CN103986057A - Laser diode module - Google Patents
Laser diode module Download PDFInfo
- Publication number
- CN103986057A CN103986057A CN201310705879.5A CN201310705879A CN103986057A CN 103986057 A CN103986057 A CN 103986057A CN 201310705879 A CN201310705879 A CN 201310705879A CN 103986057 A CN103986057 A CN 103986057A
- Authority
- CN
- China
- Prior art keywords
- laser diode
- circuit board
- flexible circuit
- plastic casing
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a laser diode module. In the laser diode module, a laser diode is bonded on a flexible circuit board, and the flexible circuit board and a plastic casing 2 are bonded together through a glue. A collimating mirror is adhered to a plastic casing 1, and through adjusting the relative positions of the plastic casing 1 and the plastic casing 2, the distance between the laser diode and the collimating mirror can be adjusted until laser reaches a collimation requirement. The plastic casing 1 and the plastic casing 2 are bonded together by use of the glue so that their relative positions are fixed. When the module runs, power is directly supplied through the flexible circuit board, the laser diode emits light, and the light becomes light beams through the collimating mirror. The whole module is made of a plastic material and is formed in a one-step mode, the material cost is low, and the processing steps are few. A whole system is directly connected with a mainboard through the flexible circuit board, manual welding is reduced, and the reliability is higher.
Description
Technical field
A kind of laser diode module belongs to laser scanning system, and its effect is the point-like laser light source that collimation is provided for laser scanner.The present invention relates generally to the material of laser diode module shell, the control mode of laser diode luminous intensity, and binding (bonding) mode of laser diode, the change of radiating mode, whole module changes with the outside mode being connected.
Background technology
The laser diode collimation module that scanner uses in the market, common structure, is 1. used the stock of copper product as shell, and for heat radiation, material cost is higher, and working (machining) efficiency is also very low.2. need to increase a photodiode, detection laser intensity, control circuit stable.3. in order to dispel the heat, diode is all that binding (bonding) is being held on transcalent base material.With a metal cap to inner device package.5. outside connected mode is to be welded on mainboard by 3 pins.This structural disadvantages is exactly that material cost is high; The heat producing is large, so power consumption is large; Production and processing technology complexity, production capacity is little.
The present invention uses simpler structure, material cost still less, and the more control mode of power saving, provides stable collimation laser light source.
Summary of the invention
Laser alignment module in the past, structural design as shown in Figure 1, is bound laser diode (bonding) on copper heat sink, adopts photodiode to detect luminous power, uses copper shell to fix collimating mirror, and regulates collimation focal length.Whole module is welded on mainboard by 3 pins.
New invention has adopted the structure as Fig. 2, a kind of mode of more simplifying.Directly adopt plastic shell, mould one-shot forming, processing capacity reduces.Change binding (bonding) mode of laser diode simultaneously, diode has directly been bound to (bonding) in flexible circuit board, the welding link in the middle of having reduced, more simple and reliable.The control mode of laser intensity, changes the mode that uses inner photosensitive diode detection, cancels photodiode, adopts the control of system external power.
Brief description of the drawings
Fig. 1 is prior art laser diode module group assembling figure
Fig. 2 is great innovative technology laser diode module group assembling figure
Embodiment
1. collimating mirror is bonded on plastic casing 1 with glue.
2. laser tube is directly bound (bonding) in flexible circuit board
3. flexible circuit board sticks together with plastic casing 2
Flexible circuit board with scanner mainboard make one overall, do not need extra connecting moves.
5. regulate the relative position of plastic casing 1 and plastic casing 2, can regulate the collimation of laser, after having regulated, cling with glue.
Claims (5)
1. a Novel laser diode module.Be that it directly binds laser diode (bonding) in flexible circuit board, and cancel the photodiode that sensitization is used, use plastic material shell, move by the position between two plastic casings, realize collimation focusing.
2. describe according to claim 1, laser diode be direct binding (bonding) in flexible circuit board, the connecting welding link in the middle of can reducing like this, such as the welding of pin, makes to produce simpler.
3. describe according to claim 1, laser module has been cancelled photodiode, saves cost.
4. describe according to claim 1, diode modules is not used metal heat sink cooling, directly uses plastic shell, by controlling the luminous power of diode, reduces the generation of heat.
5. describe according to claim 1, move by relative position between two plastic casings, realize laser alignment focusing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310705879.5A CN103986057A (en) | 2013-12-13 | 2013-12-13 | Laser diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310705879.5A CN103986057A (en) | 2013-12-13 | 2013-12-13 | Laser diode module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103986057A true CN103986057A (en) | 2014-08-13 |
Family
ID=51277930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310705879.5A Pending CN103986057A (en) | 2013-12-13 | 2013-12-13 | Laser diode module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103986057A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1519829A (en) * | 2002-12-26 | 2004-08-11 | 索尼公司 | Semiconductor integrated device |
| US7171066B1 (en) * | 2005-09-07 | 2007-01-30 | Fuji Xerox Co., Ltd. | Optical module and optical transmission device |
| CN201752061U (en) * | 2010-02-12 | 2011-02-23 | 华信光电科技股份有限公司 | Plastic laser diode module and device made by applying same |
| CN202423821U (en) * | 2011-11-21 | 2012-09-05 | 武汉华工正源光子技术有限公司 | High speed packaging structure of laser diode |
| CN103036618A (en) * | 2012-12-13 | 2013-04-10 | 深圳市易飞扬通信技术有限公司 | Light transmit-receive element and sealing method thereof |
-
2013
- 2013-12-13 CN CN201310705879.5A patent/CN103986057A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1519829A (en) * | 2002-12-26 | 2004-08-11 | 索尼公司 | Semiconductor integrated device |
| US7171066B1 (en) * | 2005-09-07 | 2007-01-30 | Fuji Xerox Co., Ltd. | Optical module and optical transmission device |
| CN201752061U (en) * | 2010-02-12 | 2011-02-23 | 华信光电科技股份有限公司 | Plastic laser diode module and device made by applying same |
| CN202423821U (en) * | 2011-11-21 | 2012-09-05 | 武汉华工正源光子技术有限公司 | High speed packaging structure of laser diode |
| CN103036618A (en) * | 2012-12-13 | 2013-04-10 | 深圳市易飞扬通信技术有限公司 | Light transmit-receive element and sealing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11009705B2 (en) | Free space multiple laser diode module with fast axis collimator | |
| KR101416820B1 (en) | Laser Optic Device for Bonding Flip Chip of Laser Thermo Compression Type | |
| CN104836119A (en) | Optical fiber coupled laser | |
| WO2013099340A1 (en) | Laser module and method for manufacturing same | |
| CN204271437U (en) | Surface fixed diffraction optics laser module | |
| CN205141362U (en) | Adopt semiconductor laser's of bi -polar fiber optic coupling output laser system | |
| JP2008227494A (en) | Light-emitting apparatus | |
| CN104283108A (en) | High-power laser module and packaging method thereof | |
| TW201815503A (en) | Optical homogenization device and laser bonding apparatus containing the same | |
| CN109980498A (en) | A kind of high power pulse-width tunable semiconductor laser module | |
| CN205122992U (en) | Semiconductor laser structure of bi -polar fiber optic coupling output | |
| CN106094406A (en) | The COB encapsulation method for simplifying of a kind of laser scanning projection module and module | |
| CN103986057A (en) | Laser diode module | |
| CN203415814U (en) | Large power laser module | |
| CN205178260U (en) | Semiconductor laser device of bi -polar fiber optic coupling output | |
| CN205122993U (en) | Semiconductor laser of bi -polar fiber optic coupling output | |
| JP6383866B2 (en) | Semiconductor laser module and three-dimensional additive manufacturing apparatus | |
| CN201656243U (en) | Semiconductor laser with optical fiber coupled output | |
| CN204437923U (en) | A kind of one of the distance-light based on LASER Light Source headlamp | |
| CN104104013A (en) | Split type semiconductor laser diode energy beam combination device | |
| CN103363442A (en) | Lens unit, light irradiation unit, and light irradiation apparatus | |
| CN203117474U (en) | Laser package coupled device | |
| CN215575808U (en) | Optical transmission module of TO encapsulation | |
| CN201478685U (en) | Array microchip laser structure | |
| CN205263361U (en) | Take waveguide chip package structure of radiating block |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| DD01 | Delivery of document by public notice |
Addressee: Liu Weina Document name: Notification of Acceptance of Patent Application |
|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140813 |
|
| WD01 | Invention patent application deemed withdrawn after publication |