CN103990501A - Efficient heat-transmission and heat-isolation micro thermal control chip system - Google Patents
Efficient heat-transmission and heat-isolation micro thermal control chip system Download PDFInfo
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- CN103990501A CN103990501A CN201410271144.0A CN201410271144A CN103990501A CN 103990501 A CN103990501 A CN 103990501A CN 201410271144 A CN201410271144 A CN 201410271144A CN 103990501 A CN103990501 A CN 103990501A
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Abstract
The invention discloses an efficiently heat-transmission and heat-isolation micro thermal control chip system which comprises a heating electrode, a heat dissipation element, a micro heat pipe, a micro reaction cavity, a micro flow channel, a micro flow control system, a metal lead, an electronic signal process and control module, glass, silicon and silicon oxide, a heat-isolation groove and a sensor, wherein one end of the micro heat pipe is connected with the heating electrode or a heat dissipating and condensing element; the other end of the micro heat pipe is connected with the micro reaction cavity; the micro flow control system is connected with the micro reaction cavity through the micro flow channel; the electronic signal process and control module is connected with the micro reaction cavity or the sensor through the metal lead; the micro heat pipe adopts a siphon heat pipe; porous materials are deposited on the inner wall of the micro heat pipe; the glass is boned at the bottom of the micro heat pipe. Through the heat exchange of the micro heat pipe and the micro reaction cavity, the temperature of reacting solution in the micro reaction cavity can be rapidly increased or reduced; the heating electrode, the heat dissipation element, the metal lead and the micro flow channel are not in the same area and the machining is convenient; the heating electrode and the heat dissipation element are distributed in certain individually areas of the chip and the performances of other parts are generally not impacted.
Description
Technical field
The present invention relates to a kind of efficient heat transfer and hot low-grade fever control chip system of isolating, especially can realize the chip system of rapid temperature rise and drop and zoned temperature control.
Background technology
Along with micro electro mechanical system (MEMS) technology (Micro Electro Mechanical System, developing rapidly and the deepening continuously of interdisciplinary research MEMS), chip system develops into circuit and multiple physics, chemistry, the perception of biological information and the broad sense chip system that processing capacity is integrated in one from the integrated of simple various electronic devices and components and semiconductor circuit.In such chip system, many biochemical reactions are temperature sensitive, and electronic devices and components need heat radiation, and therefore thermal control is most important for the normal work of chip system.
Microsystems technology is by conventional semiconductors technical development.Generally speaking, high power density electronic chip and microactrator part need can quick heat radiating, and the temperature of chip base is the key factor that affects its service behaviour.Micro-processing technology combine with life science the micro-full analytical system that produces by ACTIVE CONTROL solution mobile in chip (micro chamber PCR chip is example) device, complicated biochemical reaction analyte detection process is carried out continuously automatically and efficiently in chip, thereby the function in biochemical analysis laboratory is transferred on the chip of heart size.In recent years, utilize the compatible Monolithic integrated MEMS technology of IC and other silica-based/non-silicon material micro-processing method, successfully realized transmission, control and the processing on sheet of electronic signal and reaction reagent.For the control of biochemical reaction temperature environment, generally adopt at present in reaction microchamber substrate and lay the mode such as heating electrode and fan and water circulation refrigeration.
Hot pipe technique is a kind of without external drive, follows the efficient heat transfer technology of heat absorption, heat radiation by working medium from phase transformation in cyclic process.The thermal resistance of heat pipe is minimum, and effective thermal conductivity even can reach up to ten thousand times of copper.In heat pipe, be conventionally filled with volatility working medium, working medium absorbs heat at evaporator section and undergoes phase transition and become gaseous state, and emits heat at condensation segment and be condensed into liquid state.Gravity assisted heat pipe is simple in structure, and the backflow of its liquid refrigerant relies on Action of Gravity Field, can realize one-way heat conduction (instant heating can only be transmitted to top from bottom), but must vertically place at work.Siphon heat pipe, by lay one deck porous material at inside pipe wall, utilizes the siphonage backflow liquid refrigerant of porous material, therefore do not limit at work modes of emplacement, but the heat exchange property of siphon heat pipe and the siphonage of porous material is closely related.
At present, integrated circuit and micro-fluidic subsystem for electronic signal control and processing in chip system can design preparation at chip, and respectively by the exchange of metal lead wire and fluid channel and reaction microchamber generation material, energy and signal.But, the thermal control of chip system but still main employing in reaction chamber substrate lay heating electrode and fan/liquid stream is cooling etc. that mode is carried out, modularization that cannot practical function.There is following problem in such heat control method: the one, lay the limited space of heating electrode and coolant flow channel, and affect its heating/cooling power; The 2nd, Thermal Control Element and runner, plain conductor concentrate on the same area, easily cause the difficulty in processing; The 3rd, usually heating/cooling whole chip base simultaneously of heating/when cooling, causes thermal capacitance greatly and easily affects the performance of other device.
Summary of the invention
The technical problem of solution required for the present invention is the defect existing for prior art, proposes a kind of efficient heat transfer and heat isolation low-grade fever control chip that can realize flash heat transfer and subregion constant temperature control.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of efficient heat transfer and hot low-grade fever control chip system of isolating, comprise heating electrode, heat dissipation element, micro heat pipe, reaction microchamber, fluid channel, microfluidic system, metal lead wire, electronic signal process and control module, glass, silicon, silica, heat dam, sensor, micro heat pipe one end connects heating electrode or heat dissipation element, the other end connects reaction microchamber, microfluidic system connects reaction microchamber by fluid channel, and electronic signal process is connected reaction microchamber or sensor with control module by metal lead wire.
On described chip system, between different temperatures district, be provided with the heat dam that reduces heat exchange.
Described micro heat pipe adopts siphon heat pipe, inwall deposit porous material, bottom key combined glass glass.
Described heat dam adopts etching in silicon base to form, and outer wall can self-assembling formation silica diaphragm; Or the low polymer film of the coated coefficient of heat transfer.
Described micro heat pipe outside is Semiconducting Silicon Materials; Below described Semiconducting Silicon Materials, being glass, is insulating materials silica above.
Described heating electrode, heat dissipation element, sensor adopt standard microelectronic technique to prepare in silicon base, are attached to insulating materials silicon oxide surface.
Described reaction microchamber adopts lithographic method to prepare in silicon base, can carry out as required surface modification.
Efficient heat transfer and a hot low-grade fever control chip system of isolating, comprise the High Efficiency Thermal control module that heating electrode, heat dissipation element, micro heat pipe, heat dam etc. form, microfluidic system, electronic signal process and the control module of the composition such as reaction microchamber, fluid channel.Micro heat pipe one end connects heating electrode or heat dissipation element, and the other end connects reaction microchamber, between the two, transmits fast efficient heat; Microfluidic system is that reaction microchamber transports reactant by fluid channel, controls reactant/product and the speed thereof of the reaction microchamber of coming in and going out; Electronic signal process and control module, by the metal lead wire various signals in reaction microchamber of can sampling, realize signals collecting and control, by electronic signal process control High Efficiency Thermal control module and microfluidic system.
Heating electrode and heat dissipation element concentrate on certain region of chip, carry out exchange heat by micro heat pipe and reaction microchamber, if abundant heating electrode and and heat dissipation element, can realize the rapid temperature rise and drop of reaction solution in reaction microchamber, and keep zones of different temperature constant respectively.
The invention has the beneficial effects as follows: proposed a kind of efficient heat transfer and hot low-grade fever control chip system of isolating, carried out exchange heat by micro heat pipe and reaction microchamber, can realize the rapid temperature rise and drop of reaction solution in reaction microchamber; Heating electrode, heat dissipation element, metal lead wire, fluid channel be not at the same area, easy to process; Heating electrode and heat dissipation element are distributed in a certain individual region of chip, substantially do not affect the performance of other devices.
Brief description of the drawings
Fig. 1 is the top view of the low-grade fever control chip system of a kind of efficient heat transfer and heat isolation.
Fig. 2 is the sectional view of the low-grade fever control chip system of a kind of efficient heat transfer and heat isolation.
1. heating electrodes in figure, 2. heat dissipation element, 3. micro heat pipe, 4. reaction microchamber, 5. fluid channel, 6. microfluidic system, 7. metal lead wire, 8. electronic signal process and control module, 9. glass, 10. silicon, 11. silica, 12. heat dams, 13. sensors.
Detailed description of the invention
As shown in the figure, a kind of efficient heat transfer and hot low-grade fever control chip system of isolating, comprise heating electrode (1), heat dissipation element (2), micro heat pipe (3), reaction microchamber (4), fluid channel (5), microfluidic system (6), metal lead wire (7), electronic signal process and control module (8), glass (9), silicon (10), silica (11), heat dam (12), sensor (13), micro heat pipe (3) one end connects heating electrode (1) or heat dissipation element (2), the other end connects reaction microchamber (4), microfluidic system (6) connects reaction microchamber (4) by fluid channel (5), electronic signal process is connected reaction microchamber (4) or sensor (13) with control module (8) by metal lead wire (7).
On described chip system, between different temperatures district, be provided with the heat dam (12) that reduces heat exchange.
Described micro heat pipe (3) adopts siphon heat pipe, inwall deposit porous material, bottom key combined glass glass (9).
Described heat dam (12) adopts etching in silicon base to form, and outer wall can self-assembling formation silica (11) diaphragm; Or the low polymer film of the coated coefficient of heat transfer.
Described micro heat pipe (3) outside is Semiconducting Silicon Materials (10); Described Semiconducting Silicon Materials (10) is glass (9) below, is insulating materials silica (11) above.
Described heating electrode (1), heat dissipation element (2), sensor (13) adopt standard microelectronic technique to prepare in silicon base, are attached to insulating materials silica (11) surface.
Described reaction microchamber (4) adopts lithographic method to prepare in silicon base, can carry out as required surface modification.
A kind of efficient heat transfer and hot low-grade fever control chip system of isolating, comprise the High Efficiency Thermal control module of the compositions such as heating electrode (1), heat dissipation element (2), micro heat pipe (3), heat dam (12), the microfluidic system (6) of the composition such as reaction microchamber (4), fluid channel (5), electronic signal process and control module (8).Micro heat pipe (3) one end connects heating electrode (1) or heat dissipation element (2), and the other end connects reaction microchamber (4), between the two, transmits fast efficient heat; Microfluidic system (6) transports reactant by fluid channel (5) for reaction microchamber (4), controls reactant/product and the speed thereof of the reaction microchamber of coming in and going out; Electronic signal process and control module (8), by metal lead wire (7) the various signals in reaction microchamber (4) of can sampling, realize signals collecting and control, by electronic signal process control High Efficiency Thermal control and micro-fluidic.
Heating electrode (1) and heat dissipation element (2) concentrate on certain region of chip, carry out exchange heat by micro heat pipe (3) and reaction microchamber (4), if abundant heating electrode (1) and and heat dissipation element (2), can realize the rapid temperature rise and drop of the interior reaction solution of reaction microchamber (4), and keep zones of different temperature constant respectively.
Claims (7)
1. the low-grade fever control chip system of an efficient heat transfer and hot isolation, it is characterized in that: comprise heating electrode (1), heat dissipation element (2), micro heat pipe (3), reaction microchamber (4), fluid channel (5), microfluidic system (6), metal lead wire (7), electronic signal process and control module (8), glass (9), silicon (10), silica (11), heat dam (12), sensor (13), micro heat pipe (3) one end connects heating electrode (1) or heat dissipation element (2), the other end connects reaction microchamber (4), microfluidic system (6) connects reaction microchamber (4) by fluid channel (5), electronic signal process is connected reaction microchamber (4) or sensor (13) with control module (8) by metal lead wire (7).
2. a kind of efficient heat transfer according to claim 1 and hot low-grade fever control chip system of isolating, is characterized in that: on chip system, between different temperatures district, be provided with the heat dam (12) that reduces heat exchange.
3. a kind of efficient heat transfer according to claim 1 and hot low-grade fever control chip system of isolating, is characterized in that: described micro heat pipe (3) adopts siphon heat pipe, inwall deposit porous material, bottom key combined glass glass (9).
4. the low-grade fever control chip system of a kind of efficient heat transfer according to claim 1 and 2 and heat isolation, is characterized in that: described heat dam (12) adopts etching in silicon base to form, and outer wall can self-assembling formation silica (11) diaphragm; Or the low polymer film of the coated coefficient of heat transfer.
5. the low-grade fever control chip system with heat isolation according to a kind of efficient heat transfer described in claim 1 or 3, is characterized in that: described micro heat pipe (3) is outside is Semiconducting Silicon Materials (10); Described Semiconducting Silicon Materials (10) is glass (9) below, is insulating materials silica (11) above.
6. a kind of efficient heat transfer according to claim 1 and hot low-grade fever control chip system of isolating, it is characterized in that: described heating electrode (1), heat dissipation element (2), sensor (13) adopt standard microelectronic technique to prepare in silicon base, are attached to insulating materials silica (11) surface.
7. a kind of efficient heat transfer according to claim 1 and hot low-grade fever control chip system of isolating, is characterized in that: described reaction microchamber (4) adopts lithographic method to prepare in silicon base, can carry out as required surface modification.
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| CN201410271144.0A CN103990501A (en) | 2014-06-18 | 2014-06-18 | Efficient heat-transmission and heat-isolation micro thermal control chip system |
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| CN201410271144.0A CN103990501A (en) | 2014-06-18 | 2014-06-18 | Efficient heat-transmission and heat-isolation micro thermal control chip system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111362226A (en) * | 2020-03-12 | 2020-07-03 | 中国科学院上海微系统与信息技术研究所 | Resonant micro-cantilever chip and preparation method thereof |
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2014
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Patent Citations (6)
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| US20050009070A1 (en) * | 2003-05-23 | 2005-01-13 | Bio-Rad Laboratories, Inc., A Corporation Of The State Of Delaware | Localized temperature control for spatial arrays of reaction media |
| US20050006372A1 (en) * | 2003-07-10 | 2005-01-13 | Citizen Watch Co., Ltd | Temperature regulator for microchemical chip |
| US20060228812A1 (en) * | 2005-04-01 | 2006-10-12 | Konica Minolta Medical & Graphic, Inc. | Micro analysis system |
| CN101097897A (en) * | 2007-07-05 | 2008-01-02 | 上海交通大学 | Integrated pulsating chip heat pipe and method for making same |
| CN102716771A (en) * | 2012-06-07 | 2012-10-10 | 北京大学 | Continuous flow type micro-flow control chip for realizing reactions under high temperature and high pressure and preparation method thereof |
| CN103489838A (en) * | 2013-10-15 | 2014-01-01 | 北京大学 | Enhanced radiation three-dimensional packaging structure and packaging method for same |
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| CN111362226A (en) * | 2020-03-12 | 2020-07-03 | 中国科学院上海微系统与信息技术研究所 | Resonant micro-cantilever chip and preparation method thereof |
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Application publication date: 20140820 |