system 6, the second buffering systems 6 and comprise surge chamber 51, be arranged on the outside surface top of surge chamber 51 and the molecular pump 113 of bottom and by transmission mechanism, substrate realized translating device 114(Fig. 3 of translation).By this system, realize the first film coating mode to substrate film coating of the present invention.
Static plated film chamber 11, dynamically plated film chamber 21 or buffer chamber 51 each chambers temp scope are from room temperature to 550 ℃, operating air pressure 1-10mTorr, power 1-50kW, vacuum base pressure <2E
-6torr.
For realizing the second film coating mode to substrate film coating of the present invention.Do not need to arrange the second buffering system 6, in static coating system 1, be provided with and by transmission mechanism, substrate realized translating device 114(Fig. 4 of translation).
Embodiment mono-
The film coating method of the first pattern is shown in Fig. 3, specifically:
1) substrate 3 is placed on frame substrate carrier, with the first transmission speed of 25m/min, pass through successively rough vacuum switching chamber 41 and high vacuum switching chamber 42, then the first transmission speed V1 with 25m/min enters static coating chamber 1, make the to be coated facing to the first filming assembly 12 in static coating chamber 1 of substrate 3, make substrate 3 in static coating chamber 1, carry out pure static plated film or shuttle-scanning plated film;
2) make with the first transmission speed of 25m/min, at the uniform velocity to enter the first surge chamber 5 through the substrate 3 of static plated film, then with the second transmission speed V2 of 4m/min, enter and in dynamic coating chamber 2, carry out continuous dynamic transmission plated film;
3) make with the second transmission speed of 4m/min, to enter the second surge chamber 6 through the substrate 3 of dynamic plated film, then in the interior translation of the second surge chamber 6, oppositely enter successively in dynamic coating chamber and static coating chamber, translation is plated film not later.After translation, reverse the second transmission speed with 4m/min is passed through high vacuum switching chamber 42 and rough vacuum switching chamber 41 with the first transmission speed of 25m/min after entering successively dynamic coating chamber, the first surge chamber and static coating chamber more successively, and send from rough vacuum switching chamber outlet 412, whole plated film completes.
Embodiment bis-
The film coating method of the first pattern is with embodiment mono-, and different is that the first transmission speed V1 is 1m/min; The second transmission speed V2 is 0.5m/min.
Embodiment tri-
The film coating method of the first pattern is with embodiment mono-, and different is that the first transmission speed V1 is 30m/min; The second transmission speed V2 is 10m/min.
Embodiment tetra-
The film coating method of the second pattern is shown in Fig. 4, specifically:
A. substrate 3 is placed on frame substrate carrier, substrate 3 passes through rough vacuum switching chamber 41 and high vacuum switching chamber 42 successively with the first transmission speed V1 of 25m/min, then substrate 3 enters after dynamic coating chamber 2 and the first surge chamber 5 successively with the second transmission speed V2 of 0.5-10m/min, arrive the innermost static coating chamber 1 of coating wire, vertical translation in static coating chamber, make the to be coated facing to the first filming assembly 12 in static coating chamber 2 of substrate 3, make substrate 3 in static coating chamber 1, carry out pure static plated film or shuttle-scanning plated film; Then reverse the first transmission speed V1 with 1-30m/min enters the first surge chamber 5, with the second transmission speed V2 of 0.5-10m/min, enter successively dynamic coating chamber 2 again and carry out dynamic plated film, the first transmission speed V1 with 1-30m/min passes through high vacuum switching chamber 42 and rough vacuum switching chamber 41 successively again, and send from rough vacuum switching chamber outlet 412, whole plated film completes
Embodiment five
The film coating method of the second pattern is with embodiment tetra-, and different is that the first transmission speed V1 is 1m/min, and the second transmission speed V2 is 0.5m/min.
Embodiment six
The film coating method of the second pattern is with embodiment tetra-, and different is that the first transmission speed V1 is 30m/min, and the second transmission speed V2 is 10m/min.
This specific embodiment is only explanation of the invention; it is not limitation of the present invention; those skilled in the art can make to the present embodiment the modification that there is no creative contribution as required after reading this specification sheets, but as long as within the scope of claim of the present invention, are all subject to the protection of patent law.
Claims (12)
1. a sound the admixture plates the film system, is characterized in that comprising:
Static coating system: static coating system comprises static plated film chamber, be arranged in described static plated film chamber for the first filming assembly to substrate surface deposition plating; And be arranged on the first transmission assembly that can be used for substrate to carry out shuttle-scanning in described static plated film chamber; Described the first filming assembly comprises the target that two or more are arranged in parallel, and the distance of described shuttle-scanning is zero or any distance that is less than adjacent target spacing;
And dynamic coating system, comprise dynamic plated film chamber, be arranged on and for the substrate surface to after static plated film, carry out the second plated film assembly of plated film in described dynamic plated film chamber; And be arranged on and for the substrate to after static plated film, carry out continuously the second transmission assembly of transmission in described dynamic plated film chamber.
2. a kind of sound the admixture plates the film system according to claim 1, characterized by further comprising vacuum switched system and be arranged on described static coating system and dynamic the first buffering system between coating system, described vacuum switched system comprises and setting gradually and interconnective rough vacuum switching chamber and high vacuum switching chamber.
3. a kind of sound the admixture plates the film system according to claim 1 and 2, is characterized in that: in described static plated film chamber and dynamically plated film chamber, comprise respectively for to the target of substrate surface deposition plating with for the well heater to described base plate heating; In described static plated film chamber and dynamically plated film chamber, be provided with to meet cold pump or the molecular pump that vacuum requires; In described rough vacuum switching chamber, be provided with for making comprising import track and import and comprising exit track and outlet of described substrate turnover.
4. a kind of sound the admixture plates the film system according to claim 3, it is characterized in that: described the first transmission assembly or the second transmission assembly comprise the frame substrate carrier for supporting substrate, move on stainless steel rider or travelling belt described frame substrate carrier edge bottom, and frame substrate carrier top is by moving between friction guide deflection sheave or frictionless magnetic steering guide rail.
5. a kind of sound the admixture plates the film system according to claim 2, is characterized in that: described the first buffering system comprises surge chamber, is arranged on described surge chamber is outside and be connected with surge chamber molecular pump or cold pump; In described static coating system, be provided with and by transmission mechanism, substrate realized the translating device of translation.
6. a kind of sound the admixture plates the film system according to claim 2, it is characterized in that: described dynamic coating system one end is provided with the second buffering system, described the second buffering system comprises surge chamber, is arranged on described outside and the molecular pump being connected with surge chamber and by transmission mechanism, substrate is realized the translating device of translation.
7. utilize claim 1-6 any one sound the admixture plates the film system to carry out a method for sound the admixture plates the film, it is characterized in that:
1) substrate is placed on frame substrate carrier, the first transmission speed with 1-30m/min enters described static coating chamber, make the to be coated facing to the first filming assembly in static coating chamber of substrate, make substrate in static coating chamber, carry out pure static plated film or shuttle-scanning plated film;
2) make with the first transmission speed of 1-30m/min, at the uniform velocity to enter the first surge chamber through the substrate of static plated film, then with the second transmission speed of 0.5-10m/min, enter and in dynamic coating chamber, carry out continuous dynamic transmission plated film;
3) make with the second transmission speed of 0.5-10m/min, to enter the second surge chamber through the substrate of dynamic plated film, then translation in described the second surge chamber, oppositely enters in described dynamic coating chamber and static coating chamber successively, and translation is plated film not later.
8. utilize claim 1-6 any one sound the admixture plates the film system to carry out a sound the admixture plates the film method, it is characterized in that:
A. substrate is placed on frame substrate carrier, with the first transmission speed of 1-30m/min, enters successively described dynamic coating chamber, the first surge chamber and static coating chamber, vertical translation in described static coating chamber then, vertical translation is plated film not in the past;
B. after vertical translation, in described static coating chamber, make the to be coated facing to the first filming assembly in static coating chamber of substrate, make substrate in static coating chamber, carry out pure static plated film or shuttle-scanning plated film;
C. make with the second transmission speed of 1-30m/min, at the uniform velocity to enter the first surge chamber through the substrate of static plated film, then with the second transmission speed of 0.5-10m/min, enter and in dynamic coating system, transmit continuously plated film.
9. the method for sound the admixture plates the film according to claim 7, is characterized in that: substrate is passing through rough vacuum switching chamber and high vacuum switching chamber through before described static coating chamber successively with the first transmission speed of 1-30m/min; Substrate enters successively after described dynamic coating chamber, the first surge chamber and static coating chamber the first transmission speed with 1-30m/min successively by high vacuum switching chamber and rough vacuum switching chamber with the second transmission speed of 0.5-10m/min after vertical translation after Static and dynamic plated film in the second surge chamber again, and send from the outlet of rough vacuum switching chamber, whole plated film completes.
10. the method for sound the admixture plates the film according to claim 8, is characterized in that: substrate is passing through rough vacuum switching chamber and high vacuum switching chamber through before described dynamic coating chamber successively with the first transmission speed of 1-30m/min; Substrate carries out static plated film after vertical translation in arriving the innermost static coating chamber of coating wire, then reverse the first transmission speed with 1-30m/min enters the first surge chamber, with the second transmission speed of 0.5-10m/min, enter successively described dynamic coating chamber again and carry out dynamic plated film, with the first transmission speed of 1-30m/min, pass through successively high vacuum switching chamber and rough vacuum switching chamber again, and send from the outlet of rough vacuum switching chamber, whole plated film completes.
The method of 11. sound the admixture plates the films according to claim 10, is characterized in that: substrate enters after described dynamic coating chamber and the first surge chamber successively with the second transmission speed of 0.5-10m/min, arrives the innermost static coating chamber of coating wire.
12. according to the method for the sound the admixture plates the film described in claim 9 or 10, it is characterized in that: described the first transmission speed is 25 m/min, and described the second transmission speed is 3-5m/min.
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| CN107740059A (en) * | 2017-10-19 | 2018-02-27 | 浙江上方电子装备有限公司 | Electrochromic device ioning method, preparation method and product |
| CN108070841A (en) * | 2016-11-11 | 2018-05-25 | 无锡威迪变色玻璃有限公司 | Continuous coating system and method |
| CN108138322A (en) * | 2015-10-25 | 2018-06-08 | 应用材料公司 | For equipment vacuum-deposited on substrate and system and for method vacuum-deposited on substrate |
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| CN107740059B (en) * | 2017-10-19 | 2019-12-10 | 浙江上方电子装备有限公司 | Ionization method of electrochromic device, preparation method and product |
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