CN103987188A - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN103987188A CN103987188A CN201410230775.8A CN201410230775A CN103987188A CN 103987188 A CN103987188 A CN 103987188A CN 201410230775 A CN201410230775 A CN 201410230775A CN 103987188 A CN103987188 A CN 103987188A
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- CN
- China
- Prior art keywords
- block
- circuit board
- flexible circuit
- circuit element
- display module
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A flexible circuit board is applied to a display panel. The flexible circuit board comprises a first block, a second block and at least one circuit element, wherein the second block is adjacent to and connected to the first block, the circuit element is arranged on the first block and electrically connected with the first block, the circuit element is electrically insulated from the second block, and the second block is arranged above the first block in a bendable mode so that the circuit element can be covered between the first block and the second block.
Description
Technical field
The present invention relates to a kind of flexible circuit board.
Background technology
Display panels (Liquid Crystal Display, LCD) is the display unit of thin plane, is made up of colour or the monochrome pixels of some, is positioned over light source or reflecting surface front.Liquid crystal display is low in energy consumption, therefore gains great popularity, and is the display unit of current main flow.
Conventionally on display panels, flexible circuit board can be set, and utilize this flexible circuit board to be electrically connected the disparate modules in display floater.Circuit element can be set on flexible circuit board conventionally, contact and short circuit with other conducting elements in display floater for fear of circuit element, can on circuit element, stick insulating tape, with buffer circuit element.
But, between circuit element and flexible circuit board, have difference in height, and also have difference in height between each circuit element, and difference in height will make adhesive tape produce bounce.In addition, the upper surface of circuit element is less, and therefore the contact area of adhesive tape and circuit element is also less.Above-mentioned situation all makes adhesive tape easily come off, thereby cannot bring into play buffer circuit element in case effect of short circuit.
Summary of the invention
The object of the present invention is to provide a kind of flexible circuit board, by the second block of flexible circuit board is covered on the first block, thereby isolate the circuit element on the first block and avoid circuit element to contact and short circuit with other conducting elements.
According to an embodiment of the present invention, a kind of flexible circuit board is applied to display floater.Flexible circuit board comprises the first block, the second block and at least one circuit element.The second block is adjacent and be connected in the first block.Circuit element is arranged at the first block, and is electrically connected with the first block, and circuit element and the second block are for being electrically insulated.The second block is bent in the first block top, and circuit element is coated between the first block and the second block.
In one or more execution mode of the present invention, the thickness of the first block is different from the thickness of the second block.
In one or more execution mode of the present invention, the second block is only insulating material.
In one or more execution mode of the present invention, the second block comprises a metal material.
In one or more execution mode of the present invention, the junction of the first block and the second block is formed with empty cutter line.
In one or more execution mode of the present invention, flexible circuit board more comprises elasticity bonding coat.Elasticity bonding coat is between the first block and the second block, in order to bind the first block in the time that the second block covers circuit element.
In one or more execution mode of the present invention, the second lamina block is only insulating material.
Another execution mode according to the present invention, a kind of display floater comprises display module and aforesaid flexible circuit board.Flexible circuit board is arranged on display module, and wherein the first block contacts or is electrically connected with display module entity.
The another execution mode according to the present invention, a kind of display floater comprises display module and flexible circuit board.Flexible circuit board is arranged on display module.Flexible circuit board comprises multi-layer sheet block, at least one circuit element and lamina block.Multi-layer sheet block contacts with display module entity.Circuit element is arranged on multi-layer sheet block.Lamina block is connected in multi-layer sheet block, and multi-layer sheet block bends and covering circuit element relatively.
An execution mode again according to the present invention, a kind of display floater comprises display module and flexible circuit board.Flexible circuit board is arranged on display module.Flexible circuit board comprises the first lamina block, at least one circuit element and the second lamina block.The first lamina block contacts with display module entity.Circuit element is arranged on the first lamina block.The second lamina block is connected in the first lamina block, and can bend and covering circuit element by relative the first lamina block.
The above-mentioned execution mode of the present invention, by the second block being covered in to the first block top, is coated between the first block and the second block circuit element, thereby buffer circuit element avoid circuit element to contact and short circuit with other conducting elements.In addition, owing to having the required material of the first block and the second block in the traditional handicraft of manufacturing flexible circuit board, the new technology of therefore manufacturing flexible circuit board does not need additionally to prepare material, and can in the situation that not increasing material cost, complete.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Brief description of the drawings
Fig. 1 illustrates the end view according to the display floater of an embodiment of the present invention;
Fig. 2 A illustrates the vertical view that is not yet assembled in display module according to the flexible circuit board of an embodiment of the present invention;
Fig. 2 B illustrates flexible circuit board in Fig. 2 A vertical view in the time that the second block covers circuit element;
Fig. 3 illustrates along the cutaway view of the line segment 3 of Fig. 2 B;
Fig. 4 A illustrates the cutaway view according to the substrate layer of an embodiment of the present invention;
Fig. 4 B illustrates the cutaway view according to the lamina structure of an embodiment of the present invention;
Fig. 4 C illustrates the cutaway view according to the Multilayer Structure of an embodiment of the present invention;
Fig. 5 illustrates the vertical view according to the still uncut flexible circuit board of an embodiment of the present invention;
Fig. 6 A illustrates the vertical view that is not yet assembled in display module according to the flexible circuit board of another execution mode of the present invention;
Fig. 6 B illustrates flexible circuit board in Fig. 6 A vertical view in the time that the second block covers circuit element.
Wherein, Reference numeral
3: line segment
100,100 ', 400: flexible circuit board
111: the first first type surfaces
112: the second first type surfaces
120: the first blocks
130: circuit element
140: the second blocks
144: first end
145: the second ends
150: empty cutter line
160: elasticity bonding coat
160a: the first elasticity bonding coat
160b: the second elasticity bonding coat
471: fastener
471e: extension
471p: protuberance
472: buckle structure
472e: holding section
472o: opening
181: circuit block
182: circuit element setting area
183: without circuit block
184: cover block
185: frame block
191,191a, 191b: substrate layer
192,192a, 192b: metal level
193: protective layer
194: bonding coat
200: display module
300: display floater
M1, M2: part
Embodiment
Below will disclose multiple execution mode of the present invention with accompanying drawing, as clearly stated, the details in many practices will be explained in the following description.But, should be appreciated that, the details in these practices does not apply to limit the present invention.That is to say, in part execution mode of the present invention, the details in these practices is non-essential.In addition,, for the purpose of simplifying accompanying drawing, some existing usual structures and element will illustrate in the mode of simply illustrating in the accompanying drawings.
Please refer to Fig. 1, it illustrates the end view according to the display floater 300 of an embodiment of the present invention.The display floater 300 of present embodiment comprises display module 200 and flexible circuit board 100.Flexible circuit board 100 is for being applied to display floater 300, and flexible circuit board 100 is arranged on display module 200.
Particularly, display module 200 comprises display floater and backlight module.Display module 200 more can comprise glue frame, and wherein glue frame is around the periphery of display floater and backlight module.
Fig. 2 A illustrates the vertical view that is not yet assembled in display module 200 according to the flexible circuit board 100 of an embodiment of the present invention.Vertical view when the second block 140 that Fig. 2 B illustrates the flexible circuit board 100 in Fig. 2 A is covered in circuit element 130 (the first block 120).As Fig. 2 A and Fig. 2 B illustrate, flexible circuit board 100 comprises the first block 120, the second block 140 and at least one circuit element 130.The second block 140 is adjacent and be connected in the first block 120.Circuit element 130 is arranged at the first block 120, and be electrically connected with the first block 120, and circuit element 130 and the second block 140 are for being electrically insulated, particularly, circuit element 130 can by the first block 120 will be electrically or signal be delivered to display floater, and cannot be by the second block 140 and display floater transmission electrically or signal.The second block 140 is bent in the first block 120 tops, as shown in Figure 2 B.In other words, the second block 140 can bend and cover circuit element 130 by relative the first block 120.
As Fig. 1 illustrates, the first block 120 contacts or is electrically connected with display module 200 entities.Particularly, the first block 120 has more the first relative first type surface 111 and the second first type surface 112, and circuit element 130 is arranged on the first first type surface 111, and the second first type surface 112 is in the face of display module 200.Therefore, circuit element 130 exposes to display module 200, thereby circuit element 130 likely contacts the conducting elements such as the metallic magnetism of display floater 300 (not illustrating) and short circuit.
As Fig. 1 and Fig. 2 B illustrate, by the second block 140 being covered in to the first block 120 tops, circuit element 130 is coated between the first block 120 and the second block 140, thereby buffer circuit element 130 avoid circuit element 130 to contact and short circuit with other conducting elements.
Particularly, the first block 120 sticks in the bottom surface of display module 200, thereby flexible circuit board 100 is fixed on display module 200 relatively, but the present invention is not as limit.In other embodiments, flexible circuit board 100 can be attached at the side of display module 200, or flexible circuit board 100 can be attached on the extension protruding pinna of glue frame, as long as flexible circuit board 100 can be fixed on display module 200 relatively.
Fig. 3 illustrates along the cutaway view of the line segment 3 of Fig. 2 B.As Fig. 3 illustrates, flexible circuit board 100 more can comprise elasticity bonding coat 160.Elasticity bonding coat 160 is between the first block 120 and the second block 140, in order to bind the first block 120 and the second block 140 in the time that the second block 140 covers circuit element 130.
The thickness of elasticity bonding coat 160 can be more than or equal to the height of circuit element 130.Should be appreciated that, the embodiment of above lifted elasticity bonding coat 160 is only for illustrating, and not in order to limit the present invention, persond having ordinary knowledge in the technical field of the present invention, should look actual needs, and elasticity is selected the embodiment of elasticity bonding coat 160.
When elasticity bonding coat 160 is binded to the first block 120 and the second block 140, because the thickness of elasticity bonding coat 160 is more than or equal to the height of circuit element 130, make circuit element 130 can not be resisted against the second block 140, and with elasticity bonding coat 160 on produce pulling force.Therefore elasticity bonding coat 160 can firmly bind the first block 120 and the second block 140, avoids occurring the situation that elasticity bonding coat 160 departs from the first block 120 or the second block 140.In addition, in the time having inhomogeneous external force to put on flexible circuit board 100, elasticity bonding coat 160 can produce deformation and offset external force, and so elasticity bonding coat 160 will can not make because external force pulls the ability of binding the first block 120 and the second block 140 decline.
The material of elasticity bonding coat 160 can be foam material, or elasticity bonding coat 160 can be foam tape.Should be appreciated that, the embodiment of above lifted elasticity bonding coat 160 is only for illustrating, and not in order to limit the present invention, persond having ordinary knowledge in the technical field of the present invention, should look actual needs, and elasticity is selected the embodiment of elasticity bonding coat 160.
As Fig. 2 A and Fig. 3 illustrate, the second block 140 more can have relative first end 144 and the second end 145, and first end 144 connects the first block 120.Elasticity bonding coat 160 more can comprise the first elasticity bonding coat 160a and the second elasticity bonding coat 160b that are arranged at respectively first end 144 and the second end 145.When the first elasticity bonding coat 160a and the second elasticity bonding coat 160b are by the first block 120 and the second block 140 when fixing, circuit element 130 is between the first elasticity bonding coat 160a and the second elasticity bonding coat 160b.Thus, the first end 144 of the second block 140 and the second end 145 are fixed on the first block 120 steadily, and then make the second block 140 complete firmly covering and buffer circuit element 130.
Fig. 4 A illustrates the cutaway view according to the substrate layer 191 of an embodiment of the present invention.Fig. 4 B illustrates the cutaway view according to the lamina structure of an embodiment of the present invention.Fig. 4 C illustrates the cutaway view according to the Multilayer Structure of an embodiment of the present invention.As Fig. 3, Fig. 4 A, Fig. 4 B and Fig. 4 C illustrate, the first block 120 can be lamina structure or Multilayer Structure, and the second block 140 can be only one deck substrate layer 191 or be lamina structure.In other words, the local M2 in Fig. 3 can be the structure in Fig. 4 B or Fig. 4 C, and the local M1 in Fig. 3 can be the structure (configuration mode turns upside down) in Fig. 4 A or Fig. 4 B.
As Fig. 4 B illustrates, lamina structure can comprise substrate layer 191, metal level 192 and protective layer 193.Metal level 192 is arranged on substrate layer 191.Protective layer 193 is arranged on metal level 192.Metal level 192 is between substrate layer 191 and protective layer 193.
As Fig. 4 C illustrates, Multilayer Structure can comprise substrate layer 191a, 191b, bonding coat 194, metal level 192a, 192b and protective layer 193.Bonding coat 194, metal level 192a, substrate layer 191b, metal level 192b and protective layer 193 are sequentially arranged on substrate layer 191a.In addition, the one side that substrate layer 191a does not arrange other layers also can arrange other metal level or protective layer.
The thickness of the first block 120 can be identical or different with the thickness of the second block 140.In the time that the thickness of the first block 120 is identical with the thickness of the second block 140, the first block 120 and the second block 140 can be lamina structure simultaneously, and the first block 120 can be described as the first lamina block, and the second block 140 can be described as the second lamina block.
In the time that the thickness of the first block 120 is different with the thickness of the second block 140, can there be following two kinds of situations.In the time that the first block 120 is lamina structure, the second block 140 is only one deck substrate layer 191.In the time that the first block 120 is Multilayer Structure, the second block 140 is lamina structure, and the first block 120 can be described as multi-layer sheet block, and the second block 140 can be described as lamina block.
Because the second block 140 is lamina structure or only (approximately 49 μ m) for the thickness of one deck substrate layer 191, the second blocks 140 will be approximately equal to or less than greatly the thickness of insulating tape.Therefore, use the situation of insulating tape compared to tradition, the second block 140 also can not interfere with the setting of other elements in the configured in one piece of display floater 300.
In the time that the second block 140 is only one deck substrate layer 191, the second block 140 has the function of insulation, and buffer circuit element 130 is to avoid circuit element 130 to contact and short circuit with other conducting elements.In the time that the second block 140 is lamina structure, the second block 140 has insulation and the effect shielding, be buffer circuit element 130 to avoid circuit element 130 to contact and short circuit with other conducting elements, and shield external electrical field and make circuit element 130 not be subject to the interference of external electrical field.
The material of substrate layer 191 can be insulating material.Particularly, the material of substrate layer 191 can be polyimides (Polyimide, PI).The material of metal level 192 can be metal material.Particularly, the material of metal level 192 can be copper.The material of protective layer 193 can be insulating material.Particularly, the material of protective layer 193 can be polyimides (Polyimide, PI).The material of bonding coat 194 can be solid.Particularly, the material of bonding coat 194 can be epoxy resin (Epoxy).Fig. 5 illustrates the vertical view according to the still uncut flexible circuit board 100 ' of an embodiment of the present invention.As Fig. 2 A and Fig. 5 illustrate, the flexible circuit board 100 in Fig. 2 A is for having cut, and the flexible circuit board 100 ' in Fig. 5 is not yet cutting.Still uncut flexible circuit board 100 ' is whole piece, and flexible circuit board 100 ' comprises circuit block 181 and without circuit block 183.Circuit block 181 will arrange circuit thereon after cutting, and become the first block 120.Circuit block 181 has circuit element setting area 182, is used for arranging circuit element 130.Adjacent and be connected in circuit block 181 without circuit block 183.Comprise and cover block 184 and frame block 185 without circuit block 183.The covering block 184 of part becomes the second block 140 after cutting.Most of or whole frame blocks 185 are removed after cutting, but the present invention is not as limit.
In traditional handicraft, will be removed after cutting without circuit block 183.Compared to this, in the each execution mode of the present invention, part can be retained without circuit block 183, and can form the second block 140.Hence one can see that, and the required material of the second block 140 can form when manufacturing flexible circuit board 100, therefore can in the situation that not increasing material cost, complete.Meanwhile, form the second block by the former material that should be dropped, to apply and to replace effect of insulating tape, more can cost saving.In addition, utilize turnover the second block can reduce the probability of old use insulating tape and electronic component generation dislocation, significantly promote insulation and the effect shielding.
In the process of cutting, do the cutting of shallow-layer in the junction of the first block 120 and the second block 140, but do not cut off the junction of the first block 120 and the second block 140, so be formed with empty cutter line 150 (or claiming roulette) in the junction of the first block 120 and the second block 140.Thus, the first block 120 will be easier to bend with respect to the second block 140, and after bending, the second block 140 is also not easy to occur resilience.
As Fig. 2, Fig. 4 A, Fig. 4 B, Fig. 4 C and Fig. 5 illustrate; because flexible circuit board 100 ' is whole piece, therefore substrate layer 191, metal level 192 or the protective layer 193 in the first block 120 and the second block 140 can form in the same technique forming in flexible circuit board 100 '.Even if the first block 120 and the second block 140 are different structure, still have part-structure in same technique, to form.For instance; when the first block 120 is Multilayer Structure; when the second block 140 is lamina structure, can first form substrate layer 191b, metal level 192b and protective layer 193 in lamina structure and Multilayer Structure simultaneously, then form again other parts of Multilayer Structure.
Fig. 6 A illustrates the vertical view that is not yet assembled in display module 200 according to the flexible circuit board 400 of another execution mode of the present invention.Fig. 6 B illustrates flexible circuit board 400 in Fig. 6 A vertical view in the time that the second block 140 covers circuit element 130.As Fig. 6 A and Fig. 6 B illustrate, flexible circuit board 400 more comprises fastener 471 and buckle structure 472.Fastener 471 connects the second end 145.Buckle structure 472 is arranged on the first block 120, and corresponding to fastener 471, in order in the time that the second block 140 covers circuit element 130, fixes the first block 120 and the second block 140 by engaging fastener 471.In addition, because flexible circuit board 400 is fixed the first block 120 and the second block 140 by fastener 471 and buckle structure 472, so can not need to arrange elasticity bonding coat 160.
Particularly, fastener 471 comprises interconnected extension 471e and at least one protuberance 471p, and extension 471e connects the second end 145.In the present embodiment, fastener 471 is formed at the side of the second block 140, and fastener 471 is T font, but the present invention is not as limit, also can be other shapes that can reach identical effect, as L font.Buckle structure 472 has opening 472o and the holding section 472e (the dotted line place of Fig. 6 A) adjacent to opening 472o.In the present embodiment, buckle structure 472 is formed at the side of the first block 120, and wherein, in the time that the second block 140 turns down and is covered in the first block 120 with respect to the first block 120, the position of fastener 471 can be corresponding to buckle structure 472.In detail, in the time that the second block 140 covers circuit element 130, the setting position of opening 472o is corresponding to the setting position of extension 471e, and the setting position of holding section 472e is corresponding to the setting position of protuberance 471p.So in the time that the second block 140 covers circuit element 130, extension 471e is positioned at opening 472o, protuberance 471p is arranged at the second first type surface 112 (seeing Fig. 1) through opening 472o, and protuberance 471p contact holding section 472e.Because the second block 140 is for being arranged on the first first type surface 111, therefore protuberance 471p engages mutually with holding section 472e, and makes the second block 140 relatively be fixed on the first block 120.
As Fig. 5 and Fig. 6 A illustrate, still the frame block 185 of uncut flexible circuit board 100 ' can become fastener 471 after cutting, and on the first block 120 cutting openings 472o to form buckle structure 472.Because frame block 185 is generally Multilayer Structure, therefore fastener 471 also can be Multilayer Structure.Because the thickness of Multilayer Structure is thicker, hardness is also higher, so fastener 471 can more stably engage with buckle structure 472.
The above-mentioned execution mode of the present invention is by the second block 140 being covered in to the first block 120 tops, circuit element 130 is coated between the first block 120 and the second block 140, thereby buffer circuit element 130 avoid circuit element 130 to contact and short circuit with other conducting elements.In addition, owing to thering is the required material of the first block 120 and the second block 140 in the traditional handicraft of manufacturing flexible circuit board, therefore the new technology of manufacturing flexible circuit board 100 does not need additionally to prepare material, and can in the situation that not increasing material cost, complete.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (10)
1. a flexible circuit board, is applied to a display floater, it is characterized in that, this flexible circuit board comprises:
One first block;
One second block is adjacent and be connected in this first block; And
At least one circuit element, is arranged at this first block, and is electrically connected with this first block, and this circuit element and this second block are for being electrically insulated;
Wherein this second block can bend in this first block top, and this circuit element is coated between this first block and this second block.
2. flexible circuit board according to claim 1, is characterized in that, the thickness of this first block is different from the thickness of this second block.
3. flexible circuit board according to claim 1, is characterized in that, this second block is an insulating material.
4. flexible circuit board according to claim 1, is characterized in that, this second block comprises a metal material.
5. flexible circuit board according to claim 1, is characterized in that, the junction of this first block and this second block is formed with an empty cutter line.
6. flexible circuit board according to claim 1, is characterized in that, more comprises:
One elasticity bonding coat, between this first block and this second block, in order to bind this first block in the time that this second block covers this circuit element.
7. flexible circuit board according to claim 6, is characterized in that, the thickness of this elasticity bonding coat is more than or equal to the height of this circuit element.
8. a display floater, is characterized in that, comprises:
One display module; And
Just like the flexible circuit board described in claim 1～7, be arranged on this display module, wherein this first block contacts or is electrically connected with this display module entity.
9. a display floater, is characterized in that, comprises:
One display module; And
One flexible circuit board, is arranged on this display module, and this flexible circuit board comprises:
One multi-layer sheet block, contacts with this display module entity;
At least one circuit element, is arranged on this multi-layer sheet block; And
One lamina block, is connected in this multi-layer sheet block, and can be relatively this multi-layer sheet block bending and cover this circuit element.
10. a display floater, is characterized in that, comprises:
One display module; And
One flexible circuit board, is arranged on this display module, and this flexible circuit board comprises:
One first lamina block, contacts with this display module entity;
At least one circuit element, is arranged on this first lamina block; And
One second lamina block, is connected in this first lamina block, and can be relatively this first lamina block bending and cover this circuit element.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410230775.8A CN103987188A (en) | 2014-05-28 | 2014-05-28 | Flexible circuit board |
| TW103124573A TWI541565B (en) | 2014-05-28 | 2014-07-17 | Display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410230775.8A CN103987188A (en) | 2014-05-28 | 2014-05-28 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103987188A true CN103987188A (en) | 2014-08-13 |
Family
ID=51278975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410230775.8A Pending CN103987188A (en) | 2014-05-28 | 2014-05-28 | Flexible circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103987188A (en) |
| TW (1) | TWI541565B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108307584A (en) * | 2017-01-13 | 2018-07-20 | 株式会社村田制作所 | Component module |
| CN109600914A (en) * | 2019-01-14 | 2019-04-09 | 维沃移动通信有限公司 | A kind of circuit board, device mould group and mobile terminal |
| CN110012587A (en) * | 2018-01-05 | 2019-07-12 | 易华电子股份有限公司 | With the flexible circuit board for reducing bending bounce |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142875A (en) * | 2001-11-07 | 2003-05-16 | Matsushita Electric Ind Co Ltd | Flexible board with shield and display device using the same |
| DE102008022977A1 (en) * | 2008-05-09 | 2009-04-09 | Siemens Medical Instruments Pte. Ltd. | Encapsulated circuit manufacturing method for hearing aid, involves not encapsulating printed circuit board region by encapsulation and by rotatary attachment of upper surface to self-adhesive encapsulation, where surface is encapsulated |
| US20090201652A1 (en) * | 2008-02-13 | 2009-08-13 | Siemens Medical Instruments Pte Ltd. | Circuit with an integrated shield and hearing aid |
| CN101672446A (en) * | 2009-10-15 | 2010-03-17 | 友达光电股份有限公司 | Light source module and backlight module |
| CN103048819A (en) * | 2013-01-10 | 2013-04-17 | 友达光电(厦门)有限公司 | Flexible circuit board |
-
2014
- 2014-05-28 CN CN201410230775.8A patent/CN103987188A/en active Pending
- 2014-07-17 TW TW103124573A patent/TWI541565B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142875A (en) * | 2001-11-07 | 2003-05-16 | Matsushita Electric Ind Co Ltd | Flexible board with shield and display device using the same |
| US20090201652A1 (en) * | 2008-02-13 | 2009-08-13 | Siemens Medical Instruments Pte Ltd. | Circuit with an integrated shield and hearing aid |
| DE102008022977A1 (en) * | 2008-05-09 | 2009-04-09 | Siemens Medical Instruments Pte. Ltd. | Encapsulated circuit manufacturing method for hearing aid, involves not encapsulating printed circuit board region by encapsulation and by rotatary attachment of upper surface to self-adhesive encapsulation, where surface is encapsulated |
| CN101672446A (en) * | 2009-10-15 | 2010-03-17 | 友达光电股份有限公司 | Light source module and backlight module |
| CN103048819A (en) * | 2013-01-10 | 2013-04-17 | 友达光电(厦门)有限公司 | Flexible circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108307584A (en) * | 2017-01-13 | 2018-07-20 | 株式会社村田制作所 | Component module |
| CN110012587A (en) * | 2018-01-05 | 2019-07-12 | 易华电子股份有限公司 | With the flexible circuit board for reducing bending bounce |
| CN110012587B (en) * | 2018-01-05 | 2020-08-11 | 易华电子股份有限公司 | Flexible circuit board with reduced bending bounce |
| CN109600914A (en) * | 2019-01-14 | 2019-04-09 | 维沃移动通信有限公司 | A kind of circuit board, device mould group and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI541565B (en) | 2016-07-11 |
| TW201544870A (en) | 2015-12-01 |
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Application publication date: 20140813 |