CN103926807A - Silicon wafer aligning method - Google Patents
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Abstract
The present invention discloses a silicon wafer aligning method, which comprises: 1, inputting the position of a precise aligning coordinate point on a silicon wafer, and an upper coordinate and a lower coordinate of movement of a precise aligning process work-piece table; 2, adopting the distances between the previous working positions and the next working positions of the precise aligning process as a constraint function of the zero distance, or finding the nearest neighbor points between the previous working positions and the next working positions of the precise aligning process and connecting the nearest neighbor points so as to be adopted as the constraint function, adopting a traveling salesman algorithm to optimize, and increasing a penalty function as a weight when meeting the constraint condition; 3, adopting a search algorithm to carry out problem calculation; and 4, outputting the calculation result.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacture field, relate in particular to a kind of silicon slice alignment method for lithographic equipment.
Background technology
In litho machine field, the productive rate Throughout of complete machine is one of litho machine three large core index, constantly make great efforts to exploit potentialities for improving the each litho machine of productive rate manufacturer, in prior art, invent double-workpiece-table system, wherein overall measurement position to silicon chip on 16 alignment marks carry out fine alignment, to improve alignment precision.
In super large integrated circuit manufacture field, for solving the routing problem of complicated multiple spot punching, as a kind of in conjunction with traveling salesman problem algorithm (Traveling Sales Problem in proposed in US Patent No. 7054798, TSP) approximate treatment is carried out in single punching path in plane, obtain a machining path the shortest, improve working (machining) efficiency with this.
Can be divided into three aspects: influence factor to the research of this problem, the firstth, system trajectory and programme planning; Second is work stage exercise performance; The 3rd is Pointing strategy and monotechnics.Analyze in conjunction with basic exercise time formula T=S/V, wherein T is the needed time of motion, and S is the move distance that need to reach, and V is movement velocity.Wherein have and can be divided into two classes in conjunction with the workflow T of concrete station and operation, T1 for to move the needed time between two stations, and T2 is in a certain needed time of station work.Be T=T1+T2.
One of influence factor is system trajectory and programme planning, refers to adopt which kind of scheme and method to realize the aligning of multiple gauge points on silicon chip, and the track of their precedence and motion.Consumed time of moving between any two points in system trajectory planning belongs to T1, is between two stations and moves the needed time.
Two of influence factor is work stage exercise performance.About the background content of work stage exercise performance; can reference papers; author: Mu Haihua etc.; the point-to-point motion three rank trajectory planning precision controls of ultraprecise; " mechanical engineering journal "; Vol. 44 (1), 2008, pp.127-132. conventionally work stage motion model is planned to three rank or quadravalence model carries out emulation.As shown in fig. 1, Fig. 1 is work stage motion model concept map in litho machine.It shown in table one, is a kind of typical work stage exercise performance parameter.
Table one
For the motion of the close together (10mm-100mm) of point-to-point transmission space, according to work stage motion model and rule, according to as shown in table 1, conventionally the acceleration and deceleration between short distance are not enough to make work stage speed rising to larger movement velocity, conventionally only rise to 200 mm/s to 400mm/s in this distance segment work stage maximal rate.That is to say, in this LAP, although work stage possesses the ability (more than 1000mm/s) that reaches larger stepping rate, in fact its duty in lower movement velocity still.Herein, it needs to be noted for short distance work stage step motion, in the time of photo-etching machine exposal and the work of measurement position, the micropositioner of work stage is the process in accelerating to start and deceleration stops frequently, all for most of the time duty, the actual motion speed of work stage is not high.Work stage model to above performance decomposes and calculates, and can obtain following step-by-step system, approximate model and the curve of the corresponding run duration of move distance, as shown in Figure 2.
Three of influence factor is Pointing strategy and monotechnics.Conventionally silicon chip alignment mark has multi-motion mode, and as Video Capture mark, shown in Fig. 3, first X is to scanning then Y-direction scanning; Or then first Y-direction scans X to scanning.As shown in Figure 4, as aerial image imaging mark, or along miter angle scanning alignment mark.Because the physical size of alignment mark is minimum, be generally between 400 microns to 500 microns, and physical distance between mark compares, proportion is less than 1%, therefore the otherness that the difference of mark aligned units technology and mode of motion causes is negligible in Practical Project.
Simultaneously also because in the process of alignment scanning, the lower 3mm/s to 30mm/s that is generally of its movement velocity, this speed is less with the average velocity (400mm/s to 600mm/s) of the work stage motion numerical value of comparing, be only 4%-5%, therefore carrying out in model simplification and engineering calculation, we can suppose to be static to punctual work stage, and carry out the unit aligning of alignment mark point.Belong to T2 in technical the consumed time of aligned units, be in a certain needed time of station work.
As shown in Figure 5, this alignment methods specifically comprises for the silicon chip fine alignment flow process using in prior art and algorithm: alignment precision is improved in the alignment scanning path that silicon chip fine alignment adopts simple bending algorithm (simple meander algorithm) effectively to shorten interferometer according to existing n on silicon chip silicon chip fine alignment mark.This algorithm is roughly divided into m group along y to increasing order by all silicon chip fine alignment marks, and the scanning pattern that group number is even number is along x to increasing order, and odd number is contrary.Then according to each group of group number is ascending, scanning pattern is coupled together.So far cook up the scanning of silicon chip fine alignment mark and aim at path.
Its detailed planning parameters of scanning paths process of traditional silicon chip fine alignment path calculation method can be divided into following step:
Step 1. is divided into A1 according to y direction by alignment mark, A2 ... An set:
The quantity of a) establishing set is 0 (in set, not comprising any one silicon chip alignment mark);
B) select not in set the minimum position (xj, yj) of y value in all silicon chip alignment marks;
C) select yk-yj < y_tolerance in all marks (xk, yk), y_tolerance scope is just decided to be and is greater than 0, is less than or equal to 100 (mm);
D) mark of selecting is made as to new set A i;
E) repeat above b, c, d step until on silicon chip all alignment marks all choose.
Mark in the each set A i of step 2. is pressed x forward and is arranged: Ai is ascending arrangement successively, if i is that odd number is by the mark reversed arrangement in Ai.
For particular problem, adopt the simple bending algorithm of prior art scheme, its total distance exceedes 1500 mm.
In sum, in prior art, need a kind of new alignment methods, can in ensureing alignment accuracy, improve and aim at efficiency.
Summary of the invention
In order to overcome the defect existing in prior art, the invention provides a kind of silicon slice alignment method, can in ensureing alignment accuracy, improve and aim at efficiency.
In order to realize foregoing invention object, the present invention discloses a kind of silicon slice alignment method, comprising: step 1, the position of input fine alignment coordinate points on silicon chip and the coordinate up and down of fine alignment flow process work stage motion; Step 2, distance between a upper station of fine alignment flow process and next station are as the constraint function of zero distance, or by the nearest-neighbors point first finding between a upper station and the next station of fine alignment flow process, and they are connected with each other as constraint function, then adopt travelling salesman's algorithm optimization, in the time meeting constraint condition, increase by a penalty as weight; Step 3, utilize searching algorithm to carry out problem solving; Step 4, output solving result.
This step 1 specifically comprises: the arbitrary preparation station p0 (x0 of step 1.1 from silicon wafer exposure operation, y0) locate to start, motion control unit drives silicon wafer stage to drive silicon chip opsition dependent p1, p2, the order that pn is corresponding, lay respectively at p1 (x1 by the n of silicon chip surface relevant this preparation station, y1), p2 (x2, y2), pn (xn, yn) alignment mark moves under the vertical direction of mark scannng unit one by one, this order is characterised in that to connect with straight line the total kilometres that each mark position was formed that this order traveled through the shortest, i.e. 2 pi in any front and back in this traversal order, coordinate (the xi of pj, yi), (xj, yj) meet total kilometres for the shortest, i=0～n-1, j=i+1～n,
Step 1.2 computing formula is as follows:
, wherein
with
represent X value and the Y value of the position of last coordinate of working position;
with
represent X value and the Y value of the position coordinates of next first coordinate of work; On this, a working position is for to carry out by leveling position, field silicon chip, and this next one working position is that two work stage exchange wait position.
Distance in this step 2 between a upper station of fine alignment flow process and next station specifically comprises as the constraint function of zero distance: when distance between the next one of upper and fine alignment working position that calculates fine alignment working position, be preset as 0; First find the nearest-neighbors point between a upper station and the next station of fine alignment flow process, and they are connected with each other and are specifically comprised as constraint function; First look for the nearest-neighbors with a working position coordinate on it to 16 coordinate points of fine alignment, then find the nearest-neighbors of 16 coordinate points of fine alignment with its next working position coordinate, the evaluation function in step 2 is Euclid function or chessboard function.
When this evaluation function is Euclid function, its computing formula is as follows:
, sum total distance is the shortest,
with
represent X value and the Y value of working position coordinate ps (xs, ys) in a working position; Or represent in middle working position that working position coordinate p1 (x1, y1) is to X value and the Y value of pn (xn, yn); Or representing X value and the Y value of working position coordinate pe (xe, ye) in next working position, this centre working position is silicon chip fine alignment working position.
When this evaluation function is chessboard function, its computing formula is as follows:
, sum total distance is the shortest,
with
represent X value and the Y value of working position coordinate ps (xs, ys) in a working position; Or in the middle of representing, work is X value and the Y value of middle working position coordinate p1 (x1, y1) to pn (xn, yn); This centre working position is silicon chip fine alignment working position.
The searching algorithm using in this step 3 is the one in following algorithm: greedy algorithm, two pairs of exchanges, three pairs of exchanges, heuritic approach, simulated annealing, ant cave algorithm or genetic algorithms.
In this step 1.1, the angle of scanning is along directions X or Y-direction or miter angle direction.
Compared with prior art, the advantage that the technical program has is as follows: the first, ensure complete machine alignment precision, 16 silicon chip alignment mark points carry out priority and aim at.The second, simultaneously improve fine alignment efficiency, and then improve overall efficiency.Three, fine alignment Link Efficiency improves 5-25%, improves overall efficiency+2 slice/hour.Four, shorten work stage motion path, reduce work stage loss, extend complete machine serviceable life.Five, can compatible ATHENA and SMASH alignment sensor.Six, can relate to X to scanning with Y-direction by compatible fine registration, also can compatibility be applicable to miter angle scanning alignment mark.
Brief description of the drawings
Can be by following detailed Description Of The Invention and appended graphic being further understood about the advantages and spirit of the present invention.
Fig. 1 is work stage motion model concept map in litho machine;
Fig. 2 is approximate model and the curve of the corresponding run duration of move distance in work stage motion model;
Fig. 3 be in alignment procedures first X to the scheme schematic diagram of Y-direction passing marker again;
Fig. 4 is the scheme schematic diagram along 45 degree scanning direction marks in alignment procedures;
Fig. 5 is the aligning path profile using in prior art under simple bending algorithm;
Fig. 6 is litho machine complete machine architecture system figure;
Fig. 7 is double-workpiece-table litho machine workflow diagram;
Fig. 8 be shown in the present go out the algorithm flow chart of the first embodiment;
Fig. 9 waits for the aligning path profile of position at X forward in the first embodiment;
Figure 10 waits for the aligning path profile of position at X negative sense in the first embodiment;
Figure 11 be shown in the present go out the algorithm flow chart of the second embodiment;
Figure 12 waits for the aligning path profile of position at X forward in the second embodiment;
Figure 13 waits for the aligning path profile of position at X negative sense in the second embodiment.
Embodiment
Describe specific embodiments of the invention in detail below in conjunction with accompanying drawing.
For the technical program is described better, below will be defined as follows to help to understand the technical program.
Silicon chip alignment device (Wafer Alignment, WA): the function of silicon chip alignment device has been that the horizontal level of silicon chip and mask is aimed at.It is upper that described radiation beam B incides described patterning device (for example, the mask) MA for example remaining on, on supporting construction (mask platform) MT, and by patterning device patterning.Oneself for example, after passing patterning device (, mask) MA, and described radiation beam B is by optical projection system PS, and described PS focuses on radiation beam on the target part C of substrate w.By the second locating device PW and position transducer IF (for example, interferometric device, linear encoder or capacitive transducer) help, can accurately move described substrate table WT, for example, to different target part C is positioned in the path of described radiation beam PB.Similarly, for example, after the machinery in mask storehouse obtains, or in scan period, described the first locating device PM and another position transducer can be used for patterning device MA accurately to locate with respect to the path of described radiation beam PB.Conventionally, can realize by the help of the long stroke module (coarse positioning) of a part of described the first locating device PM of formation and short stroke module (accurately location) movement of patterning device supporting construction (for example, mask platform) MT.Similarly, the movement of substrate table WT or substrate supports can form described the second locating device PW by utilization the long stroke module (coarse positioning) of a part and short stroke module (accurately location) realize.The in the situation that of stepper (contrary with scanner), described supporting construction MT can only be connected with short-stroke actuator, maybe can fix.Can use patterning device alignment mark M1, M2 and substrate alignment mark P1, take special target part although P2 carrys out the substrate alignment mark shown in aligned pattern formation device MA and substrate Wo, they can be arranged on the position between target part (the line alignment mark of knowing).Similarly, providing more than one tube core for example, in the situation of patterning device (, mask) MA, patterning device alignment mark can be arranged between tube core.
The function of silicon chip sports platform (Wafer Stage, WS) silicon chip sports platform (or claim work stage) is that the operation of corresponding operation is carried out in the position (station place) of carrying silicon chip and moving to appointment.Described lithographic equipment can be there is two (two platforms) or more substrate tables or " substrate support " (and/or two or more mask platform or " mask support member ") type two in the machine of this " many ", can use concurrently additional platform and/or supporting construction, or can by one or more other and or supporting construction in exposing, in one or more and/or supporting construction, carry out preliminary step.
The technical program has proposed a kind of efficient silicon chip fine alignment flow process and method.Flow process and the path of silicon chip being carried out to 16 silicon chip alignment marks are optimized method, this method is considered a upper station and the next station linkage of the alignment mark working position of 16 left and right of fine alignment and fine alignment flow process altogether, it is that a kind of global optimization is applied to the optimization thought scheme in local flow process, make the working trajectory of its applicable work stage reach the shortest, improve work stage sport efficiency and complete machine productive rate with this.
Fig. 6 is litho machine complete machine architecture system figure, especially a kind of typical double-workpiece-table litho machine.In the present invention, using this litho machine as schematically illustrating, but the present invention is not merely applicable to the litho machine of the type.This litho machine comprises a photo-etching machine silicon chip exposure system.Photo-etching machine silicon chip exposure system comprises: a kind of silicon chip alignment device and system (Wafer Alignment, WA) 300, it includes a silicon chip alignment device, can realize the aligning of (at the upper surface of silicon chip micropositioner) in silicon chip mark (at silicon chip upper surface) and TIS version, set up relation between the two.It comprises a work stage, and work stage 100 is made up of micropositioner 110 and coarse motion platform 120.Silicon chip 4 is placed in work stage micropositioner 110 tops, and micropositioner 110 can deliver silicon chip 4 and move.Comprise that in addition a kind of measuring system is as laser interferometer 210(Interferometer, IF), or the sensor such as plane grating chi (Encoder), can realize the measurement of the nano-precision to micropositioner 110 and silicon chip 4.
A kind of double-workpiece-table workflow has been described in Fig. 7.It comprises following job step: under a., sheet mechanical arm is taken silicon chip away from silicon wafer stage; B. going up a mechanical arm is positioned over silicon chip on silicon wafer stage; D. search for accurate zero-bit, laser interferometer zero clearing; E. aim at and be used for setting up worktable coordinate system; F. silicon chip is carried out to overall leveling; G. coarse alignment is used for setting up silicon chip coordinate system; H. silicon chip is carried out by field leveling; I. with reference to alignment mark, silicon chip is carried out to fine alignment; J. two work stage exchange; K. search for accurate zero-bit, laser interferometer zero clearing; L. implement coaxial alignment; M. silicon chip is carried out to part calibration; N. determine optimal focal plane 1; O. determine optimal focal plane 2; P. implement scan exposure.
The technical program, based on traveling salesman problem algorithm, adopts two kinds of optimized algorithms.The first is weight of zero algorithm, and the distance between a upper station and the next station of fine alignment flow process, as the constraint function of zero distance, namely first first couples together upper and lower working position, adopts subsequently traveling salesman problem algorithm to be optimized.The second is nearest neighbor algorithm, first finds the nearest-neighbors point between a upper station and the next station of fine alignment flow process, and they are connected with each other as constraint function, adopts subsequently traveling salesman problem algorithm to be optimized.
This silicon chip accurate alignment method, comprising:
1, arbitrary preparation station p0 (x0 from silicon wafer exposure operation, y0) locate to start, motion control unit drives silicon wafer stage to drive silicon chip opsition dependent p1, p2, the order that pn is corresponding, lay respectively at p1 (x1 by the n of silicon chip surface relevant this preparation station, y1), p2 (x2, y2), pn (xn, yn) alignment mark moves under the vertical direction of mark scannng unit one by one, this order is characterised in that to connect with straight line the total kilometres that each mark position was formed that this order traveled through the shortest, be 2 pi in any front and back in described traversal order, coordinate (the xi of pj, yi), (xj, yj) meet total kilometres for the shortest, wherein, i=0～n-1, j=i+1～n,
And its computing formula comprises following feature, first:
or
distance is the shortest, wherein
with
represent X value and the Y value of working position coordinate ps (xs, ys) in a work order (h. carries out by field leveling silicon chip);
with
represent X value and the Y value of working position coordinate p1 (x1, y1) in next work order (i. silicon chip fine alignment);
And its computing formula comprises following feature, second:
or
distance is the shortest, wherein
with
represent X value and the Y value of working position coordinate pn (xn, yn) in a work order (i. silicon chip fine alignment);
with
represent X value and the Y value of working position coordinate pe (xe, ye) in next work order (j. work stage exchanges wait).
2, mark scannng unit scans one by one correspondence markings by above order and records the space characteristics of mark of correlation, until complete scanning and the feature record to n alignment mark.
3, registration signal processing unit is aimed at waveform display method by the above-mentioned space characteristics information of recorded a n alignment mark by matching, needs the matching of determining each sinusoidal cycles waveform to count, to obtain desirable matching waveform.The silicon chip that draws current station after calculating is aimed at correction data △ x, and △ y, passes to motion control unit by data;
4, motion control unit is by △ x, and △ y is converted into silicon wafer stage and drives signal, drives silicon wafer stage carrying silicon chip to move to fine alignment position and completes fine alignment.
5, last, motion control unit drives silicon chip next preparation station pn+1 (xn+1, yn+1) to silicon wafer exposure operation, as the work coordinate of sports platform exchange position.
Below by introduce shown in the present go out the first embodiment be weight of zero algorithm.Fig. 8 be shown in the present go out the algorithm flow chart of the first embodiment.The method comprises four steps, is respectively input data S801, restrained boundary arranges S802, problem solving S803 and Output rusults S804.The method specifically comprises:
S801: input data.They comprise with reference to alignment mark carries out in fine alignment flow process silicon chip, the position of fine alignment coordinate points (as 16 or 32) on silicon chip, and work stage drive silicon chip should move to alignment sensor under, secondly should comprise a upper coordinate and the next coordinate of the motion of fine alignment flow process work stage.As shown in Figure 7, on it, a working position is that h. carries out by field leveling silicon chip, its next working position, and two work stage of j. exchange the coordinate points of waiting for position.
Its computing formula is as follows:
, wherein
with
represent that a working position h. carries out by leveling position, field silicon chip, the position of last coordinate (X value and Y value);
with
lower two work stage of j. of representative exchange waits for position, (X value and the Y value) of the position coordinates of first coordinate;
S802: restrained boundary setting, refers to that the distance between a upper coordinate and the next coordinate of fine alignment working position to fine alignment working position is weight of zero.When the distance between the next one of upper and fine alignment working position that needs to calculate fine alignment working position in program, they are just equaled 0 by hypothesis.In algorithm process, for meeting specific constraint condition, increase penalty and control this relation.Penalty application is herein a kind of weight to traveling salesman problem middle distance.If meet the condition of punishment, just in this distance, apply penalty value; If do not meet this condition, just do not apply penalty value.
Evaluation function adopts two kinds of optional schemes, and the first is Euclid function, and the second is chessboard function.
Evaluation function one: adopt Euclidean distance function (Euclidean Distance), calculate the physical distance of point-to-point transmission.
Its computing formula is as follows:
, sum total distance is the shortest, wherein
with
represent X value and the Y value of a coordinate.
with
represent X value and the Y value of working position coordinate ps (xs, ys) in a work order (h. carries out by field leveling silicon chip);
Or X value and the Y value of the middle working position coordinate p1 (x1, y1) of order (i. silicon chip fine alignment) to pn (xn, yn) of working in the middle of representing;
Or represent X value and the Y value of the middle working position coordinate pe (xe, ye) of next work order (j. work stage exchange wait).
Evaluation function two: adopt chessboard distance function (Chessboard Distance), feature that can independent parallel operation according to work stage X and the long stroke of Y-direction, the maximal value of calculating X and Y distance between two points, as evaluation function.
Its computing formula is as follows:
, sum total distance is the shortest, wherein
with
represent X value and the Y value of a coordinate.
with
represent X value and the Y value of working position coordinate ps (xs, ys) in a work order (h. carries out by field leveling silicon chip);
Or X value and the Y value of the middle working position coordinate p1 (x1, y1) of order (i. silicon chip fine alignment) to pn (xn, yn) of working in the middle of representing.
S803: problem solving.Optional searching algorithm comprises: greedy algorithm, the two pairs of exchanges, the three pairs of exchanges, heuritic approach, simulated annealing, ant cave algorithm, genetic algorithm.Generally speaking they are all a kind of approximate datas, but for 16-20 point of picture, the problem of this low combination complexity, approximate data can obtain gratifying solving result conventionally.
S804: Output rusults, they comprise output optimal case, it is visual to calculate total distance, designated firing duration, calculating productive rate, graphics path.Its result can be referring to the contrast in silicon chip fine alignment mark path and flow process in Fig. 9, Figure 10 and table 2 many algorithms result of calculation path.Fig. 9 waits for the aligning path profile of position at X forward in the first embodiment; Figure 10 waits for the aligning path profile of position at X negative sense in the first embodiment.Numeral in Fig. 9 Figure 10 in coordinate points represents the order of coordinate points that path planning travels through successively.
This embodiment both can relate to X to scanning with Y-direction by compatible fine registration, also can compatibility be applicable to miter angle scanning alignment mark.
The second embodiment is a kind of nearest neighbor algorithm, and it is based on global optimization thought, and the path optimizing design cycle of upper and lower working position nearest-neighbors, as shown in Figure 11 program design and algorithm flow chart.
1101: input data, they comprise with reference to alignment mark carries out in fine alignment flow process silicon chip, the position of fine alignment coordinate points (as 16) on silicon chip, work stage drive silicon chip should move to alignment sensor under, secondly should comprise a upper coordinate and the next coordinate of the motion of fine alignment flow process work stage.As shown in Figure 7, on it, a working position should be that h. carries out by field leveling silicon chip, its next working position, and two work stage of j. exchange the coordinate points of waiting for position.
Second step: restrained boundary setting, first look for the nearest-neighbors with a working position coordinate on it to 16 coordinate points of fine alignment, arrive and lock.Then find the nearest-neighbors of 16 coordinate points of fine alignment with its next working position coordinate, and locking.In algorithm process, for meeting specific constraint condition, increase penalty and control this relation.Penalty application is herein a kind of weight to traveling salesman problem middle distance.If meet the condition of punishment, just in this distance, apply penalty value; If do not meet this condition, just do not apply penalty value.
Evaluation function adopts two kinds of optional schemes, and the first is Euclid function, and the second is chessboard function.
Evaluation function one: adopt Euclidean distance function (Euclidean Distance), calculate the physical distance of point-to-point transmission.
Its computing formula is as follows:
sum total distance is the shortest, wherein
with
represent X value and the Y value of a coordinate.
with
represent X value and the Y value of working position coordinate ps (xs, ys) in a work order (h. carries out by field leveling silicon chip); Or X value and the Y value of the middle working position coordinate p1 (x1, y1) of order (i. silicon chip fine alignment) to pn (xn, yn) of working in the middle of representing; Or represent X value and the Y value of the middle working position coordinate pe (xe, ye) of next work order (j. work stage exchange wait).
Evaluation function two: adopt chessboard distance function (Chessboard Distance), feature that can independent parallel operation according to work stage X and the long stroke of Y-direction, the maximal value of calculating X and Y distance between two points, as evaluation function.
Its computing formula is as follows:
sum total distance is the shortest, wherein
with
represent X value and the Y value of a coordinate.
with
represent X value and the Y value of working position coordinate ps (xs, ys) in a work order (h. carries out by field leveling silicon chip); Or X value and the Y value of the middle working position coordinate p1 (x1, y1) of order (i. silicon chip fine alignment) to pn (xn, yn) of working in the middle of representing; Or represent X value and the Y value of the middle working position coordinate pe (xe, ye) of next work order (j. work stage exchange wait).
The 3rd step: problem solving.Optional searching algorithm comprises: greedy algorithm, the two pairs of exchanges, the three pairs of exchanges, heuritic approach, simulated annealing, ant cave algorithm, genetic algorithm.Generally speaking they are all a kind of approximate datas, but for 16-20 point of picture, the problem of this low combination complexity, approximate data can obtain gratifying solving result conventionally.
The 4th step: Output rusults, they comprise output optimal case, it is visual to calculate total distance, designated firing duration, calculating productive rate, graphics path.Its result can be referring to the contrast in silicon chip fine alignment mark path and flow process in Figure 12, Figure 13 and table 2 many algorithms result of calculation path.Figure 12 waits for the aligning path profile of position at X forward in the first embodiment; Figure 13 waits for the aligning path profile of position at X negative sense in the first embodiment.Numeral in Figure 12 Figure 13 in coordinate points represents the order of coordinate points that path planning travels through successively.
Present embodiment both can relate to X to scanning with Y-direction by compatible fine registration, also can compatibility be applicable to miter angle scanning alignment mark.
Table 2
Compared with prior art, the advantage that the technical program has is as follows: the first, ensure complete machine alignment precision, 16 silicon chip alignment mark points carry out priority and aim at.The second, simultaneously improve fine alignment efficiency, and then improve overall efficiency.Three, fine alignment Link Efficiency improves 5-25%, improves overall efficiency+2 slice/hour.Four, shorten work stage motion path, reduce work stage loss, extend complete machine serviceable life.Five, can compatible ATHENA and SMASH alignment sensor.Six, can relate to X to scanning with Y-direction by compatible fine registration, also can compatibility be applicable to miter angle scanning alignment mark.
Described in this instructions is preferred embodiment of the present invention, and above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (7)
1. a silicon slice alignment method, is characterized in that, comprising:
Step 1, the position of input fine alignment coordinate points on silicon chip and the coordinate up and down of fine alignment flow process work stage motion;
Step 2, distance between a upper station of fine alignment flow process and next station are as the constraint function of zero distance, or by the nearest-neighbors point first finding between a upper station and the next station of fine alignment flow process, and they are connected with each other as constraint function, then adopt travelling salesman's algorithm optimization, in the time meeting constraint condition, increase by a penalty as weight;
Step 3, utilize searching algorithm to carry out problem solving;
Step 4, output solving result.
2. silicon slice alignment method as claimed in claim 1, is characterized in that, described step 1 specifically comprises:
The arbitrary preparation station p0 (x0 of step 1.1 from silicon wafer exposure operation, y0) locate to start, motion control unit drives silicon wafer stage to drive silicon chip opsition dependent p1, p2, the order that pn is corresponding, lay respectively at p1 (x1 by the n of silicon chip surface relevant this preparation station, y1), p2 (x2, y2), pn (xn, yn) alignment mark moves under the vertical direction of mark scannng unit one by one, this order is characterised in that to connect with straight line the total kilometres that each mark position was formed that this order traveled through the shortest, be 2 pi in any front and back in described traversal order, coordinate (the xi of pj, yi), (xj, yj) meet total kilometres for the shortest, i=0～n-1, j=i+1～n,
Step 1.2 computing formula is as follows:
, wherein,
with
represent X value and the Y value of the position of last coordinate of working position;
with
represent X value and the Y value of the position coordinates of next first coordinate of work; A described upper working position is for to carry out by leveling position, field silicon chip, and described next working position is that two work stage exchange wait position.
3. silicon slice alignment method as claimed in claim 1, it is characterized in that, the distance in described step 2 between a upper station of fine alignment flow process and next station specifically comprises as the constraint function of zero distance: when distance between the next one of upper and fine alignment working position that calculates fine alignment working position, be preset as 0; First find the nearest-neighbors point between a upper station and the next station of fine alignment flow process, and they are connected with each other and are specifically comprised as constraint function; First look for the nearest-neighbors with a working position coordinate on it to 16 coordinate points of fine alignment, then find the nearest-neighbors of 16 coordinate points of fine alignment with its next working position coordinate, the evaluation function in step 2 is Euclid function or chessboard function.
4. silicon slice alignment method as claimed in claim 3, is characterized in that, when described evaluation function is Euclid function, its computing formula is as follows:
, sum total distance is the shortest,
with
represent X value and the Y value of working position coordinate ps (xs, ys) in a working position; Or represent in middle working position that working position coordinate p1 (x1, y1) is to X value and the Y value of pn (xn, yn); Or represent X value and the Y value of working position coordinate pe (xe, ye) in next working position, described in the middle of working position be silicon chip fine alignment working position.
5. silicon slice alignment method as claimed in claim 3, is characterized in that, when described evaluation function is chessboard function, its computing formula is as follows:
, sum total distance is the shortest,
with
represent X value and the Y value of working position coordinate ps (xs, ys) in a working position; Or in the middle of representing, work is X value and the Y value of middle working position coordinate p1 (x1, y1) to pn (xn, yn); In the middle of described, working position is silicon chip fine alignment working position.
6. silicon slice alignment method as claimed in claim 1, it is characterized in that, the searching algorithm using in described step 3 is the one in following algorithm: greedy algorithm, two pairs of exchanges, three pairs of exchanges, heuritic approach, simulated annealing, ant cave algorithm or genetic algorithms.
7. silicon slice alignment method as claimed in claim 2, is characterized in that, in described step 1.1, the angle of scanning is along directions X or Y-direction or miter angle direction.
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| CN112947006A (en) * | 2019-11-26 | 2021-06-11 | 上海微电子装备（集团）股份有限公司 | Alignment mark selection method, device, equipment, photoetching system and medium |
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