CN103957291A - Mobile phone chip inserted connection structure and inserted connection method - Google Patents
Mobile phone chip inserted connection structure and inserted connection method Download PDFInfo
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- CN103957291A CN103957291A CN201410141597.1A CN201410141597A CN103957291A CN 103957291 A CN103957291 A CN 103957291A CN 201410141597 A CN201410141597 A CN 201410141597A CN 103957291 A CN103957291 A CN 103957291A
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- cell phone
- chip
- mobile phone
- socket
- pcb board
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Abstract
The invention provides a mobile phone chip inserted connection structure and an inserted connection method. The mobile phone chip inserted connection structure comprises a mobile phone main board body and a mobile phone chip. An insertion base is fixedly connected to the installation position, corresponding to the mobile phone chip, of the mobile phone main board body, the mobile phone chip is welded to a PCB, the PCB is provided with an insertion head connected with a pin of the mobile phone chip in a guiding mode, and the mobile phone chip is connected with the mobile phone main board body through the insertion base and the insertion head which are connected in an inserted mode. According to the mobile phone chip inserted connection structure and the inserted connection method, an independent module is composed of the mobile phone chip and the PCB and can be independently produced and sold, and the interchangeability of the mobile phone chip is improved; the physical structures of the insertion base and the insertion head and an electric signal can be defined to be in standard modes, one kind of main board bodies accordingly adapt to multiple kinds of chips, and hardware upgrading of a mobile phone becomes possible; in addition, the mobile phone chip is connected with the mobile phone main board body through the insertion base and the insertion head which are connected in the inserted mode, and the mobile phone chip is convenient to disassemble and assemble without depending on a professional tool.
Description
Technical field
The present invention relates to mobile phone electronic apparatus field, be specifically related to a kind of chip for cell phone connected structure and insertion method.
Background technology
The main chip such as processor, character library and the camera of existing cell phone mainboard are all directly fixed on mainboard with soldering form.Advantage is: reliability is high, be easy to large-scale production, be easy to control cost, but there is following shortcoming: once after mainboard produced, only have professional to use the professional tools such as BGA maintenance platform could change said chip, domestic consumer cannot rely on the simple tool such as tweezers, screwdriver to realize the replacing of said chip and equipment, also cannot realize by changing chip the upgrading of mobile phone hardware configuration.
For improving the compatibility of mobile phone camera, standard assemblied camera, Chinese invention patent CN103338283A has adopted socket in the assembly structure of mobile phone camera chip, this patent discloses a kind of assembly structure of mobile phone camera chip, comprise cell phone mainboard and camera chip, the installation position of the corresponding described camera chip of described cell phone mainboard is provided with an annular socket being fixedly connected with described cell phone mainboard, described camera chip is sheathed in described annular socket, described camera chip is connected conducting by described annular socket with described cell phone mainboard.The present invention uses annular socket and camera chip can realize the standardization of camera chip assembling, improve the compatibility of mobile phone camera, reduce the R&D costs of cell-phone camera head unit, can realize the unified mounting means of the camera chip in different mobile phones, be applicable on different cell phone mainboards, shorten the construction cycle of new cell-phone about camera mounting design.
The chip such as processor, character library of cell phone mainboard with comprise being connected of mainboard electrical connection and two aspects of mechanical connection, electrical connection is to provide path for electric signal; Mechanical connection is that chip is fixed on mainboard, prevents that it from coming off.Existing soldering method unites two into one electrical connection and mechanical connection, and the pin of welding is the path of electric signal, securely chip is fixed on mainboard again.The chip such as processor, character library all has multiple pins, if use annular socket of the present invention, need on the medial surface of annular socket, arrange and pin shell fragment one to one, this measure will cause the complex structure of socket, difficulty is produced in design, and different processor, word-base chip etc. need corresponding different sockets, can not solve the problem of compatibility, installation code completely.In addition, camera chip is directly electrically connected by contact and shell fragment, and in the present invention, camera locking device is not set yet, and camera chip is easily deviate from annular socket, makes electrical connection unstable, affects the use of mobile phone camera.
Summary of the invention
The technical problem to be solved in the present invention is to provide that a kind of chip dismounting of cell phone mainboard is easy, nuclear interface standardizing, chip for cell phone connected structure and the insertion method that can independently produce, change.
For solving the problems of the technologies described above, embodiments of the invention provide a kind of chip for cell phone connected structure, comprise cell phone mainboard body, mainboard chip, on the installation position of the corresponding described chip for cell phone of described cell phone mainboard body, be connected with a socket, described mainboard chip is welded on a pcb board, described pcb board is provided with and draws the plug that connects described chip for cell phone pin, and described chip for cell phone is connected conducting with plug with cell phone mainboard body by the socket of pegging graft.
In said structure, the size of socket and plug, mounting means, number of pins, signaling point position and characteristics of signals etc. are canonical form according to chip property definition, make a kind of cell phone mainboard can adapt to various chips, and mobile phone hardware upgrading becomes possibility.
The number of pins of socket and plug is determined according to standard definition.
Wherein, described socket adopts ZIF, golden finger, mother row, FPC winding displacement or plate to plate form, and described plug adopts the form corresponding with socket, but socket and plug are not limited to above-mentioned several form.
Above-mentioned chip for cell phone connected structure also comprises the locking device that relatively described cell phone mainboard body is fixedly installed, and described pcb board lock onto on described cell phone mainboard body by this locking device.
Preferably, described locking device is made up of 2～6 buckles, and being fixedly connected with cell phone mainboard body without snap fit end of described buckle, has snap fit end to be arranged on described pcb board.
Described connected structure can be described as follows: described cell phone mainboard body is provided with 2 sockets that adopt golden finger form, and the below of described pcb board is provided with 2 plugs that adopt golden finger form, and described plug and socket is corresponding pegs graft.
Described connected structure can also be described as follows: described cell phone mainboard body is provided with the socket of an employing FPC winding displacement form, and described pcb board is connected with described socket by FPC winding displacement.
Further, between described pcb board and cell phone mainboard body, be provided with insulation cushion.
Wherein, described host chip is processor chips, word-base chip or camera chip, but is not limited to this several chips.
The embodiment of the present invention also provides a kind of insertion method of above-mentioned chip for cell phone connected structure, comprises the steps:
(1), according to the character of chip for cell phone, Criterion in advance, defines the feature such as socket, size, mounting means, number of pins, signaling point position and the characteristics of signals of plug that connects chip for cell phone and cell phone mainboard;
(2) together with the other parts of socket and cell phone mainboard, manufacture, weld, debug, form cell phone mainboard body;
(3) produce pcb board, then solder plug and chip for cell phone thereon, forms the standalone module with chip for cell phone;
(4) socket on the plug of standalone module and cell phone mainboard body is pegged graft;
(5) utilize locking device that pcb board is locked with respect to cell phone mainboard, complete the grafting of chip for cell phone.
The beneficial effect of technique scheme of the present invention is as follows:
Chip for cell phone of the present invention and a standalone module of pcb board composition, can produce and sell separately, improves the interchangeability of chip for cell phone; The physical structure of socket, plug and the signal of telecommunication can be defined as canonical form, adapt to various chips thereby realize a kind of mainboard body, make the HardwareUpgring of mobile phone become possibility; In addition, chip for cell phone is connected conducting with plug with cell phone mainboard body by the socket of pegging graft, and chip for cell phone easy accessibility, does not need to rely on professional tool.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of the present invention one;
Fig. 2 is the structural representation of the embodiment of the present invention two.
Description of reference numerals:
1-1, cell phone mainboard body;
1-2, mainboard chip;
1-3, socket;
1-4, pcb board;
1-5, plug;
1-6, locking device;
2-1, cell phone mainboard body;
2-2, mainboard chip;
2-3, socket;
2-4, pcb board;
2-5, FPC winding displacement;
2-6, locking device;
2-7, insulation cushion.
Embodiment
For making the technical problem to be solved in the present invention, technical scheme and advantage clearer, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
Embodiment mono-: as shown in Figure 1, a kind of chip for cell phone connected structure, comprises cell phone mainboard body 1-1, mainboard chip 1-2, is connected with 1-2 socket 1-3 that adopts golden finger form on the installation position of the corresponding described chip for cell phone 1-2 of described cell phone mainboard body 1-1.
Described mainboard chip 1-2 is processor chips or word-base chip, is welded on a pcb board 1-4; Described pcb board 1-4 is provided with 2 and draws the plug 1-5 that connects described chip for cell phone 1-2 pin, adopts golden finger form, and described chip for cell phone 1-2 is connected conducting with plug 1-5 with cell phone mainboard body 1-1 by the socket 1-3 pegging graft.
Described socket 1-3 and plug 1-5 can also adopt ZIF, row mother or plate to plate form.
On described cell phone mainboard body 1-1, be installed with locking device 1-6, described pcb board 1-4 lock onto on described cell phone mainboard body 1-1 by this locking device 1-6.
In the present embodiment, described locking device 1-6 is made up of 2 buckles, and being fixedly connected with cell phone mainboard body 1-1 without snap fit end of described buckle, has snap fit end to be arranged on described pcb board 1-4.
The embodiment of the present invention one also provides a kind of insertion method of above-mentioned chip for cell phone connected structure, comprises the steps:
(1), according to the character of chip for cell phone, Criterion in advance, defines the feature such as socket, size, mounting means, number of pins, signaling point position and the characteristics of signals of plug that connects chip for cell phone and cell phone mainboard;
(2) together with the other parts of socket and cell phone mainboard, manufacture, weld, debug, form cell phone mainboard body;
(3) produce pcb board, then solder plug and chip for cell phone thereon, forms the standalone module with chip for cell phone;
(4) socket on the plug of standalone module and cell phone mainboard body is pegged graft;
(5) utilize locking device that pcb board is locked with respect to cell phone mainboard, complete the grafting of chip for cell phone.
Embodiment bis-: as shown in Figure 2, a kind of chip for cell phone connected structure, comprises cell phone mainboard body 2-1, mainboard chip 2-2, is connected with the socket 2-3 that adopts FPC winding displacement form on the installation position of the corresponding described chip for cell phone 2-2 of described cell phone mainboard body 2-1.
Described mainboard chip 2-2 is camera chip, is welded on a pcb board 2-4; Described pcb board 2-4 is provided with and draws the FPC winding displacement 2-5 that connects described chip for cell phone 2-2 pin, and one end of FPC winding displacement 2-5 and socket 2-3 peg graft.
Between described pcb board 2-4 and cell phone mainboard body 2-1, be provided with 2 insulation cushion 2-7.
On described cell phone mainboard body 2-1, be installed with locking device 2-6, described pcb board 2-4 lock onto on described cell phone mainboard body 2-1 by this locking device 2-6.
In the present embodiment, described locking device 2-6 is made up of 2 buckles, and being fixedly connected with cell phone mainboard body 2-1 without snap fit end of described buckle, has snap fit end to be arranged on described pcb board 2-4.
The embodiment of the present invention two also provides a kind of insertion method of above-mentioned chip for cell phone connected structure, comprises the steps:
(1), according to the character of chip for cell phone, Criterion in advance, defines the feature such as socket, size, mounting means, number of pins, signaling point position and the characteristics of signals of plug that connects chip for cell phone and cell phone mainboard;
(2) together with the other parts of socket and cell phone mainboard, manufacture, weld, debug, form cell phone mainboard body;
(3) produce pcb board, then solder plug and chip for cell phone thereon, forms the standalone module with chip for cell phone;
(4) plug of standalone module is pegged graft by the socket on FPC winding displacement and cell phone mainboard body;
(5) utilize locking device that pcb board is locked with respect to cell phone mainboard, complete the grafting of chip for cell phone.
Chip for cell phone of the present invention and a standalone module of pcb board composition, can produce and sell separately, improves the interchangeability of chip for cell phone; The physical structure of socket, plug and the signal of telecommunication can be defined as canonical form, adapt to various chips thereby realize a kind of mainboard body, make the HardwareUpgring of mobile phone become possibility; In addition, chip for cell phone is connected conducting with plug with cell phone mainboard body by the socket of pegging graft, and chip for cell phone easy accessibility, does not need to rely on professional tool.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of principle of the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (9)
1. a chip for cell phone connected structure, comprise cell phone mainboard body, mainboard chip, on the installation position of the corresponding described chip for cell phone of described cell phone mainboard body, be connected with a socket, it is characterized in that, described mainboard chip is welded on a pcb board, described pcb board is provided with and draws the plug that connects described chip for cell phone pin, and described chip for cell phone is connected conducting with plug with cell phone mainboard body by the socket of pegging graft.
2. chip for cell phone connected structure according to claim 1, is characterized in that, described socket adopts ZIF, golden finger, mother row, FPC winding displacement or plate to plate form, and described plug adopts the form corresponding with socket.
3. chip for cell phone connected structure according to claim 1, is characterized in that, also comprises the locking device that relatively described cell phone mainboard body is fixedly installed, and described pcb board lock onto on described cell phone mainboard body by this locking device.
4. chip for cell phone connected structure according to claim 3, is characterized in that, described locking device is made up of 2～6 buckles, and being fixedly connected with cell phone mainboard body without snap fit end of described buckle, has snap fit end to be arranged on described pcb board.
5. chip for cell phone connected structure according to claim 1, it is characterized in that, described cell phone mainboard body is provided with 2 sockets that adopt golden finger form, and the below of described pcb board is provided with 2 plugs that adopt golden finger form, and described plug and socket is corresponding pegs graft.
6. chip for cell phone connected structure according to claim 1, is characterized in that, described cell phone mainboard body is provided with the socket of an employing FPC winding displacement form, and described pcb board is connected with described socket by FPC winding displacement.
7. chip for cell phone connected structure according to claim 6, is characterized in that, between described pcb board and cell phone mainboard body, is provided with insulation cushion.
8. chip for cell phone connected structure according to claim 1, is characterized in that, described host chip is processor chips, word-base chip or camera chip.
9. an insertion method for the chip for cell phone connected structure as described in claim 1～8, is characterized in that, comprises the steps:
(1), according to the character of chip for cell phone, Criterion in advance, defines the feature such as socket, size, mounting means, number of pins, signaling point position and the characteristics of signals of plug that connects chip for cell phone and cell phone mainboard;
(2) together with the other parts of socket and cell phone mainboard, manufacture, weld, debug, form cell phone mainboard body;
(3) produce pcb board, then solder plug and chip for cell phone thereon, forms the standalone module with chip for cell phone;
(4) socket on the plug of standalone module and cell phone mainboard body is pegged graft;
(5) utilize locking device that pcb board is locked with respect to cell phone mainboard, complete the grafting of chip for cell phone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410141597.1A CN103957291A (en) | 2014-04-10 | 2014-04-10 | Mobile phone chip inserted connection structure and inserted connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410141597.1A CN103957291A (en) | 2014-04-10 | 2014-04-10 | Mobile phone chip inserted connection structure and inserted connection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103957291A true CN103957291A (en) | 2014-07-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410141597.1A Pending CN103957291A (en) | 2014-04-10 | 2014-04-10 | Mobile phone chip inserted connection structure and inserted connection method |
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| Country | Link |
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| CN (1) | CN103957291A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768402A (en) * | 2019-03-29 | 2019-05-17 | 天津乾铁科技有限公司 | A kind of card insert type chip installing structure of intercom |
| CN109782161A (en) * | 2018-12-26 | 2019-05-21 | 中国科学院长春光学精密机械与物理研究所 | The debugging circuit board and its adjustment method of anti-fuse FPGA |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080119080A1 (en) * | 2006-11-17 | 2008-05-22 | Molex Incorporated | Zoom lens camera module socket |
| CN201590854U (en) * | 2010-02-04 | 2010-09-22 | 中兴通讯股份有限公司 | Mobile phone automatic focusing camera module |
| CN203933699U (en) * | 2014-04-10 | 2014-11-05 | 吴金才 | A kind of chip for cell phone connected structure |
-
2014
- 2014-04-10 CN CN201410141597.1A patent/CN103957291A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080119080A1 (en) * | 2006-11-17 | 2008-05-22 | Molex Incorporated | Zoom lens camera module socket |
| CN201590854U (en) * | 2010-02-04 | 2010-09-22 | 中兴通讯股份有限公司 | Mobile phone automatic focusing camera module |
| CN203933699U (en) * | 2014-04-10 | 2014-11-05 | 吴金才 | A kind of chip for cell phone connected structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109782161A (en) * | 2018-12-26 | 2019-05-21 | 中国科学院长春光学精密机械与物理研究所 | The debugging circuit board and its adjustment method of anti-fuse FPGA |
| CN109768402A (en) * | 2019-03-29 | 2019-05-17 | 天津乾铁科技有限公司 | A kind of card insert type chip installing structure of intercom |
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Application publication date: 20140730 |