CN103983180B - The measuring method of a kind of cable thickness/degree of eccentricity and measuring apparatus thereof - Google Patents
The measuring method of a kind of cable thickness/degree of eccentricity and measuring apparatus thereof Download PDFInfo
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- CN103983180B CN103983180B CN201410259384.9A CN201410259384A CN103983180B CN 103983180 B CN103983180 B CN 103983180B CN 201410259384 A CN201410259384 A CN 201410259384A CN 103983180 B CN103983180 B CN 103983180B
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- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000012360 testing method Methods 0.000 claims abstract description 77
- 230000005540 biological transmission Effects 0.000 claims abstract description 20
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 230000009182 swimming Effects 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000446313 Lamella Species 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Abstract
The present invention discloses measuring method and the measuring apparatus thereof of a kind of cable thickness/degree of eccentricity, and cable method for measuring thickness comprises the following steps: 1) chooses and makes cable under test test piece; 2) test piece is fixed on sample table transmission mechanism; 3) rotating threaded shaft makes trip cutter and test piece to be measured tangent on one side, and reading resets; 4) translation trip cutter and test piece the other side to be measured are tangent, stop rotational lead screw, send data to micro-chip with the angle sensor device of leading screw coaxial rotation, and micro-chip process data obtain thickness data and these data shown on digital indicator. The measuring method of degree of eccentricity is after recording cable inside/outside conductive layer thickness and thickness of insulating layer, calculates. This measuring method is simple to operate, utilizes leading screw to calculate the miles of relative movement of trip cutter, then calculates gauge, and adopt numerical monitor to overcome people's eye error, can effectively reduce the reading number of times in test process, it is to increase test accuracy rate and test efficiency.
Description
Technical field
The present invention relates to cable detection field, particularly relate to measuring method and the measuring apparatus thereof of a kind of cable thickness/degree of eccentricity.
Background technology
Patent CN103292665A discloses and a kind of measures the method for cable insulation thickness and degree of eccentricity and corresponding measuring apparatus, this testing method relies on measuring apparatus disclosed in it and completes, reading is completed owing to this kind of device mainly relies on people's eye, and this kind of testing method reading is more, testing process record data volume is big, calculation procedure is many, is easy to make mistakes, cause final detection result accuracy rate low and test inefficiency.
Summary of the invention
In order to solve the problems of the technologies described above, the present invention provides measuring method and the measuring apparatus thereof of a kind of cable thickness/degree of eccentricity, this device utilizes leading screw to calculate the miles of relative movement of trip cutter, then gauge is calculated, and adopt numerical monitor to overcome people's eye error, can effectively reduce the reading number of times in test process, it is to increase test accuracy rate and test efficiency.
The technical scheme of the present invention is as follows for this reason:
The measuring method of a kind of cable thickness: comprise the following steps:
1) making cable under test test piece is chosen;
2) test piece is fixed on sample table transmission mechanism;
3) the control knob rotational lead screw of turn reading device makes the outboard/inboard of trip cutter and test piece to be measured tangent, it is determined that reading device reading, for supposing zero point, is reset by this point;
4) it is tangent that the control knob rotational lead screw again rotating reading device makes trip cutter move to the outer semiconducting layer corresponding to test piece to be measured/interior semi-conductive layer to inside/outside, stop rotating control knob, by carrying, the current/voltage signal rotating angle is directly transferred to the micro-chip comprising analog conversion function to angle sensor device, or is transferred to micro-chip through D/A converter module;
Micro-chip process data method in two steps:
First angle data is converted week number to: all number=angle of rotation/360;
Secondly week number is converted into slant range: slant range=week number * leading screw pitch;
Range data after micro-chip process is shown on digital indicator 5, obtains outer semiconducting layer/interior semi-conductive layer thickness.
A measuring method for cable eccentricity degree, comprises following steps:
1) making cable under test test piece is chosen;
2) test piece is fixed on sample table transmission mechanism;
3) control knob of turn reading device, mobile trip cutter makes itself and test piece outermost layer tangent; Pulling up right side three-jaw transmission control knob, rotate the pilot lever of the left side vertical rotating shaft of control, rotating shaft drives test piece to rotate, and is assisted by magnifying glass, finds the thinnest position of test piece;
4), after determining the thinnest position of test piece, regulate trip cutter to its outermost, taking this point as supposing zero point;
5) the control knob rotational lead screw rotating reading device makes trip cutter move to the inside, angle sensor device and leading screw coaxial rotation, the rotation angle of Real-Time Monitoring leading screw, when the inner side swimming cutter and outer semiconducting layer is tangent, stop rotating control knob, by carrying, the current/voltage signal rotating angle is directly transferred to the micro-chip comprising analog conversion function to angle sensor device, or is transferred to micro-chip through D/A converter module;
Micro-chip processes data in two steps:
First angle data is converted week number to: all number=angle of rotation/360;
Secondly week number is converted into slant range: slant range=week number * leading screw pitch;
Range data after micro-chip process is shown on digital indicator 5, i.e. test piece the thinnest position outer semiconducting layer thickness;
6) zeros data, supposes zero point, again according to step 5) method trip cutter is moved to the inside, read test piece the thinnest position thickness of insulating layer and interior semi-conductive layer thickness respectively;
7) pilot lever controlling vertical rotating shaft on the left of sample table transmission mechanism is rotated, rotating shaft drives test piece to rotate, determine the measuring position of other any radiuses, the leading screw control knob of turn reading device, mobile trip cutter, assisted by magnifying glass, the tangency location of trip cutter with inner side is located the first measurement point, and suppose that it is zero point, outwards mobile trip cutter is tangent to the outside of itself and interior semi-conductive layer, record the interior semi-conductive layer thickness X that this measurement point is corresponding, after record, reading device is reset, redefine supposition zero point, outwards mobile trip cutter 6 is tangent to the outside of itself and insulation layer again, record corresponding thickness of insulating layer Y, being reset by reading device after record, redefine supposition zero point, outwards mobile trip cutter 6 is tangent with the outside of outer semiconducting layer to it again, records outer semiconducting layer thickness Z,
8) adopt with step 7) same procedure measure the N number of different positions of test piece interior semi-conductive layer thickness X1,X2,X3, X4����XN, thickness of insulating layer Y1,Y2,Y3,Y4����YNWith outer semiconducting layer thickness Z1,Z2,Z3,Z4����ZN;
Insulation layer and the degree of eccentricity of inside and outside semi-conductive layer is calculated respectively according to following formula:
Swim cutter described in measuring process and record interior semi-conductive layer thickness/thickness of insulating layer/outer semiconducting layer thickness from inside to outside successively, or ecto-entad records outer semiconducting layer thickness/thickness of insulating layer/interior semi-conductive layer thickness successively.
A kind of measuring apparatus measured for cable thickness/degree of eccentricity, described measuring apparatus is made up of reading device and sample table transmission mechanism, leading screw, trip cutter, angle sensor device, micro-chip and digital indicator that described reading device comprises base plate, is fixed on described base plate;The lower end of described trip cutter is connected with described leading screw by screw-drive mechanism; One end of described leading screw is provided with the angle sensor device for detecting its angle of rotation; Described angle sensor device is directly connected with the micro-chip comprising analog conversion function or is connected with micro-chip by D/A converter module; Described micro-chip is connected with described digital indicator;
The electric current comprising angle of rotation received or voltage signal are directly transferred to the micro-chip comprising analog conversion function or are transferred to micro-chip through D/A converter module by described angle sensor device; Described micro-chip is transferred to digital indicator after being processed by Received signal strength; The signal received is shown by described digital indicator in digital form.
The screw-drive mechanism being connected with described leading screw of described trip cutter is ball-screw nut mechanism.
Described micro-chip and digital indicator integrated installation are in the surface of described trip cutter.
One end that described leading screw arranges angle sensor device is provided with control knob, this control knob and leading screw coaxial rotation.
This measuring apparatus volume is little, leading screw is utilized to calculate the miles of relative movement of trip cutter, then calculate gauge, and adopt numerical monitor to overcome people's eye error, utilize the detection leading screw angle change of angle sensor device and then be converted into axial displacement, its angle precision value can be accurate to 0.1 degree, also namely the precision of whole instrument is about d/3600 (d < 5mm), much smaller than 1, substantially increases accuracy of detection, and this device is easy to operate, can effectively increase work efficiency. Utilize the reading number of times that this measuring apparatus can effectively reduce in test process, it is to increase accuracy rate and test efficiency. Simultaneously owing to this device number reading method changes, there is not strict demand as position for thread jaw chuck in CN103292665A, reduce the difficulty of device fabrication to a certain extent.
Accompanying drawing explanation
Fig. 1 is the three-dimensional structure diagram of measuring apparatus of the present invention;
Fig. 2 is the vertical view of measuring apparatus reading part of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the technical scheme of the present invention is described in detail.
For the ease of the understanding to testing method, first the structure of measuring apparatus is described below. This measuring apparatus is made up of reading device and sample table transmission mechanism; Described sample table transmission mechanism rotates fixed conveyor part with CN103292665A middle gear, Fig. 6,7 of its structure iron ginseng CN103292665A. Only being described by the parts that operating process uses when below describing cable method for measuring thickness, its transmission process is no longer described.
As shown in Figure 2, its structure comprises base plate 7 to the vertical view of described reading device, the leading screw 1, trip cutter 6, angle sensor device 2, micro-chip 4 and the digital indicator 5 that are fixed on described base plate 7; The lower end of described trip cutter 6 is connected with described leading screw 1 by screw-drive mechanism, and the rotation of leading screw 1 can be converted into the horizontal shift of trip cutter 6; One end of described leading screw 1 is provided with the angle sensor device 2 for detecting its angle of rotation; Described angle sensor device 2 is directly connected with the micro-chip 4 comprising analog conversion function or is connected with micro-chip 4 by D/A converter module; Described micro-chip 4 is connected with described digital indicator 5;
The electric current comprising angle of rotation received or voltage signal are directly transferred to the micro-chip 4 comprising analog conversion function or are transferred to micro-chip 4 through D/A converter module by described angle sensor device 2; Described micro-chip 4 is transferred to digital indicator 5 after being processed by Received signal strength;The signal received is shown by described digital indicator 5 in digital form.
In a kind of enforcement mode of this device, the screw-drive mechanism being connected with described leading screw 1 of described trip cutter 6 is ball-screw nut mechanism.
In the enforcement mode of this device, s12x128, stc series that Texas Instrument produces, MSP430, F41x, F16x, F41x, F43x or F44x can be selected as the micro-chip comprising analog conversion function; Select Atmel8051,80c51 or 89s51 that Texas Instrument produces as the micro-chip not comprising analog conversion function, and select ADC0809 or ADC12 that Texas Instrument produces as the D/A converter module being connected with the micro-chip not comprising analog conversion function.
The WDA-D30-SA type angle sensor device that the optional Shanghai Jiang Jingxiang Electronics Co., Ltd. of the angle sensor device of this device produces, or select the angle sensor device of the similar precision/function of other manufacturer production.
In a kind of enforcement mode of this device, described micro-chip 4 and digital indicator 5 integrated installation in the surface of described trip cutter, can reduction equipment volume, can conveniently observe again.
In a kind of enforcement mode of this device, one end that described leading screw arranges angle sensor device is provided with control knob 3, this control knob 3 and leading screw 1 coaxial rotation.
The measuring method of a kind of cable thickness: comprise the following steps:
1) making cable under test test piece is chosen;
First, taking out all sheaths from insulation, extract conductor and sealing coat out, careful operation, in order to avoid damaging insulation, if interior outer semiconducting layer connects together with insulating sticky, then need not be removed;
Secondly, each test piece is made up of a heat insulating lamella, applies suitable instrument and cuts thin slice along the plane with conductor axis perpendicular, and the core without the flat flexible cord of sheath should not separate;
2) test piece is fixed on sample table transmission mechanism 8;
First the test piece made is placed on the lower sheeting of portable cable measuring apparatus, then insert and rotate right side three-jaw transmission control knob 11, three movable claws in mobile thread jaw chuck 7 are determined to suppose the center of circle, the position of three movable claws 7 is necessary for recessed position, test piece edge, finally upper compressing tablet is covered in test piece, and tighten fixing;
3) control knob 3 rotational lead screw 1 of turn reading device makes trip cutter 6 tangent with the outboard/inboard of test piece to be measured, it is determined that reading device reading, for supposing zero point, is reset by this point;
4) it is tangent that control knob 3 rotational lead screw 1 again rotating reading device makes trip cutter 6 move to the outer semiconducting layer corresponding to test piece to be measured/interior semi-conductive layer to inside/outside, stop rotating control knob 3, by carrying, the current/voltage signal rotating angle is directly transferred to the micro-chip 4 comprising analog conversion function to angle sensor device 2, or is transferred to micro-chip 4 through D/A converter module;
The method that micro-chip 4 processes data is in two steps:
First angle data is converted week number to: all number=angle of rotation/360;
Secondly week number is converted into slant range: slant range=week number * leading screw pitch;
Range data after micro-chip 4 process is shown on digital indicator 5, obtains outer semiconducting layer/interior semi-conductive layer thickness.
A measuring method for cable eccentricity degree, comprises the following steps:
1) making cable under test test piece is chosen;
First, taking out all sheaths from insulation, extract conductor and sealing coat out, careful operation, in order to avoid damaging insulation, if interior outer semiconducting layer connects together with insulating sticky, then need not be removed;
Secondly, each test piece is made up of a heat insulating lamella, applies suitable instrument and cuts thin slice along the plane with conductor axis perpendicular, and the core without the flat flexible cord of sheath should not separate;
2) test piece is fixed on sample table transmission mechanism 8;
First the test piece made is placed on the lower sheeting of portable cable measuring apparatus, then insert and rotate right side three-jaw transmission control knob 11, three movable claws in mobile thread jaw chuck 7 are determined to suppose the center of circle, the position of three movable claws 7 is necessary for recessed position, test piece edge, finally upper compressing tablet is covered in test piece, and tighten fixing;
3) control knob 3 of turn reading device, mobile trip cutter 6 makes itself and test piece outermost layer tangent; Pulling up right side three-jaw transmission control knob 11, rotate the pilot lever 10 of the left side vertical rotating shaft of control, rotating shaft drives test piece to rotate, and is assisted by magnifying glass, finds the thinnest position of test piece;
4), after determining the thinnest position of test piece, regulate trip cutter 6 to its outermost, taking this point as supposing zero point;
5) control knob 3 rotational lead screw 1 rotating reading device makes trip cutter 6 move to the inside, angle sensor device 2 and leading screw 1 coaxial rotation, the rotation angle of Real-Time Monitoring leading screw 1, when the inner side swimming cutter 6 and outer semiconducting layer is tangent, stop rotating control knob 3, by carrying, the current/voltage signal rotating angle is directly transferred to the micro-chip 4 comprising analog conversion function to angle sensor device 2, or is transferred to micro-chip 4 through D/A converter module;
Micro-chip 4 processes data in two steps: first angle data converts to week number: all number=angle of rotation/360;
Secondly week number is converted into slant range: slant range=week number * leading screw pitch;
Range data after micro-chip 4 process is shown on digital indicator 5, i.e. test piece the thinnest position outer semiconducting layer thickness;
6) zeros data, supposes zero point, again according to step 5) method trip cutter 6 is moved to the inside, read test piece the thinnest position thickness of insulating layer and interior semi-conductive layer thickness respectively;
7) pilot lever 10 controlling vertical rotating shaft on the left of sample table transmission mechanism is rotated, rotating shaft drives test piece to rotate, determine the measuring position of other any radiuses, the leading screw control knob 3 of turn reading device, mobile trip cutter 6, assisted by magnifying glass, the tangency location of trip cutter with inner side is located the first measurement point, and suppose that it is zero point, outwards mobile trip cutter 6 is tangent to the outside of itself and interior semi-conductive layer, record the interior semi-conductive layer thickness X that this measurement point is corresponding, after record, reading device is reset, redefine supposition zero point, outwards mobile trip cutter 6 is tangent to the outside of itself and insulation layer again, record corresponding thickness of insulating layer Y, being reset by reading device after record, redefine supposition zero point, outwards mobile trip cutter 6 is tangent with the outside of outer semiconducting layer to it again, records outer semiconducting layer thickness Z,
8) adopt with step 7) same procedure measure the N number of different positions of test piece interior semi-conductive layer thickness X1,X2,X3, X4����XN, thickness of insulating layer Y1,Y2,Y3,Y4����YNWith outer semiconducting layer thickness Z1,Z2,Z3,Z4����ZN;
Insulation layer and the degree of eccentricity of inside and outside semi-conductive layer is calculated respectively according to following formula:
Rotate test piece, it is determined that edge or outer rim test point in insulation layer, reading is reset, rotate test piece, choose skew amount vision maximum reading, draw A1, draw N number of reading, A with reason1,A2,A3,A4����AN, then deviation degree is:
Claims (7)
1. the measuring method of a cable thickness: it is characterized in that comprising the following steps:
1) making cable under test test piece is chosen;
2) test piece is fixed on sample table transmission mechanism (8);
3) rotational lead screw (1) makes trip cutter (6) tangent with the outboard/inboard of test piece to be measured, it is determined that reading device reading, for supposing zero point, is reset by this point;
4) again rotational lead screw (1) to make trip cutter (6) move to the outer semiconducting layer corresponding to test piece to be measured/interior semi-conductive layer to inside/outside tangent, stop rotational lead screw (1), by carrying, the current/voltage signal rotating angle is directly transferred to the micro-chip (4) comprising analog conversion function to angle sensor device (2), or is transferred to micro-chip (4) through D/A converter module;
Micro-chip (4) process data method in two steps:
First angle data is converted week number to: all number=angle of rotation/360;
Secondly week number is converted into slant range: slant range=week number * leading screw pitch;
Range data after micro-chip (4) process is shown on digital indicator (5), obtains outer semiconducting layer/interior semi-conductive layer thickness.
2. the measuring method of a cable eccentricity degree, it is characterised in that comprise following steps:
1) making cable under test test piece is chosen;
2) test piece is fixed on sample table transmission mechanism (8);
3) control knob (3) of turn reading device, mobile trip cutter (6) makes itself and test piece outermost layer tangent; Pulling up right side three-jaw transmission control knob (11), rotate the pilot lever (10) of the left side vertical rotating shaft of control, rotating shaft drives test piece to rotate, and is assisted by magnifying glass, finds the thinnest position of test piece;
4) after determining the thinnest position of test piece, regulate trip cutter (6) to its outermost, taking this point as supposing zero point;
5) control knob (3) rotational lead screw (1) rotating reading device makes trip cutter (6) move to the inside, angle sensor device (2) and leading screw (1) coaxial rotation, the rotation angle of Real-Time Monitoring leading screw (1), when the inner side swimming cutter (6) and outer semiconducting layer is tangent, stop rotating control knob (3), by carrying, the current/voltage signal rotating angle is directly transferred to the micro-chip (4) comprising analog conversion function to angle sensor device (2), or is transferred to micro-chip (4) through D/A converter module;
Micro-chip (4) processes data in two steps:
First angle data is converted week number to: all number=angle of rotation/360;
Secondly week number is converted into slant range: slant range=week number * leading screw pitch;
Range data after micro-chip (4) process is shown on digital indicator (5), i.e. test piece the thinnest position outer semiconducting layer thickness;
6) zeros data, supposes zero point, again according to step 5) method will swim cutter (6) and move to the inside, read test piece the thinnest position thickness of insulating layer and interior semi-conductive layer thickness respectively;
7) pilot lever (10) controlling vertical rotating shaft on the left of sample table transmission mechanism is rotated, rotating shaft drives test piece to rotate, determine the measuring position of other any radiuses, the leading screw control knob (3) of turn reading device, mobile trip cutter (6), assisted by magnifying glass, the tangency location of trip cutter with inner side is located the first measurement point, and suppose that it is zero point, outwards mobile trip cutter (6) is tangent to the outside of itself and interior semi-conductive layer, record the interior semi-conductive layer thickness X that this measurement point is corresponding, after record, reading device is reset, redefine supposition zero point, outwards mobile trip cutter (6) is tangent to the outside of itself and insulation layer again, record corresponding thickness of insulating layer Y, being reset by reading device after record, redefine supposition zero point, outwards mobile trip cutter (6) is tangent with the outside of outer semiconducting layer to it again, records outer semiconducting layer thickness Z,
8) adopt with step 7) same procedure measure the N number of different positions of test piece interior semi-conductive layer thickness X1,X2,X3, X4����XN, thickness of insulating layer Y1,Y2,Y3,Y4����YNWith outer semiconducting layer thickness Z1,Z2,Z3,Z4����ZN;
Insulation layer and the degree of eccentricity of inside and outside semi-conductive layer is calculated respectively according to following formula:
3. measuring method as claimed in claim 2, it is characterized in that: swim cutter (6) described in measuring process and record interior semi-conductive layer thickness/thickness of insulating layer/outer semiconducting layer thickness from inside to outside successively, or ecto-entad records outer semiconducting layer thickness/thickness of insulating layer/interior semi-conductive layer thickness successively.
4. for the measuring apparatus of measuring method as described in claim 1 or 2 or 3, it is characterized in that: described measuring apparatus is made up of reading device and sample table transmission mechanism, leading screw (1), trip cutter (6), angle sensor device (2), micro-chip (4) and digital indicator (5) that described reading device comprises base plate (7), is fixed on described base plate (7); The lower end of described trip cutter (6) is connected with described leading screw (1) by screw-drive mechanism; One end of described leading screw (1) is provided with the angle sensor device (2) for detecting its angle of rotation; Described angle sensor device (2) is directly connected with the micro-chip (4) comprising analog conversion function or is connected with micro-chip (4) by D/A converter module; Described micro-chip (4) is connected with described digital indicator (5);
The electric current comprising angle of rotation received or voltage signal are directly transferred to the micro-chip (4) comprising analog conversion function or are transferred to micro-chip (4) through D/A converter module by described angle sensor device (2); Described micro-chip (4) is transferred to digital indicator (5) after being processed by Received signal strength; The signal received is shown by described digital indicator (5) in digital form.
5. measuring apparatus as claimed in claim 4, it is characterised in that: the screw-drive mechanism being connected with described leading screw (1) of described trip cutter (6) is ball-screw nut mechanism.
6. measuring apparatus as claimed in claim 4, it is characterised in that: described micro-chip (4) and digital indicator (5) integrated installation are in the surface of described trip cutter.
7. measuring apparatus as claimed in claim 4, it is characterised in that: one end that described leading screw arranges angle sensor device is provided with control knob (3), this control knob (3) and leading screw (1) coaxial rotation.
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| CN201410259384.9A CN103983180B (en) | 2014-06-12 | 2014-06-12 | The measuring method of a kind of cable thickness/degree of eccentricity and measuring apparatus thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104776787B (en) * | 2015-04-20 | 2017-06-23 | 长春理工大学 | A kind of revolving body eccentric testing method |
| CN108592834B (en) * | 2018-06-20 | 2023-10-31 | 国网安徽省电力有限公司电力科学研究院 | Measuring device for thickness and inner diameter and outer diameter of cable insulating layer |
| CN112179297A (en) * | 2019-07-01 | 2021-01-05 | 云南电网有限责任公司玉溪供电局 | Composite insulator sheath core displacement detection method based on microwave reflection technology |
| CN112268504B (en) * | 2020-09-14 | 2022-05-24 | 西安理工大学 | Online detection device and method for cable eccentricity instrument |
| CN113865526A (en) * | 2021-09-28 | 2021-12-31 | 广东电网有限责任公司 | Composite insulator core rod eccentricity detection method and device, terminal equipment and medium |
| CN113959298B (en) * | 2021-10-22 | 2023-11-03 | 国网天津市电力公司 | Cable thickness/eccentricity measuring method and measuring device |
| CN114674221B (en) * | 2022-03-01 | 2023-08-25 | 宁波金田新材料有限公司 | Quick eccentric detection device for enameled wire |
| CN114877842B (en) * | 2022-04-27 | 2023-12-05 | 翼存(上海)智能科技有限公司 | Real-time metering device and metering method for film |
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