CN103984393A - Dismounting assembly and memory module thereof - Google Patents
Dismounting assembly and memory module thereof Download PDFInfo
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- CN103984393A CN103984393A CN201310050946.4A CN201310050946A CN103984393A CN 103984393 A CN103984393 A CN 103984393A CN 201310050946 A CN201310050946 A CN 201310050946A CN 103984393 A CN103984393 A CN 103984393A
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- corner
- circuit board
- printed circuit
- pcb
- memory modules
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Abstract
A disassembly assembly is used for installing or disassembling a memory module with a printed circuit board in a memory slot, the printed circuit board is provided with a terminal side and a free side far away from the terminal side, the disassembly assembly comprises a plurality of metal pieces, and the metal pieces are arranged on the free side of the printed circuit board; the invention also discloses a memory module, comprising: a printed circuit board having a terminal side and a free side remote from the terminal side; and the disassembling component comprises a plurality of metal pieces arranged on the free side. The dismounting assembly can enable the applied external force to be stressed evenly so as to mount or dismount the memory module in a memory slot and prevent static from entering the printed circuit board to influence the normal function of the printed circuit board.
Description
Technical field
The present invention relates to a kind of auxiliary dismounting assembly of electronic installation, particularly a kind of dismounting assembly and memory modules thereof that prevents electrostatic interference.
Background technology
The volume of electronic installation is constantly microminiaturized, and its operational function and processing speed are increasingly powerful and quick, be assemblied in outside the mainboard of electronic installation inside and electronic component etc. also must dwindle thereupon, also must possess higher operation frequency, to meet current user's demand simultaneously.For instance, along with the data-handling capacity of computing machine is more and more stronger, also more and more higher for the capacity of calculator memory module and the requirement of speed.
DRAM (Dynamic Random Access Memory) (Dynamic Random Access Memory, DRAM) is all to exist with module form in computer system; That is described DRAM module comprises internal memory IC and printed circuit board (PCB), conventionally user is that the printed circuit board (PCB) of first aiming at DRAM module forces in DRAM module upper limb after memory bank again, so that printed circuit board (PCB) is inserted in memory bank, and when DRAM module is positively inserted in memory bank, computer system begins can normal operation.
Yet, often user in the process of the application of force can by its on hand with static import DRAM module into and cause its function that cannot bring into normal play, severe patient even can cause the impaired and fault of electronic package.In addition, area that can the application of force due to the upper limb of DRAM module is less, area that can the application of force is roughly the thickness area of printed circuit board (PCB), thus user easily because the application of force not exclusively causes DRAM module, positively do not insert in memory bank, thereby cannot bring into play its normal function; Or user easily causes DRAM module damage because the application of force is unequal.
Summary of the invention
Fundamental purpose of the present invention, is to provide a kind of dismounting assembly of being convenient to user installation or dismounting electronic installation, and user is in the process of installation or removal, can prevent that static from scurrying into electronic installation and affecting its normal function.
In order to achieve the above object, the invention provides a kind of dismounting assembly, a memory modules that has a printed circuit board (PCB) in order to installation or removal is in a memory bank, this printed circuit board (PCB) has a terminals side and a free side away from this terminals side, described dismounting assembly comprises a plurality of metalworks, is arranged at the free side of this printed circuit board (PCB).
According to above-mentioned dismounting assembly, the present invention also provides a kind of memory modules, it comprises a printed circuit board (PCB) and a dismounting assembly, wherein this printed circuit board (PCB) has a terminals side and a free side away from this terminals side, this dismounting assembly comprises a plurality of metalworks, and those metalworks are arranged at the free side of this printed circuit board (PCB).
In one embodiment of this invention, those metalwork each interval one preset distances, make institute's externally applied forces mean forced.
In one embodiment of this invention, this printed circuit board (PCB) has a first surface and a second surface with respect to this first surface, and one first corner that this first surface and this second surface respectively have contiguous this terminals side and one second corner and away from one the 3rd corner and one the 4th corner of this terminals side, those metalworks are to be arranged at respectively the 3rd corner of this first surface, the 3rd corner of the 4th corner of this first surface, this second surface and the 4th corner of this second surface.
In one embodiment of this invention, the terminals side of this printed circuit board (PCB) comprises a plurality of ground terminals, the first surface of this printed circuit board (PCB) and second surface are respectively provided with many metallic traces, and one end of those metallic circuits connects respectively a plurality of metalworks and the other end connects respectively those ground terminals.
In one embodiment of this invention, those metalworks are a plurality of metallic sheaths, and those metallic sheaths are sheathed on the free side of this printed circuit board (PCB) and cover respectively the 3rd corner of this first surface and this second surface and the 4th corner of this first surface and this second surface.
In one embodiment of this invention, the 3rd corner and the 4th corner of this first surface are respectively provided with one first snap-in structure, the 3rd corner and the 4th corner of this second surface are respectively provided with one second snap-in structure, and each tool one of those metallic sheaths is corresponding to the first position limiting structure and second position limiting structure corresponding to this second snap-in structure of this first snap-in structure.
In one embodiment of this invention, each metallic sheath has the ring-side wall that a diapire and is connected in this diapire, and this first position limiting structure and this second position limiting structure are relatively arranged at the inner edge of this ring-side wall.
The present invention at least has advantages of following: by dismounting assembly of the present invention, memory modules is when assembling or dismounting, user on hand with static can conduct to ground terminal by metalwork, to prevent static from scurrying into memory modules, its integrated circuit is damaged, can extend the serviceable life of memory modules.
In order further to understand the present invention, reach technology, method and the beneficial effect that set object is taked, refer to following relevant detailed description of the present invention, accompanying drawing, believe object of the present invention, feature and feature, when being goed deep into thus and concrete understanding, yet appended accompanying drawing only provides reference and explanation use with explanation, is not used for the present invention to be limited.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the memory modules of embodiments of the invention one;
Fig. 2 is the schematic diagram of memory modules of the change state of embodiments of the invention one;
Fig. 3 A is the combination schematic diagram of the memory modules of embodiments of the invention two;
Fig. 3 B is the decomposing schematic representation of the memory modules of embodiments of the invention two;
Fig. 4 A is the combination schematic diagram of the memory modules of embodiments of the invention three;
Fig. 4 B is the decomposing schematic representation of the memory modules of embodiments of the invention three.
[main element description of reference numerals]
1 memory modules 172 second corners
10 printed circuit board (PCB)s 173 the 3rd corner
11 integrated circuit 174 the 4th corner
12 module card 175 second snap-in structures
The 13 long limits of terminals side 18
130 Metal Contact district 19 minor faces
131 ground terminal 20 dismounting assemblies
14 free side 21 metalworks
15 metallic circuit 21A metal formings
16 first surface 21B metallic sheaths
161 first corner 211B diapires
162 second corner 212B ring-side walls
163 the 3rd corner 213B the first position limiting structures
164 the 4th corner 214B the second position limiting structures
165 first snap-in structure D preset distances
17 second surface S memory banks
171 first corners
Embodiment
Embodiment mono-
Please refer to Fig. 1 and Fig. 2, Fig. 1, Fig. 2 are the schematic diagram of the memory modules 1 of the embodiment of the present invention one.Described memory modules 1 comprises a printed circuit board (PCB) 10 and a dismounting assembly 20.
Particularly, printed circuit board (PCB) 10 is by integrated circuit 11 and a module card 12(Card of a plurality of encapsulation) institute form, wherein the periphery of the integrated circuit 11 of encapsulation is provided with a plurality of metal pins, and the surface of module card 12 is also formed with the hole (figure does not show) of metal pattern and those metal pin weldings of confession; In addition, printed circuit board (PCB) 10 also has a terminals side 13 and a free side 14 away from terminals side 13, wherein terminals side 13 is provided with a Metal Contact district 130, in order to be inserted in the memory bank S of a computer motherboard, allow memory modules 1 can be in computer system stored routine and data.
Dismounting assembly 20 comprises a plurality of metalworks 21 that are arranged at the free side 14 of printed circuit board (PCB) 10; In the present embodiment, described metalwork 21 is for metal forming 21A(is as Copper Foil) and quantity be four, relatively be arranged between two the free side 14 of printed circuit board (PCB) 10, in other words, those metalworks 21 are arranged at the free side 14 of printed circuit board (PCB) 10 in the mode of a group between two, and each interval one preset distance D between two groups of metal forming 21A; Wherein, rough square shape and the area of being of each metal forming 21A is for convenience of the area of user's finger application of force.
What deserves to be explained is, there is no particular restriction for above-mentioned preset distance D, so long as can on average force in the distance on printed circuit board (PCB) 10 for user, all can be used as the preset distance D between described two groups of metal forming 21A; In addition, the quantity of metal forming 21A, size are also without particular limitation, can adjust to some extent according to product demand.
Moreover, the Metal Contact district 130 of printed circuit board (PCB) 10 terminals side 13 comprises a plurality of ground terminals 131, and the first surface 16 of printed circuit board (PCB) 10 and second surface 17 are respectively provided with many metallic traces 15, one end of those metallic circuits 15 connects respectively those metal formings 21A, and the other end of those metallic circuits 15 connects respectively those ground terminals 131, in order to static is conducted to ground terminal 131 by metal forming 21A, and further from ground terminal 131, conduct to the outside of computer system.
In more detail, printed circuit board (PCB) 10 has a first surface 16 and a second surface 17 with respect to first surface 16, and first surface 16 and second surface 17 respectively have one first corner 161,171 of terminals side of being adjacent to 13 and one second corner 162,172 and away from one the 3rd corner 163,173 and one the 4th corner 164,174 of terminals side 13; In a preferred embodiment, those metal formings 21A be arranged at respectively the 3rd corner 163 of first surface 16, the 3rd corner 173 of the 4th corner 164 of first surface 16, second surface 17 and the 4th corner 174(of second surface 17 as shown in Figure 1).
Whereby, user can coordinate the balance of the two hand application of forces, positively memory modules 1 is installed in the memory bank S of computer motherboard, and by memory modules 1 under described memory bank S dismounting; Further, in the process of installation or removal memory modules 1, user on hand with static can conduct to ground terminal 131 by metal forming 21A, to prevent static from scurrying into, integrated circuit 11 is damaged.
In order further to understand feature of the present invention, further above-mentioned corner is defined, printed circuit board (PCB) 10 has two crossing long limit 18 and two minor faces 19, and above-mentioned the first corner 161,171, the second corner 162,172, the 3rd corner 163,173 and 164,174, the 4th corner lays respectively at four intersections of described two long limits 18 and two minor faces 19.Be understandable that, the foregoing is only a better enforcement state of the present invention, pieces of metallic foil of the present invention (metal forming) is the mode of a group between two also, relatively be arranged on the first surface 16 and second surface 17 of printed circuit board (PCB) 10, and be respectively adjacent in the 3rd corner 163,173 of first surface 16 and second surface 17 and the 4th corner 164,174(as shown in Figure 2).
Embodiment bis-
Refer to Fig. 3 A and Fig. 3 B, Fig. 3 A, Fig. 3 B are the schematic diagram of the memory modules 1 of the embodiment of the present invention two.That the metalwork 21 of the present embodiment is a plurality of metallic sheath 21B, and quantity is two with the difference of embodiment mono-.
Particularly, described two metallic sheath 21B are sheathed on respectively the free side 14 of memory modules 1, and be covered in the 4th corner 164,174 of the 3rd corner 163,173 of first surface 16 and second surface 17 and first surface 16 and second surface 17, wherein each metallic sheath 21B is rough is L shape, and size is not particularly limited.In more detail, each metallic sheath 21B has a diapire 211B and a ring-side wall 212B, wherein relative two walls of ring-side wall 212B are formed with a preset space length, and described preset space length is slightly less than the thickness of printed circuit board (PCB) 10, so that metallic sheath 21B tightly fits on printed circuit board (PCB) 10.
Embodiment tri-
Refer to Fig. 4 A and Fig. 4 B, Fig. 4 A, Fig. 4 B are the schematic diagram of the memory modules 1 of the embodiment of the present invention three.With the difference of embodiment bis-be, the printed circuit board (PCB) 10 of the present embodiment has a plurality of the first snap-in structures 165 and a plurality of the second snap-in structure 175, and each metallic sheath 21B is rough is L shape, and has one first position limiting structure 213B and one second position limiting structure 214B.
In the present embodiment, the quantity of the first snap-in structure 165 and the second snap-in structure 175 is all two, wherein said 2 first snap-in structures 165 are arranged at respectively the 3rd corner 163 and the 4th corner 164 of the first surface 16 of printed circuit board (PCB) 10, and 175 of described 2 second snap-in structures are arranged at respectively the 3rd corner 173 and the 4th corner 174 of the second surface 17 of printed circuit board (PCB) 10.In addition, described the first position limiting structure 213B and the second position limiting structure 214B are relatively arranged at the inner edge of the ring-side wall 212B of metallic sheath 21B, wherein the first position limiting structure 213B is combined with the mutual buckle of the first snap-in structure 165, and the second position limiting structure 214B is combined with the mutual buckle of the second snap-in structure 175.
For instance, projection or fixture block that the first snap-in structure 165 and the second snap-in structure 175 are various shapes, the first position limiting structure 213B and the second position limiting structure 214B are corresponding recess or Ka Gou, vice versa.
Dismounting assembly disclosed by the invention, has effect as described below:
One, memory modules of the present invention is when assembling or dismounting, user can coordinate the balance of the two hand application of forces, positively memory modules is assembled in the memory bank of computer motherboard, and by memory modules under memory bank dismounting, can guarantee the reliability that memory modules and computer system are electrically connected, thereby make computer system bring into play its normal function.
Two, memory modules of the present invention is in assembling or when dismounting, user on hand with static can conduct to ground terminal by metalwork, to prevent static from scurrying into memory modules, its integrated circuit is damaged, can extend the serviceable life of memory modules.
The above, be only preferred embodiment of the present invention, and the equalization of therefore making according to the embodiment of the present invention changes or revises, and still belongs to the scope that the present invention protects.
Claims (14)
1. a dismounting assembly, a memory modules that has a printed circuit board (PCB) in order to installation or removal is in a memory bank, this printed circuit board (PCB) has a terminals side and a free side away from this terminals side, it is characterized in that, described dismounting assembly comprises a plurality of metalworks, is arranged at the free side of this printed circuit board (PCB).
2. dismounting assembly as claimed in claim 1, is characterized in that, the plurality of metalwork each interval one preset distance, makes institute's externally applied forces mean forced.
3. the dismounting assembly as described in claim 1, it is characterized in that, this printed circuit board (PCB) has a first surface and a second surface with respect to this first surface, and this first surface and this second surface respectively have one first corner of contiguous this terminals side and one second corner and away from one the 3rd corner and one the 4th corner of this terminals side, the plurality of metalwork is arranged at respectively the 3rd corner of this first surface, the 3rd corner of the 4th corner of this first surface, this second surface and the 4th corner of this second surface.
4. dismounting assembly as claimed in claim 3, it is characterized in that, the terminals side of this printed circuit board (PCB) comprises a plurality of ground terminals, the first surface of this printed circuit board (PCB) and second surface are respectively provided with many metallic traces, one end of the plurality of metallic circuit connects respectively the plurality of metalwork, and the other end connects respectively the plurality of ground terminal.
5. dismounting assembly as claimed in claim 3, it is characterized in that, the plurality of metalwork is a plurality of metallic sheaths, and the plurality of metallic sheath is sheathed on the free side of this printed circuit board (PCB) and covers respectively the 3rd corner of this first surface and this second surface and the 4th corner of this first surface and this second surface.
6. dismounting assembly as claimed in claim 5, it is characterized in that, the 3rd corner and the 4th corner of this first surface are respectively provided with one first snap-in structure, the 3rd corner and the 4th corner of this second surface are respectively provided with one second snap-in structure, and each tool one of the plurality of metallic sheath is corresponding to the first position limiting structure and second position limiting structure corresponding to this second snap-in structure of this first snap-in structure.
7. dismounting assembly as claimed in claim 6, is characterized in that, each metallic sheath has the ring-side wall that a diapire and is connected in this diapire, and this first position limiting structure and this second position limiting structure are relatively arranged at the inner edge of this ring-side wall.
8. a memory modules, is characterized in that, comprising:
One printed circuit board (PCB), it has a terminals side and a free side away from this terminals side;
And
One dismounting assembly, it comprises a plurality of metalworks that are arranged at this free side.
9. memory modules as claimed in claim 8, is characterized in that, the plurality of metalwork each interval one preset distance, makes institute's externally applied forces mean forced.
10. memory modules as claimed in claim 8, it is characterized in that, this printed circuit board (PCB) has a first surface and a second surface with respect to this first surface, and this first surface and this second surface respectively have one first corner of contiguous this terminals side and one second corner and away from one the 3rd corner and one the 4th corner of this terminals side, the plurality of metalwork is arranged at respectively the 3rd corner of this first surface, the 3rd corner of the 4th corner of this first surface, this second surface and the 4th corner of this second surface.
11. memory modules as claimed in claim 10, it is characterized in that, the terminals side of this printed circuit board (PCB) comprises a plurality of ground terminals, the first surface of this printed circuit board (PCB) and second surface are respectively provided with many metallic traces, and one end of these many metallic traces connects respectively the plurality of metalwork and the other end connects respectively the plurality of ground terminal.
12. memory modules as claimed in claim 10, it is characterized in that, the plurality of metalwork is a plurality of metallic sheaths, and the plurality of metallic sheath is sheathed on the free side of this printed circuit board (PCB) and covers respectively the 3rd corner of this first surface and this second surface and the 4th corner of this first surface and this second surface.
13. memory modules as claimed in claim 12, it is characterized in that, the 3rd corner and the 4th corner of this first surface are respectively provided with one first snap-in structure, the 3rd corner and the 4th corner of this second surface are respectively provided with one second snap-in structure, and each tool one of those metallic sheaths is corresponding to the first position limiting structure and second position limiting structure corresponding to this second snap-in structure of this first snap-in structure.
14. memory modules as claimed in claim 13, is characterized in that, each metallic sheath has the ring-side wall that a diapire and is connected in this diapire, and this first position limiting structure and this second position limiting structure are relatively arranged at the inner edge of this ring-side wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310050946.4A CN103984393A (en) | 2013-02-07 | 2013-02-07 | Dismounting assembly and memory module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310050946.4A CN103984393A (en) | 2013-02-07 | 2013-02-07 | Dismounting assembly and memory module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103984393A true CN103984393A (en) | 2014-08-13 |
Family
ID=51276405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310050946.4A Pending CN103984393A (en) | 2013-02-07 | 2013-02-07 | Dismounting assembly and memory module thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN103984393A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5502620A (en) * | 1994-03-11 | 1996-03-26 | Molex Incorporated | Grounded IC card |
| CN2375062Y (en) * | 1999-04-02 | 2000-04-19 | 富准精密工业(深圳)有限公司 | Radiator |
| TW458423U (en) * | 2000-05-09 | 2001-10-01 | Speed Tech Corp | Thin type connector having grounding device |
| US20070263359A1 (en) * | 2006-05-12 | 2007-11-15 | Foxconn Technology Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
| US20100328835A1 (en) * | 2009-06-25 | 2010-12-30 | Samsung Electronics Co., Ltd. | Memory module for preventing electrostatic discharge (ESD) and system including the same |
-
2013
- 2013-02-07 CN CN201310050946.4A patent/CN103984393A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5502620A (en) * | 1994-03-11 | 1996-03-26 | Molex Incorporated | Grounded IC card |
| CN2375062Y (en) * | 1999-04-02 | 2000-04-19 | 富准精密工业(深圳)有限公司 | Radiator |
| TW458423U (en) * | 2000-05-09 | 2001-10-01 | Speed Tech Corp | Thin type connector having grounding device |
| US20070263359A1 (en) * | 2006-05-12 | 2007-11-15 | Foxconn Technology Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
| US20100328835A1 (en) * | 2009-06-25 | 2010-12-30 | Samsung Electronics Co., Ltd. | Memory module for preventing electrostatic discharge (ESD) and system including the same |
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Application publication date: 20140813 |