CN103981544B - A kind of seamless joint method of the circular ring metal die strip of surface tool optical microstructures aggregation - Google Patents
A kind of seamless joint method of the circular ring metal die strip of surface tool optical microstructures aggregation Download PDFInfo
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- CN103981544B CN103981544B CN201410218805.3A CN201410218805A CN103981544B CN 103981544 B CN103981544 B CN 103981544B CN 201410218805 A CN201410218805 A CN 201410218805A CN 103981544 B CN103981544 B CN 103981544B
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- 238000004220 aggregation Methods 0.000 title claims abstract description 14
- 230000002776 aggregation Effects 0.000 title claims abstract description 14
- 238000007789 sealing Methods 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 19
- 238000005323 electroforming Methods 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 239000002390 adhesive tape Substances 0.000 claims abstract description 9
- 238000005498 polishing Methods 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
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- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229920000297 Rayon Polymers 0.000 claims 1
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
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Abstract
The invention discloses the seamless joint method of the circular ring metal die strip of a kind of surface tool optical microstructures aggregation.The present invention is to take with peelable adhesive tape abutment joint front sealing label, cram at the seam back side with room temperature curing type A/B structural conductive glue, and process seam with sheet metal and bicomponent structural adhesive from the back side by method fixing for seam, and combine electroforming process, eventually form overlarge area annular strip metal template.It is smooth without ablation that the present invention has seam, and mechanical strength such as can guarantee that at the advantage.
Description
Technical field
The present invention relates to optical mould manufacturing technology field, a kind of surface tool optical microstructures aggregation
The seamless joint method of circular ring metal die strip.
Background technology
Optical microstructures aggregation, such as microprism array, microlens array, fresnel lens array etc., passes through plastic tree
Fat large area on the mould with these micro structure aggregations replicates, i.e. ultraprecise nano impression can manufacture and have not
Functional film with optical effect.As having the reflective membrane of microprism array, there is the bright enhancement film of microlens array, tool
The Salar light-gathering sheet of fresnel lens array.
In order to realize the mesh of the imprinting and copying optical microstructures aggregation of high accuracy, large area, serialization on plastic resin
, it is necessary to use outer surface to have the annular banding template of this optical microstructures aggregation.How to splice overlarge area without
The annular die strip of seam, is the link realizing continuous prodution high-quality micro structure resin thin film most critical.
Producer typically uses following technique the most both at home and abroad: first junior unit metallic nickel template edge is cut, polishes, is polished,
Mouth docking in limit is spliced into big plate again, then descends groove electroforming, and the daughter board of gained is linked to be an entirety, thus makes bigger nickel
Plate.
Owing to cannot ensure the most identical gapless of splicing seams and the absolute on a plane of limit, sealing left and right, seam crossing exists
During electroforming, daughter board can produce the burr that cannot remove and injustice.Some patent documentation is reported for work, and employing method of laser welding will
Seam mouth welds from the back side, but owing to laser welding belongs to sweat soldering, is inevitably generated localized hyperthermia, due to
Expanding with heat and contract with cold and the impact of thermal stress, make the optical microstructures generation geometry deformation about soldered, limit mouth extrudes,
Producing bigger gap and dislocation, and cannot completely weld due to weld seam and cram completely, the daughter board seam that electroforming goes out is deposited equally
At burr.
Summary of the invention
The technical problem to be solved is for the deficiencies in the prior art, it is provided that a kind of surface tool optical microstructures
The seamless joint method of the circular ring metal die strip of aggregation.
Technical scheme is as follows:
A kind of seamless joint method of the circular ring metal die strip of surface tool optical microstructures aggregation, its step is as follows:
(1) little for unit area flat panel caster is carried out edge cuts, polishing, example angle by requirement and size, will polishing
Intact some little area caster, size and texture structure direction as requested are spelled side by side and are placed on a plane, make limit
Edge is mutually close to, and coincide to observing gapless and is as the criterion, and is fixed；With peelable one-faced tapes, the pressing of seam front is sealed
Closing, little surface elemant template had both been connected into one and whole had magnified plate, magnified plate entirety turn-over by whole, allow back seam upwards,
And again extrude on sealing, it is ensured that the adhesive tape of bottom surface is sturdy with plate；
(2) sealing is crammed in the extruding of room temperature curing type A/B structural conductive glue, it is ensured that gap filling is complete, with scraper and cotton balls
Unnecessary conducting resinl is removed, only ensures that sealing fills up conducting resinl and is as the criterion；Treat that conducting resinl is dried, then with fine sandpaper gently
About polishing sealing, blow away sand-lime, then smear sealing and left and right with bicomponent structural adhesive, and by the metal foil of wide 30cm
Sheet presses on bicomponent structural adhesive；After structure glue is dry, the peelable adhesive tape in front is peeled off, form the firm front of seam
Sealing is without depression and the large area template of continuous conduction；
(3) good large area template assembled in (2) is put into electroforming in flat board electrotyping bath, obtain opening seamless motherboard greatly；
(4) with big seamless motherboard as unit, by (1), (2), (3) step method, larger area putting down without plate seam continuously is formed
Face die plate；
(5) by the plane template of sufficient length that obtains in (4) according to (1), (2) step method, limit mouth is connected from beginning to end, is formed
Lines is towards interior annular banding caster；By the outer surface PVC one-side band glue-film stickup of non-for banding caster lines
Close, make outer surface in state of insulation, be 5% sodium dichromate by the inner surface mass concentration of banding caster tool lines
Solution sprays Passivation Treatment equably, and retains 2 minutes, then rinses with pure water, and inner surface just forms one layer can make son
The oxide-film that plate and motherboard are peeled off smoothly；Then with conventional electrocasting method, electroforming in cylindrical shape electrotyping bath, banding are put into
The inner surface of caster just forms one layer and accurately replicates caster lines and the outside annular banding subtemplate of lines, will
Electroforming complete after the mother that mutually attached to, subtemplate take out from electrotyping bath, through rinse be dried peel off, resulting bottle template
It it is i.e. the outside annular banding working template of lines.
Described peelable one-faced tapes is the PET peelable adhesive tape (3M898 such as Minnesota Mining and Manufacturing Company with certain support strength
Cord belt).
Described A/B structural conductive glue is that double-component, normal temperature cured type epoxy resin structural conducting resinl are (as Dongguan City grinds safe glue
The TD-8813 high intensity electronic conduction glue that stick company limited produces).
Described bicomponent structural adhesive forms (such as Wuhan double bond DB8011 bi-component with epoxy resin and firming agent hybrid modulation
Epoxy construction AB glue).
Described foil is stainless steel substrates, and its thickness is 0.5mm, and width is 30cm, and length is equal with sealing length.
The invention have the benefit that (1) A/B structural conductive glue belongs to reaction-curable, the colloid molecules after solidification becomes crosslinking
Network structure, solid is difficult to de-splitting, and has not only conducted electricity but also acid and alkali-resistance, solvent resistant, has been difficult in cleaning subsequently and electroforming destroy.
(2) peelable one-faced tapes is the peelable adhesive tape of PET with certain support strength, and peelable glue cohesive strength is big, peelable not cull,
Ensure that conducting resinl neither penetrates into sealing both sides, front and flushes with plate face again.(3) annular electro casting is used disposably to be fabricated to circle
Endless belt-shaped working template, compares flat-plate laser and is welded into the way of annular template, has seam smooth without ablation, machine
The advantages such as tool intensity can guarantee that.
Accompanying drawing explanation
Fig. 1 is that the little area metal template group with optical microstructures aggregation is combined into overlarge area annular strip metal mould
The seamless spliced technique of plate be embodied as schematic diagram；Wherein, A1, A2 representative unit little area flat panel metal mother plate,
B1, B2 represent the metallic plate processed；After A, B, C, D, E, F, G, H, I, J represent every procedure respectively
The template splicing shape formed；1,2,3,4 represent respectively peelable one-faced tapes, room temperature curing type A/B structural conductive glue,
Bicomponent structural adhesive, foil.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail.
Embodiment
The peelable one-faced tapes used in embodiment is the 3M898 cord belt of Minnesota Mining and Manufacturing Company；A/B structural conductive glue
It is the TD-8813 high intensity electronic conduction glue that produces of Dongguan City Yan Tai adhesive company limited；Bicomponent structural adhesive is Wuhan
Double bond DB8011 bi-component epoxy structure AB glue.
1, making two module units little area flat panel metal mother plate A1, A2, size is not less than 500mm × 500mm,
Two blocks of described lithographic plate metal mother plates are carried out edge cuts, polishing, example angle, it is ensured that end face is smooth, and linearity is good.
The metallic plate processed is B1, B2, and size is 480mm × 480mm, and the inclination angle of corresponding sides mouth is 30 degree.
2, by metal plate B 1 intact for polishing, B2, size and texture structure direction as requested are spelled side by side and are placed on one
Plane, makes the edge at inclination angle mutually be close to, and coincide to observing gapless and is as the criterion, and it is maintained static, shape temporarily
Become assembly shown in figure C.
3, the pressing of seam front being closed with peelable one-faced tapes 1, unit template is connected into entirety, forms accompanying drawing institute
Show D, magnify plate D entirety turn-over by whole, allow back seam upwards, and again on sealing extrude, make following adhesive tape
Sturdy with plate, by room temperature curing type A/B structural conductive glue 2 extrusion packing sealing, it is ensured that to meet gap to fill completely, use scraper
With cotton balls, unnecessary conducting resinl is removed, only ensure that sealing fills up conducting resinl and is as the criterion, form E shown in accompanying drawing.Treat conducting resinl
After being fully cured, then polish about sealing gently with fine sandpaper, blow away sand-lime, then smear sealing with bicomponent structural adhesive 3
And left and right, and the foil 4 of wide 30cm is pressed on bicomponent structural adhesive 3, treat that bicomponent structural adhesive 3 is the most solid
After change, the peelable adhesive tape 1 in front is peeled off, form seam firm front sealing without depression and the large area mould of continuous conduction
Plate G.
4, good metal form G assembled in 3 is put into electroforming in flat board electrotyping bath, just available big seamless motherboard, then
With big seamless motherboard as unit, by the above process, larger area can just be formed continuously without the plane template H of plate seam.
5, by large area template H of sufficient length, by above joining method, limit mouth is connected from beginning to end, forms lines towards interior
Annular banding caster I, the outer surface of non-for this caster lines is closed, make outer surface in state of insulation, will
The inner surface Passivation Treatment of annular banding caster tool lines, then rinse with pure water, inner surface just forms one layer of oxidation
Film, is then placed in electroforming in cylindrical shape electrotyping bath, and the inner surface of annular banding caster just forms one layer and accurately replicates
Caster lines and the outside annular banding subtemplate of lines, the mother and sons' template that mutually attached to after electroforming is completed from
Taking out in electrotyping bath, peel off through rinsing to be dried, resulting bottle template is i.e. the annular banding working template J that lines is outside.
The annular banding working template made by the above process has the smooth exquisiteness of splicing seams, observes seamless, without optics
Luminance loss, joint strength can meet the advantages such as long term mechanical operating.
Detecting through high magnified glass, gap is smaller than 0.02mm, fully meets and observes seamless requirement.
Testing plate face, seam mouth left and right through retro-reflecting coefficient detector is the retro-reflecting coefficient of-4 ° at view angle 0.2 °, angle of incidence,
Taking 20 Point Measurements, recording retro-reflecting coefficient minima is 900mcd/lx/m2, maximum is 980mcd/lx/m2, flat
Average is 950mcd/lx/m2, and with template center four some positions measured by retro-reflecting coefficient meansigma methods 953mcd/lx/m2Phase
Relatively, retro-reflecting coefficient is in normal fluctuation range, and average data is almost equal, it was demonstrated that without optics luminance loss.
Through upper machine trail run, die strip after iterative cycles runs 15 days on heating roller and chill roll, does not find seam mouth
Having the disadvantageous changes such as any craze and transfiguration, joint strength can meet the demand of long-term production operating.
It should be appreciated that for those of ordinary skills, can be improved according to the above description or be converted,
And all these modifications and variations all should belong to the protection domain of claims of the present invention.
Claims (4)
1. a seamless joint method for the circular ring metal die strip of surface tool optical microstructures aggregation, is characterized in that, its step
Rapid as follows:
(1) surface has the unit little area flat panel caster of optical microstructures aggregation carry out edge by requirement and size and cut
Cut, polish, example angle, by some little area flat panel caster intact for polishing, size as requested and texture structure direction are also
Row spelling is placed on a plane, makes edge mutually be close to, and coincide to observing gapless and is as the criterion, and is fixed；With peelable one side glue
The pressing of seam front is closed by band, and little surface elemant caster had both been connected into one and whole has magnified plate, magnified plate entirety turn-over by whole,
Allow back seam upwards, and again on sealing extrude, it is ensured that the adhesive tape of bottom surface is sturdy with plate；
(2) sealing is crammed in the extruding of room temperature curing type A/B structural conductive glue, it is ensured that gap filling is complete, will be many with scraper and cotton balls
Remaining conducting resinl removes, and only ensures that sealing fills up conducting resinl and is as the criterion；Treat that conducting resinl is dried, then sealing of polishing gently with fine sandpaper
Left and right, blows away sand-lime, then smears sealing and left and right with bicomponent structural adhesive, and presses to double by the foil of wide 30cm
In component structure glue；After structure glue is dry, the peelable adhesive tape in front is peeled off, form seam firm front sealing and without depression and connect
The large area template of continuous conduction；
(3) good large area template assembled in (2) is put into electroforming in flat board electrotyping bath, obtain opening seamless motherboard greatly；
(4) with big seamless motherboard as unit, by (1), (2), (3) step method, larger area is formed continuously without the plane of plate seam
Template；
(5) by the plane template of sufficient length that obtains in (4) according to (1), (2) step method, limit mouth is connected from beginning to end, forms lines
Towards interior annular banding caster, putting into electroforming in cylindrical shape electrotyping bath, gained daughter board is i.e. the surface tool light that lines is outside
Learn the annular banding working template of micro structure aggregation.
Seamless joint method the most according to claim 1, is characterized in that, described peelable one-faced tapes is 3M898 viscose
Band.
Seamless joint method the most according to claim 1, is characterized in that, described A/B structural conductive glue is double-component, often
Temperature solidified type epoxy resin structure conducting resinl；Described bicomponent structural adhesive forms with epoxy resin and firming agent hybrid modulation.
Seamless joint method the most according to claim 1, is characterized in that, described foil be thickness be 0.5mm not
Rust steel disc, its width is 30cm, and length is equal with sealing length.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410218805.3A CN103981544B (en) | 2014-05-22 | 2014-05-22 | A kind of seamless joint method of the circular ring metal die strip of surface tool optical microstructures aggregation |
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| CN201410218805.3A CN103981544B (en) | 2014-05-22 | 2014-05-22 | A kind of seamless joint method of the circular ring metal die strip of surface tool optical microstructures aggregation |
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| CN103981544B true CN103981544B (en) | 2016-08-24 |
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| CN104962956A (en) * | 2015-07-17 | 2015-10-07 | 晋江联兴反光材料有限公司 | Manufacturing technique of cylindrical microprism mold |
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| CN110777399A (en) * | 2019-11-18 | 2020-02-11 | 河南理工大学 | Core mould for electroforming to prepare thin-wall seamless metal round pipe |
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