CN103971870A - Polymer thermosensitive resistor core material and product preparation method thereof - Google Patents
Polymer thermosensitive resistor core material and product preparation method thereof Download PDFInfo
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- CN103971870A CN103971870A CN201410055577.2A CN201410055577A CN103971870A CN 103971870 A CN103971870 A CN 103971870A CN 201410055577 A CN201410055577 A CN 201410055577A CN 103971870 A CN103971870 A CN 103971870A
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Abstract
The invention discloses a polymer thermosensitive resistor core material and a product preparation method thereof. The polymer thermosensitive resistor core material comprises a conductive polymer composite with the Curie temperature of 90 DEG C and a conductive polymer composite with the Curie temperature of 150 DEG C, wherein the conductive polymer composite with the Curie temperature of 90 DEG C and the conductive polymer composite with the Curie temperature of 150 DEG C are combined in any weight ratio. According to the polymer thermosensitive resistor core material and the product preparation method thereof, two conductive polymer composites with different Curie temperatures are adopted, so that a proportion of the two materials is calculated according to the required Curie temperature in an actual production process, and a product at any Curie temperature between the Curie temperatures of the two materials can be produced; and production and management are simple and practical, and the work efficiency is greatly improved.
Description
Technical field
The present invention relates to production of electronic components technical field, the preparation method of especially a kind of macromolecular thermosensitive resistor device core and products thereof.
Background technology
Semistor (Positive temperature coefficient resistance, be called for short PTCR) be a kind of resistance element that is step rising with temperature rising resistance value in the temperature range in a certain region, at crystallization or the hypocrystalline high molecular polymer of dosing conducting particles, can present positive temperature coefficient PTC phenomenon, its principle is exactly rising-heat contracting-cold, when temperature rises, macromolecular chain is swollen to rise, between conducting particles, distance increases, thereby cause resistance value to increase, near temperature rising melting point polymer, namely reach while turn-offing temperature, the hurried rising of resistivity meeting, and this melting temperature is exactly Curie temperature.Utilize this resistivity-temperature characteristics, can make the components and parts that overcurrent, overvoltage, overtemperature protection are used.
Heat and PTC radiated energy equilibrium relation that the components and parts of three kinds of protection use finally all utilize the electric flux of PTC generation to produce; and PTC heat radiation is except relevant with PTC bulk & form; there are much relations with Curie temperature and the ambient temperature temperature difference; the electric flux of the larger needs of the temperature difference is just larger; according to this principle, draw; same size, the different Curie temperature non-operating currents of resistance value are difference also, and the high non-operating current of Curie temperature is larger.
Its interior environment temperature of different products is also different, as stored-program control exchange, require 40 ℃ of high workloads, intelligent electric meter is indoor requires 60 ℃, open air requires 70 ℃, 60 ℃ of general household electrical appliances, if when PTC need put into transformer, also need to add the temperature rise of transformer, the temperature of transformer may reach 100 ℃ even 110 ℃, having a narrow range of temperature of Curie temperature and ambient temperature easily produces misoperation, and temperature difference big-movement is slow or be failure to actuate, and so all do not reach desirable effect.
Different like this ambient temperatures just needs the PTC product of different Curie temperature, and the PTC product needed of different Curie temperature adopts different materials, adopts different formulas, and buying, production, storehouse management are all brought to very large challenge.
Summary of the invention
The object of the invention is: the preparation method of a kind of macromolecular thermosensitive resistor device core and products thereof is provided, and it is simple, practical, can produce fast the product that Curie temperature is any Curie temperature between 90-150 ℃, effectively increase work efficiency.
The present invention is achieved in that macromolecular thermosensitive resistor device core, the conductive polymer composite that comprises 150 ℃ of the conductive polymer composite of 90 ℃ of Curie temperature and Curie temperature, the conductive polymer composite that the conductive polymer composite that Curie temperature is 90 ℃ and Curie temperature are 150 ℃ is by any weight ratio combination, that is: their weight percent is 0-100%:0-100%, adds up to 100%; Calculate by weight, the composition of the conductive polymer composite that Curie temperature is 90 ℃ comprises 35-75 part high molecular polymer matrix 1,30-60 part carbon black and 0.1-10 part processing aid; The composition of the conductive polymer composite that Curie temperature is 150 ℃ comprises 35-75 part high molecular polymer matrix 2,30-60 part carbon black and 0.1-10 part processing aid.
Described high molecular polymer matrix 1 is one or more the combination in any in polyethylene or polyethylene and ethylene copolymers.
Described high molecular polymer matrix 2 is one or more the combination in any in the copolymer of polypropylene, Kynoar or polypropylene and Kynoar.
Described processing aid is one or more the combination in any in carbon black dispersant, antioxidant, crosslinking accelerator or coupling agent.
The method of preparing macromolecular thermosensitive resistor device, by above-mentioned parts by weight, by high molecular polymer matrix 1, carbon black and processing aid extrusion granulator at 150-250 ℃ of temperature, after the pellet that makes is cooling, be crushed to material particle diameter and be not more than 60 orders, obtained the conductive polymer composite of 90 ℃ of pulverulent Curie temperature; By high molecular polymer matrix 2, carbon black and processing aid extrusion granulator at 150～250 ℃ of temperature, after the pellet that makes is cooling, be crushed to material particle diameter and be not more than 60 orders, obtain the conductive polymer composite of 150 ℃ of pulverulent Curie temperature; After the conductive polymer composite of 150 ℃ of the conductive polymer composite of 90 ℃ of Curie temperature and Curie temperature is fully mixed according to the above ratio, with mould pressing method, make two sides and paste tinsel, the composite sheet of thickness 0.1-1.0mm; This composite sheet is crosslinked with gamma-rays or electron irradiation, and dosage is 5～100Mrad; By composite sheet cutting or punching molding, and the upper extraction electrode of welding, then its outside coated insulation layer, after solidifying, obtain macromolecular thermosensitive resistor device.
Manufacturing thermistor out after the conductive polymer composite of 150 ℃ of the conductive polymer composite of 90 ℃ of temperature and Curie temperature is mixed, its Curie temperature T
cas shown in the formula,
Wherein A is the conductive polymer composite weight of 90 ℃ of Curie temperature;
B is the conductive polymer composite weight of 150 ℃ of Curie temperature.
Owing to having adopted technique scheme, compared with prior art, the present invention adopts the conductive polymer composite of two kinds of different Curie temperature, in actual production process, according to needed Curie temperature, calculate the ratio of bi-material, just can produce the product of any Curie temperature between bi-material Curie temperature.Production of the present invention, manage simple and practically, increase work efficiency widely.
Accompanying drawing explanation
Accompanying drawing 1 is R-T curve of the present invention.
Embodiment
Embodiments of the invention 1: the method for preparing macromolecular thermosensitive resistor device, by above-mentioned parts by weight, after polyethylene DGDA-6098, Cabot carbon black 550, carbon black disperser (potassium stearate), antioxidant B215, crosslinking accelerator TAIC and coupling agent LD-105 are mixed, extrusion granulator at 150-250 ℃ of temperature, after the pellet that makes is cooling, be crushed to material particle diameter and be not more than 60 orders, obtained pulverulent conductive polymer composite (being labeled as A powder); By mould pressing method system, the pressing of A powder two sides are pasted to tinsel, be made for the composite sheet of thickness 0.27-0.35mm; This composite sheet is crosslinked with gamma-ray irradiation, and dosage is 5Mrad; Composite sheet is cut into the chip of 5*7mm size, and the upper extraction electrode of welding, then its outside coated insulation layer, after solidifying, obtain macromolecular thermosensitive resistor device.And test its resistance-temperature curve (curve 1) as shown in Figure 1.
Embodiments of the invention 2: the method for preparing macromolecular thermosensitive resistor device, by above-mentioned parts by weight, after Kynoar Solef 6020, Cabot carbon black 550, carbon black disperser (potassium stearate), antioxidant B215, crosslinking accelerator TAIC and coupling agent LD-105 are mixed, extrusion granulator at 150-250 ℃ of temperature, after the pellet that makes is cooling, be crushed to material particle diameter and be not more than 60 orders, obtained conductive polymer composite (being labeled as B powder); By mould pressing method system, the pressing of B powder two sides are pasted to tinsel, be made for the composite sheet of thickness 0.27-0.35mm; This composite sheet is crosslinked with gamma-ray irradiation, and dosage is 5Mrad; Composite sheet is cut into the chip of 5*7mm size, and the upper extraction electrode of welding, then its outside coated insulation layer, after solidifying, obtain macromolecular thermosensitive resistor device.And test its resistance-temperature curve (curve 2) as shown in Figure 1.
Embodiments of the invention 3: the method for preparing macromolecular thermosensitive resistor device, by above-mentioned parts by weight, A powder in embodiment 1 is mixed to (being labeled as C powder) with the B powder in embodiment 2 according to the proportioning of weight ratio 7.5:2.5, by mould pressing method system, the pressing of C powder two sides are pasted to tinsel, be made for the composite sheet of thickness 0.27-0.35mm; This composite sheet is crosslinked with gamma-ray irradiation, and dosage is 5Mrad; Composite sheet is cut into the chip of 5*7mm size, and the upper extraction electrode of welding, then its outside coated insulation layer, after solidifying, obtain macromolecular thermosensitive resistor device.And test its resistance-temperature curve (curve 3) as shown in Figure 1.
Embodiments of the invention 4: the method for preparing macromolecular thermosensitive resistor device, by above-mentioned parts by weight, A powder in embodiment 1 is mixed to (being labeled as D powder) with the B powder in embodiment 2 according to the proportioning of weight ratio 5:5, by mould pressing method system, the pressing of D powder two sides are pasted to tinsel, be made for the composite sheet of thickness 0.27-0.35mm; This composite sheet is crosslinked with gamma-ray irradiation, and dosage is 5Mrad; Composite sheet is cut into the chip of 5*7mm size, and the upper extraction electrode of welding, then its outside coated insulation layer, after solidifying, obtain macromolecular thermosensitive resistor device.And test its resistance-temperature curve (curve 4) as shown in Figure 1.
Embodiments of the invention 5: the method for preparing macromolecular thermosensitive resistor device, by above-mentioned parts by weight, A powder in embodiment 1 is mixed to (being labeled as E powder) with the B powder in embodiment 2 according to the proportioning of weight ratio 2.5:7.5, by mould pressing method system, the pressing of E powder two sides are pasted to tinsel, be made for the composite sheet of thickness 0.27-0.35mm; This composite sheet is crosslinked with gamma-ray irradiation, and dosage is 5Mrad; Composite sheet is cut into the chip of 5*7mm size, and the upper extraction electrode of welding, then its outside coated insulation layer, after solidifying, obtain macromolecular thermosensitive resistor device.And test its resistance-temperature curve (curve 5) as shown in Figure 1.
The data of above-described embodiment are as table 1
Conclusion
Two kinds of particles that Curie temperature conducting polymer core is not used of preparation height, calculate as required the weight proportion of two kinds of particles, mix again the core that can make any Curie temperature between height two Curie temperature, very convenient in purchasing management, production management, technical management like this, operating efficiency is higher than original, reaches object and the effect of expection.
Claims (5)
1. a macromolecular thermosensitive resistor device core, it is characterized in that: comprise the conductive polymer composite of 150 ℃ of the conductive polymer composite of 90 ℃ of Curie temperature and Curie temperature, the conductive polymer composite that the conductive polymer composite that Curie temperature is 90 ℃ and Curie temperature are 150 ℃ is by any weight ratio combination; Calculate by weight, the composition of the conductive polymer composite that Curie temperature is 90 ℃ comprises 35-75 part high molecular polymer matrix 1,30-60 part carbon black and 0.1-10 part processing aid; The composition of the conductive polymer composite that Curie temperature is 150 ℃ comprises 35-75 part high molecular polymer matrix 2,30-60 part carbon black and 0.1-10 part processing aid.
2. macromolecular thermosensitive resistor device core according to claim 1, is characterized in that: described high molecular polymer matrix 1 is one or more the combination in any in polyethylene or polyethylene and ethylene copolymers.
3. macromolecular thermosensitive resistor device core according to claim 1, is characterized in that: the combination in any of one or more in the copolymer that described high molecular polymer matrix 2 is polypropylene, Kynoar or polypropylene and Kynoar.
4. macromolecular thermosensitive resistor device core according to claim 1, is characterized in that: described processing aid is one or more the combination in any in carbon black dispersant, antioxidant, crosslinking accelerator or coupling agent.
5. a method that adopts macromolecular thermosensitive resistor device core claimed in claim 1 to prepare macromolecular thermosensitive resistor device, it is characterized in that: by above-mentioned parts by weight, by high molecular polymer matrix 1, carbon black and processing aid extrusion granulator at 150-250 ℃ of temperature, after the pellet that makes is cooling, be crushed to material particle diameter and be not more than 60 orders, obtained the conductive polymer composite of 90 ℃ of pulverulent Curie temperature; By high molecular polymer matrix 2, carbon black and processing aid extrusion granulator at 150～250 ℃ of temperature, after the pellet that makes is cooling, be crushed to material particle diameter and be not more than 60 orders, obtain the conductive polymer composite of 150 ℃ of pulverulent Curie temperature; After the conductive polymer composite of 150 ℃ of the conductive polymer composite of 90 ℃ of Curie temperature and Curie temperature is fully mixed according to the above ratio, with mould pressing method, make two sides and paste tinsel, the composite sheet of thickness 0.1-1.0mm; This composite sheet is crosslinked with gamma-rays or electron irradiation, and dosage is 5～100Mrad; By composite sheet cutting or punching molding, and the upper extraction electrode of welding, then its outside coated insulation layer, after solidifying, obtain macromolecular thermosensitive resistor device.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108164252A (en) * | 2017-12-12 | 2018-06-15 | 孝感华工高理电子有限公司 | A kind of PTC raw powder's production technologies |
| CN110189878A (en) * | 2018-04-11 | 2019-08-30 | 谭乔文 | A kind of surge protector MOV chip and preparation method thereof |
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