CN103986917B - Multi-angle thermal image monitoring system - Google Patents
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Abstract
The invention relates to a monitoring system, in particular to a multi-angle thermal image monitoring system, and belongs to the technical field of infrared imaging. According to the technical scheme, the multi-angle thermal image monitoring system comprises an infrared camera set used for collecting infrared images in a monitoring field of vision. The infrared camera set is connected with an image processing sub-system, and a calibration lookup table is preset in the image processing sub-system. The infrared images of an object in the monitoring field of vision are collected through the infrared camera set and transmitted to the image processing sub-system. The image processing sub-system determines the three-dimensional coordinates of the object according to the calibration lookup table and displays the depth of field of the object. According to the multi-angle thermal image monitoring system, real-time three-dimensional space positioning of a concerned scene and the object is achieved, more image information is collected, the monitoring effect of thermal images is improved, and the multi-angle thermal image monitoring system is wide in application range, safe and reliable.
Description
Technical Field
The invention relates to a monitoring system, in particular to a multi-view thermal image monitoring system, and belongs to the technical field of infrared imaging.
Background
The infrared thermal imaging technology is developed in the late twentieth century, and plays an important role in both military and civil fields. The infrared thermal imaging technology overcomes the defect that the low-light-level imaging technology completely depends on the natural light of the environment, can identify objects behind camouflage and obstacles, and provides better visual field conditions for night video monitoring.
The infrared thermal imager uses an infrared detector and an optical imaging objective lens to receive an infrared radiation energy distribution pattern of a detected target and reflect the infrared radiation energy distribution pattern on a photosensitive element of the infrared detector so as to obtain an infrared thermal image, and the thermal image corresponds to a thermal distribution field on the surface of an object. The core technology of infrared thermal imaging technology is detector technology. The infrared detectors are classified into a refrigeration type and a non-refrigeration type according to the operating temperature. Since the first thermal imagers were introduced to date, the refrigeration-type thermal infrared imagers have been developed to the third generation. The first generation thermal imager adopts a multi-element linear array or small area array detector, the optical scanning mechanism is complex, the signal processing is simple, and the image quality is lower than that of a black-and-white television image; the second generation thermal imager adopts a long linear array or a staring focal plane array with the resolution equivalent to that of a black-and-white television, and a reading circuit adopts a large-scale integrated circuit and has a certain signal processing function; the third generation thermal imaging system adopts a long line array or a staring focal plane array with the resolution equivalent to that of a high-definition television, has a plurality of working wave bands, and has a reading circuit which adopts a super large scale integrated circuit and a complex signal processing function. The refrigeration type infrared detector mainly comprises an HgCdTe and InSb light quantum type detector and a GaAlAs/GaAs quantum well type detector. Uncooled infrared thermal imaging technology began relatively late, but developed very rapidly. The resolution of the existing uncooled infrared focal plane array is equivalent to that of a second-generation refrigeration thermal imager. Mature uncooled infrared detectors mainly include two types, pyroelectric type and microbolometer type.
In the military field, infrared thermal imaging systems are mainly used in the fields of weapons, vehicle sights and the like. The infrared reconnaissance system adopting the uncooled infrared focal plane array can effectively detect and track the target under the conditions of long distance and severe weather. In the civil field, the infrared thermal imaging system is mainly used in the fields of all-weather video monitoring, nondestructive testing, process control, traffic hazard early warning and the like.
At present, the traditional infrared thermal imaging system is mainly used for fire detection of electrical equipment, target monitoring, fire prevention monitoring, camouflage, hidden target identification and the like under night and severe weather conditions in the civil field, mainly in the fields of electric power, metallurgy, traffic, public security, fire protection, customs and the like, can only realize single detection or video monitoring function on a target, and cannot provide space positioning information of a target object in a concerned scene.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a multi-view thermal image monitoring system which realizes real-time three-dimensional space positioning of a scene and an object of interest, collects more image information, improves the thermal image monitoring effect, and is wide in application range, safe and reliable.
According to the technical scheme provided by the invention, the multi-view thermal image monitoring system comprises an infrared camera set for collecting infrared images of monitoring views, wherein the infrared camera set is connected with an image processing subsystem, and a calibration lookup table is preset in the image processing subsystem; acquiring an infrared image of an object in a monitoring view by using an infrared camera group, and transmitting the infrared image of the object to an image processing subsystem; and the image processing subsystem determines the three-dimensional coordinates of the object according to the calibration lookup table and displays the depth of field of the object.
An infrared marking device is placed in a monitoring visual field in an infrared camera set, the infrared camera set transmits an image of the infrared marking device to an image processing subsystem, and the image processing subsystem determines to obtain a calibration lookup table according to the geometric position and the geometric relation of the infrared marking device.
The infrared camera set comprises a plurality of infrared cameras, a set visual angle difference is formed among the infrared cameras, and the infrared cameras are arranged in an arc shape, a linear shape or a broken line shape.
And the visual angle difference between the adjacent infrared cameras is 5-30 degrees.
The infrared marking device comprises a plurality of infrared signal sources distributed in a dot matrix, and the step of obtaining a calibration lookup table in the image processing subsystem by using the infrared marking device comprises the following steps:
step 1, placing K groups of infrared marking devices in a monitoring visual field of an infrared camera group, respectively carrying out image acquisition on each group of infrared marking devices by N infrared cameras in the infrared camera group, and respectively obtaining f for each group of infrared marking devices by the infrared camera groupcal_1、fcal_2，……fcal_NThe number of N images of the image group,the infrared marking device comprises J infrared signal sources; each image is divided into local area signals corresponding to J infrared signal sourcesSo as to obtain the compound with the characteristics of,
wherein f iscal_iRepresenting the captured image of the infrared marker device by the ith infrared camera, | (m, n) ∈ signal j | represents the number of elements of the set, m, n represents the index into the image,indicating the center position of a signal source corresponding to the j in the calibrated ith infrared camera image;
step 2, using r for the positions of J infrared signal sources in each group of infrared marking devices1,r2…,rJShowing that data fitting is carried out on a group of infrared marking devices according to the central position obtained in the step 1 to obtain
Wherein, cx1(m,n),cx2(m,n),cx3(m,n),dx1(m,n),dx2(m,n),dx3(m,n)，lx(m,n)，cy1(m,n)，cy2(m,n)，cy3(m,n)，dy1(m,n),dy2(m,n),dy3(m,n),ly(m,n)、cz(n)，cz1，cz2，dz1,dz2Is a fitting parameter to be determined; and the value of m and N covers 1-N at least once;
for K groups of infrared marking devices, for signal source No. j, there are
Therefore, all the parameters to be fitted are obtained through the formula (1) and the formula (2) so as to establish a calibration lookup table in the image processing subsystem.
The number J of the infrared signal sources in each group of infrared marking devices is more than 30.
The image processing subsystem determining three-dimensional coordinates of an object comprises the steps of:
step 1, registering object images collected by an infrared camera group to obtain a required registration point group;
step 2, selecting object seed points through gray scale interval selection or an interactive mode;
step 3, selecting a registration point group within a set distance by taking the seed point as a center;
step 4, calculating the comprehensive position of the selected registration point group in the object image;
and 5, determining the three-dimensional coordinates of the object according to the comprehensive position, and displaying and outputting the depth of field of the object.
Registration is performed using the SIFT method.
The invention has the advantages that: the thermal image information of a plurality of visual angles is utilized, and the position information of the interested object can be provided in real time; different numbers and installation modes of the infrared cameras can be selected according to requirements, cost limits, installation conditions and the like, and the system has strong adaptability; the method is not limited by the quality of the thermal image, the calculation precision of the three-dimensional space position is improved by using multiple matched pixels, and the robustness of the system is enhanced; the method can conveniently provide an interactive mode to select the interested target, has strong practicability and improves the monitoring efficiency.
Drawings
FIG. 1 is a schematic diagram of an arrangement of the infrared camera set of the present invention.
Fig. 2 is a schematic diagram of a second arrangement of the infrared camera set of the present invention.
FIG. 3 is a schematic diagram of a third arrangement of the infrared camera set of the present invention.
Fig. 4 is a layout view of the infrared marker apparatus of the present invention.
Detailed Description
The invention is further illustrated by the following specific figures and examples.
As shown in fig. 1, 2, 3 and 4: in order to realize the real-time three-dimensional space positioning of a scene and an object of interest, the system comprises an infrared camera set for collecting infrared images of a monitoring visual field, wherein the infrared camera set is connected with an image processing subsystem, and a calibration lookup table is preset in the image processing subsystem; acquiring an infrared image of an object in a monitoring view by using an infrared camera group, and transmitting the infrared image of the object to an image processing subsystem; and the image processing subsystem determines the three-dimensional coordinates of the object according to the calibration lookup table and displays the depth of field of the object.
Specifically, the infrared camera group can adopt current infrared cameras, can obtain the infrared image of object through infrared camera, the infrared camera group includes a plurality of infrared cameras, has the angular difference of settlement between a plurality of infrared cameras, and a plurality of infrared cameras are arranged and are arc, linear type or broken line type. And the visual angle difference between the adjacent infrared cameras is 5-30 degrees. In a specific implementation, the number of infrared cameras in the infrared camera group can be determined according to the monitoring visual field, and the image processing subsystem comprises a computer.
As shown in fig. 4, the infrared marking device is an infrared signal source (a non-lighting electric light source mainly for generating infrared radiation) distributed in a lattice, such as a heat radiation infrared light source. The infrared signal sources of all points have no special requirements, but the infrared signal sources which are consistent are required to be distributed at the lattice positions.
An infrared marking device is placed in a monitoring visual field in an infrared camera set, the infrared camera set transmits an image of the infrared marking device to an image processing subsystem, and the image processing subsystem determines to obtain a calibration lookup table according to the geometric position and the geometric relation of the infrared marking device.
Specifically, the infrared marking device comprises a plurality of infrared signal sources distributed in a lattice manner, and the step of obtaining the calibration lookup table in the image processing subsystem by using the infrared marking device comprises the following steps:
step 1, placing K groups of infrared marking devices in a monitoring visual field of an infrared camera group, respectively carrying out image acquisition on each group of infrared marking devices by N infrared cameras in the infrared camera group, and respectively obtaining f for each group of infrared marking devices by the infrared camera groupcal_1、fcal_2，……fcal_NN of (A)The infrared marking device comprises J infrared signal sources; each image is divided into local area signals [ f ] corresponding to J infrared signal sourcescal_i]m,nSo as to obtain the compound with the structure,
wherein f iscal_iRepresenting the captured image of the infrared marker device by the ith infrared camera, | (m, n) ∈ signal j | represents the number of elements of the set, m, n represents the index into the image,in the embodiment of the invention, the index parameter m, n of the image is related to the size of the image and can be determined and obtained according to the size of the image, the jth light source in the infrared marking device only forms a signal in a certain area range of the image, so that for the signal j, the (m, n) ∈ signal j is m, and the value range of n is in the image range corresponding to the split j signal.
Step 2, using r for the positions of J infrared signal sources in each group of infrared marking devices1,r2…,rJShowing that data fitting is carried out on a group of infrared marking devices according to the central position obtained in the step 1 to obtain
Wherein, cx1(m,n),cx2(m,n),cx3(m,n),dx1(m,n),dx2(m,n),dx3(m,n)，lx(m,n)，cy1(m,n)，cy2(m,n)，cy3(m,n)，dy1(m,n),dy2(m,n),dy3(m,n),ly(m,n)、cz(n)，cz1，cz2，dz1,dz2Is a fitting parameter to be determined; and the value of m and N covers 1-N at least once;
for K groups of infrared marking devices, for signal source No. j, there are
Therefore, all the parameters to be fitted are obtained through the formula (1) and the formula (2) so as to establish a calibration lookup table in the image processing subsystem. (r)x)jDenotes the X-direction coordinate, (r)y)jDenotes the y-coordinate, (r)z)jRepresenting the z-direction coordinate. For an infrared calibration device, the actual position in the infrared signal source of the infrared calibration device is known.
Determining a formula (1) through parameters obtained by fitting, and substituting the comprehensive positions of the registration point group in the object image into the formula (1) to obtain the depth of field in the actual imaging process; the values at the standard grid points can also be calculated using formula (1) to form a lookup table, and then the depth of field can be found according to the integrated position of the set of registration points in the object image. The fitting parameters are all coefficients.
Further, in the embodiment of the present invention, in order to ensure the validity of the fitting to the parameters, the number J of the infrared signal sources in each group of infrared marking devices is greater than 30.
The image processing subsystem determining three-dimensional coordinates of an object comprises the steps of:
step 1, registering object images collected by an infrared camera group to obtain a required registration point group; in the embodiment of the present invention, the obtained registration point group is (m)1,n1)i,(m2,n2)i,(m3,n3)iI is 1, …, I, group I. In the embodiment of the invention, an SIFT method is adopted for registration.
Step 2, selecting object seed points through gray scale interval selection or an interactive mode;
in the embodiment of the present invention, when selecting the seed point through the gray scale/brightness range, in any frame, or selecting the scene or the object of interest or the seed point through manual interaction in any frame, when selecting the seed point through the gray scale/brightness range, α > f (m, n) > β is (m, n). α, β are upper and lower thresholds, and f (m, n) is a pixel value of the image. (m, n) denotes a seed point.
The purpose of registration is to find pixels in different images that correspond to the same object. The seed point may also be a pixel of interest or an initial pixel. There are many methods for registration in the field of image processing, and here, an SIFT method is used, which mainly calculates a feature vector for each pixel point of an image, searches for points with close feature quantities in different images, and a registration point group can be distributed on the whole of the image. The seed point may be a relatively close set of registration points, which may be determined by the position of the set of registration points in the same image as the seed point.
Step 3, selecting a registration point group within a set distance by taking the seed point as a center;
and obtaining a matching point group (usually 3-5 groups) closest to the seed point. Taking the selection of seed points in the image as an example:
wherein (m, n) - (m)1,n1)iIs vector subtraction, | ·| non-conducting phosphor2Is the euclidean two norm. After obtaining i, the process is repeated for the remaining set of registration points to obtain i2,i3,…。i1Is the number of the matching point group, and the subscript thereof indicates the matching point group of the minimum distance. i.e. i2Is the sequence number of the matching point group of the next smallest distance. argmin is the parameter that takes the function to obtain the minimum.
Step 4, calculating the comprehensive position of the selected registration point group in the object image;
calculating the integrated pixel position (a) of the matching points1,bs1)，(as2,bs2) And (a)s3,bs3) Is concretely provided with
Wherein,denotes the ith1Pixel index of a group of matching points in an image，Denotes the ith1The set of matching points is indexed in the pixels of the other image,denotes the ith1The pixel index of each matching point group in the third image is described above by taking three infrared cameras as an example. When there are N infrared cameras, (a)s1,bs1)、(as2,bs2)、…、(asN,bsN) Is the position of the object of interest on the image formed by the respective infrared camera. When calculating the depth of field, these values are substituted into (2) so that the physical three-dimensional position is:
and 5, determining the three-dimensional coordinates of the object according to the comprehensive position, and displaying and outputting the depth of field of the object.
Handle (a)s1,bs1),(as2,bs2),(as3,bs3) Substitution into (1) yields:
displaying the coordinates or depth of field in any one or more thermal image images. And repeating the steps to obtain the three-dimensional coordinate positions of the scene objects. In the embodiment of the invention, the depth of field refers to the distance from the infrared camera.
The invention utilizes the thermal image information of a plurality of visual angles, and can provide the position information of the interested object in real time; different numbers and installation modes of the infrared cameras can be selected according to requirements, cost limits, installation conditions and the like, and the system has strong adaptability; the method is not limited by the quality of the thermal image, the calculation precision of the three-dimensional space position is improved by using multiple matched pixels, and the robustness of the system is enhanced; the method can conveniently provide an interactive mode to select the interested target, has strong practicability and improves the monitoring efficiency.
Claims (6)
1. The utility model provides a multi-view thermal imagery monitored control system which characterized by: the system comprises an infrared camera set used for collecting infrared images of a monitoring visual field, wherein the infrared camera set is connected with an image processing subsystem, and a calibration lookup table is preset in the image processing subsystem; acquiring an infrared image of an object in a monitoring view by using an infrared camera group, and transmitting the infrared image of the object to an image processing subsystem; the image processing subsystem determines the three-dimensional coordinates of the object according to the calibration lookup table and displays the depth of field of the object;
placing an infrared marking device in a monitoring visual field in an infrared camera set, transmitting an image of the infrared marking device to an image processing subsystem by the infrared camera set, and determining to obtain a calibration lookup table by the image processing subsystem according to the geometric position and the geometric relation of the infrared marking device;
the infrared marking device comprises a plurality of infrared signal sources distributed in a dot matrix, and the step of obtaining a calibration lookup table in the image processing subsystem by using the infrared marking device comprises the following steps:
step 1, placing K groups of infrared marking devices in a monitoring visual field of an infrared camera group, respectively carrying out image acquisition on each group of infrared marking devices by N infrared cameras in the infrared camera group, and respectively obtaining f for each group of infrared marking devices by the infrared camera groupcal_1、fcal_2，……fcal_NThe infrared marking device comprises J infrared signal sources; each image is divided into local area signals [ f ] corresponding to J infrared signal sourcescal_i]m,nSo as to obtain the compound with the structure,
wherein f iscal_iRepresenting the captured image of the infrared marker device by the ith infrared camera, | (m, n) ∈ signal j | represents the number of elements of the set, m, n represents the index into the image,indicating the center position of a signal source corresponding to the j in the calibrated ith infrared camera image;
step 2, using r for the positions of J infrared signal sources in each group of infrared marking devices1,r2…,rJShowing that data fitting is carried out on a group of infrared marking devices according to the central position obtained in the step 1 to obtain
Wherein, cx1(m,n),cx2(m,n),cx3(m,n),dx1(m,n),dx2(m,n),dx3(m,n)，lx(m,n)，cy1(m,n)，cy2(m,n)，cy3(m,n)，dy1(m,n),dy2(m,n),dy3(m,n),ly(m,n)、cz(n)，cz1，cz2，dz1,dz2Is a fitting parameter to be determined; and the value of m and N covers 1-N at least once;
for K groups of infrared marking devices, for signal source No. j, there are
Therefore, all the parameters to be fitted are obtained through the formula (1) and the formula (2) so as to establish a calibration lookup table in the image processing subsystem.
2. The multi-view thermographic monitoring system of claim 1, which is characterized by: the infrared camera set comprises a plurality of infrared cameras, a set visual angle difference is formed among the infrared cameras, and the infrared cameras are arranged in an arc shape, a linear shape or a broken line shape.
3. The multi-view thermographic monitoring system of claim 2, which is characterized by: and the visual angle difference between the adjacent infrared cameras is 5-30 degrees.
4. The multi-view thermographic monitoring system of claim 1, which is characterized by: the number J of the infrared signal sources in each group of infrared marking devices is more than 30.
5. The multi-view thermographic monitoring system of claim 1, which is characterized by: the image processing subsystem determining three-dimensional coordinates of an object comprises the steps of:
step 1, registering object images collected by an infrared camera group to obtain a required registration point group;
step 2, selecting object seed points through gray scale interval selection or an interactive mode;
step 3, selecting a registration point group within a set distance by taking the seed point as a center;
step 4, calculating the comprehensive position of the selected registration point group in the object image;
and 5, determining the three-dimensional coordinates of the object according to the comprehensive position, and displaying and outputting the depth of field of the object.
6. The multi-view thermographic monitoring system of claim 5, which is characterized by: registration is performed using the SIFT method.
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