CN103970162B - The heater of a kind of cylindrical coaxial resonant cavity and temperature-controlled process thereof - Google Patents
The heater of a kind of cylindrical coaxial resonant cavity and temperature-controlled process thereof Download PDFInfo
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Abstract
本发明公开了一种圆柱形同轴谐振腔体的加热装置及其温度控制方法,装置包括有控制单元、温度采集单元、功率加热单元,方法包括温度采集、温度比较、温度统计、温度调整几个步骤。本发明通过改变流经MOSFET管漏极和源级的电流来控制加热功率的大小来满足可控、均匀的加热过程要求,可有效减少工作温度对谐振频率的影响、提高物料湿密度检测的精度。
The invention discloses a heating device for a cylindrical coaxial resonant cavity and a temperature control method thereof. The device includes a control unit, a temperature acquisition unit, and a power heating unit. The method includes temperature acquisition, temperature comparison, temperature statistics, and temperature adjustment. steps. The invention controls the heating power by changing the current flowing through the drain and source of the MOSFET tube to meet the requirements of a controllable and uniform heating process, which can effectively reduce the influence of the working temperature on the resonance frequency and improve the accuracy of the wet density detection of the material .
Description
技术领域technical field
本发明涉及加热装置领域,具体是一种圆柱形同轴谐振腔体的加热装置及其温度控制方法。The invention relates to the field of heating devices, in particular to a heating device for a cylindrical coaxial resonant cavity and a temperature control method thereof.
背景技术Background technique
对于利用谐振腔法对物料进行湿密度检测过程中,谐振频率的稳定对测试精度至关重要;而由于腔体材料的热膨胀效应,导致谐振腔的尺寸与实验温度、材料的热胀系数相关,因此谐振腔的空腔谐振频率必将由于工作温度与基准温度的不同而变化。所以为了确保测试精度,需要对谐振腔体进行加热并保持温度恒定,并且在加热过程中应避免骤冷骤热保持均匀可控的加热过程。In the process of using the resonant cavity method to detect the wet density of materials, the stability of the resonant frequency is crucial to the test accuracy; and due to the thermal expansion effect of the cavity material, the size of the resonant cavity is related to the experimental temperature and the thermal expansion coefficient of the material. Therefore, the cavity resonant frequency of the resonator will change due to the difference between the working temperature and the reference temperature. Therefore, in order to ensure the test accuracy, it is necessary to heat the resonant cavity and keep the temperature constant, and avoid sudden cooling and sudden heating during the heating process to maintain a uniform and controllable heating process.
现有的加热控制电路,通常是利用PWM波的通断动作进行加热过程控制的。单纯采用PWM波进行加热功率的控制时,PWM波高电平时加热电路全功率加热,热量大;PWM波低电平时又完全不加热,控制过程惯性较大,无法连续精确控制加热温度且加热过程无法保持均匀。The existing heating control circuit usually uses the on-off action of PWM wave to control the heating process. When PWM wave is simply used to control the heating power, the heating circuit is heated at full power when the PWM wave is high, and the heat is large; when the PWM wave is low, it does not heat at all, and the inertia of the control process is large, and the heating temperature cannot be continuously and accurately controlled. Keep it even.
因此,为减少工作温度对谐振频率的影响提高测试精度,如何获得可控的均匀加热过程,是本领域技术人员需要解决的技术问题。Therefore, how to obtain a controllable uniform heating process is a technical problem to be solved by those skilled in the art in order to reduce the influence of the working temperature on the resonance frequency and improve the test accuracy.
发明内容 本发明的目的是提供一种圆柱形同轴谐振腔体的加热装置及其温度控制方法,通过连续改变流经MOSFET管漏极和源级的电流来控制加热功率的大小满足可控、均匀的加热过程要求。SUMMARY OF THE INVENTION The object of the present invention is to provide a heating device for a cylindrical coaxial resonant cavity and its temperature control method, by continuously changing the current flowing through the drain and source of the MOSFET tube to control the heating power to meet the controllable, Uniform heating process requirements.
为了达到上述目的,本发明所采用的技术方案为:In order to achieve the above object, the technical scheme adopted in the present invention is:
种圆柱形同轴谐振腔体的加热装置,其特征在于:包括有控制单元、温度采集单元、功率加热单元,所述温度采集单元和功率加热单元分别与控制单元连接;A heating device for a cylindrical coaxial resonant cavity, characterized in that: it includes a control unit, a temperature acquisition unit, and a power heating unit, and the temperature acquisition unit and the power heating unit are respectively connected to the control unit;
所述温度采集单元设在圆柱形同轴谐振腔体上开槽中,并与圆柱形同轴谐振腔体紧密导热接触;The temperature acquisition unit is arranged in a slot on the cylindrical coaxial resonant cavity, and is in close thermal contact with the cylindrical coaxial resonant cavity;
所述控制单元包括控制电压产生子单元、滤波调整子单元,其中控制电压产生子单元由主控芯片、接入主控芯片的DA转换芯片构成,滤波调整子单元由运算放大器构成的滤波电路、比例积分电路构成,所述温度采集单元输出的信号接入主控芯片,主控芯片根据温度采集单元输出的信号,控制DA转换芯片产生控制电压信号,DA转换芯片产生的控制电压信号接入滤波调整子单元,依次经过滤波调整子单元中滤波电路滤波、比例积分电路比例积分变换后,变换为功率控制电压信号并接入功率加热单元;The control unit includes a control voltage generation subunit and a filter adjustment subunit, wherein the control voltage generation subunit is composed of a main control chip and a DA conversion chip connected to the main control chip, and the filter adjustment subunit is a filter circuit composed of an operational amplifier, The proportional integral circuit is composed, the signal output by the temperature acquisition unit is connected to the main control chip, and the main control chip controls the DA conversion chip to generate a control voltage signal according to the signal output by the temperature acquisition unit, and the control voltage signal generated by the DA conversion chip is connected to the filter The adjustment sub-unit is converted into a power control voltage signal and connected to the power heating unit after being filtered by the filter circuit in the filter adjustment sub-unit and converted by the proportional integral circuit in sequence;
所述功率加热单元包括两个功率MOSFET管,两个功率MOSFET管分布于圆柱形同轴谐振腔体顶部和底部,并分别与圆柱形同轴谐振腔体紧密导热接触,两个功率MOSFET管分别接收控制单元中滤波调整子单元输出的功率控制电压信号,由功率控制电压信号控制两个功率MOSFET管感生沟道的宽窄,以调整漏极和源极之间电流的大小,完成对加热功率大小的控制。The power heating unit includes two power MOSFET tubes, the two power MOSFET tubes are distributed on the top and bottom of the cylindrical coaxial resonant cavity, and are in close thermal contact with the cylindrical coaxial resonant cavity respectively, and the two power MOSFET tubes are respectively Receive the power control voltage signal output by the filter adjustment sub-unit in the control unit, and control the width of the induction channel of the two power MOSFET tubes by the power control voltage signal to adjust the current between the drain and the source, and complete the heating power size control.
所述的一种圆柱形同轴谐振腔体的加热装置,其特征在于:所述温度采集单元采用高精度的数字式感温集成电路,温度采集单元输出通过串行总线接入控制单元中控制电压产生子单元的主控芯片,且温度采集单元通过导热垫设置在圆柱形同轴谐振腔体上开槽中。The heating device for a cylindrical coaxial resonant cavity is characterized in that: the temperature acquisition unit adopts a high-precision digital temperature-sensing integrated circuit, and the output of the temperature acquisition unit is connected to the control unit for control through a serial bus. The main control chip of the voltage generation sub-unit, and the temperature acquisition unit is arranged in the slot on the cylindrical coaxial resonant cavity through the heat conduction pad.
所述的一种圆柱形同轴谐振腔体的加热装置,其特征在于:所述滤波调整子单元由运算放大器构成的滤波电路、比例积分电路构成,其中:The heating device for a cylindrical coaxial resonant cavity is characterized in that: the filter adjustment subunit is composed of a filter circuit composed of an operational amplifier and a proportional integral circuit, wherein:
滤波放大电路包括运算放大器U1,DA转换芯片产生的控制电压信号依次经过串联的电阻R1、电阻R2接入运算放大器U1的反相输入端,电阻R1与电阻R2之间通过电容C1接地,运算放大器U1的同相输入端接地,运算放大器U1的反相输入端与输出端之间接有电阻R3;The filter amplifier circuit includes an operational amplifier U1. The control voltage signal generated by the DA conversion chip is sequentially connected to the inverting input terminal of the operational amplifier U1 through the series resistor R1 and resistor R2. The capacitor C1 is grounded between the resistor R1 and the resistor R2. The operational amplifier The non-inverting input terminal of U1 is grounded, and a resistor R3 is connected between the inverting input terminal and the output terminal of the operational amplifier U1;
比例积分电路包括运算放大器U2、U3,运算放大器U1的输出端通过电阻R4接入运算放大器U2的反相输入端,运算放大器U1的输出端还通过电阻R5接入运算放大器U3的反相输入端,运算放大器U2的同相输入端接地,运算放大器U2的反相输入端与输出端之间接入电容C2,运算放大器U3的同相输入端接地,运算放大器U3的反相输入端与输出端之间接入电容C3,运算放大器U2的输出端通过电阻R6、运算放大器U3的输出端通过电阻R7分别接入功率加热单元,以向功率加热单元输出两路功率控制电压信号。The proportional-integral circuit includes operational amplifiers U2 and U3. The output terminal of the operational amplifier U1 is connected to the inverting input terminal of the operational amplifier U2 through a resistor R4, and the output terminal of the operational amplifier U1 is also connected to the inverting input terminal of the operational amplifier U3 through a resistor R5. , the non-inverting input terminal of the operational amplifier U2 is grounded, the capacitor C2 is connected between the inverting input terminal and the output terminal of the operational amplifier U2, the non-inverting input terminal of the operational amplifier U3 is grounded, and the inverting input terminal and the output terminal of the operational amplifier U3 are connected The capacitor C3, the output terminal of the operational amplifier U2 are respectively connected to the power heating unit through the resistor R6, and the output terminal of the operational amplifier U3 is connected to the power heating unit through the resistor R7, so as to output two power control voltage signals to the power heating unit.
所述的一种圆柱形同轴谐振腔体的加热装置,其特征在于:所述功率加热单元包括两个功率MOSFET管T1、T2,两个功率MOSFET管T1、T2分别通过涂抹导热硅脂并上螺钉与圆柱形同轴谐振腔体顶部、底部对应紧密接触,两个功率MOSFET管T1、T2的源极分别接地,漏极分别接入电源VCC,其中一个功率MOSFET管T1的栅极通过电阻R8、源极通过电阻R9分别接入滤波调整子单元中比例积分电路其中一路输出的功率控制电压信号,另一个功率MOSFET管T2的栅极通过电阻R10、源极通过电阻R11分别接入滤波调整子单元中比例积分电路另一路输出的功率控制电压信号。The heating device for a cylindrical coaxial resonant cavity is characterized in that: the power heating unit includes two power MOSFET tubes T1 and T2, and the two power MOSFET tubes T1 and T2 are respectively coated with thermally conductive silicone grease and The upper screw is in close contact with the top and bottom of the cylindrical coaxial resonant cavity. The sources of the two power MOSFETs T1 and T2 are respectively grounded, and the drains are respectively connected to the power supply VCC. The gate of one of the power MOSFETs T1 passes through the resistor R8 and the source are respectively connected to the power control voltage signal output by one of the proportional integral circuits in the filter adjustment subunit through the resistor R9, and the gate of the other power MOSFET T2 is respectively connected to the filter adjustment through the resistor R10 and the source through the resistor R11 The power control voltage signal output by another channel of the proportional integral circuit in the subunit.
一种圆柱形同轴谐振腔体的温度控制方法,其特征在于:包括以下步骤:A temperature control method for a cylindrical coaxial resonant cavity, characterized in that: comprising the following steps:
(1)、温度采集步骤:通过温度采集单元测量被加热的圆柱形同轴谐振腔体的温度;(1), temperature acquisition step: measure the temperature of the heated cylindrical coaxial resonant cavity through the temperature acquisition unit;
(2)、温度比较步骤:通过控制单元中主控芯片比较温度采集单元所测量的圆柱形同轴谐振腔体温度和目标温度的差值以及相邻两次采集的温度差值;(2) Temperature comparison step: compare the difference between the temperature of the cylindrical coaxial resonant cavity measured by the temperature acquisition unit and the target temperature and the temperature difference between two adjacent acquisitions through the main control chip in the control unit;
(3)、温度统计步骤:通过控制单元中主控芯片对每次采集的圆柱形同轴谐振腔体温度与目标温度的差值进行累计;(3) Temperature statistics step: through the main control chip in the control unit, the difference between the temperature of the cylindrical coaxial resonant cavity collected each time and the target temperature is accumulated;
(4)、温度调整步骤:当该圆柱形同轴谐振腔体的温度低于该目标温度时,通过控制单元计算产生功率控制电压信号来调整加热功率的大小。(4) Temperature adjustment step: when the temperature of the cylindrical coaxial resonant cavity is lower than the target temperature, the control unit calculates and generates a power control voltage signal to adjust the heating power.
本发明的有益效果:Beneficial effects of the present invention:
本发明提供一种用于圆柱形同轴谐振腔体的加热电路及其温度控制方法,通过改变流经MOSFET管漏极和源级的电流来控制加热功率的大小来满足可控、均匀的加热过程要求,可有效减少工作温度对谐振频率的影响、提高物料湿密度检测的精度。The invention provides a heating circuit for a cylindrical coaxial resonant cavity and its temperature control method, which controls the heating power by changing the current flowing through the drain and source of the MOSFET tube to meet the controllable and uniform heating It can effectively reduce the influence of working temperature on resonance frequency and improve the accuracy of material wet density detection.
附图说明Description of drawings
图1为本发明的加热电路的方块示意图。FIG. 1 is a schematic block diagram of a heating circuit of the present invention.
图2为本发明的控制电压产生子单元的方块示意图。FIG. 2 is a schematic block diagram of the control voltage generating subunit of the present invention.
图3为本发明的滤波调整子单元的方块示意图。FIG. 3 is a schematic block diagram of the filter adjustment subunit of the present invention.
图4为本发明的功率加热单元的方块示意图。Fig. 4 is a schematic block diagram of the power heating unit of the present invention.
图5为本发明的温度采集单元和功率加热单元安装位置示意图。Fig. 5 is a schematic diagram of the installation positions of the temperature acquisition unit and the power heating unit of the present invention.
图6为本发明的温度控制方法的流程图。Fig. 6 is a flow chart of the temperature control method of the present invention.
具体实施方式detailed description
如图1-图5所示,一种圆柱形同轴谐振腔体的加热装置,包括有控制单元102、温度采集单元101、功率加热单元103,温度采集单元101和功率加热单元103分别与控制单元102连接;As shown in Figures 1-5, a heating device for a cylindrical coaxial resonant cavity includes a control unit 102, a temperature acquisition unit 101, and a power heating unit 103, and the temperature acquisition unit 101 and the power heating unit 103 are respectively connected with the control unit unit 102 connection;
温度采集单元101设在圆柱形同轴谐振腔体上开槽中,并与圆柱形同轴谐振腔体紧密导热接触;The temperature acquisition unit 101 is arranged in a slot on the cylindrical coaxial resonant cavity, and is in close thermal contact with the cylindrical coaxial resonant cavity;
控制单元102包括控制电压产生子单元201、滤波调整子单元202,其中控制电压产生子单元201由主控芯片301、接入主控芯片301的DA转换芯片302构成,滤波调整子单元202由运算放大器构成的滤波电路、比例积分电路构成,温度采集单元101输出的信号接入主控芯片301,主控芯片301根据温度采集单元101输出的信号,控制DA转换芯片302产生控制电压信号,DA转换芯片302产生的控制电压信号接入滤波调整子单元202,依次经过滤波调整子单元202中滤波电路滤波、比例积分电路比例积分变换后,变换为功率控制电压信号并接入功率加热单元103;The control unit 102 includes a control voltage generation subunit 201 and a filter adjustment subunit 202, wherein the control voltage generation subunit 201 is composed of a main control chip 301 and a DA conversion chip 302 connected to the main control chip 301, and the filter adjustment subunit 202 is composed of an operation A filter circuit composed of an amplifier and a proportional integral circuit are composed. The signal output by the temperature acquisition unit 101 is connected to the main control chip 301, and the main control chip 301 controls the DA conversion chip 302 to generate a control voltage signal according to the signal output by the temperature acquisition unit 101, and the DA conversion The control voltage signal generated by the chip 302 is connected to the filter adjustment subunit 202, and after being filtered by the filter circuit in the filter adjustment subunit 202 and transformed by the proportional integral circuit in turn, it is converted into a power control voltage signal and connected to the power heating unit 103;
功率加热单元103包括两个功率MOSFET管,两个功率MOSFET管分布于圆柱形同轴谐振腔体顶部和底部,并分别与圆柱形同轴谐振腔体紧密导热接触,两个功率MOSFET管分别接收控制单元102中滤波调整子单元202输出的功率控制电压信号,由功率控制电压信号控制两个功率MOSFET管感生沟道的宽窄,以调整漏极和源极之间电流的大小,完成对加热功率大小的控制。The power heating unit 103 includes two power MOSFET tubes, the two power MOSFET tubes are distributed on the top and bottom of the cylindrical coaxial resonant cavity, and are in close thermal contact with the cylindrical coaxial resonant cavity respectively, and the two power MOSFET tubes respectively receive The power control voltage signal output by the filter adjustment sub-unit 202 in the control unit 102 controls the width of the induced channel of the two power MOSFET tubes by the power control voltage signal to adjust the current between the drain and the source to complete the heating Power size control.
温度采集单元101采用高精度的数字式感温集成电路,温度采集单元101输出通过串行总线接入控制单元102中控制电压产生子单元201的主控芯片,且温度采集单元101通过导热垫设置在圆柱形同轴谐振腔体上开槽中。The temperature acquisition unit 101 adopts a high-precision digital temperature-sensing integrated circuit. The output of the temperature acquisition unit 101 is connected to the main control chip of the control voltage generation subunit 201 in the control unit 102 through a serial bus, and the temperature acquisition unit 101 is set through a thermal pad. Slotted on the cylindrical coaxial resonant cavity.
滤波调整子单元202由运算放大器构成的滤波电路、比例积分电路构成,其中:The filter adjustment subunit 202 is composed of a filter circuit composed of an operational amplifier and a proportional-integral circuit, wherein:
滤波放大电路包括运算放大器U1,DA转换芯片产生的控制电压信号依次经过串联的电阻R1、电阻R2接入运算放大器U1的反相输入端,电阻R1与电阻R2之间通过电容C1接地,运算放大器U1的同相输入端接地,运算放大器U1的反相输入端与输出端之间接有电阻R3;The filter amplifier circuit includes an operational amplifier U1. The control voltage signal generated by the DA conversion chip is sequentially connected to the inverting input terminal of the operational amplifier U1 through the series resistor R1 and resistor R2. The capacitor C1 is grounded between the resistor R1 and the resistor R2. The operational amplifier The non-inverting input terminal of U1 is grounded, and a resistor R3 is connected between the inverting input terminal and the output terminal of the operational amplifier U1;
比例积分电路包括运算放大器U2、U3,运算放大器U1的输出端通过电阻R4接入运算放大器U2的反相输入端,运算放大器U1的输出端还通过电阻R5接入运算放大器U3的反相输入端,运算放大器U2的同相输入端接地,运算放大器U2的反相输入端与输出端之间接入电容C2,运算放大器U3的同相输入端接地,运算放大器U3的反相输入端与输出端之间接入电容C3,运算放大器U2的输出端通过电阻R6、运算放大器U3的输出端通过电阻R7分别接入功率加热单元,以向功率加热单元输出两路功率控制电压信号。The proportional-integral circuit includes operational amplifiers U2 and U3. The output terminal of the operational amplifier U1 is connected to the inverting input terminal of the operational amplifier U2 through a resistor R4, and the output terminal of the operational amplifier U1 is also connected to the inverting input terminal of the operational amplifier U3 through a resistor R5. , the non-inverting input terminal of the operational amplifier U2 is grounded, the capacitor C2 is connected between the inverting input terminal and the output terminal of the operational amplifier U2, the non-inverting input terminal of the operational amplifier U3 is grounded, and the inverting input terminal and the output terminal of the operational amplifier U3 are connected The capacitor C3, the output terminal of the operational amplifier U2 are respectively connected to the power heating unit through the resistor R6, and the output terminal of the operational amplifier U3 is connected to the power heating unit through the resistor R7, so as to output two power control voltage signals to the power heating unit.
功率加热单元103包括两个功率MOSFET管T1、T2,两个功率MOSFET管T1、T2分别通过涂抹导热硅脂并上螺钉与圆柱形同轴谐振腔体顶部、底部对应紧密接触,两个功率MOSFET管T1、T2的源极分别接地,漏极分别接入电源VCC,其中一个功率MOSFET管T1的栅极通过电阻R8、源极通过电阻R9分别接入滤波调整子单元中比例积分电路其中一路输出的功率控制电压信号,另一个功率MOSFET管T2的栅极通过电阻R10、源极通过电阻R11分别接入滤波调整子单元中比例积分电路另一路输出的功率控制电压信号。The power heating unit 103 includes two power MOSFET tubes T1 and T2. The two power MOSFET tubes T1 and T2 are respectively in close contact with the top and bottom of the cylindrical coaxial resonant cavity by applying heat-conducting silicone grease and screws. The two power MOSFET tubes The sources of the tubes T1 and T2 are respectively grounded, and the drains are respectively connected to the power supply VCC. The gate of one of the power MOSFET tubes T1 is respectively connected to one of the output circuits of the proportional integral circuit in the filter adjustment subunit through the resistor R8 and the source through the resistor R9. The power control voltage signal of the other power MOSFET tube T2 is respectively connected to the power control voltage signal output by the proportional integral circuit in the filter adjustment sub-unit through the resistor R10 and the source through the resistor R11.
如图6所示,一种圆柱形同轴谐振腔体的温度控制方法,包括以下步骤:As shown in Figure 6, a temperature control method of a cylindrical coaxial resonant cavity comprises the following steps:
(1)、温度采集步骤:通过温度采集单元测量被加热的圆柱形同轴谐振腔体的温度;(1), temperature acquisition step: measure the temperature of the heated cylindrical coaxial resonant cavity through the temperature acquisition unit;
(2)、温度比较步骤:通过控制单元中主控芯片比较温度采集单元所测量的圆柱形同轴谐振腔体温度和目标温度的差值以及相邻两次采集的温度差值;(2) Temperature comparison step: compare the difference between the temperature of the cylindrical coaxial resonant cavity measured by the temperature acquisition unit and the target temperature and the temperature difference between two adjacent acquisitions through the main control chip in the control unit;
(3)、温度统计步骤:通过控制单元中主控芯片对每次采集的圆柱形同轴谐振腔体温度与目标温度的差值进行累计;(3) Temperature statistics step: through the main control chip in the control unit, the difference between the temperature of the cylindrical coaxial resonant cavity collected each time and the target temperature is accumulated;
(4)、温度调整步骤:当该圆柱形同轴谐振腔体的温度低于该目标温度时,通过控制单元计算产生功率控制电压信号来调整加热功率的大小。(4) Temperature adjustment step: when the temperature of the cylindrical coaxial resonant cavity is lower than the target temperature, the control unit calculates and generates a power control voltage signal to adjust the heating power.
结合图1,本发明的加热电路主要包括温度采集单元101、控制单元102及功率加热单元103。控制单元102包括控制电压产生子单元201和滤波调整子单元202,通过串行总线与温度采集单元相连,接收采集到的谐振腔体的温度值,由控制电压产生子单元201经过计算产生控制电压并经滤波调整子单元202对控制电压进行滤波积分调整输出到功率加热单元103完成加热功率大小的调节。Referring to FIG. 1 , the heating circuit of the present invention mainly includes a temperature acquisition unit 101 , a control unit 102 and a power heating unit 103 . The control unit 102 includes a control voltage generation subunit 201 and a filter adjustment subunit 202, which are connected to the temperature acquisition unit through a serial bus, receive the collected temperature value of the resonant cavity, and the control voltage generation subunit 201 generates a control voltage through calculation And through the filter adjustment sub-unit 202, the control voltage is adjusted by filter integration and output to the power heating unit 103 to complete the adjustment of the heating power.
结合图2,本发明的控制电压产生子单元201主要由主控芯片301和DA转换芯片302组成。主控芯片301通过串行总线接收温度采集单元101采集到的温度值经过计算输出控制DA转换芯片302,由DA转换芯片302产生控制电压信号。Referring to FIG. 2 , the control voltage generation subunit 201 of the present invention is mainly composed of a main control chip 301 and a DA conversion chip 302 . The main control chip 301 receives the temperature value collected by the temperature acquisition unit 101 through the serial bus, calculates and outputs it to control the DA conversion chip 302, and the DA conversion chip 302 generates a control voltage signal.
结合图3,产生的控制电压信号接入滤波调整子单元202,对其滤波后进行积分调整为可控制功率加热单元103中MOSFET管加热功率的控制电压。Referring to FIG. 3 , the generated control voltage signal is connected to the filter adjustment subunit 202 , and after filtering, it is integrally adjusted to be a control voltage that can control the heating power of the MOSFET tube in the power heating unit 103 .
结合图4,本发明的功率加热单元103包括两个功率MOSFET管,控制单元102产生的功率加热控制电压接入功率MOSFET管的栅极,可以调整MOSFET管感生通道的宽窄,进而可以调整MOSFET管流经漏极和源级的电流,从而完成对MOSFET管加热功率大小的控制。4, the power heating unit 103 of the present invention includes two power MOSFET tubes, and the power heating control voltage generated by the control unit 102 is connected to the gate of the power MOSFET tube, so that the width of the induction channel of the MOSFET tube can be adjusted, and then the MOSFET tube can be adjusted. The current flowing through the drain and source of the tube can complete the control of the heating power of the MOSFET tube.
结合图5,温度采集单元101采用高精度的数字式感温集成电路,在谐振腔体下部开槽中通过导热垫与谐振腔体紧密接触,用于采集谐振腔体的温度;为了确保谐振腔体受热均匀,两个功率MOSFET管,分布于谐振腔体的上下两部分,通过涂抹导热硅脂并上螺钉与谐振腔体紧密接触。In conjunction with Figure 5, the temperature acquisition unit 101 uses a high-precision digital temperature-sensing integrated circuit, which is in close contact with the resonant cavity through a thermal pad in the slot at the bottom of the resonant cavity, and is used to collect the temperature of the resonant cavity; in order to ensure that the resonant cavity The body is heated evenly, and two power MOSFET tubes are distributed in the upper and lower parts of the resonant cavity. They are in close contact with the resonant cavity by applying heat-conducting silicone grease and attaching screws.
结合图6,本发明中的温度控制方法主要分为四个步骤:温度采集步骤、温度比较步骤、温度统计步骤及温度调整步骤。温度采集步骤以所述温度采集单元101测量被加热的谐振腔体的温度;温度比较步骤是以所述控制单元中102主控芯片301比较所述温度采集单元101所测量的谐振腔体温度和目标温度的差值以及相邻两次采集的温度差值;温度统计步骤是对每次采集的谐振腔体温度与目标温度的差值进行累计;温度调整步骤是跟上述三个步骤,在该腔体的温度低于该目标温度、接近目标温度及略超过目标温度时,通过控制单元计算产生功率控制电压信号来调整加热功率的大小,对谐振腔体进行全功率、半功率、微功率加热及不加热。Referring to FIG. 6 , the temperature control method in the present invention is mainly divided into four steps: a temperature collection step, a temperature comparison step, a temperature statistics step and a temperature adjustment step. The temperature acquisition step uses the temperature acquisition unit 101 to measure the temperature of the heated resonant cavity; the temperature comparison step is to compare the resonant cavity temperature measured by the temperature acquisition unit 101 with the main control chip 301 in the control unit 102 The difference between the target temperature and the temperature difference between two adjacent acquisitions; the temperature statistics step is to accumulate the difference between the resonant cavity temperature and the target temperature collected each time; the temperature adjustment step is the same as the above three steps. When the temperature of the cavity is lower than the target temperature, close to the target temperature or slightly above the target temperature, the control unit calculates and generates a power control voltage signal to adjust the heating power, and performs full-power, half-power, and micro-power heating on the resonant cavity And without heating.
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