CN103934569A - Layered slicing method based on selective laser sintering - Google Patents
Layered slicing method based on selective laser sintering Download PDFInfo
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- CN103934569A CN103934569A CN201410175610.5A CN201410175610A CN103934569A CN 103934569 A CN103934569 A CN 103934569A CN 201410175610 A CN201410175610 A CN 201410175610A CN 103934569 A CN103934569 A CN 103934569A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/80—Data acquisition or data processing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/38—Process control to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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Abstract
The invention discloses a layered slicing method based on selective laser sintering. The layered slicing method based on the selective laser sintering comprises the steps of reading an STL file of a part to be machined; determining a layering direction, the maximum value and the minimum value of layering thicknesses, the maximum value of step errors and the maximum value of surface roughness; carrying out first layer slicing on triangle patches in an STL model in the layering direction; calculating the minimum layering thickness, meeting the accuracy requirement, of a next layer according to all edges of a layer plane profile polygon and all the triangle patches related to all the edges of the layer plane profile polygon; carrying out ranking processing on intersection collection sets of the corresponding layer slicing according to the thickness of the corresponding layer to obtain the contour lines of the corresponding tangent planes. According to the layered slicing method based on the selective laser sintering, the thickness of slicing can be automatically adjusted according to the surface features of a formed part, the method has the advantages of being less in calculation, short in calculating time and high in calculating efficiency, and the surface quality and the geometrical accuracy of a manufactured part can be improved significantly.
Description
Technical field
The present invention relates to rapid shaping research field, particularly relate to a kind of hierarchical slicing method based on selective laser sintering.
Background technology
Rapid shaping technique claims again RP technique, that a kind of information such as geometry, structure by parts is set up digitized description model, then these information are outputed to computer-controlled dynamo-electric integrated manufacturing system, by pointwise, by line, carry out the three-dimensional packing moulding of material by face, thereby reach the modernization method of manufacturing quickly and accurately actual parts.Because rapid shaping is processed according to cross section profile from level to level, therefore, before processing must with hierarchy slicing software by threedimensional model the short transverse along moulding, carry out hierarchy slicing processing every certain thickness, to extract the profile in cross section.
According to rapid shaping principle, be processed as example with laser forming, laser scanning line scans sintering by synusia figure to dusty material, forms cylindricality synusia taking this figure as cross section, and the synusia shape of actual 3D solid between this cylindricality synusia and two adjacent sections is differentiated.In the time that lift height is excessive, the feature of some point, line, surface on the 3D solid between two sections will lose, and formed precision reduces.When the part that is simultaneously inclined plane to contour surface is carried out layering, along with the increase of lift height, step error strengthens thereupon, will have a strong impact on the surface quality of workpiece.If it is too little that lift height is got, although can improve formed precision, working (machining) efficiency is by influenced.Therefore choosing of lift height should, considering how to retain preferably fine feature on 3D solid, meeting under the prerequisite of surface quality requirement, adopt larger bed thickness as far as possible.For a formation system, in the time that specific moulding material is carried out to sintering, the restriction of choosing a maximum sintering thickness (by the decision such as character and laser power, sweep speed of material) and minimum sintering thickness (granularity by material determines) of bed thickness.
Existing various rapidform machines are all with hierarchy slicing software at present, and its slice thickness is all definite value conventionally.That is to say, no matter workpiece, in the difference of the complex-shaped degree of differing heights, all carries out slicing treatment according to identical bed thickness.The fairly simple easy realization of this method, still, in the time that selected bed thickness is larger, easily causes the error that profiled member is larger, when selected bed thickness hour, the precision height of profiled member, but the time of moulding is just long, shaping efficiency step-down.
Summary of the invention
Goal of the invention: the present invention aims to provide effective hierarchical slicing method of the adaptivity that a kind of operand is few, computing time is short, computational efficiency is high, the method is according to the surface characteristics of profiled member, the thickness that can automatically regulate section, can significantly improve product surface quality and geometrical accuracy.
Technical scheme: a kind of hierarchical slicing method based on selective laser sintering, it is characterized in that, comprise the following steps:
(1) read the stl file of part to be processed;
(2) determine maximin, the maximum of step error and the maximum of surface roughness of fabrication orientation, lift height;
(3) tri patch in STL model is carried out on fabrication orientation to ground floor section;
(4), according to each limit and relative each tri patch of layer plane outline polygon, calculate lower one deck and meet the minimum lift height of required precision;
(5) sort and process the outline line that obtains this section according to every thick intersection point set group to this layer of section layer by layer.
In described step (4), the concrete steps that the lower one deck of calculating meets the minimum lift height of required precision are:
If the minimum and maximum coordinate figure of the tri patch of STL model on fabrication orientation is respectively Z
maxand Z
min, the step error maximum of permission is δ
max, surface roughness extreme value is R
b, maximum sintering thickness and the minimum sintering thickness of every layer are respectively h
maxand h
min,
The aspect that to suppose at floor height be Z, a tri patch F is crossing with section S, and two end points coordinates of its intersection are P
1(x
1, y
1, z
1) and P
2(x
2, y
2, z
1), the mid point P of its intersection
0(x
0, y
0, z
0) coordinate can try to achieve by following formula:
x
0＝(x
1+x
2)/2；
y
0＝(y
1+y
2)/2；
z
0＝z
1＝z
2＝z；
To remove P
1p
2outside any point P
0make a perspective plane M, this plane and P
1p
2vertically, through P
0point, some normal equation that thus can this plane:
(x
2-x
1)(x-x
0)+(y
2-y
1)(y-y
0)＝0；
By admissible maximum step error δ
maxthe maximum lift height can this tri patch F allowing:
h
tmax1＝δ
max/cosθ；
Wherein θ is the angle of tri patch F and sliced surfaces S;
By the maximum R of admissible surface roughness
bcan obtain the maximum lift height that tri patch F allows:
h
tmax2＝(R
b+2.04067-0.22α+0.001368α
2)/0.06722；
Wherein α is the angle of tri patch F and Surface by Tangent Plane Method S vector;
Calculate the upper intersection point P of M plane and tri patch F
3(x
3, y
3, z
3), intersection point apart from the distance of section S is:
h
tmax3＝z
3-z；
Get h
t=min{h
tmax1, h
tmax2, h
tmax3,
If h
t> h
min, utilize point, face, the limit topological relation of 3D solid to find the tri patch adjacent with tri patch F, and continue to calculate the lift height of adjacent triangular faces, and and h
minand h
maxcompare, if all h
tall at h
minand h
maxbetween, get h
tminfor the thickness of lower one deck section;
If h
t≤ h
min, stop calculating, get h
minfor the thickness of lower one deck section;
If travel through this layer of all crossing tri patch, the h obtaining
tall be more than or equal to h
max, get h
maxfor the thickness of lower one deck section.
In described step (5) according to every thick intersection point set group to this layer of section layer by layer concrete steps that processing obtains the outline line in this section that sorts be: obtained down thickly from level to level by step (4), find a tri patch F crossing with lower one deck section
0{ C}, tries to achieve two crossing intersection points, finds and tri patch F according to topological relation for A, B
0adjacent tri patch F
1, and try to achieve next intersection point, travel through successively this layer of all crossing tri patch until arrive first tri patch F
0finish, obtain the outline line of this layer of section.
Beneficial effect: the present invention is in the time determining the lift height of lower one deck, do not need trial cut process repeatedly, only need to utilize the apex coordinate on each limit on current synusia polygonal cross-section profile, and the topology information on the point of the tri patch corresponding relation relevant to each limit and 3D solid, face, limit, just can directly calculate lower one deck and meet the lift height of layering required precision (step error and surface roughness), simplify calculating, improved computational efficiency.The thickness of cutting into slices by self adaptation adjustment is controlled speed and the precision of moulding, thereby can effectively enhance productivity and the quality of production, especially for the profiled member of complicated structure, ensureing that under the prerequisite of shaping speed, the precision of workpiece is greatly improved.
Brief description of the drawings
Fig. 1 is schematic flow sheet of the present invention;
Fig. 2 is part tri patch model structure figure of the present invention;
Fig. 3 be of the present invention by adaptive layered the bed thickness schematic diagram after cutting into slices;
Fig. 4 is the two-dimensional representation of bed thickness of the present invention.
Detailed description of the invention
As shown in Figure 1,2,3, 4, a kind of hierarchical slicing method based on selective laser sintering, comprises the following steps:
(1) read the stl file being generated by CAD part drawing to be processed;
(2) determine maximin, the maximum of step error and the maximum of surface roughness of fabrication orientation, lift height;
(3) tri patch in STL model is carried out on fabrication orientation to ground floor section;
(4) according to each limit and relative each tri patch of layer plane outline polygon, calculate lower one deck and meet the minimum lift height of required precision, concrete steps are:
If the minimum and maximum coordinate figure of the tri patch of STL model on fabrication orientation is respectively Z
maxand Z
min, the step error maximum of permission is δ
max, surface roughness extreme value is R
b, maximum sintering thickness and the minimum sintering thickness of every layer are respectively h
maxand h
min,
The aspect that to suppose at floor height be Z, a tri patch F is crossing with section S, and two end points coordinates of its intersection are P
1(x
1, y
1, z
1) and P
2(x
2, y
2, z
1), the mid point P of its intersection
0(x
0, y
0, z
0) coordinate can try to achieve by following formula:
x
0＝(x
1+x
2)/2；
y
0＝(y
1+y
2)/2；
z
0＝z
1＝z
2＝z；
To remove P
1p
2outside any point P
0make a perspective plane M, this plane and P
1p
2vertically, through P
0point, some normal equation that thus can this plane:
(x
2-x
1)(x-x
0)+(y
2-y
1)(y-y
0)＝0；
By admissible maximum step error δ
maxthe maximum lift height can this tri patch F allowing:
h
tmax1＝δ
max/cosθ；
Wherein θ is the angle of tri patch F and sliced surfaces S;
By the maximum R of admissible surface roughness
bcan obtain the maximum lift height that tri patch F allows:
h
tmax2＝(R
b+2.04067-0.22α+0.001368α
2)/0.06722；
Wherein α is the angle of tri patch F and Surface by Tangent Plane Method S vector;
Calculate the upper intersection point P of M plane and tri patch F
3(x
3, y
3, z
3), intersection point apart from the distance of section S is:
h
tmax3＝z
3-z；
Get h
t=min{h
tmax1, h
tmax2, h
tmax3,
If h
t> h
min, utilize point, face, the limit topological relation of 3D solid to find the tri patch adjacent with tri patch F, and continue to calculate the lift height of adjacent triangular faces, and and h
minand h
maxcompare, if all h
tall at h
minand h
maxbetween, get h
tminfor the thickness of lower one deck section;
If h
t≤ h
min, stop calculating, get h
minfor the thickness of lower one deck section;
If travel through this layer of all crossing tri patch, the h obtaining
tall be more than or equal to h
max, get h
maxfor the thickness of lower one deck section.
(5) according to every thick intersection point set group to this layer of section layer by layer, the processing of sort obtains the outline line in this section, and concrete steps are: obtained down thickly from level to level by step (4), find a tri patch F crossing with lower one deck section
0{ C}, tries to achieve two crossing intersection points, finds and tri patch F according to topological relation for A, B
0adjacent tri patch F
1, and try to achieve next intersection point, travel through successively this layer of all crossing tri patch until arrive first tri patch F
0finish, obtain the outline line of this layer of section.
The present invention, according to the surface characteristics of profiled member, can regulate the thickness of section automatically, has advantages of that operand is few, computing time is short, computational efficiency is high, and can significantly improve product surface quality and geometrical accuracy.In the time determining the lift height of lower one deck, do not need trial cut process repeatedly, only need to utilize the apex coordinate on each limit on current synusia polygonal cross-section profile, and the topology information on the point of the tri patch corresponding relation relevant to each limit and 3D solid, face, limit, just can directly calculate lower one deck and meet the lift height of layering required precision (step error and surface roughness), simplify calculating, improved computational efficiency.The thickness of cutting into slices by self adaptation adjustment is controlled speed and the precision of moulding, thereby can effectively enhance productivity and the quality of production, especially for the profiled member of complicated structure, ensureing that under the prerequisite of shaping speed, the precision of workpiece is greatly improved.
Claims (3)
1. the hierarchical slicing method based on selective laser sintering, is characterized in that, comprises the following steps:
(1) read the stl file of part to be processed;
(2) determine maximin, the maximum of step error and the maximum of surface roughness of fabrication orientation, lift height;
(3) tri patch in STL model is carried out on fabrication orientation to ground floor section;
(4), according to each limit and relative each tri patch of layer plane outline polygon, calculate lower one deck and meet the minimum lift height of required precision;
(5) sort and process the outline line that obtains this section according to every thick intersection point set group to this layer of section layer by layer.
2. the hierarchical slicing method based on selective laser sintering according to claim 1, is characterized in that, in described step (4), the concrete steps that the lower one deck of calculating meets the minimum lift height of required precision are:
If the minimum and maximum coordinate figure of the tri patch of STL model on fabrication orientation is respectively Z
maxand Z
min, the step error maximum of permission is δ
max, surface roughness extreme value is R
b, maximum sintering thickness and the minimum sintering thickness of every layer are respectively h
maxand h
min,
The aspect that to suppose at floor height be Z, a tri patch F is crossing with section S, and two end points coordinates of its intersection are P
1(x
1, y
1, z
1) and P
2(x
2, y
2, z
1), the mid point P of its intersection
0(x
0, y
0, z
0) coordinate can try to achieve by following formula:
x
0＝(x
1+x
2)/2；
y
0＝(y
1+y
2)/2；
z
0＝z
1＝z
2＝z；
To remove P
1p
2outside any point P
0make a perspective plane M, this plane and P
1p
2vertically, through P
0point, some normal equation that thus can this plane:
(x
2-x
1)(x-x
0)+(y
2-y
1)(y-y
0)＝0；
By admissible maximum step error δ
maxthe maximum lift height can this tri patch F allowing:
h
tmax1＝δ
max/cosθ；
Wherein θ is the angle of tri patch F and sliced surfaces S;
By the maximum R of admissible surface roughness
bcan obtain the maximum lift height that tri patch F allows:
h
tmax2＝(R
b+2.04067-0.22α+0.001368α
2)/0.06722；
Wherein α is the angle of tri patch F and Surface by Tangent Plane Method S vector;
Calculate the upper intersection point P of M plane and tri patch F
3(x
3, y
3, z
3), intersection point apart from the distance of section S is:
h
tmax3＝z
3-z；
Get h
t=min{h
tmax1, h
tmax2, h
tmax3,
If h
t> h
min, utilize point, face, the limit topological relation of 3D solid to find the tri patch adjacent with tri patch F, and continue to calculate the lift height of adjacent triangular faces, and and h
minand h
maxcompare, if all h
tall at h
minand h
maxbetween, get h
tminfor the thickness of lower one deck section;
If h
t≤ h
min, stop calculating, get h
minfor the thickness of lower one deck section;
If travel through this layer of all crossing tri patch, the h obtaining
tall be more than or equal to h
max, get h
maxfor the thickness of lower one deck section.
3. the hierarchical slicing method based on selective laser sintering according to claim 1, it is characterized in that, in described step (5) according to every thick intersection point set group to this layer of section layer by layer concrete steps that processing obtains the outline line in this section that sorts be: obtained down thickly from level to level by step (4), find a tri patch F crossing with lower one deck section
0{ C}, tries to achieve two crossing intersection points, finds and tri patch F according to topological relation for A, B
0adjacent tri patch F
1, and try to achieve next intersection point, travel through successively this layer of all crossing tri patch until arrive first tri patch F
0finish, obtain the outline line of this layer of section.
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Cited By (6)
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| CN104503711A (en) * | 2014-11-17 | 2015-04-08 | 杭州先临三维科技股份有限公司 | Self-adaption layering method of 3D printing |
| CN105149791A (en) * | 2015-08-07 | 2015-12-16 | 武汉嘉铭激光有限公司 | Large-breadth laser etching system and control method |
| CN106925782A (en) * | 2017-01-19 | 2017-07-07 | 南京航空航天大学 | A kind of LMD laser manufacturing process based on bionic function |
| CN107671286A (en) * | 2017-09-26 | 2018-02-09 | 北京恒创增材制造技术研究院有限公司 | A kind of method for improving metal 3D printing speed |
| WO2019228278A1 (en) * | 2018-05-31 | 2019-12-05 | 共享智能铸造产业创新中心有限公司 | Layer-thickness variable slicing method, 3d printing method and 3d printed product |
| CN110889902A (en) * | 2018-09-11 | 2020-03-17 | 北京京东尚科信息技术有限公司 | Three-dimensional modeling method and device |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104503711A (en) * | 2014-11-17 | 2015-04-08 | 杭州先临三维科技股份有限公司 | Self-adaption layering method of 3D printing |
| CN104503711B (en) * | 2014-11-17 | 2017-10-20 | 杭州先临三维科技股份有限公司 | A kind of adaptive layered method of 3D printing |
| CN105149791A (en) * | 2015-08-07 | 2015-12-16 | 武汉嘉铭激光有限公司 | Large-breadth laser etching system and control method |
| CN106925782A (en) * | 2017-01-19 | 2017-07-07 | 南京航空航天大学 | A kind of LMD laser manufacturing process based on bionic function |
| CN106925782B (en) * | 2017-01-19 | 2019-08-02 | 南京航空航天大学 | A kind of LMD laser manufacturing process based on bionic function |
| CN107671286A (en) * | 2017-09-26 | 2018-02-09 | 北京恒创增材制造技术研究院有限公司 | A kind of method for improving metal 3D printing speed |
| CN107671286B (en) * | 2017-09-26 | 2019-06-14 | 北京恒创增材制造技术研究院有限公司 | A method of improving metal 3D printing speed |
| WO2019228278A1 (en) * | 2018-05-31 | 2019-12-05 | 共享智能铸造产业创新中心有限公司 | Layer-thickness variable slicing method, 3d printing method and 3d printed product |
| CN110889902A (en) * | 2018-09-11 | 2020-03-17 | 北京京东尚科信息技术有限公司 | Three-dimensional modeling method and device |
| CN110889902B (en) * | 2018-09-11 | 2024-01-12 | 北京京东尚科信息技术有限公司 | Three-dimensional modeling method and device |
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