CN109862739B

CN109862739B - Terminal

Info

Publication number: CN109862739B
Application number: CN201910237986.7A
Authority: CN
Inventors: 杨子东
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2019-03-27
Filing date: 2019-03-27
Publication date: 2020-11-03
Anticipated expiration: 2039-03-27
Also published as: CN109862739A

Abstract

An embodiment of the present invention provides a terminal, including: mainboard, mainboard device and functional module, this functional module includes: the mainboard device comprises a side wall, a metal plate and a functional chip, wherein the mainboard device is fixed on the mainboard, the side wall is fixed on the mainboard, a guide structure is arranged on the side wall, the metal plate is in sliding connection with the side wall through the guide structure, the side wall is connected with the metal plate to form a shielding structure for containing the mainboard device, and the functional chip is fixed on the metal plate and is positioned outside the shielding structure. In the embodiment of the invention, the side wall of the functional module is provided with the guide structure, the metal plate can be in sliding connection with the side wall through the guide structure, and when the metal plate bearing the functional chip slides to a specified position, the assembly of the shielding structure and the installation of the functional chip on the terminal main board can be simultaneously completed, so that the assembly working efficiency is improved.

Description

Terminal

Technical Field

The embodiment of the invention relates to the technical field of terminals, in particular to a terminal.

Background

With the continuous development of terminal technology, users have more and more functional requirements on terminals, and in order to enable terminal equipment to have multiple different functions, multiple functional devices need to be arranged inside the terminals.

Referring to fig. 1, there is shown a conventional function module 10, the function module 10 being disposed on a main board 11 of a terminal, the function module 10 including: shielding cover 12, conductive foam 13, reinforcing plate 14, flexible circuit board 15 and functional chip 16.

The existing terminal assembling method comprises the following steps: firstly, the shielding cover 12 is fixed on the mainboard 11, then the conductive foam 13 is sequentially fixed on the top of the shielding cover 12, the reinforcing plate 14 is fixed on the conductive foam 13, the flexible circuit board 15 is fixed on the reinforcing plate 14, and finally the functional chip 16 is fixed on the flexible circuit board 15.

Disclosure of Invention

The embodiment of the invention provides a terminal, which solves the problem of low assembly efficiency in the prior art.

According to a first aspect of embodiments of the present invention, there is provided a terminal, including: mainboard, mainboard device and functional module, the functional module includes: lateral wall, metal sheet and function chip, wherein, the mainboard device is fixed on the mainboard, the lateral wall is fixed on the mainboard, be provided with guide structure on the lateral wall, the metal sheet passes through guide structure with lateral wall sliding connection, the lateral wall with the metal sheet is connected and is formed one and be used for holding the shielding structure of mainboard device, the function chip is fixed on the metal sheet, and is located outside the shielding structure.

In the embodiment of the invention, the side wall of the functional module is provided with the guide structure, the metal plate bearing the functional chip can be in sliding connection with the side wall through the guide structure, and when the metal plate slides to a specified position, the assembly of the shielding structure and the positioning and installation of the functional chip on the terminal mainboard can be simultaneously completed, so that the assembly working efficiency is improved.

Furthermore, a shielding structure is formed by the metal plate and the side wall, and compared with the existing functional module which needs to be provided with a shielding cover independently, the whole thickness of the functional module is reduced, and the internal space of the terminal is saved;

furthermore, as the metal plate and the side wall form a shielding structure, the cover top of the shielding cover and the conductive foam for communicating the cover top of the shielding cover with the metal plate are omitted, the material is saved, and the production cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a conventional functional module;

fig. 2 is a schematic structural diagram of a functional module according to an embodiment of the present invention;

FIG. 3 is a schematic diagram illustrating dimensions of a functional module according to an embodiment of the present invention;

FIG. 4a is a schematic structural diagram of a functional module according to an embodiment of the present invention;

FIG. 4b is a second schematic structural diagram of a functional module according to an embodiment of the present invention;

FIG. 4c is a third schematic structural diagram of a functional module according to an embodiment of the present invention;

FIG. 4d is a fourth schematic structural diagram of a functional module according to an embodiment of the present invention;

FIG. 4e is a fifth schematic structural diagram of a functional module according to the embodiment of the present invention;

FIG. 4f is a sixth schematic structural diagram of a functional module according to an embodiment of the present invention;

FIG. 4g is a seventh schematic structural diagram of a functional module according to an embodiment of the present invention;

fig. 4h is an eighth schematic structural diagram of a functional module according to an embodiment of the present invention;

fig. 5 is a schematic flow chart illustrating an assembling method of a terminal according to an embodiment of the present invention;

FIG. 6a is a schematic view of an assembly of functional modules according to an embodiment of the present invention;

FIG. 6b is a second schematic view of the functional module assembly according to the embodiment of the present invention;

fig. 6c is a third schematic view illustrating the assembly of the functional module according to the embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that the terms "first" and "second" in the description of the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; the two elements can be directly connected or indirectly connected through an intermediate medium, and the two elements can be communicated with each other or the two elements can interact with each other, so that the specific meaning of the terms in the invention can be understood according to specific situations by a person skilled in the art.

The following description provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.

Referring to fig. 2, an embodiment of the present invention provides a terminal, including: mainboard 11, mainboard device 111 and functional module 20, this functional module 20 includes: the main board device 111 is fixed on the main board 11, the side wall 21 is provided with a guide structure 24, the metal plate 22 is slidably connected with the side wall 21 through the guide structure 24, the side wall 21 is connected with the metal plate 22 to form a shielding structure 25 for accommodating the main board device 111 of the terminal, and the functional chip 23 is fixed on the metal plate 22 and located outside the shielding structure 25.

The terminal can be a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer and the like, and the type of the terminal is not particularly limited in the embodiment of the invention.

The main board device 111 may be an electronic component such as a capacitor, a resistor, and the like, and the type of the main board device 111 is not specifically limited in the embodiment of the present invention.

The shielding structure 25 composed of the side wall 21 and the metal plate 22 shown in fig. 2 is used for protecting and electromagnetically shielding the main board device 111, and therefore, both the side wall 21 and the metal plate 22 need to have a function of shielding electromagnetic interference. The material of the side wall 21 and the metal plate 22 are both metal materials, such as: stainless steel, cupronickel, and the like, the material of the side wall 21 and the metal plate 22 may be the same, the material of the side wall 21 and the metal plate 22 may be different, and the material of the side wall 21 and the metal plate 22 is not particularly limited in the embodiment of the present invention. It will be appreciated that the metal plate 22 may also be referred to as a reinforcing steel sheet.

The functional chip 23 shown in fig. 2 is a chip structure having a certain function, and the functional chip may be any one of the following: a fingerprint chip, an audio processing chip, an image processing chip, etc., and the type of the functional chip 23 is not specifically limited in the embodiment of the present invention.

The guide structure 24 shown in fig. 2 is a groove structure or a slide rail structure, and if the groove structure is adopted, the tightness of the fit between the metal plate 22 and the guide structure 24 can be ensured, and if the slide rail structure is adopted, the relative sliding between the metal plate 22 and the guide structure 24 can be smoother, so that the assembling speed is increased.

With continued reference to fig. 2, the function module 20 further includes: the connecting member 26, the functional chip 23 are fixed on the connecting member 26, the connecting member 26 is fixed on the metal plate 22, one end of the connecting member 26 is electrically connected with the functional chip 23, and the other end of the connecting member 26 is used for electrically connecting with the main board 11.

The above-mentioned connecting member 26 is used for electrically connecting the functional chip 23 with other devices on the main board 11, such as: the functional chip 23 is electrically connected to the processor on the motherboard 11, and data transmission between the functional chip 23 and other devices on the motherboard 11 is realized through the connecting member 26.

It can be understood that, in order to make the side wall 21 and the metal plate 22 have the electromagnetic shielding function, an electrostatic discharge path needs to be formed between the side wall 21 and the metal plate 22, wherein the side wall 21 may be connected to the ground terminal of the main board 11 by welding, the metal plate 22 may be connected to the side wall 21 for grounding, and the metal plate 22 may also be connected to the ground terminal of the main board 11 by the connecting member 26.

Further, the connector 26 may be a flexible circuit board. The metal plate 22 is electrically connected to a corresponding ground terminal on the flexible circuit board through a conductive adhesive, and the ground terminal of the flexible circuit board is electrically connected to the ground terminal of the main board 11, so that the metal plate 22 is grounded.

In the embodiment of the invention, the side wall is provided with the guide structure, the metal plate bearing the functional chip can be in sliding connection with the side wall through the guide structure, when the metal plate slides to a specified position, the assembly of the shielding structure and the positioning and installation of the functional chip on the terminal mainboard can be simultaneously completed, and the assembly working efficiency is improved.

The guide structure 24 shown in fig. 2 is disposed in the middle of the side wall 21, and the metal plate 22 is assembled with the side wall 21 through the guide structure 24, so that the distance between the metal plate 22 and the main board 11 is reduced, and the overall thickness of the functional module 20 is reduced.

Specifically, referring to fig. 1 and 3, fig. 1 shows the dimensional relationship of the components of the existing functional module 10, and fig. 3 shows the dimensional relationship of the components of the functional module 20 according to the embodiment of the present invention.

The total thickness of the functional module 10 in fig. 1 is W1, and satisfies the following dimensional relationship:

W1＝A1+B1+C1+D+E+F1；

the total thickness of the functional module 20 in fig. 3 is W2, and satisfies the following dimensional relationship:

W2＝A2+B2+C2+F2；

wherein, a1 is the thickness of the functional chip 16, B is the thickness of the flexible circuit board 15, C1 is the thickness of the stiffener 14, D is the thickness of the conductive foam 13, E is the thickness of the cover top of the shielding cover 12, F1 is the distance between the cover top of the shielding cover 12 and the motherboard 11, a2 is the thickness of the functional chip 23, B2 is the thickness of the connecting member 26, C2 is the thickness of the metal plate 22, and F2 is the distance between the metal plate 22 and the motherboard 11.

Since the functional chips having the same functions have the same structure and the same dimensions, the

functional chips

16 and 23 have the same thickness, that is, a1 is a 2.

Suppose that: the thicknesses of the flexible circuit board 15 and the connector 26 are equal, namely B1 ═ B2; and the thickness of the reinforcing plate 14 is equal to that of the metal plate 22, and C1 is C2.

Further, it is assumed that the distance between the cover top of the shield cover 12 and the main board 11 is equal to the distance between the metal plate 22 and the main board 11, i.e., F1 — F2.

As can be understood from the above dimensional relationship, the total thickness (W2) of the function module 20 in fig. 3 is reduced in thickness (the size of the cap of the shield cover 12 and the conductive foam 13 is reduced, that is, the thickness is reduced by "D + E") as compared with the total thickness (W1) of the function module 10 in fig. 1. Due to the fact that the cover top of the shielding cover and the structure of the conductive foam can be reduced, materials are saved, production cost is reduced, the functional module is light and thin, and the space inside the terminal is saved.

Referring to fig. 4a, another functional module 40 is provided in the embodiment of the present invention, including: the sidewall 21, the metal plate 22 and the functional chip 23, wherein the sidewall 21, the metal plate 22 and the functional chip 23 may be described with reference to the corresponding description in fig. 2, and are not described herein again.

The side wall 21 shown in fig. 4a comprises: at least two side walls, with the guide structure 24 being disposed in the middle of the side walls.

It will be appreciated that the guide structure 24 may also be provided at the top of the side walls.

The shape of the side wall 21 may be rectangular, triangular or other irregular shape. It will be appreciated that when the shape of the side wall 21 is changed, the shape of the metal plate 22 will need to be changed accordingly.

The side wall 21 is rectangular in shape as an example. Referring to fig. 4b to 4d, fig. 4b is a front view of the function module 40, fig. 4c is a left side view of the function module 40, and fig. 4d is a top view of the function module 40.

As shown in fig. 4b to 4d, the side wall 21 includes: a first side wall 401, a second side wall 402, a third side wall 403 and a fourth side wall 404, wherein the first side wall 401 and the third side wall 403 are opposite, the second side wall 402 and the fourth side wall 404 are opposite, the guiding structure 24 is arranged in the middle of the first side wall 401 and the third side wall 403, and the second side wall 402 is provided with a first notch 41.

In the embodiment of the present invention, the first notch 41 is an assembly entrance of the metal plate 22, and the metal plate 22 is inserted into the side wall 21 from the first notch 41 and assembled with the side wall 21 under the guiding action of the guiding structure 24.

As shown in fig. 4b, the guiding structure 24 is a groove provided in the middle of the first sidewall 401 and the third sidewall 403.

Further, the thickness of the first and

third sidewalls

401 and 403 is greater than the thickness of the second and

fourth sidewalls

402 and 404, increasing the thickness of the first and

third sidewalls

401 and 403, and avoiding a reduction in the structural strength of the first and

third sidewalls

401 and 403 due to the provision of the grooves in the first and

third sidewalls

401 and 403.

As shown in fig. 4c, a sealing groove 4041 for receiving an end of the metal plate 22 may be provided on the fourth sidewall 404.

In the embodiment of the present invention, the sealing groove 4041 is used to improve the sealing property between the metal plate 22 and the fourth sidewall 404. In addition, the sealing groove 4041 may also be used to limit the metal plate 22, and it is determined whether the metal plate 22 is assembled to a target position through the sealing groove 4041, so as to ensure the assembly quality.

As shown in fig. 4b to 4d, the functional module 40 may further include a top cover 42, and the top cover 42 is provided with a second notch 43 for avoiding the functional chip 23.

In the embodiment of the present invention, the top cover 42 may further improve the electromagnetic shielding effect of the shielding structure, and the second notch 43 is used to prevent the functional chip 23 from colliding with the top cover 42 when moving with the metal plate 22.

Taking the shape of the side wall 21 as an example, refer to fig. 4e to 4g, wherein fig. 4e is a front view of the function module 40, fig. 4f is a left view of the function module 40, and fig. 4g is a top view of the function module 40.

As shown in fig. 4e to 4g, the side wall 21 includes: the guide structure comprises a fifth side wall 405, a sixth side wall 406 and a seventh side wall 407, wherein the fifth side wall 405, the sixth side wall 406 and the seventh side wall 407 are sequentially connected end to end, the guide structure 24 is arranged in the middle of the fifth side wall 405 and the sixth side wall 406, and the first notch 41 is arranged on the seventh side wall 407.

As shown in fig. 4e, the guiding structure 24 is a groove provided in the middle of the fifth and

sixth side walls

405, 406.

Further, the thickness of the fifth sidewall 405 and the sixth sidewall 406 is greater than that of the seventh sidewall 407, and the thickness of the fifth sidewall 405 and the sixth sidewall 406 is increased, so that the structural strength of the fifth sidewall 405 and the sixth sidewall 406 is prevented from being reduced due to the arrangement of the grooves on the fifth sidewall 405 and the sixth sidewall 406.

As shown in fig. 4f and 4g, the sidewall 21 may further include a top cover 42, and the top cover 42 is provided with a second notch 43 for avoiding the functional chip 23.

It should be noted that the shape of the side wall 21 may also be a circle or other shapes, and for the case that the shape of the side wall 21 is a circle or other shapes, the descriptions of fig. 4b to 4d or fig. 4e to 4g may be referred to, and are not described again here.

In fig. 4b to 4d and fig. 4e to 4g, the guiding structure 24 is taken as an example of a groove disposed in the middle of the side wall 21, and it is understood that the guiding structure 24 may also be a sliding rail structure disposed on the top of the side wall 21.

Referring to fig. 4h, the guide structure 24 is a slide rail structure and is disposed on the top of the side wall 21. The metal plate 22 is directly engaged with the slide rail at the top of the side wall 21 to complete the assembly of the metal plate with the side wall 21. Thus, even if the side wall 21 has a capping structure, the capping of the side wall 21 can be prevented from colliding with the position of the functional chip 23.

Referring to fig. 5, an embodiment of the present invention further provides a terminal assembling method, where the method includes the following steps:

step 501: fixing the side wall on the main board;

in the embodiment of the invention, the side wall can be fixed on the main board in a welding mode, and the side wall is provided with the guide structure which can be a groove or a sliding rail.

Step 502: fixing the functional chip on the metal plate;

in the embodiment of the invention, the metal plate is used for bearing the functional chip. Furthermore, a flexible circuit board is arranged between the functional chip and the metal plate, the functional chip is communicated with other devices on the terminal mainboard through the flexible circuit board, and the metal plate is electrically connected with the grounding end of the flexible circuit board through conductive adhesive to realize the grounding of the metal plate.

It should be noted that, the embodiment of the present invention does not limit the execution sequence of the step 501 and the step 502, and the step 501 may be executed first, and the step 502 may be executed; step 502 may be executed first, and step 501 may be executed; step 501 and step 502 may also be performed simultaneously. After completing step 501 and step 502, step 503 is performed.

Step 503: and forming a shielding structure for accommodating the main board device by the metal plate and the side wall through the guide structure.

In the embodiment of the invention, the metal plate and the side wall form a shielding structure for accommodating the main board device under the guiding action of the guiding structure.

Specifically, referring to fig. 6a to 6c, the assembly process of the functional module is shown, the metal plate 22 is inserted into the side wall 21 from the first notch 41 on the side wall 21, and under the guiding action of the guiding structure 24, the metal plate 22 slides to the target position, completing the assembly of the functional module 20.

It should be noted that the functional module shown in fig. 6a to 6c is the functional module shown in fig. 4a to 4d, wherein the sidewall 21 is rectangular, and the guiding structure 24 is a groove disposed in the middle of the sidewall 21. For functional modules with sidewalls 21 having other shapes, the assembling process can refer to the description of fig. 6a to 6c, and will not be described herein again.

While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A terminal, comprising: mainboard, mainboard device and functional module, the functional module includes: the main board device is fixed on the main board, the side wall is fixed on the main board, a guide structure is arranged on the side wall, the metal board is in sliding connection with the side wall through the guide structure, the side wall is connected with the metal board to form a shielding structure for accommodating the main board device, and the functional chip is fixed on the metal board and located outside the shielding structure;

the metal plate is a reinforcing plate;

the function module includes: the metal plate is inserted into the first notch and is in sliding connection with the guide structure.

2. The terminal of claim 1, wherein the function module further comprises: the connecting piece, the function chip is fixed on the connecting piece, the connecting piece is fixed on the metal sheet, the one end of connecting piece with the function chip electricity is connected, the other end of connecting piece be used for with the mainboard electricity is connected.

3. A terminal according to claim 1, wherein the guide formation is provided in the middle of the side wall.

4. A terminal as claimed in claim 3, wherein the at least two side walls include a first side wall, a second side wall, a third side wall and a fourth side wall, wherein the first side wall and the third side wall are opposite and the second side wall and the fourth side wall are opposite, the guide is disposed in a middle portion of the first side wall and the third side wall, and the first notch is disposed in the second side wall.

5. A terminal according to claim 4, wherein the fourth side wall is provided with a sealing groove for receiving an end of the metal plate.

6. A terminal as claimed in claim 3, wherein when the at least two sidewalls include a fifth sidewall, a sixth sidewall and a seventh sidewall, the fifth sidewall, the sixth sidewall and the seventh sidewall are sequentially connected end to end, the guide structure is disposed in the middle of the fifth sidewall and the sixth sidewall, and the seventh sidewall is provided with the first notch.

7. The terminal of claim 3, wherein the function module further comprises: and the top cover is connected with the at least two side walls, and a second notch for avoiding the functional chip is arranged on the top cover.

8. A terminal according to claim 1, wherein the guide structure is a groove structure or a rail structure.

9. A terminal according to claim 2, characterised in that the connector is a flexible circuit board, FPC.

10. A terminal as claimed in claim 9, wherein the FPC is secured to the metal plate by a conductive adhesive, and the metal plate is electrically connected to a ground terminal of the FPC by the conductive adhesive.