CN103970318A - Sensing module package structure and manufacture method thereof - Google Patents
Sensing module package structure and manufacture method thereof Download PDFInfo
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- CN103970318A CN103970318A CN201310035061.7A CN201310035061A CN103970318A CN 103970318 A CN103970318 A CN 103970318A CN 201310035061 A CN201310035061 A CN 201310035061A CN 103970318 A CN103970318 A CN 103970318A
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Abstract
The invention discloses a sensing module package structure and a manufacture method thereof. The sensing module package structure is characterized in that a protection layer for avoiding high-temperature influence in a process, especially a protection structure formed by high-melting-point materials is arranged outside a sensing circuit of a touch panel. The embodiment of the manufacture method comprises the following steps: putting a sensing circuit module into a first mould, filling the first mould with a first molten material, cooling for the first time to form a first covering body, and bonding the first covering body with one part of the sensing circuit module; putting a semi-finished product into a second mould, filling the second mould with a second molten material, and cooling for the second time to form a second covering body for covering another part of the circuit module. The sensing module package structure formed by bonding the first and second covering bodies with the sensing circuit module is formed through the two steps and can be used for protecting internal circuit components in the process.
Description
Technical field
The present invention relates to a kind of electronic sensing circuit structure and its method for making, particularly in encapsulation, one method for making of avoiding the surface structure that high temperature destroys is set when sensing circuit.
Background technology
In the time making contact panel, panel is provided with the sensing circuit that touch-control is used behind, when encapsulation, normally utilizes the high molecular polymers such as plastic cement as back veneer material.General manufacturing process is that sensing circuit is placed in the molding machine with specific appearance, and injects the macromolecule polymer material of molten, and manufacturing process, under a specific high temperature, can jointly form with sensing circuit a part for electronic installation after cooling.The sensing circuit 101 of describing as schematically shown in Figure 1, through moulding together with macromolecule polymer material in being placed in mould, forms a clad material 103 in the outside of sensing circuit 101.
But in above-mentioned technique, high temperature may damage the electronic component on general sensing circuit, or the material that on circuit, particular element is used also can be melted down, and therefore often needs the sensing circuit of particular design, therefore produces the possibility that cost rises.
Existing sensing circuit can be with reference to the described cross-section structure of figure 2.
In figure, be shown as the touch-control sensing module coated with the second polymer layer 211 by the first polymeric layer 201, wherein primary structure has the conducting wire 205 and another conductive layer 209 that utilize touch-control track of issues induction track, can be separated by with insulation course 207 according to demand between the two, 207 ', between conducting wire 205 and conductive layer 209, produce a capacitive sensing effect, touch-control event may produce the variation of electric capacity, therefore can draw its induction track.Structurally, the primary structure of touch-control sensing module is adhered to and is coated on the first outer polymeric layer 201 by optical cement 203.
The board structure that above-mentioned the second polymer layer 211 is whole sensing module, can be a kind of polyphenyl dicarboxylate (Poly (Ethylene Terephthalate) with the material of the first polymeric layer 201, PET), or other macromolecule polymer materials, all may be because the element of the high temperature injury sensing circuit of molten in above-mentioned technique.
Summary of the invention
Because prior art is in the time making electronic installation, may be because high temperature produces the problem of infringement when wherein each portion element of sensing circuit and outer enclosure structure form, the object of the invention is to propose a kind of electronic sensing circuit structure and its method for making, can be by stage technique, the problem of avoiding manufacturing process high temperature to cause.
According to one of embodiment of the present invention, in the time making encapsulation sensing circuit, at the superficial layer of its circuit structure, one structure of avoiding high temperature to destroy is set especially, pass through formed protective seam and stop temperatures involved.
The method for making of sensing module encapsulating structure comprises first purchases a sensing circuit module with contact panel sensing circuit, afterwards sensing circuit module is inserted to the first mould, and inject the first molten material in the first mould, through the first molten material of shaping of cooling program for the first time, to form the first cladding of a coating circuit module part.
Afterwards, the composition of the first cladding and sensing circuit module is inserted to the second mould, reinject the second molten material in the second mould, through this second molten material of shaping of cooling program for the second time, to form second cladding of another part of coating circuit module, sensing module encapsulating structure is the structure by the first cladding and the second cladding engagement feel slowdown monitoring circuit module.
Above-mentioned sensing circuit module primary structure is two conductive layers and an insulation course wherein; and the first molten material or the second molten material are macromolecule polymer material; be formed at two conductive layers and surface of insulating layer structure with this and can be a protection structure that blocks high temperature, there is dystectic material layer such as one.
The primary structure of sensing module encapsulating structure embodiment has the above-mentioned sensing circuit module structure coated with it, and sensing circuit module mainly contains substrate layer, the first conductive layer, insulation course, the second conductive layer and superficial layer.Outside this circuit module, utilize two stage method for makings to form the first cladding and the second cladding, wherein the first cladding and the second cladding are formed by the macromolecule polymer material that flows into the first mould and the second mould respectively.
Specifically, in an embodiment, the superficial layer of above-mentioned sensing circuit module can be a materials with high melting point layer, or outside superficial layer, forms another protective seam.
Beneficial effect of the present invention is; in sum; sensing module encapsulating structure and its method for making proposed by the invention are particularly utilized two-stage process; in sensing circuit module, form respectively two kinds of claddings; wherein in the time processing high temperature problem; utilize the high temperature resistant materials with blocking high temperature such as materials with high melting point, therefore in technique, also can protect its internal circuit element.
Brief description of the drawings
Fig. 1 is the sensing circuit encapsulation schematic diagram of prior art;
Fig. 2 is the sensing circuit structural profile schematic diagram of prior art;
Figure 3 shows that sensing module primary structure schematic diagram of the present invention;
Figure 4 shows that sensing module structure embodiment schematic diagram of the present invention;
In Fig. 5 (a) and (b) be depicted as two-stage process embodiment schematic diagram of the present invention;
Figure 6 shows that sensing module packaging technology embodiment flow process of the present invention.
Wherein, description of reference numerals is as follows:
Sensing circuit 101 clad materials 103
The first polymeric layer 201 optical cements 203
Conducting wire 205 insulation courses 207,207 '
Conductive layer 209 the second polymer layers 211
Superficial layer 300 first conductive layers 301
Insulation course 303 second conductive layers 305
Substrate layer 307 materials with high melting point layers 401
Double faced adhesive tape 403 conducting wires 405
Insulation course 407,407 ' conductive layer 409
Substrate layer 411 sensing circuit modules 501
The first cladding 503 second claddings 505
Step S601～S615 sensing module packaging technology
Embodiment
In order to make a sensing module encapsulating structure that avoids temperatures involved in technique; this instructions proposes a kind of sensing module encapsulating structure and its method for making; utilize technique to make protection structure at the skin of sensing circuit module; particularly dystectic material; make internal circuit unlikely destroyed or affect element efficiency in high-temperature technology, and the material tack of materials with high melting point itself more can be considered the characteristic of its adjacent material.
Instructions is carried the embodiment of sensing module structure can be with reference to figure 3.
Sensing module structure shown in schematic diagram is used in particular for the sensing circuit of contact panel, primary structure includes two conductive layers (the first conductive layer 301 and the second conductive layer 305) insulation course 303 with interval, and wherein the combination of the first conductive layer 301 and the second conductive layer 305 can induce the track of touch-control.Structure also includes substrate layer 307 and a superficial layer 300.
According to the described inventive embodiments of this instructions, in the time making the encapsulating structure of sensing module, be made as a high-melting-point structure of avoiding high temperature to destroy at the superficial layer 300 of its structure especially, can be a kind of as the insulating material of pi (Kaptone), or other heat insulation coating, replace by this tradition as the superficial layer of polyphenyl dicarboxylate (PET).
The encapsulating structure embodiment schematic diagram of sensing module as shown in Figure 4.
According to inventive embodiments, the main composition of sensing module encapsulating structure has the sensing circuit module of circuit part, with the cladding of encapsulating material part.
Mainly include substrate layer 411, and on substrate layer 411, be formed with the second conductive layer 305 of sensing module primary structure embodiment shown in conductive layer 409(corresponding diagram 3), insulation course 407, 407 ' is formed on conductive layer 409 again, the first conductive layer 301 of sensing module primary structure embodiment shown in conductive layer 409 and another conducting wire 405(corresponding diagram 3) between be separated with this insulation course 407, 407 ', conductive layer 409(the second conductive layer) with conducting wire 405(the first conductive layer) every the corresponding setting of this insulation system, insulation course 407, 407 ' design can be according to actual needs adjustment, electrical specification between two conductive layers by this, can induce the behavior of touch-control, such as the variation of electric capacity, and depict accordingly touch trajectory.
In this example, utilize a materials with high melting point layer 401 to replace and be originally formed at surperficial structure, this type of materials with high melting point can prevent that internal circuit module is by the temperatures involved in technique, materials with high melting point layer 401 can utilize double faced adhesive tape 403(as a kind of transparent optical cement) be combined with the structure that substrate layer 411 forms with above-mentioned conducting wire 405, insulation course 407,407 ', conductive layer 409.
And in one embodiment, the surface of materials with high melting point layer 401 can be coated with a surface modifier, with increase and outside cladding between tack, such as the first cladding (503) as shown in (b) in Fig. 5 or the second cladding (505).In an embodiment again, the surface of materials with high melting point layer 401 also can mat be coated with an optical characteristics material increases optical characteristics.Special one carries, and in one embodiment, the material of materials with high melting point layer 401 and the first cladding (503) or the second cladding (505) can be a high tack material, or preferably material of tack.
Implement in aspect at another, aforementioned materials with high melting point layer 401 because with the first cladding (503) and the second cladding (505) adjacency, therefore the material tack of materials with high melting point layer 401 will be considered the material behavior of the first cladding (503) and/or the second cladding (505), particularly with tack preferably for considering.
It is worth mentioning that, because general optical cement may cause softening causing be out of shape or come off because of high temperature under general hot conditions, now can select more resistant to elevated temperatures double faced adhesive tape, the double faced adhesive tape of for example silicon materials (silicon) series, can bear 250 degree high temperature Celsius or select the high temperature resistant series of products such as the solid type (UV) of light or heat curing-type liquid glue to replace, double faced adhesive tape also can be selected the good optical cement of tool optical characteristics.Materials with high melting point can be selected especially or surface-coated special material in order to increase optical characteristics or tack on material is selected in addition.
Specifically; in the time forming the encapsulating structure of above-mentioned sensing module; the embodiment that instructions proposes utilizes a kind of two stage method for making; form by this outside cladding of coated sensation slowdown monitoring circuit module; the clad structure namely being formed by high-temperature fusion shape material, can be the external protector of electronic installation that uses this sensor circuit.
In Fig. 5, (a) is depicted as the structural representation that in above-mentioned two-stage process, the first stage realizes, in this example, at least comprise that above-mentioned superficial layer is (as Fig. 3,300), conductive layer (301), insulation course (303), conductive layer (305) and the isostructural sensing circuit module 501 of substrate layer (307), outside is formed with the first cladding 503, with a part for coated sensation slowdown monitoring circuit module 501, this example is the part of below.
Then the structure that subordinate phase realizes as shown in (b) in Fig. 5, this example comprises the semi-manufacture that above-mentioned sensing circuit module 501 and the first cladding 503 form, then form again the second cladding 505, coated sensation slowdown monitoring circuit module 501 remaining parts, wherein the first cladding 503 and the second cladding 505 are formed by the macromolecule polymer material that flows into two kinds of modules respectively.
Fig. 6 then describes the process example of the encapsulating structure of sensing module in this instructions.
At the beginning of step starts, first purchase the above-mentioned sensing circuit module with basic sensing circuit structure, particularly include the sensing circuit that is applied to contact panel.Then, as step S601, the related elements of this module is inserted in the first mould, the first mould particularly according to use this sensing circuit module electronic installation design and determine, form by this part for outer protection structure, as the first cladding.
For another example step S603, injects the first molten material in above-mentioned the first mould, and this type of material is in particular high molecular polymer, needs high temperature to become flowable molten fluid, through the complete part that is engaged in sensing circuit module of the first mould.Then as step S605, through the first molten material of shaping of cooling program for the first time, to form the first cladding (step S607), therefore the first cladding can engage a part that sets sensing circuit module.
Afterwards the composition (semi-manufacture) of the first cladding and sensing circuit module is inserted to another the second mould (step S609); the second mould is to determine according to the design of related electronic device equally, coordinates above-mentioned the first mould can form the outer protection structure of electronic installation.
As step S611, inject the second molten material in the second mould, this second molten material is at high temperature fluid, can closely engage with sensing circuit module.Again through the second molten material (step S613) of shaping of cooling program for the second time, to form second cladding (step S615) of another part that above-mentioned the first cladding is not coated.
Through above-mentioned technique; form the sensing module encapsulating structure by the first cladding and the second cladding engagement feel slowdown monitoring circuit module; according to design; the first cladding and the second cladding or one can be high molecular polymer; determine according to design requirement; namely this type of high molecular polymer is under manufacturing process need to the environment at high temperature, and this instructions proposes to have the sensing circuit module of protection structure, intercepts by this impact of high temperature on circuit component.
In sum; sensing module encapsulating structure and its method for making that this instructions proposes are particularly utilized two-stage process; in sensing circuit module, form respectively two kinds of claddings; wherein in the time processing high temperature problem; utilize the high temperature resistant materials with blocking high temperature such as materials with high melting point, therefore in technique, also can protect its internal circuit element.
Only the foregoing is only better possible embodiments of the present invention, non-ly therefore limit to the scope of the claims of the present invention, therefore such as use the equivalent structure that instructions of the present invention and diagramatic content are done to change, be all in like manner contained in scope of the present invention, close and give Chen Ming.
Claims (11)
1. a method for making for sensing module encapsulating structure, is characterized in that described method comprises step:
Purchase a sensing circuit module, comprise the sensing circuit that is applied to a contact panel;
This sensing circuit module is inserted to one first mould;
Inject one first molten material in this first mould;
Through this first molten material of shaping of cooling program for the first time, to form one first cladding, this first cladding engages a part for this sensing circuit module;
The composition of this first cladding and this sensing circuit module is inserted to one second mould;
Inject one second molten material in this second mould;
Through this second molten material of shaping of cooling program for the second time, to form one second cladding, this second cladding engages this first cladding and is not coated another part of this sensing circuit module; And
Form the sensing module encapsulating structure that is engaged this sensing circuit module by this first cladding with this second cladding.
2. the method for making of sensing module encapsulating structure as claimed in claim 1, is characterized in that described the first molten material or this second molten material are macromolecule polymer material.
3. the sensing module encapsulating structure of an application method for making made as claimed in claim 1.
4. sensing module encapsulating structure as claimed in claim 3, this first cladding and this second cladding comprising this sensing circuit module with coated this sensing circuit module, wherein this first cladding and this second cladding are formed by the macromolecule polymer material that flows into one first mould and one second mould respectively; It is characterized in that described sensing circuit module comprises:
One substrate layer;
One forms the second conductive layer on this substrate layer;
One is formed at the insulation course on this second conductive layer;
One is formed at the first conductive layer on this insulation course, this first conductive layer and this second conductive layer interval corresponding setting with this insulation course; And
One is formed at the superficial layer on this first conductive layer.
5. sensing module encapsulating structure as claimed in claim 4, is characterized in that described superficial layer is a materials with high melting point layer.
6. sensing module encapsulating structure as claimed in claim 5, the material of this materials with high melting point layer on the superficial layer described in it is characterized in that and the first cladding or the second cladding are a high tack material.
7. sensing module encapsulating structure as claimed in claim 5, is characterized in that described structure also comprises a double faced adhesive tape that is used in the top layer that is attached at this sensing module encapsulating structure.
8. sensing module encapsulating structure as claimed in claim 7, is characterized in that being also provided with this double faced adhesive tape on the first described conductive layer, and this double faced adhesive tape is the solid type of silicon materials, light or heat curing-type liquid glue.
9. sensing module encapsulating structure as claimed in claim 7, is characterized in that being also provided with this double faced adhesive tape on the first described conductive layer, and this double faced adhesive tape is the optical cement with optical characteristics.
10. sensing module encapsulating structure as claimed in claim 5, is characterized in that surface-coated one surface modifier of described materials with high melting point layer is with the tack between increase and this first cladding or this second cladding.
11. sensing module encapsulating structures as claimed in claim 5, is characterized in that the surface-coated one optical characteristics material of described materials with high melting point layer increases optical characteristics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310035061.7A CN103970318B (en) | 2013-01-29 | 2013-01-29 | Sensing module encapsulating structure and its preparation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310035061.7A CN103970318B (en) | 2013-01-29 | 2013-01-29 | Sensing module encapsulating structure and its preparation method |
Publications (2)
| Publication Number | Publication Date |
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| CN103970318A true CN103970318A (en) | 2014-08-06 |
| CN103970318B CN103970318B (en) | 2017-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310035061.7A Expired - Fee Related CN103970318B (en) | 2013-01-29 | 2013-01-29 | Sensing module encapsulating structure and its preparation method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109064882A (en) * | 2018-07-18 | 2018-12-21 | 业成科技（成都）有限公司 | Display device and preparation method thereof |
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| JP2009146354A (en) * | 2007-12-18 | 2009-07-02 | Nissha Printing Co Ltd | Touch panel integrated resin molding |
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| CN102103430A (en) * | 2009-12-17 | 2011-06-22 | 苹果公司 | Injection molding method and touch sensitive device |
| TW201229853A (en) * | 2010-11-05 | 2012-07-16 | Fujifilm Corp | Touch panel and image display device |
| TW201239062A (en) * | 2010-12-31 | 2012-10-01 | 3M Innovative Properties Co | Double-sided adhesive tape having improved reworkability |
| TW201245725A (en) * | 2011-03-11 | 2012-11-16 | Panasonic Corp | Sensor |
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2013
- 2013-01-29 CN CN201310035061.7A patent/CN103970318B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009146354A (en) * | 2007-12-18 | 2009-07-02 | Nissha Printing Co Ltd | Touch panel integrated resin molding |
| CN102103430A (en) * | 2009-12-17 | 2011-06-22 | 苹果公司 | Injection molding method and touch sensitive device |
| CN101986115A (en) * | 2010-10-22 | 2011-03-16 | 惠州市卓耐普智能技术有限公司 | Coating structure for locating center of sensor and forming method thereof |
| TW201229853A (en) * | 2010-11-05 | 2012-07-16 | Fujifilm Corp | Touch panel and image display device |
| TW201239062A (en) * | 2010-12-31 | 2012-10-01 | 3M Innovative Properties Co | Double-sided adhesive tape having improved reworkability |
| TW201245725A (en) * | 2011-03-11 | 2012-11-16 | Panasonic Corp | Sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109064882A (en) * | 2018-07-18 | 2018-12-21 | 业成科技（成都）有限公司 | Display device and preparation method thereof |
| CN109064882B (en) * | 2018-07-18 | 2021-01-29 | 业成科技（成都）有限公司 | Display device and method for manufacturing the same |
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| Publication number | Publication date |
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| CN103970318B (en) | 2017-09-05 |
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