CN103938257A - Multipurpose electrochemical cell device as well as electroplating and analysis method - Google Patents
Multipurpose electrochemical cell device as well as electroplating and analysis method Download PDFInfo
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- CN103938257A CN103938257A CN201410193474.2A CN201410193474A CN103938257A CN 103938257 A CN103938257 A CN 103938257A CN 201410193474 A CN201410193474 A CN 201410193474A CN 103938257 A CN103938257 A CN 103938257A
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Abstract
The invention discloses a multipurpose electrochemical cell device as well as an electroplating and analysis method. A working electrode is used as a sample, and is horizontally loaded on a horizontal plane so as to ensure that the size of electroplating areas can be accurately controlled in an electroplating process by designing the structure of an electrochemical cell; the sample can be rapidly replaced by designing a movable platform so as to improve the efficiency; the device can be suitable for performing electrochemical deposition and electrochemical analysis on certain special substrates through isolation, and also can be used for performing electrochemical analysis on the sample under atmosphere protection under the condition that the electrolyte volatilization is prevented.
Description
Technical field
The present invention relates to multipurpose electrochemical pool device, relate to specifically the multipurpose electrochemical pool device that can be used for electrochemistry plating and electrochemical analysis.
Background technology
Plating is a kind of technology of utilizing the plated film that electrolysis process carries out, can be used for preparing the thin-film material such as metal or alloy.When plating, conventionally matrix (working electrode) is dipped in electroplate liquid, profit uses it as negative electrode, and using the metallic substance of electroplated as anode.Electrolytic solution is the solution of certain density electroplated metal ion.In the situation that applying certain electric current, anode metal loses electronics and becomes metal ion transport in electrolytic solution, and the metal ion in solution moves to negative electrode, thus after electron gain, become atoms metal and be deposited on electrode surface form film.Fig. 1 has provided chief component and the principle of work of traditional plating.Electroplating system is mainly by electrochemical workstation, sample (working electrode), form electrode, reference electrode, electroplate liquid and plating tank.Wherein working electrode, is the important component part of electrolyzer to electrode and reference electrode, accesses respectively electrochemical workstation and forms three-electrode electro Chemical system.
Along with electrochemical applications extensively with deeply, researchist has also proposed increasing requirement to electrochemical cell, the performance to it and function also have more concern.In traditional electrochemistry electroplanting device, sample (working electrode) is directly immersed in electrolytic solution, and needed electrolyzer needs the larger whole sample that just can hold conventionally, so also just causes needed electrolytic solution consumption larger.In addition, as gold/sheet mica, because the bonding force between gold and sheet mica itself is not very strong, if be directly immersed in electrolytic solution, easily cause peeling off of deposited film gold for some special substrate, therefore traditional common electrolyzer is inapplicable.
Therefore, be not suitable for the problem of special substrate in order to solve common electrolyzer, a kind of multipurpose electrochemical pool device need to be provided.
Summary of the invention
In order to overcome the shortcoming and defect of prior art; the object of the present invention is to provide a kind of multipurpose electrochemical pool device of Simple compact; be applicable to some special substrates (as gold/sheet mica; gold/silicon, and can in the situation that preventing electrolytic solution volatilization, under atmosphere protection, carry out electrochemical analysis to sample (working electrode).
Object of the present invention is achieved through the following technical solutions: a first aspect of the present invention provides a kind of multipurpose electrochemical pool device, comprising:
Put the pedestal as the working electrode of sample for level;
By being fixed on two moveable platforms that pillar moves up and down of described pedestal; And
For injecting the electrolytic solution pipe that described moveable platform moves up and down that passes through of electrolytic solution.
In another preference, described electrolytic solution pipe is made with transparent material.
In another preference, also comprise plastic closure, this plastic closure seals the suitable for reading of described electrolytic solution pipe.
In another preference, described working electrode is connected with peripheral equipment by the scalable metal probe being fixed on described moveable platform.
In another preference, described peripheral equipment is electrochemical workstation and computer.
In another preference, also comprise round plastic O shape ring, this round plastic O shape is encircled sealing between described working electrode and described electrolytic solution pipe.
A second aspect of the present invention provides a kind of electrochemistry electro-plating method, utilizes the device that first aspect provides to electroplate, and the method comprises the following steps:
Working electrode level as sample is put on pedestal;
Moveable platform connects electrolytic solution pipe and moves down, and contacts with working electrode by round plastic O shape ring;
Make to seal between working electrode and electrolytic solution pipe by round plastic O shape ring;
In electrolytic solution pipe, inject electrolytic solution; And
Regulate electroplating parameter to electroplate.
A third aspect of the present invention provides a kind of electrochemical analysis method, utilizes the device that first aspect provides to analyze, and the method comprises the following steps:
Working electrode level as sample is put on pedestal;
Moveable platform connects electrolytic solution pipe and moves down, and contacts with working electrode by round plastic O shape ring;
Make to seal between working electrode and electrolytic solution pipe by round plastic O shape ring;
In electrolytic solution pipe, inject electrolytic solution and rare gas element; And
Regulate electrochemical analysis parameter to analyze.
The present invention is directed to problems of the prior art, proposed a kind of new multipurpose electrochemical pool device.
Brief description of the drawings
Fig. 1 illustrates the chief component of tradition plating and the figure of principle of work.
Fig. 2 is the figure that the electrochemical cell device while plating for electrochemistry is shown.
Fig. 3 is the figure of the electrochemical cell device while illustrating for electrochemical analysis.
Embodiment
Below in conjunction with the drawings and specific embodiments, further set forth the present invention.Should be understood that following examples are only not used in and limit the scope of the invention for the present invention is described.
Embodiment 1
Fig. 2 is the figure that the electrochemical cell device while plating for electrochemistry is shown.Electrochemical cell device comprises pedestal 1, moveable platform 2, electrolytic solution pipe 3.When this electrochemical cell device busy, be connected in peripheral equipment.Show in the drawings electrochemical workstation and computer 11 as peripheral equipment, but also can apply as required the peripheral equipment of other kinds.Pedestal 1 is made with metallic aluminum material, is formed as square, and size can be for example that length, width and height are 9 × 9 × 2cm.Moveable platform 2 is made with brass material.Electrolytic solution pipe 3 is made with transparent material, such as circular glass pipe, thereby in can clear view plating/electrochemical analysis process as the variation of the working electrode 6 of sample 9, size can be for example that internal diameter is 4.8mm, external diameter is 6.8mm.Reference electrode 8 and are copper cash to electrode 7, size can be for example that diameter is 1mm, length is 10cm.Electrolytic solution pipe 3 can move by easy on and off by moveable platform 2, thereby realizes the fast replacing of working prototype 6.Moveable platform 2 can move up and down by two pillars that are fixed on pedestal 1 itself.Working electrode 6 is by being fixed on scalable metal probe on moveable platform 2 and realizing and as the connection of electrochemical workstation and the computer 11 of peripheral equipment.
While plating, first for example,, using after the working electrode 6 (gold/sheet mica) of sample 9 lies in a horizontal plane on pedestal 1, moveable platform 2 connects electrolytic solution pipe 3 and moves down, and contacts with sample 9 by round plastic O shape ring 10.By downward pressing spring circle 4 and fixing cage knob 5, make to reach between working electrode 6 and electrolytic solution pipe 3 effect of sealing by round plastic O shape ring 10.After electrolytic solution pipe 3 seals with sample 9, to the interior injection electrolytic solution of electrolytic solution pipe 3, electrolytic solution is for example that concentration is copper sulfate (CuSO4) solution of 50mM and the sulphuric acid soln electrolytic solution of 10mM.Working electrode 6, reference electrode 8 and electrode 7 is connected to electrochemical workstation and computer 11 by lead-in wire, forms three-electrode system.Regulate electroplating parameter, for example deposition voltage or electroplating current, thus electroplate.
Embodiment 2
Fig. 3 is the figure of the electrochemical cell device while illustrating for electrochemical analysis.The structure of electrochemical cell device is basically identical with respect to embodiment 1 illustrated in fig. 2.
Similar when carrying out the process of electrochemical analysis and electroplating, difference is in electrolytic solution pipe 3, slowly to pass into rare gas element by pin mouth, for example nitrogen (1-2 bubbles per second).Electrolytic solution pipe 3 is suitable for reading to be sealed by plastic closure 13, only reserves reference electrode 8, to the outlet of electrode 7 and pin mouth.Regulate electrochemical analysis parameter, thereby under atmosphere protection, sample (working electrode 6) is carried out to electrochemical analysis in the situation that preventing electrolytic solution volatilization.
Applied after the present invention, tool has the following advantages and beneficial effect:
(1) provide a kind of electrochemistry to electroplate and the electrochemical cell device of electrochemical analysis double-purpose;
(2) plating and the electrochemical analysis of the working electrode of more applicable special substrates;
(3) can in the situation that preventing electrolytic solution volatilization, under atmosphere protection, carry out electrochemical analysis to sample (working electrode);
(4) needed electrolyte content is very little, is applicable to the deposition (needs do not configure a large amount of electrolytic solution) of some rare metals;
(5) can be at stressed uniform situation lower seal sample by moveable platform, thus the destruction of the sample surfaces causing due to unbalance stress avoided, in addition can also quick-replaceable sample, raise the efficiency;
(6) between working electrode and peripheral equipment, be connected contact by scalable metal probe, ensured good contact and fast changeable sample.
In addition should be understood that those skilled in the art can make various changes or modifications the present invention after having read above-mentioned teachings of the present invention, these equivalent form of values fall within the application's appended claims limited range equally.
Description of reference numerals
1: pedestal
2: moveable platform
3: electrolytic solution pipe
4: spring ring
5: fixing cage knob
6: working electrode
7: to electrode
8: reference electrode
9: sample
10: round plastic O shape ring
11: electrochemical workstation and computer
12: scalable metal probe
13: plastic closure.
Claims (8)
1. a multipurpose electrochemical pool device, is characterized in that, comprising:
Put the pedestal as the working electrode of sample for level;
By being fixed on two moveable platforms that pillar moves up and down of described pedestal; And
For injecting the electrolytic solution pipe that described moveable platform moves up and down that passes through of electrolytic solution.
2. multipurpose electrochemical pool device as claimed in claim 1, is characterized in that,
Described electrolytic solution pipe is made with transparent material.
3. multipurpose electrochemical pool device as claimed in claim 1, is characterized in that,
Also comprise plastic closure, this plastic closure seals the suitable for reading of described electrolytic solution pipe.
4. multipurpose electrochemical pool device as claimed in claim 3, is characterized in that,
Described working electrode is connected with peripheral equipment by the scalable metal probe being fixed on described moveable platform.
5. multipurpose electrochemical pool device as claimed in claim 4, is characterized in that,
Described peripheral equipment is electrochemical workstation and computer.
6. multipurpose electrochemical pool device as claimed in claim 4, is characterized in that,
Also comprise round plastic O shape ring, this round plastic O shape is encircled sealing between described working electrode and described electrolytic solution pipe.
7. an electrochemistry electro-plating method, is characterized in that,
Use multipurpose electrochemical pool device as claimed in claim 6 to electroplate, the method comprises the following steps:
Working electrode level as sample is put on pedestal;
Moveable platform connects electrolytic solution pipe and moves down, and contacts with working electrode by round plastic O shape ring;
Make to seal between working electrode and electrolytic solution pipe by round plastic O shape ring;
In electrolytic solution pipe, inject electrolytic solution; And
Regulate electroplating parameter to electroplate.
8. an electrochemical analysis method, is characterized in that,
Use multipurpose electrochemical pool device as claimed in claim 6 to analyze, the method comprises the following steps:
Working electrode level as sample is put on pedestal;
Moveable platform connects electrolytic solution pipe and moves down, and contacts with working electrode by round plastic O shape ring;
Make to seal between working electrode and electrolytic solution pipe by round plastic O shape ring;
In electrolytic solution pipe, inject electrolytic solution and rare gas element; And
Regulate electrochemical analysis parameter to analyze.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410193474.2A CN103938257A (en) | 2014-05-08 | 2014-05-08 | Multipurpose electrochemical cell device as well as electroplating and analysis method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410193474.2A CN103938257A (en) | 2014-05-08 | 2014-05-08 | Multipurpose electrochemical cell device as well as electroplating and analysis method |
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| CN103938257A true CN103938257A (en) | 2014-07-23 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1290310A (en) * | 1998-02-12 | 2001-04-04 | Acm研究公司 | Plating apparatus and method |
| CN1329681A (en) * | 1998-11-03 | 2002-01-02 | 纳托尔公司 | Method and apparatus for electrochemical mechanical deposition |
| CN101109094A (en) * | 2006-07-18 | 2008-01-23 | 廖彦珍 | Method of horizontally plating, electrodepositing or electrodeless plating processing on substrate |
| JP2008121062A (en) * | 2006-11-10 | 2008-05-29 | Ebara Corp | Plating device and plating method |
| CN102507429A (en) * | 2011-10-21 | 2012-06-20 | 天津大学 | Corrosion detection sensor based on electrochemistry theory |
| CN103252541A (en) * | 2013-05-06 | 2013-08-21 | 南京航空航天大学 | Device and method for manufacturing large-length-diameter-ratio nanoscale shafts |
-
2014
- 2014-05-08 CN CN201410193474.2A patent/CN103938257A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1290310A (en) * | 1998-02-12 | 2001-04-04 | Acm研究公司 | Plating apparatus and method |
| CN1329681A (en) * | 1998-11-03 | 2002-01-02 | 纳托尔公司 | Method and apparatus for electrochemical mechanical deposition |
| CN101109094A (en) * | 2006-07-18 | 2008-01-23 | 廖彦珍 | Method of horizontally plating, electrodepositing or electrodeless plating processing on substrate |
| JP2008121062A (en) * | 2006-11-10 | 2008-05-29 | Ebara Corp | Plating device and plating method |
| CN102507429A (en) * | 2011-10-21 | 2012-06-20 | 天津大学 | Corrosion detection sensor based on electrochemistry theory |
| CN103252541A (en) * | 2013-05-06 | 2013-08-21 | 南京航空航天大学 | Device and method for manufacturing large-length-diameter-ratio nanoscale shafts |
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Application publication date: 20140723 |
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