CN103934567A - Laser machining system and method thereof - Google Patents
Laser machining system and method thereof Download PDFInfo
- Publication number
- CN103934567A CN103934567A CN201310021789.4A CN201310021789A CN103934567A CN 103934567 A CN103934567 A CN 103934567A CN 201310021789 A CN201310021789 A CN 201310021789A CN 103934567 A CN103934567 A CN 103934567A
- Authority
- CN
- China
- Prior art keywords
- laser
- machined surface
- rapidoprint
- unit
- fixture block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Plasma & Fusion (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention provides a laser machining system and a method thereof. According to the system, a laser shoots into a first machining surface of a machining material, penetrates out from a second machining surface of the machining material, is reflected to the second machining surface, and is focused on the second machining surface, and a focus is formed.
Description
Technical field
The present invention relates to a kind of apparatus and method that use laser to carry out materials processing.
Background technology
In electronic product now, its trend adopts glass as dielectric material (Interposer) in, thus the following process mode of this glass, as boring, in the middle of it is just being discussed by ardent research.
Have now a kind of newer glass drilling mode, it adopts respectively processing mode of two sides, or simultaneously with dual system respectively by the two sides bright dipping of glass, to process.
From the above, if two sides processing mode respectively, the one side of the glass that can process in advance, the another side of reprocessing glass, and this two machined surface is combined, to form a perforation; If dual system processing mode, is the dual system two sides of processed glass simultaneously, and this two machined surface is combined, to form a perforation; As previously mentioned, these two kinds of processing modes all have and are difficult for the shortcoming of aiming at, and this dual system has more the shortcoming of system complex, therefore still have can improved space for existing glass drilling mode.
Summary of the invention
Because above-mentioned shortcoming, the object of the present invention is to provide a kind of laser processing device and method thereof, it utilizes a reflector element, and make laser penetrate a rapidoprint after focus on again the back side of this rapidoprint.
After the present invention can realize and penetrate rapidoprint, then focused on the object on rapidoprint surface by outside.
The present invention can be used in respectively positive processing and above-mentioned backside reflection processing via adjusting the Laser Focusing degree of depth, and have and be easy to aim at two sides Working position, and the advantage of the complicated degree of simplification device.
For achieving the above object, the technical solution used in the present invention comprises:
A kind of laser processing, is characterized in that, it includes:
One laser is injected one first machined surface of a rapidoprint, and is passed by one second machined surface of this rapidoprint, and this laser is through reflexing to this second machined surface, and focuses on this second machined surface, to form a focus.
Described laser processing, wherein: further have and treat that this second machined surface has had one second working depth, this Laser Focusing is in this first machined surface, to form a focus; And
Treat that this first machined surface has had one first working depth, this first working depth is combined with this second plus depth, to form a perforation.
Described laser processing, wherein: this laser reflexes to this second machined surface through a reflector element, and this laser is produced by a laser cell.
Described laser processing, wherein: this rapidoprint is a glass, the thickness of this glass is less than 1000 microns, and the aperture of this perforation is less than 500 microns, and this sharp light wavelength is 300 to 2000 nanometers.
For achieving the above object, the technical solution used in the present invention also comprises:
A kind of laser processing, is characterized in that, it includes:
One first machined surface of one Laser Focusing one rapidoprint, to form a focus;
Treat that this first machined surface has had one first working depth, this laser is passed by one second machined surface of this rapidoprint, and this laser is through reflexing to this second machined surface, and focuses on this second machined surface, to form a focus; And
Treat that this second machined surface has had one second working depth, this first working depth is combined with this second plus depth, to form a perforation.
Described laser processing, wherein: this laser reflexes to this second machined surface through a reflector element, and this laser is produced by a laser cell.
Described laser processing, wherein: this rapidoprint is a glass, the thickness of this glass is less than 1000 microns, and the aperture of this perforation is less than 500 microns, and this sharp light wavelength is 300 to 2000 nanometers.
For achieving the above object, the technical solution used in the present invention also comprises:
A kind of laser-processing system, is characterized in that, it includes:
One fixing unit;
One laser cell, it is located at a side of this fixing unit; And
One reflector element, it is with respect to this laser cell.
Described laser processing, wherein: further there is at least one jaw unit, this jaw unit is with respect to this laser cell, this jaw unit has one first fixture block and one second fixture block, this first fixture block and this second fixture block are toward each other, this first fixture block and this second fixture block toward each other, and couple respectively an air pressure unit.
Described laser-processing system, wherein: further have a visual unit, this visual unit is located at a side of this fixing unit.
Described laser-processing system, wherein: this laser cell is an angle of inclination with respect to this reflector element; Or this reflector element relatively this laser cell is an angle of inclination.
Described laser-processing system, wherein: the two ends of this fixing unit have respectively at least one opening, the opening of its one end couples the unit of bleeding.
Comprehensively above-mentioned, the more existing device of device provided by the invention is more simple and easy, therefore can reduce the complicated degree of single unit system.
The present invention is laser penetration rapidoprint, and focuses on the back side of rapidoprint, then relies on and control the degree of depth focusing on, to realize two sides processing, and internal breakdown, and maintain the high-quality of two sides opening.
Reflector element of the present invention, it can make rapidoprint be positioned at the out of focus degree of depth, reduces the energy density of laser penetration rapidoprint, then focuses on the material back side via reflector element, and then avoid the inner generation of rapidoprint explosion reaction.
Brief description of the drawings
Fig. 1 is the schematic diagram of the first embodiment of a kind of laser processing device of the present invention;
Fig. 2 is the schematic diagram of the second embodiment of a kind of laser processing device of the present invention;
Fig. 3 is the position view of a laser cell of the present invention, a rapidoprint, a reflector element;
Fig. 4 is the another position view of laser cell of the present invention, rapidoprint, reflector element;
Fig. 5 is a position view again of laser cell of the present invention, rapidoprint, reflector element.
Description of reference numerals: 10 laser cells; 11 visual unit; 12 jaw unit; 120 first fixture blocks; 121 second fixture blocks; 13 reflecting units; 14 fixing unit; 140 openings; 15 unit of bleeding; 16 rapidoprints; 17 air pressure unit; 20 laser cells; 21 visual unit; 22 jaw unit; 220 first fixture blocks; 221 second fixture blocks; 23 reflecting units; 24 fixing unit; 240 openings; 25 unit of bleeding; 26 rapidoprints; 27 air pressure unit; 30 laser cells; 31 laser; 32 rapidoprints; 320 first machined surfaces; 321 second machined surfaces; 33 focuses; 34 reflector elements; 40 laser cells; 41 laser; 42 rapidoprints; 420 first machined surfaces; 421 second machined surfaces; 43 focuses; 44 reflector elements; 50 laser cells; 51 laser; 52 rapidoprints; 520 first machined surfaces; 521 second machined surfaces; 53 focuses; 54 reflector elements; θ angle of inclination; θ 1 angle of inclination; θ 2 angles of inclination.
Detailed description of the invention
Below rely on particular specific embodiment explanation the specific embodiment of the present invention, in affiliated technical field, have and conventionally know that the knowledgeable can be by content disclosed in the present specification, understand easily other advantages of the present invention and effect.
Please coordinate with reference to shown in figure 1, the present invention is a kind of the first embodiment of laser-processing system, and it has a laser cell 10, a visual unit 11, at least one jaw unit 12, a reflecting unit 13, a fixing unit 14, bleed unit 15 and an air pressure unit 17.
Laser cell 10 and visual unit 11 are located at a side of fixing unit 14.
Jaw unit 12 is with respect to laser cell 10, jaw unit 12 is selective setting, jaw unit 12 has one first fixture block 120 and one second fixture block 121, the first fixture block 120 and the second fixture block 121 are toward each other, the first fixture block 120 and the second fixture block 121 are toward each other, and coupling respectively air pressure unit 17, air pressure unit 17 is an air delivery pump.
Reflecting unit 13 is with respect to laser cell 10, and reflecting unit 13 can be a speculum.
The top of fixing unit 14 and bottom have respectively at least one opening 140, and fixed cell 14 is fixing one rapidoprint 16 selectively.
The bottom of fixing unit 14 is located in the unit 15 of bleeding, and couples opening 140.
Please coordinate with reference to shown in figure 2 the second embodiment of laser-processing system of the present invention.
Laser cell 20 and visual unit 21 are located at one end of fixing unit 24.
Jaw unit 22 is with respect to laser cell 20, and jaw unit 22 has one first fixture block 220 and one second fixture block 221, the first fixture blocks 220 and the second fixture block 221 toward each other, and couples respectively air pressure unit 27, and air pressure unit 27 is an air delivery pump.
Reflecting unit 23 is with respect to laser cell 20, and reflecting unit 23 can be a speculum.
The both sides of fixing unit 24 have respectively at least one opening 240, and fixed cell 24 is fixing one rapidoprint 26 selectively.
A side of fixing unit 24 is located in the unit 25 of bleeding, and couples opening 240.
The present invention is a kind of laser processing, and it has:
Laser-processing system is as shown in Figure 1 a longitudinal system, the edge of one rapidoprint 16 is fixed by fixing unit 14, and rapidoprint 16 can be subject to the impact of gravity, with the state of being kept upright, this rapidoprint 16 is a glass, and the thickness of this glass is less than 1000 microns.
The selective jaw unit 12 arranging can be in the time of laser cell 10 start, and clamping rapidoprint 16, with the action of holing.In the time of jaw unit 12 clamping rapidoprint 16, the first fixture block 120 has a distance with the surface of rapidoprint 16, the second fixture block 121 has a distance with the surface of rapidoprint 16, air pressure unit 17 provides respectively an air pressure to the first fixture block 120 and the second fixture block 121, and this air pressure is used for clamping rapidoprint 16.
Laser-processing system is as shown in Figure 2 a horizontal system, rapidoprint 26 itself is subject to the impact of gravity, rapidoprint 26 is likely not sagging towards a direction by the part of fixing unit 24 fixings, therefore jaw unit 22 clamps rapidoprint 26, to prevent that rapidoprint 26 is subject to the impact of gravity and sagging, the first fixture block 120 of making flowing mode Fig. 1 described above and second fixture block 121 of the first fixture block 220 and the second fixture block 221.
Please coordinate with reference to shown in figure 3, laser cell 30 produces a laser 31, this laser 31 is through one first machined surface 320 of rapidoprint 32, and passed by one second machined surface 321, the laser 31 that this passes is through second machined surface 321 that reflexes to of reflector element 34, and produce a focus 33 at the second machined surface 321, be the reflection of laser 31 through reflector element 34, and focus on the second machined surface 321, to produce this focus 33, the first machined surface 320 is with respect to the second machined surface 321, and this sharp light wavelength is 300 to 2000 nanometers.
Please coordinate with reference to shown in figure 4, laser cell 40 is a tilt angle theta with respect to rapidoprint 42, or laser cell 40 is a tilt angle theta with respect to reflector element 42, this tilt angle theta is 0 degree to 90 degree, as mentioned above, laser 41 passes the first machined surface 420 of rapidoprint 42, and is passed by the second machined surface 421, the laser 41 that this passes is through second machined surface 421 that reflexes to of reflector element 44, and produces a focus 43 at the second machined surface 421.
Please coordinate with reference to shown in figure 5, reflector element 54 is a tilt angle theta 1 with respect to rapidoprint 52, or reflector element 54 is a tilt angle theta 1 with respect to laser cell 50, or laser cell 50 is a tilt angle theta 2 with respect to reflector element 54 or rapidoprint 52, this tilt angle theta 1, θ 2 is 0 degree to 90 degree, as mentioned above, the laser 51 that laser cell 50 produces is through the first machined surface 520 of rapidoprint 52, and passed by the second machined surface 521, the laser 51 that this passes is through second machined surface 521 that reflexes to of reflector element 54, and produce a focus 53 at the second machined surface 521.
Please coordinate with reference to shown in figure 3, this focus 33 can be controlled again, so that it is formed at the second machined surface 321, the inside of this rapidoprint 32 or first machined surface 320 of this rapidoprint 32 of this rapidoprint 32.
The second machined surface 321 of material 32 to be processed has been machined to after one second working depth, adjust the position of focus 33, and make laser 33 focus on the first machined surface 320, when the first machined surface 320 has been machined to after one first working depth, this first working depth can combine with this second working depth, to form a perforation, the aperture of this perforation is less than 500 microns.
As shown in Figure 1, in the time that laser cell 10 moves, the processing dust that the unit 15 of bleeding can produce rapidoprint detaches.
Visual unit 11 is observed respectively the action of laser and the position of above-mentioned focus of laser cell 10, with calibration of laser unit 10.
Above-mentioned laser processing, it also can be by above-mentioned action reversed operation, because of graphic approximate, therefore describe with Fig. 3.
As shown in Figure 3, laser 31 focuses on the first machined surface 320 of rapidoprint 32, to form a focus 33.
Treat that this first machined surface 320 has had one first working depth, laser 31 is passed by one second machined surface 321 of rapidoprint 32, and laser 31 reflexes to the second machined surface 321 through reflector element 34, and focuses on the second machined surface 321, to form a focus 33.
Treat that the second machined surface 321 has had one second working depth, the first working depth is combined with the second plus depth, to form a perforation.
As shown in Figure 2, if will carry out the moulding of another perforation, fixing unit 24 can move to next bore position by rapidoprint 26, jaw unit 22 also thereby can change its position with respect to rapidoprint 26, to provide rapidoprint 26 1 suitable support.
Comprehensively above-mentioned, the present invention is used in a reflector element, to reduce the energy density of laser penetration rapidoprint, and then avoids inner generation of rapidoprint to react, i.e. explosion reaction.
The present invention makes laser penetration rapidoprint, and focuses on the second machined surface of rapidoprint, i.e. the back side of rapidoprint, then rely on and control the degree of depth focusing on, and to realize two sides processing, internal breakdown, and maintain the high-quality of two sides opening.
More than explanation is just illustrative for the purpose of the present invention; and nonrestrictive, those of ordinary skill in the art understand, in the case of not departing from the spirit and scope that claim limits; can make many amendments, variation or equivalence, but within all will falling into protection scope of the present invention.
Claims (12)
1. a laser processing, is characterized in that, it includes:
One laser is injected one first machined surface of a rapidoprint, and is passed by one second machined surface of this rapidoprint, and this laser is through reflexing to this second machined surface, and focuses on this second machined surface, to form a focus.
2. laser processing according to claim 1, is characterized in that: further have and treat that this second machined surface has had one second working depth, this Laser Focusing is in this first machined surface, to form a focus; And
Treat that this first machined surface has had one first working depth, this first working depth is combined with this second plus depth, to form a perforation.
3. laser processing according to claim 1, is characterized in that: this laser reflexes to this second machined surface through a reflector element, and this laser is produced by a laser cell.
4. laser processing according to claim 1, is characterized in that: this rapidoprint is a glass, and the thickness of this glass is less than 1000 microns, and the aperture of this perforation is less than 500 microns, and this sharp light wavelength is 300 to 2000 nanometers.
5. a laser processing, is characterized in that, it includes:
One first machined surface of one Laser Focusing one rapidoprint, to form a focus;
Treat that this first machined surface has had one first working depth, this laser is passed by one second machined surface of this rapidoprint, and this laser is through reflexing to this second machined surface, and focuses on this second machined surface, to form a focus; And
Treat that this second machined surface has had one second working depth, this first working depth is combined with this second plus depth, to form a perforation.
6. laser processing according to claim 5, is characterized in that: this laser reflexes to this second machined surface through a reflector element, and this laser is produced by a laser cell.
7. laser processing according to claim 5, is characterized in that: this rapidoprint is a glass, and the thickness of this glass is less than 1000 microns, and the aperture of this perforation is less than 500 microns, and this sharp light wavelength is 300 to 2000 nanometers.
8. a laser-processing system, is characterized in that, it includes:
One fixing unit;
One laser cell, it is located at a side of this fixing unit; And
One reflector element, it is with respect to this laser cell.
9. laser-processing system according to claim 8, it is characterized in that: further there is at least one jaw unit, this jaw unit is with respect to this laser cell, this jaw unit has one first fixture block and one second fixture block, this first fixture block and this second fixture block are toward each other, this first fixture block and this second fixture block toward each other, and couple respectively an air pressure unit.
10. laser-processing system according to claim 8, is characterized in that: further have a visual unit, this visual unit is located at a side of this fixing unit.
11. laser-processing systems according to claim 8, is characterized in that: this laser cell is an angle of inclination with respect to this reflector element; Or this reflector element relatively this laser cell is an angle of inclination.
12. laser-processing systems according to claim 8, is characterized in that: the two ends of this fixing unit have respectively at least one opening, and the opening of its one end couples the unit of bleeding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310021789.4A CN103934567A (en) | 2013-01-21 | 2013-01-21 | Laser machining system and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310021789.4A CN103934567A (en) | 2013-01-21 | 2013-01-21 | Laser machining system and method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103934567A true CN103934567A (en) | 2014-07-23 |
Family
ID=51182582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310021789.4A Pending CN103934567A (en) | 2013-01-21 | 2013-01-21 | Laser machining system and method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103934567A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110798976A (en) * | 2018-08-01 | 2020-02-14 | 宏启胜精密电子(秦皇岛)有限公司 | Method for manufacturing through hole |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133992A (en) * | 1983-12-21 | 1985-07-17 | Canon Inc | Piercing device for printed circuit board |
| CN102152002A (en) * | 2011-01-21 | 2011-08-17 | 明基材料有限公司 | Laser cutting equipment and cutting method |
| CN102489873A (en) * | 2011-11-16 | 2012-06-13 | 中国科学院上海光学精密机械研究所 | Method for preparing three-dimensional microfluidic channel inside porous glass |
| CN102610711A (en) * | 2011-01-25 | 2012-07-25 | 三星钻石工业股份有限公司 | Method for manufacturing LED chip |
| CN102785031A (en) * | 2012-08-15 | 2012-11-21 | 武汉隽龙科技有限公司 | Method and device for cutting transparent material by using ultra-short pulse laser |
-
2013
- 2013-01-21 CN CN201310021789.4A patent/CN103934567A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133992A (en) * | 1983-12-21 | 1985-07-17 | Canon Inc | Piercing device for printed circuit board |
| CN102152002A (en) * | 2011-01-21 | 2011-08-17 | 明基材料有限公司 | Laser cutting equipment and cutting method |
| CN102610711A (en) * | 2011-01-25 | 2012-07-25 | 三星钻石工业股份有限公司 | Method for manufacturing LED chip |
| CN102489873A (en) * | 2011-11-16 | 2012-06-13 | 中国科学院上海光学精密机械研究所 | Method for preparing three-dimensional microfluidic channel inside porous glass |
| CN102785031A (en) * | 2012-08-15 | 2012-11-21 | 武汉隽龙科技有限公司 | Method and device for cutting transparent material by using ultra-short pulse laser |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110798976A (en) * | 2018-08-01 | 2020-02-14 | 宏启胜精密电子(秦皇岛)有限公司 | Method for manufacturing through hole |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103025473B (en) | Base plate processing method | |
| CN103025478A (en) | Substrate processing method | |
| CN103433624B (en) | The laser scribe processing method of a kind of ceramic substrate and system | |
| EP3127673B1 (en) | Method for cutting brittle-material substrate | |
| US9776285B2 (en) | Double-directional machining laser machine tool | |
| CN102310285B (en) | Laser processing device of silicon glass bonding slice and method thereof | |
| CN102000917B (en) | LED wafer laser inner cutting and scribing device | |
| CN102229466B (en) | Method and device for performing nano-second laser cutting on glass | |
| CN104526892A (en) | Wafer cutting device | |
| CN104625438A (en) | Method for manufacturing micro channel by combining laser polarization selective ablation with acid etching | |
| CN105014243A (en) | Carbon dioxide laser cutting machine | |
| CN105743026B (en) | Laser wire stripping device | |
| CN205342223U (en) | Mixed cutting machine of laser | |
| CN109396661A (en) | One kind being used for CO2The processing method of laser aiming optical fiber processing aluminium oxide ceramics | |
| US20130063680A1 (en) | Backlight Module and Liquid Crystal Display | |
| CN103934567A (en) | Laser machining system and method thereof | |
| CN105149797A (en) | Laser drilling machine used for drilling metal plate | |
| US9867276B2 (en) | Electronic device | |
| CN206643500U (en) | A kind of laser scribing system of the wafer containing medium with low dielectric constant | |
| TW201505814A (en) | Cutting apparatus | |
| CN103962727A (en) | Sapphire cutting device | |
| CN203679532U (en) | Laser cutting processing system of ceramic substrate | |
| CN108838546A (en) | Thin micro tube inner surface micro-structure laser processing | |
| CN204505584U (en) | Wafer cutting device | |
| CN109551115B (en) | Device for laser processing chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140723 |