CN103955111B - 光掩模用基板组和光掩模组及显示装置的制造方法 - Google Patents

光掩模用基板组和光掩模组及显示装置的制造方法 Download PDF

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Publication number
CN103955111B
CN103955111B CN201410219079.7A CN201410219079A CN103955111B CN 103955111 B CN103955111 B CN 103955111B CN 201410219079 A CN201410219079 A CN 201410219079A CN 103955111 B CN103955111 B CN 103955111B
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China
Prior art keywords
photomask
pattern
transfer
base board
optical mask
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CN201410219079.7A
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English (en)
Chinese (zh)
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CN103955111A (zh
Inventor
土屋雅誉
池边寿美
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Hoya Corp
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Hoya Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76—Patterning of masks by imaging
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Optical Filters (AREA)
CN201410219079.7A 2011-04-13 2012-04-12 光掩模用基板组和光掩模组及显示装置的制造方法 Active CN103955111B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011088781 2011-04-13
JP2011-088781 2011-04-13
CN201210106982.3A CN102736397B (zh) 2011-04-13 2012-04-12 光掩模用基板和光掩模及它们的组、制造方法及转印方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201210106982.3A Division CN102736397B (zh) 2011-04-13 2012-04-12 光掩模用基板和光掩模及它们的组、制造方法及转印方法

Publications (2)

Publication Number Publication Date
CN103955111A CN103955111A (zh) 2014-07-30
CN103955111B true CN103955111B (zh) 2017-07-28

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Family Applications (2)

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CN201210106982.3A Active CN102736397B (zh) 2011-04-13 2012-04-12 光掩模用基板和光掩模及它们的组、制造方法及转印方法
CN201410219079.7A Active CN103955111B (zh) 2011-04-13 2012-04-12 光掩模用基板组和光掩模组及显示装置的制造方法

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CN201210106982.3A Active CN102736397B (zh) 2011-04-13 2012-04-12 光掩模用基板和光掩模及它们的组、制造方法及转印方法

Country Status (4)

Country Link
JP (1) JP5937873B2 (ko)
KR (2) KR101319800B1 (ko)
CN (2) CN102736397B (ko)
TW (1) TWI461753B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI668131B (zh) * 2018-07-17 2019-08-11 沈岳正 Positive and negative dot mixed printing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203160A (ja) * 2000-12-11 2001-07-27 Sony Corp 半導体装置の製造方法
CN1862376A (zh) * 2005-02-25 2006-11-15 Hoya株式会社 掩模坯料及其透明基片的制造方法,曝光掩模的制造方法
CN101006021A (zh) * 2005-06-17 2007-07-25 信越化学工业株式会社 用于光掩模的大型玻璃基板及其制造方法、计算机可读记录介质以及母玻璃曝光方法
JP2009037203A (ja) * 2007-07-12 2009-02-19 Hoya Corp パターン形成方法、薄膜トランジスタ基板の製造方法及び液晶表示装置の製造方法、並びにフォトマスク
JP2010078769A (ja) * 2008-09-25 2010-04-08 Shin-Etsu Chemical Co Ltd フォトマスクブランクスの選択方法及び製造方法並びにフォトマスクの製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3627805B2 (ja) * 2001-04-20 2005-03-09 信越化学工業株式会社 フォトマスク用ガラス基板及びその製造方法
JP4340859B2 (ja) 2003-07-25 2009-10-07 信越化学工業株式会社 フォトマスクブランク用基板の選定方法
TWI329779B (en) * 2003-07-25 2010-09-01 Shinetsu Chemical Co Photomask blank substrate, photomask blank and photomask
TW200540565A (en) * 2004-06-08 2005-12-16 Sumitomo Chemical Co Photosensitive resin composition
DE102005046135B4 (de) * 2004-09-29 2017-04-13 Hoya Corp. Substrat für Maskenrohling, Maskenrohling, Belichtungsmaske und Herstellungsverfahren für Maskenrohlingssubstrat
JP4803576B2 (ja) * 2004-09-29 2011-10-26 Ｈｏｙａ株式会社 マスクブランク用基板、マスクブランク、露光用マスク、半導体デバイスの製造方法、及びマスクブランク用基板の製造方法
US7608542B2 (en) * 2005-06-17 2009-10-27 Shin-Etsu Chemical Co., Ltd. Large-size glass substrate for photomask and making method, computer-readable recording medium, and mother glass exposure method
JP5335351B2 (ja) * 2008-10-01 2013-11-06 Ｈｏｙａ株式会社 マスクブランク用基板セット、マスクブランクセット、フォトマスクセット、及び半導体デバイスの製造方法
JP5331638B2 (ja) * 2008-11-04 2013-10-30 Ｈｏｙａ株式会社 表示装置製造用フォトマスクの製造方法及び描画装置
KR101680866B1 (ko) * 2008-11-26 2016-11-29 호야 가부시키가이샤 마스크블랭크용 기판
JP4853684B2 (ja) * 2009-03-31 2012-01-11 信越化学工業株式会社 フォトマスクブランク及びフォトマスク
KR101270659B1 (ko) * 2009-05-27 2013-06-03 주식회사 에스앤에스텍 블랭크 마스크 기판, 블랭크 마스크 및 그의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203160A (ja) * 2000-12-11 2001-07-27 Sony Corp 半導体装置の製造方法
CN1862376A (zh) * 2005-02-25 2006-11-15 Hoya株式会社 掩模坯料及其透明基片的制造方法,曝光掩模的制造方法
CN101006021A (zh) * 2005-06-17 2007-07-25 信越化学工业株式会社 用于光掩模的大型玻璃基板及其制造方法、计算机可读记录介质以及母玻璃曝光方法
JP2009037203A (ja) * 2007-07-12 2009-02-19 Hoya Corp パターン形成方法、薄膜トランジスタ基板の製造方法及び液晶表示装置の製造方法、並びにフォトマスク
JP2010078769A (ja) * 2008-09-25 2010-04-08 Shin-Etsu Chemical Co Ltd フォトマスクブランクスの選択方法及び製造方法並びにフォトマスクの製造方法

Also Published As

Publication number Publication date
JP5937873B2 (ja) 2016-06-22
CN103955111A (zh) 2014-07-30
CN102736397A (zh) 2012-10-17
TW201303384A (zh) 2013-01-16
TWI461753B (zh) 2014-11-21
KR101319800B1 (ko) 2013-10-17
KR101805953B1 (ko) 2017-12-06
CN102736397B (zh) 2015-04-01
KR20130103470A (ko) 2013-09-23
JP2012230368A (ja) 2012-11-22
KR20120116875A (ko) 2012-10-23

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