CN103970311A - Touch pad - Google Patents
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- CN103970311A CN103970311A CN201310028239.5A CN201310028239A CN103970311A CN 103970311 A CN103970311 A CN 103970311A CN 201310028239 A CN201310028239 A CN 201310028239A CN 103970311 A CN103970311 A CN 103970311A
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Abstract
The invention discloses a touch pad. The touch pad is provided with a surrounding area, and comprises a first substrate, multiple first axial electrodes, multiple peripheral routings and an external component, wherein the first axial electrodes are arranged on the first substrate and extend in the first direction; the peripheral routings are arranged in the surrounding area; the two ends of each peripheral routing are connected with the two ends of the corresponding first axial electrode respectively, and the peripheral routings connected with the two ends of the first axial electrodes extend into a connection area positioned in the surrounding area; the external component is arranged in the surrounding area and is electrically connected with the peripheral routings; the peripheral routings and the corresponding first axial electrodes, as well as the external component positioned in the connection area form a closed loop on the first substrate.
Description
Technical field
The present invention relates to a kind of Trackpad, particularly a kind of Trackpad of bilateral cabling (double routing) design with loop shape.
Background technology
The technical development of Trackpad is very diversified, and more common technology comprises resistance-type, condenser type and optical profile type etc. at present.Wherein capacitive touch control plate, owing to having the features such as high-accuracy, multi-point touch, high durability and high touch-control resolution, has become the main flow touch technology that at present middle high-order consumption electronic products use.The principle of operation of capacitive touch control plate is to detect the capacitance variations of touch point position with induction electrode, and utilizes the tie line that links each electrode on different directions axle signal is passed back and completed location.In traditional capacitance touching control plate technique, induction electrode is generally with for example tin indium oxide of transparent conductive material (indium tin oxide, ITO) form, because the resistivity of transparent conductive material is higher, therefore in the design of cabling, can all arrange at single induction electrode two ends and transmit or receive the cabling of signal, namely utilize the design of so-called bilateral cabling (double routing) to reduce resistance when single induction electrode too high and cause the impact of signal delay.Especially in the Trackpad of large-size, the length of induction electrode need increase with board size, and then causes this electricresistance effect more obviously need to drive Trackpad in the mode of bilateral cabling.
As shown in Figure 1, in traditional Trackpad 100, be to utilize many first peripheral wirings 131 and many second peripheral wirings 132 are set in the peripheral region 192 of substrate 110, the two ends that make the each induction electrode 121 that is positioned at touch-control sensing district 191 respectively first peripheral wiring 131 and corresponding second peripheral wiring 132 corresponding with are electrically connected.Each the first peripheral wiring 131 is to extend to one first bonding pad 193 with respect to the other one end being connected with induction electrode 121, and each the second peripheral wiring 132 is to extend to one second bonding pad 194 (this mode is to be generally called the two pin of going out designs) with respect to the other one end being connected with induction electrode 121.Because the first bonding pad 193 and the second bonding pad 194 are generally the two ends that are positioned at peripheral region 192, therefore a flexible circuit board (flexible printed circuit, FPC) 180 needs to carry out joint technology (bonding process) in the first bonding pad 193 and the second bonding pad 194 respectively.Cause except needing when the joint technology respectively contraposition to be carried out in the first bonding pad 193 and the second bonding pad 194 man-hours requirement grows, for example anisotropic conductive film of the material of the required use of joint technology (Anisotropic Conductive Film, ACF) use amount also needs to increase, and two pin of going out of traditional Trackpad design need to have longer size for the part of FPC, and the cost of FPC is to be directly proportional to its area, therefore that therefore the cost of FPC can increase is relatively many.Above-mentioned each problem all produces negative impact for production cost, therefore need further improve the design of the Trackpad of bilateral cabling.
Summary of the invention
Object of the present invention is providing a kind of Trackpad, utilize at bilateral cabling (double routing) and drive under design, each peripheral wiring and corresponding electrode design are become to a closed loop (closed loop), so simplify external module joint technology complexity and reach the effect reducing production costs.
The invention provides a kind of Trackpad, there is a peripheral region.Trackpad comprises one first substrate, many first axial electrode, many peripheral wirings and an external module.The first axial electrode is arranged in the first substrate and along a first direction extends.Peripheral wiring is arranged in peripheral region.The two ends of each peripheral wiring are that the two ends of corresponding with one respectively the first axial electrode are connected, and the peripheral wiring that is connected to each the first axial electrode two ends is to extend to a bonding pad that is arranged in peripheral region.External module is arranged on peripheral region, and external module is to be electrically connected with peripheral wiring.Each peripheral wiring is in the first substrate, to form a closed loop with this corresponding first axial electrode and the external module that is positioned at bonding pad.
Brief description of the drawings
Figure 1 shows that the schematic diagram of traditional Trackpad.
Figure 2 shows that the schematic diagram of the Trackpad of the first preferred embodiment of the present invention.
Fig. 3 is the cross-sectional schematic along A-A ' hatching line illustrates in Fig. 2.
Fig. 4 is the cross-sectional schematic along B-B ' hatching line illustrates in Fig. 2.
Figure 5 shows that the schematic diagram of the Trackpad of an other preferred embodiment of the present invention.
Figure 6 shows that the schematic diagram of the Trackpad of an other preferred embodiment of the present invention.
Figure 7 shows that an other preferred embodiment of the present invention Trackpad on look schematic diagram.
Figure 8 shows that the schematic side view of the Trackpad of an other preferred embodiment of the present invention.
Figure 9 shows that the schematic diagram of the Trackpad of an other preferred embodiment of the present invention.
Figure 10 shows that the schematic diagram of the Trackpad of the second preferred embodiment of the present invention.
Figure 11 is the cross-sectional schematic along C-C ' hatching line illustrates in Figure 10.
Figure 12 shows that the schematic diagram of the Trackpad of the 3rd preferred embodiment of the present invention.
Figure 13 is the cross-sectional schematic along D-D ' hatching line illustrates in Figure 12.
Figure 14 is the cross-sectional schematic along E-E ' hatching line illustrates in Figure 12.
Figure 15 shows that the schematic diagram of the Trackpad of the 4th preferred embodiment of the present invention.
Figure 16 is the cross-sectional schematic along F-F ' hatching line illustrates in Figure 15.
Figure 17 shows that the schematic diagram of the Trackpad of the 5th preferred embodiment of the present invention.
Figure 18 is the cross-sectional schematic along G-G ' hatching line illustrates in Figure 17.
Wherein, description of reference numerals is as follows:
100 Trackpad 110 substrates
121 induction electrode 131 first peripheral wirings
132 second peripheral wiring 180 flexible circuit board
191 192 peripheral regions, touch-control sensing districts
193 first 194 second bonding pads, bonding pads
200 Trackpad 201 Trackpads
202 Trackpad 203 Trackpads
204 Trackpad 211 first substrates
212 second substrate 221 first axial electrode
222 second axial electrode 231 peripheral wirings
The discontinuous portion of 231P contact pad 235
239 ground wire 240 insulation courses
250 protective seam 260 bonding coats
280 external module 291 photic zones
292 293 bonding pads, peripheral regions
300 Trackpad 370 connecting lines
380 external module 393 bonding pads
400 Trackpad 421 first axial electrode
421A collets 421B the first connecting line
421S the first sensing pad 422 second axial electrode
422B second connecting line 422S the second sensing pad
431 peripheral wiring 431P contact pads
432 peripheral wiring 432P contact pads
439 ground wire 439P contact pads
480 external module 480P contact tabs
493 bonding pad 500 Trackpads
600 Trackpad CH1 contact openings
CH2 contact openings CH3 contact openings
X first direction Y second direction
Z vertical projection direction
Embodiment
Can further understand the present invention for making to have the knack of those skilled in the art, below spy enumerates several preferred embodiment of the present invention, and coordinates accompanying drawing, describes constitution content of the present invention in detail.
If Fig. 2 is to as shown in Fig. 4, the Trackpad 200 of the first preferred embodiment of the present invention has a photic zone 291 and a peripheral region 292, and peripheral region 292 is positioned at least one side of photic zone 291.The peripheral region 292 of the present embodiment is the surrounding around photic zone 291, but the present invention can optionally not make as limit peripheral region 292 only with the adjacent setting of part edge of photic zone 291.Trackpad 200 comprises one first substrate 211, many first axial electrode 221 and many peripheral wirings 231.The first axial electrode 221 is arranged in the first substrate 211 with peripheral wiring 231.The first axial electrode 221 is to be at least arranged in photic zone 291 and along a first direction X to extend, and peripheral wiring 231 is arranged in peripheral region 292.In other words, the first axial electrode 221 can optionally be arranged in photic zone 291 completely or viewable design need to partly extend to peripheral region 292, but not as limit.The two ends of each peripheral wiring 231 are that the two ends of corresponding with one respectively the first axial electrode 221 are connected, the peripheral wiring 231 that is connected to each the first axial electrode 221 two ends is to extend to a bonding pad 293 that is arranged in peripheral region 292, and each peripheral wiring 231 is in the first substrate 211, to form a closed loop (closed loop) with the first corresponding axial electrode 221.In other words,, as starting point, advancing along peripheral wiring 231 and the first corresponding axial electrode 221 in any point on a peripheral wiring 231, finally still can get back to the starting point on this peripheral wiring 231, therefore can claim that this structure is a closed loop.In addition, this closed-loop path is only directly on the surface of the first substrate 211, to be made up of peripheral wiring 231 and the first corresponding axial electrode 221, do not need to form by for example flexible circuit board of other external modules (flexible printed circuit, FPC) again.In the present embodiment, Trackpad 200 can also comprise that an insulation course 240 and protective seam 250 storehouses are in the first substrate 211.Insulation course 240 can distinctly comprise for example silicon nitride of inorganic material (silicon nitride), monox (silicon oxide) and silicon oxynitride (siliconoxynitride), for example acrylic resin of organic material (acrylic resin) or other applicable material with the material of protective seam 250.Protective seam 250 is arranged on peripheral wiring 231, and protective seam 250 has at least one contact openings CH1, and contact openings CH1 is that part exposes corresponding peripheral wiring 231.In the present embodiment, peripheral region 292 comprises bonding pad 293, and contact openings CH1 is positioned at bonding pad 293, in order to expose at least partly the peripheral wiring 231 that is positioned at bonding pad 293.In other words; each peripheral wiring 231 is to be touched open C H1 to be exposed to outside protective seam 250 in bonding pad 293, for example, in order to make an external module (Fig. 2 does not show to Fig. 4) flexible circuit board to carry out joint technology (bonding process) to control the first axial electrode 221 by each peripheral wiring 231 with each peripheral wiring 231 in bonding pad 293.Because each peripheral wiring 231 of the present embodiment is to form a closed loop with the first corresponding axial electrode 221 in the first substrate 211, therefore Trackpad 200 can only need to arrange a bonding pad 293 to be electrically connected (this mode also can be described as one and singly goes out pin design) with external module, and then reaches the effect of simplifying joint technology.In addition, because each peripheral wiring 231 is to be connected to the first corresponding two ends of axial electrode 221 on first direction X simultaneously, so the design of peripheral wiring 231 can be considered a bilateral cabling (double routing) design, and can improve whereby because of the too high relevant issues that produce of the first axial electrode 221 resistances.
Further illustrate, first axial electrode 221 of the present embodiment and peripheral wiring 231 can comprise for example tin indium oxide of transparent conductive material (indium tin oxide, ITO), indium zinc oxide (indium zinc oxide, IZO) with aluminum zinc oxide (aluminum zinc oxide, AZO) or other for example composite bed of silver, aluminium, copper, magnesium, molybdenum, above-mentioned material of nontransparent conductive material or alloys of above-mentioned material that are applicable to, but not as limit.In addition, Trackpad 200 can also comprise that a ground wire 239 is arranged in the first substrate 211 and around each peripheral wiring 231 and each the first axial electrode 221.Ground wire 239 is that part is arranged in bonding pad 293, in order to be electrically connected with above-mentioned external module.As shown in Figure 3, peripheral wiring 231 can partly overlap to reach on the vertical projection direction Z perpendicular to the first substrate 211 one with the first corresponding axial electrode 221 and contact with each other and the effect being electrically connected, but the present invention is not as limit.As shown in Figure 5, in the Trackpad 201 of an other preferred embodiment of the present invention, peripheral wiring 231 reaches interconnected effect with the mode that the first corresponding axial electrode 221 can be one of the forming.In other words, peripheral wiring 231 and the first axial electrode 221 can be by a conductive layer being carried out to patterning and being formed in the lump in the first substrate 211, in order to reach the effect of further simplified manufacturing technique.Peripheral wiring 231 and the first axial electrode 221 can be same material and form, but not as limit.In addition, the present invention also can be optionally around at least one side in district 292 a decorative layer (not shown) is set, form decorative effect in order to the periphery at Trackpad 200, but not as limit.
As shown in Figure 6, the Trackpad 202 of an other preferred embodiment of the present invention can also comprise an external module 280, be arranged on peripheral region 292 and be arranged at least partly in bonding pad 293, external module 280 is to be electrically connected to control each the first axial electrode 221 with the peripheral wiring of bonding pad 293.External module 280 can comprise flexible circuit board, drive integrated circult or other applicable external modules.In the present embodiment, each peripheral wiring 231 is in the first substrate 211, to form closed loop with the first corresponding axial electrode 221 and the external module 280 that is positioned at bonding pad 293.In other words, each the first axial electrode 221 is in the first substrate 211, to form closed loop with corresponding peripheral wiring 231, and external module 280 is to be electrically connected to this closed loop.
As shown in Fig. 7 and Fig. 8, the Trackpad 203 of an other preferred embodiment of the present invention can also comprise many second axial electrode 222, is at least arranged in photic zone 291 and along a second direction Y and extends.In other words, the second axial electrode 222 can optionally be arranged in photic zone 291 completely or viewable design need to partly extend to peripheral region 292, but not as limit.First direction X is preferably substantially perpendicular to second direction Y, but not as limit.In the present embodiment, each the first axial electrode 221 is to be separately positioned on the different surfaces of the first substrate 211 with each the second axial electrode 222, but not as limit.What deserves to be explained is, each the first axial electrode 221 can be a touching signals with each the second axial electrode 222 and transmits electrode and a touching signals receiving electrode, respectively in order to transmit touch-control sensing signal and to receive touch-control sensing signal.In other words, Trackpad 203 can be in order to carry out a mutual capacitance type (mutualcapacitive) touch-control sensing, but not as limit.
As shown in Figure 9, the Trackpad 204 of an other preferred embodiment of the present invention can also comprise one second substrate 212 and a bonding coat 260.The second substrate 212 is to be oppositely arranged with the first substrate 211, and the second axial electrode 222 is arranged in the second substrate 212.Bonding coat 260 is arranged between the first substrate 211 and the second substrate 212, in order to bind the first substrate 211 and the second substrate 212.Second axial electrode 222 of the present embodiment is arranged on the second substrate 212 in the face of on a surface of the first substrate 211, but the present invention is as limit, and in other preferred embodiments of the present invention also viewable design the second axial electrode 222 need to be arranged on to the second substrate 212 on a surface of the first substrate 211.
As shown in Figure 10 and Figure 11, one second preferred embodiment of the present invention provides a Trackpad 300.The places different from above-described embodiment are, Trackpad 300 also comprises many connecting lines 370 and an external module 380.Connecting line 370 is arranged on protective seam 250, and protective seam 250 has at least one contact openings CH2 partly to expose corresponding peripheral wiring 231.One end of each connecting line 370 is to be electrically connected with corresponding peripheral wiring 231 by contact openings CH2, and other one end of each connecting line 370 is to extend towards the edge of Trackpad 300.That is to say, each connecting line 370 is to extend to a bonding pad 393 that is positioned at peripheral region 292 with respect to the other one end being connected with peripheral wiring 231.External module 380 is to be arranged at least partly on connecting line 370, and external module 380 is to be electrically connected with peripheral wiring 231 by connecting line 370, and then controls by connecting line 370 and peripheral wiring 231 the first axial electrode 231 that is positioned at photic zone.The peripheral wiring 231 of the present embodiment is not to be arranged in bonding pad 393, while needing heavy industry (rework), peripheral wiring 231 is produced and is destroyed, and then reach the effect that improves overall acceptability rate therefore can avoid external module 380 to carry out joint technology.The Trackpad 300 of the present embodiment is except connecting line 370, and the feature of all the other each parts, setting position and material behavior are similar to above-mentioned the first preferred embodiment, therefore at this and repeat no more.
If Figure 12 is to as shown in Figure 14, of the present invention 1 the 3rd preferred embodiment provides a Trackpad 400.Trackpad 400 has photic zone 291 and peripheral region 492 and is positioned at least one side of photic zone 291.The peripheral region 292 of the present embodiment is the surrounding around photic zone 291, but not as limit.Trackpad 400 comprises the first substrate 211, many first axial electrode 421, many second axial electrode 422 and many peripheral wirings 431.The first axial electrode 421, the second axial electrode 422 and peripheral wiring 431 are arranged on the same surface of the first substrate 211.The first axial electrode 421 is be at least arranged in photic zone 291 and extend along first direction X, the second axial electrode 422 is be at least arranged in photic zone 291 and extend along second direction Y, and the first axial electrode 421 and the second axial electrode 422 also may extend into peripheral region 292, and peripheral wiring 431 is arranged in peripheral region 292.The two ends of each peripheral wiring 431 are that the two ends of corresponding with one respectively the first axial electrode 421 are connected, and each peripheral wiring 431 is in the first substrate 211, to form a closed loop with the first corresponding axial electrode 421.Each first axial electrode 421 of the present embodiment comprises multiple the first sensing pad 421S and at least one the first connecting line 421B, the first connecting line 421B is electrically connected two the first adjacent sensing pad 421S, each the second axial electrode 422 comprises multiple the second sensing pad 422S and at least one the second connecting line 422B, and the second connecting line 422B is electrically connected two the second adjacent sensing pad 422S.Trackpad 400 can also comprise that at least one collets 421A is arranged between the first connecting line 421B and corresponding the second connecting line 422B, isolates the first axial electrode 421 and the second axial electrode 422 in order to electricity.The first connecting line 421B and the second connecting line 422B one at least wherein comprise a metal wire.
In the present embodiment; Trackpad 400 can also comprise that at least one protective seam 250 is arranged on peripheral wiring 431; or protective seam 250 can cover the first substrate 211, many first axial electrode 421, many second axial electrode 422 and many peripheral wirings 431 by whole face, and position, the number of plies, material that protective seam 250 arranges do not limit at this.Protective seam 250 has multiple contact openings CH3, and contact openings CH3 is that part exposes corresponding peripheral wiring 431.In addition, peripheral region 492 comprises a bonding pad 493, and each peripheral wiring 431 comprises that a contact pad 431P is arranged in bonding pad 493, and at least part of contact openings CH3 is that part exposes contact pad 431P.Further illustrate, Trackpad 400 can also comprise that many peripheral wirings 432 and at least one ground wire 439 are arranged in peripheral region 492.One end of each peripheral wiring 432 is to be electrically connected with the second corresponding axial electrode 422, and each peripheral wiring 432 is to extend to bonding pad 493 with respect to the other one end being connected with the second axial electrode 422.Each peripheral wiring 432 comprises in a contact pad 432P bonding pad 493, and at least part of contact openings CH3 is that part exposes contact pad 432P.Ground wire 439 is arranged in the first substrate 211 and around each peripheral wiring 431, each peripheral wiring 432, each the first axial electrode 421 and each the second axial electrode 422.Ground wire 439 comprises that a contact pad 439P is arranged in bonding pad 493, and at least part of contact openings CH3 is that part exposes contact pad 439P.
As shown in Figure 12 and Figure 14, Trackpad 400 can also comprise an external module 480, and external module 480 comprises the setting corresponding to contact pad 431P, contact pad 432P or contact pad 439P of multiple contact tabs.External module 480 can be electrically connected with contact pad 431P, the contact pad 432P and the contact pad 439P formation that are positioned at bonding pad 493 by for example anisotropic conductive film of a conductive adhesion material (not shown) (Anisotropic Conductive Film, ACF).In other words, external module 480 is to be electrically connected with peripheral wiring 431 and peripheral wiring 432 by contact openings CH3, and then can control the first axial electrode 421 and the second axial electrode 422 that are positioned at photic zone 491.The Trackpad 400 of the present embodiment except the structure of the first axial electrode 421 and with the setting position of each the second axial electrode 422, the feature of all the other each parts and material behavior are similar to above-mentioned the second preferred embodiment, therefore at this and repeat no more.
As shown in Fig. 6, Figure 15 and Figure 16, of the present invention 1 the 4th preferred embodiment provides a Trackpad 500.The places different from above-mentioned the first preferred embodiment are, each peripheral wiring 231 of Trackpad 500 comprises that a discontinuous portion 235 is arranged in bonding pad 293.The contact openings CH1 of protective seam 250 is that part exposes corresponding peripheral wiring 231, and the discontinuous portion 235 of each peripheral wiring 231 arranges setting corresponding to contact openings CH1.In other words, the both sides of the discontinuous portion 235 of each peripheral wiring 231 are to be still touched open C H1 to expose, therefore external module 280 can be formed and be electrically connected with the first axial electrode 221 by the peripheral wiring 231 being exposed out in bonding pad 293.Therefore, each peripheral wiring 231 is in the first substrate 211, to form a closed loop with the first corresponding axial electrode 221 and external module 280.That is to say, the peripheral wiring 231 that is connected to each the first axial electrode 221 two ends is to have respectively discontinuous portion 235 in bonding pad 293, and external module 280 is electrically connected to the two ends of the discontinuous portion 235 of each peripheral wiring 231 in bonding pad 293, in order to form closed loop.Under the design of the discontinuous portion 235 by the present embodiment, can possess and singly go out the advantage of pin and can reach the object of improving signal controlling by discontinuous portion 235.The Trackpad 500 of the present embodiment is except discontinuous portion 235, and the feature of all the other each parts and material behavior are similar to above-mentioned the first preferred embodiment, therefore at this and repeat no more.What deserves to be explained is, the length of each discontinuous portion 235 is to be less than or equal to 5 centimetres (mm), this discontinuous minister's degree preferable range be 0.01mm to 0.5mm, do not need the situation that strengthens external module 280 to be issued to the effect that singly goes out pin in order to be engaged in.
As shown in Fig. 6, Figure 17 and Figure 18, of the present invention 1 the 5th preferred embodiment provides a Trackpad 600.The places different from above-mentioned the 4th preferred embodiment are, each peripheral wiring 231 of Trackpad 600 also comprises that a contact pad 231P is arranged in bonding pad 293, each contact pad 231P is the two ends that are connected respectively to the discontinuous portion 235 of each peripheral wiring 231, uses so that each peripheral wiring 231 forms closed loop with the first corresponding axial electrode 221 in the first substrate 211.The contact openings CH1 of protective seam 250 is that part exposes corresponding contact pad 231P; therefore external module 280 can be electrically connected with the contact pad 231P being exposed out in bonding pad 293, and form and be electrically connected with peripheral wiring 231 and the first axial electrode 221 by contact pad 231P.The Trackpad 600 of the present embodiment is except contact pad 231P, and the feature of all the other each parts and material behavior are similar to above-mentioned the 4th preferred embodiment, therefore at this and repeat no more.What deserves to be explained is, contact pad 231P can be a transparent conductive material or metallic conduction material is made, with so that each peripheral wiring 231 forms closed loop with the first corresponding axial electrode 221 in the first substrate 211, and coordinate external module 280 to be electrically connected to each contact pad 231P, but the present invention is not as limit, as long as each peripheral wiring 231 does not limit any form to form closed loop with the first corresponding axial electrode 221 in the first substrate 211, can obtain the effect that the present invention simplifies joint technology and reduces costs.
Comprehensive the above, Trackpad of the present invention is under the driving design of bilateral cabling, each peripheral wiring is become to a closed loop with corresponding electrode design, make to use the Trackpad of bilateral cabling still can arrange in pairs or groups singly to go out the design of pin and reach and simplify the complexity of associated splice technique and the effect reducing production costs.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (14)
1. a Trackpad, is characterized in that, has a peripheral region, and this Trackpad comprises:
One first substrate;
Many the first axial electrode, are arranged in this first substrate and along a first direction and extend;
Many peripheral wirings, be arranged in this peripheral region, wherein respectively the two ends of this peripheral wiring are that the two ends of corresponding with one respectively this first axial electrode are connected, and to be connected to each those peripheral wirings at these the first axial electrode two ends be to extend to a bonding pad that is arranged in this peripheral region; And
One external module, is arranged on this peripheral region, and wherein this external module is to be electrically connected with those peripheral wirings, and respectively this peripheral wiring is in this first substrate, to form a closed loop with this corresponding first axial electrode and this external module of being positioned at this bonding pad.
2. Trackpad according to claim 1, it is characterized in that, be connected to respectively those peripheral wirings at these the first axial electrode two ends and there is respectively a discontinuous portion in this bonding pad, and this external module is connected electrically in the respectively two ends of this discontinuous portion of this peripheral wiring in this bonding pad, in order to form this closed loop.
3. Trackpad according to claim 1, is characterized in that, respectively this first axial electrode is in this first substrate, to form this closed loop with this corresponding peripheral wiring, and this external module is electrically connected to this closed loop.
4. Trackpad according to claim 1, is characterized in that, also comprises a protective seam, is at least arranged on those peripheral wirings, and wherein this protective seam has at least one contact openings, and this contact openings is that part exposes this corresponding peripheral wiring.
5. Trackpad according to claim 4, it is characterized in that, this contact openings is to be positioned at this bonding pad, and in order to expose at least partly those peripheral wirings that are positioned at this bonding pad, and this external module is to be electrically connected with those peripheral wirings by this contact openings.
6. Trackpad according to claim 5, is characterized in that, respectively this peripheral wiring comprises that a contact pad is arranged in this bonding pad, and this contact openings is to expose at least partly this contact pad.
7. Trackpad according to claim 3, it is characterized in that, also comprise a protective seam and many connecting lines, this protective seam is at least arranged on those peripheral wirings, this protective seam has at least one contact openings, and this contact openings is that part exposes this corresponding peripheral wiring, those connecting lines are arranged on this protective seam, wherein respectively one end of this connecting line is to be electrically connected with this corresponding peripheral wiring by this contact openings, and respectively other one end of this connecting line is to extend towards the edge of this Trackpad, this external module is arranged on those connecting lines at least partly, wherein this external module is to be electrically connected with those peripheral wirings by those connecting lines.
8. Trackpad according to claim 1, it is characterized in that, also comprise many second axial electrode and a photic zone, wherein this peripheral region is at least one side that is positioned at this photic zone, and those second axial electrode are be at least arranged on this photic zone and extend along a second direction.
9. Trackpad according to claim 8, is characterized in that, also comprises that one second substrate and this first substrate are oppositely arranged, and wherein those second axial electrode are arranged in this second substrate.
10. Trackpad according to claim 8, is characterized in that, respectively this first axial electrode is to be separately positioned on the different surfaces of this first substrate with each this second axial electrode.
11. Trackpads according to claim 8, it is characterized in that, also comprise at least one collets, wherein those first axial electrode and those the second axial electrode are arranged on the same surface of this first substrate, respectively this first axial electrode comprises multiple the first sensing pads and at least one the first connecting line, this first connecting line is to be electrically connected two those adjacent first sensing pads, respectively this second axial electrode comprises multiple the second sensing pads and at least one the second connecting line, this second connecting line is to be electrically connected two those adjacent second sensing pads, and these collets are arranged between this first connecting line and corresponding this second connecting line, isolate those first axial electrode and those the second axial electrode in order to electricity.
12. Trackpads according to claim 11, is characterized in that, this first connecting line and this second connecting line one at least wherein comprise a metal wire.
13. Trackpads according to claim 2, is characterized in that, respectively the length of this discontinuous portion is to be less than or equal to 5 centimetres.
14. Trackpads according to claim 2, it is characterized in that, respectively this peripheral wiring comprises that a contact pad is arranged in this bonding pad, respectively this contact pad is connected respectively to the respectively two ends of this discontinuous portion of this peripheral wiring, with so that respectively this peripheral wiring in the first substrate, form this closed loop with the first corresponding axial electrode, and this external module is to be electrically connected to each contact pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310028239.5A CN103970311A (en) | 2013-01-24 | 2013-01-24 | Touch pad |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310028239.5A CN103970311A (en) | 2013-01-24 | 2013-01-24 | Touch pad |
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| CN103970311A true CN103970311A (en) | 2014-08-06 |
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| CN201310028239.5A Pending CN103970311A (en) | 2013-01-24 | 2013-01-24 | Touch pad |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104461162A (en) * | 2014-12-31 | 2015-03-25 | 京东方科技集团股份有限公司 | Touch substrate, touch panel and touch display device |
| CN104793802A (en) * | 2015-05-08 | 2015-07-22 | 厦门天马微电子有限公司 | Array substrate and manufacturing method, display panel and display device thereof |
| WO2018032997A1 (en) * | 2016-08-19 | 2018-02-22 | 京东方科技集团股份有限公司 | Touch substrate and touch display device |
| CN108803910A (en) * | 2017-04-28 | 2018-11-13 | 京东方科技集团股份有限公司 | Touch base plate and preparation method thereof, touch control display apparatus |
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| CN108803910B (en) * | 2017-04-28 | 2021-08-06 | 京东方科技集团股份有限公司 | Touch substrate, manufacturing method thereof and touch display device |
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Application publication date: 20140806 |