CN103970239A - On-chip dynamic intelligent temperature control system - Google Patents
On-chip dynamic intelligent temperature control system Download PDFInfo
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- CN103970239A CN103970239A CN201410163491.1A CN201410163491A CN103970239A CN 103970239 A CN103970239 A CN 103970239A CN 201410163491 A CN201410163491 A CN 201410163491A CN 103970239 A CN103970239 A CN 103970239A
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Abstract
The invention provides an on-chip dynamic intelligent temperature control system which comprises an intelligent temperature management control module and multiple temperature sensors used for measuring the temperature of multiple processor units integrated in a system on chip respectively, wherein the temperature sensors send measured temperature values to the intelligent temperature management control module, and the intelligent temperature management control module allocates instruction execution loads to the processor units according to the temperature values received from the temperature sensors.
Description
Technical field
The present invention relates to dynamic and intelligent temperature control technology field on system on chip structure and sheet, more particularly, the present invention relates to a kind of upper dynamic and intelligent temperature control system.
Background technology
Along with semiconductor dimensions is more and more less, the integrated level of System on Chip/SoC is more and more higher, and SOC (system on a chip) (systemonchip, SOC) is fully developed.But, along with the raising of the integrated level of integrated circuit, System on Chip/SoC inside often all can be simultaneously integrated simulation, numeral, processor, a series of circuit such as storer, thereby the working temperature of System on Chip/SoC is significantly improved, and then cause that chip energy consumption raises, degradation problem under the life-span.
Therefore, for the effective temperature of SOC (system on a chip), controlling is a problem of needing solution badly.
Summary of the invention
Technical matters to be solved by this invention is for there being above-mentioned defect in prior art, dynamic and intelligent temperature control system on the sheet that a kind of effective temperature that can realize SOC (system on a chip) controls is provided, it is developing intellectual resource temperature management system in on-chip system chip, thereby reach temperature on real-time sheet, control, reduce single incident mistake incidence and chip hardware and damage.
In order to realize above-mentioned technical purpose, according to the present invention, a kind of upper dynamic and intelligent temperature control system is provided, and it comprises: intelligent temperature management control module and for measuring respectively a plurality of temperature sensors of the temperature of the integrated a plurality of processor units of SOC (system on a chip); Wherein, temperature sensor sends the temperature value measuring to intelligent temperature management control module; And described intelligent temperature management control module distributes the instruction of each processor unit to carry out load according to the temperature value receiving from described a plurality of temperature sensors.
Preferably, described intelligent temperature management control module waits for that by instruction the relatively few instruction in sequence sends to the respective processor unit that temperature value is higher, and instruction is waited for to the relatively many instructions in sequence send to the respective processor unit that temperature value is lower.
Preferably, temperature sensor sends to intelligent temperature management control module the temperature value measuring in real time.
Preferably, temperature sensor periodically sends to intelligent temperature management control module the temperature value measuring.
Preferably, described intelligent temperature management control module utilizes the instruction of intelligent temperature control protocol to distribute the instruction of each processor unit to carry out load.
Preferably, the instruction of intelligent temperature control protocol comprises: represent this instruction be sent to the instruction destination of which processor unit, represent the priority level of this instruction instruction priority, represent the instruction stand-by period of the stand-by period of this instruction before being performed and the instruction task amount that represents to carry out the required task amount of this instruction.
The present invention, by temperature acquisition sensor, chip system framework in temperature control protocol, sheet on exploitation sheet, can effectively be optimized management to task on sheet, thereby reaches the object that on real-time, dynamic sheet, temperature treatment is controlled.
Accompanying drawing explanation
By reference to the accompanying drawings, and by reference to detailed description below, will more easily to the present invention, there is more complete understanding and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows the concept map of dynamic and intelligent temperature control system on sheet according to the preferred embodiment of the invention.
Fig. 2 schematically shows the intelligent temperature control protocol instruction packet header file layout that on sheet according to the preferred embodiment of the invention, dynamic and intelligent temperature control system adopts.
It should be noted that, accompanying drawing is used for illustrating the present invention, and unrestricted the present invention.Note, the accompanying drawing that represents structure may not be to draw in proportion.And in accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
Fig. 1 schematically shows the concept map of dynamic and intelligent temperature control system on sheet according to the preferred embodiment of the invention.
As shown in Figure 1, dynamic and intelligent temperature control system comprises on sheet according to the preferred embodiment of the invention: intelligent temperature management control module 100 and for measuring respectively a plurality of temperature sensors 200 of the temperature of the integrated a plurality of processor units 10 of SOC (system on a chip).
For example, as shown in Figure 1, integrated 4 processor units 10 in SOC (system on a chip), can be respectively a temperature sensor 200 of 4 processor units, 10 configurations.
Wherein, temperature sensor 200 sends to intelligent temperature management control module 100 temperature value measuring.For example, temperature sensor 200 can send to intelligent temperature management control module 100 temperature value measuring in real time; For example, or temperature sensor 200 can periodically send to intelligent temperature management control module 100 temperature value (per half an hour sends to intelligent temperature management control module 100 temperature value that one-shot measurement arrives) measuring.
For example, temperature sensor 200 can with the integrated formation of corresponding processor unit 10.
Described intelligent temperature management control module 100 distributes the instruction of each processor unit 10 to carry out load according to the temperature value receiving from described a plurality of temperature sensors 200.
For example, in embodiment, described intelligent temperature management control module 100 can be waited for instruction that the relatively few instruction in sequence 20 sends to the respective processor unit 10 that temperature value is higher, and instruction is waited for to the relatively many instructions in sequence 20 send to the respective processor unit 10 that temperature value is lower." relatively few instruction " is herein relative concept with " relative many instructions ", and same " temperature value is higher " and " temperature value is lower " is relative concept.
Correspondingly, preferably, described intelligent temperature management control module 100 utilizes the instruction of intelligent temperature control protocol to distribute the instruction of each processor unit 10 to carry out load.Fig. 2 schematically shows the intelligent temperature control protocol instruction packet header file layout that on sheet according to the preferred embodiment of the invention, dynamic and intelligent temperature control system adopts.
For example, the instruction of intelligent temperature control protocol can be added to the head of pending instruction.
As shown in Figure 2, the instruction of intelligent temperature control protocol can comprise: represent this instruction be sent to the instruction destination of which processor unit 10, represent the priority level of this instruction instruction priority, represent the instruction stand-by period of the stand-by period of this instruction before being performed and the instruction task amount that represents to carry out the required task amount of this instruction.
Thus, described intelligent temperature management control module 100 can wait for that sequence 20 extracts pending instruction from instruction, and utilize the instruction of intelligent temperature control protocol by the pending command assignment of extracting to each processor unit 10.
More particularly, for example, when chip internal different processing units load is different, the phenomenon that there will be local temperature significantly to raise, the now variation meeting of temperature is detected by temperature sensor 200, and feed back to intelligent temperature management control module, intelligent temperature management control module is waited for the instruction packet header file content in sequence according to the algorithm combined command of having developed, carry out intelligent decision and whether can continue to carry out instruction by original path, when occurring that a certain some areas are overheated, and another regional relative temperature is lower and load when not high, intelligent temperature management control module can be according to the agreement of exploitation, the content of modify instruction packet header file, reach and alleviate the effect that heating region processing unit loads to reduce superheat region temperature.
By intelligent temperature management control module on the sheet of SOC (system on a chip), design, temperature treatment module reaches real time temperature monitoring thus, rationally controls the load that each sheet upper module is carried out instruction, reaches the object that intelligent temperature is controlled.
And, by the exploitation of intelligent temperature control protocol, so that before instruction load instructions packet header file, intelligent temperature management control module can pass through reading command packet header file and built-in temperature sensor, estimate in real time the load of execution module in slice, thereby by the mode of modify instruction packet header file, rearrange operating load, reach temperature controlled object.
The present invention at least has a little following:
1. the exploitation of intelligent temperature control module, temperature on monitoring piece, unifies optimum management in real time, thereby reach, is not affecting under the prerequisite of chip performance as far as possible, reduces chip temperature, protects the effects such as hardware;
2. the exploitation of the agreement that intelligent temperature is controlled is conducive to the normalization development of on-chip system chip, thereby arrives the compatibility of different temperatures control algolithm and the compatibility of on-chip system chip topological structure and temperature control modules.
In addition, it should be noted that, unless stated otherwise or point out, otherwise the descriptions such as the term in instructions " first ", " second ", " the 3rd " are only for distinguishing each assembly, element, step of instructions etc., rather than for representing logical relation between each assembly, element, step or ordinal relation etc.
Be understandable that, although the present invention with preferred embodiment disclosure as above, yet above-described embodiment is not in order to limit the present invention.For any those of ordinary skill in the art, do not departing from technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement to make many possible changes and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (6)
1. a dynamic and intelligent temperature control system on sheet, is characterized in that comprising: intelligent temperature management control module and for measuring respectively a plurality of temperature sensors of the temperature of the integrated a plurality of processor units of SOC (system on a chip); Wherein, temperature sensor sends the temperature value measuring to intelligent temperature management control module; And described intelligent temperature management control module distributes the instruction of each processor unit to carry out load according to the temperature value receiving from described a plurality of temperature sensors.
2. go up dynamic and intelligent temperature control system for according to claim 1, it is characterized in that, described intelligent temperature management control module waits for that by instruction the relatively few instruction in sequence sends to the respective processor unit that temperature value is higher, and instruction is waited for to the relatively many instructions in sequence send to the respective processor unit that temperature value is lower.
3. according to claim 1 and 2 upper dynamic and intelligent temperature control system, is characterized in that, temperature sensor sends to intelligent temperature management control module the temperature value measuring in real time.
4. according to claim 1 and 2 upper dynamic and intelligent temperature control system, is characterized in that, temperature sensor periodically sends to intelligent temperature management control module the temperature value measuring.
5. according to claim 1 and 2 upper dynamic and intelligent temperature control system, is characterized in that, described intelligent temperature management control module utilizes the instruction of intelligent temperature control protocol to distribute the instruction of each processor unit to carry out load.
6. go up dynamic and intelligent temperature control system for according to claim 1 and 2, it is characterized in that, the instruction of intelligent temperature control protocol comprises: represent this instruction be sent to the instruction destination of which processor unit, represent the priority level of this instruction instruction priority, represent the instruction stand-by period of the stand-by period of this instruction before being performed and the instruction task amount that represents to carry out the required task amount of this instruction.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410163491.1A CN103970239A (en) | 2014-04-22 | 2014-04-22 | On-chip dynamic intelligent temperature control system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410163491.1A CN103970239A (en) | 2014-04-22 | 2014-04-22 | On-chip dynamic intelligent temperature control system |
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| CN103970239A true CN103970239A (en) | 2014-08-06 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105320177A (en) * | 2015-03-25 | 2016-02-10 | 北京国睿中数科技股份有限公司 | Temperature monitoring device |
| CN113608598A (en) * | 2021-08-16 | 2021-11-05 | 北京睿芯数据流科技有限公司 | Temperature sensing bus bandwidth control method, system and device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1770111A (en) * | 2004-11-04 | 2006-05-10 | 株式会社东芝 | Processor system with temperature sensor and control method of the same |
| CN102434479A (en) * | 2011-11-15 | 2012-05-02 | 浪潮电子信息产业股份有限公司 | Constant-temperature energy-saving control method in rack server case |
-
2014
- 2014-04-22 CN CN201410163491.1A patent/CN103970239A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1770111A (en) * | 2004-11-04 | 2006-05-10 | 株式会社东芝 | Processor system with temperature sensor and control method of the same |
| CN102434479A (en) * | 2011-11-15 | 2012-05-02 | 浪潮电子信息产业股份有限公司 | Constant-temperature energy-saving control method in rack server case |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105320177A (en) * | 2015-03-25 | 2016-02-10 | 北京国睿中数科技股份有限公司 | Temperature monitoring device |
| CN113608598A (en) * | 2021-08-16 | 2021-11-05 | 北京睿芯数据流科技有限公司 | Temperature sensing bus bandwidth control method, system and device |
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Application publication date: 20140806 |
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