CN103913595A - Three-axis integrated silicon micro-resonance type accelerometer - Google Patents
Three-axis integrated silicon micro-resonance type accelerometer Download PDFInfo
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Abstract
The invention provides a three-axis integrated silicon micro-resonance type accelerometer. The three-axis integrated silicon micro-resonance type accelerometer mainly comprises a glass substrate, a two-axis silicon micro-resonance type detection structure and a single-axis micro-resonance type detection structure arranged on the surface of the glass substrate. The two-axis silicon micro-resonance type detection structure comprises a mass block and four silicon micro-machine structural units, wherein the four silicon micro-machine structural units are arranged surrounding the center of the mass block and distributed in a central symmetry mode. The single-axis micro-resonance type detection structure comprises a first mass block, a second mass block, a first vibration beam and a second vibration beam, wherein the first mass block and the second mass block are arranged in a mirror symmetry mode, the first vibration beam and the second vibration beam are arranged between the first mass block and the second mass block in parallel, and the first vibration beam and the second vibration beam are different in height in the direction perpendicular to the surface of the glass substrate, namely, the Z-axis direction.
Description
Technical field
The micro-inertia measuring field that the invention belongs to microelectromechanical systems, is specifically related to a kind of silicon micro-resonance type accelerometer.
Background technology
Inertial navigation system is widespread use in the fields such as navigation, Aeronautics and Astronautics and military affairs.Silicon micro-resonance type accelerometer has the advantages that stability is high, resolution is high, dynamic range is large, is considered to realize microelectromechanical systems (MEMS) the inertial navigation device of high-acruracy survey, has important application in national defence field.Research for silicon micro-resonance type accelerometer high precision, miniaturization, high integration is also carried out.
At present just progressively replace the conventional inertia instrument such as quartz flexible accelerometer in the application of middle low performance.Mems accelerometer has started in navigation and tactical arena application in the world.Part high precision field is also by progressively ripe the research that is substituted single shaft silicon micro-resonance type accelerometer by micro electronmechanical accelerometer simultaneously.
But in prior art, multiple resonance type accelerometers are integrated there is volume greatly and the large problem of alignment error, cannot meet high precision acceleration test demand in three axles (X, Y, Z axis) direction, affects development and the use of silicon micro-resonance type accelerometer.
Summary of the invention
In sum, necessaryly provide a kind of simple in structure, volume is little, precision is high three axle integrated silicone micro-resonance type accelerometers.
A kind of three axle integrated silicone micro-resonance type accelerometers, mainly comprise: a substrate of glass; One twin shaft silicon micro-resonance type detection architecture and a single shaft silicon micro-resonance type detection architecture are arranged at the surface of described substrate of glass, and described twin shaft silicon micro-resonance type detection architecture is for detection of being parallel to the axial acceleration of orthogonal XY in the plane of glass basic surface; Described single shaft silicon micro-resonance type detection architecture is for detection of the acceleration of the Z-direction perpendicular to XY direction; Described twin shaft silicon micro-resonance type detection architecture comprises a mass and four silicon micromechanical structure unit, and described mass is a centrosymmetric structure, the distribution that is centrosymmetric around the center of described mass of described four silicon micromechanical structure unit; Each silicon micromechanical structure unit comprises one group of resonant mode double-ended tuning fork, one group of micromechanics lever and one group of decoupling zero guide support, described decoupling zero guide support one end is connected reception inertial acceleration with described mass, the other end is connected with a power input end of described micromechanics lever, by a power output terminal of micromechanics lever, the inertial force of reception is passed to described resonant mode double-ended tuning fork; Described single shaft silicon micro-resonance type detection architecture comprises that one first mass, one second mass are mirror image and are symmetrical arranged, described the first mass and the second mass are suspended in described glass basic surface by two brace summers respectively, and rotate taking two brace summers as axle; One first beam and one second beam that shakes that shakes is set in parallel between described the first mass and the second mass, the described first two ends that shake beam are connected with the first mass and the second mass respectively, and one first drives and determine broach and one first detection and determines broach and be relatively arranged on the described first beam both sides that shake; The described second two ends that shake beam are connected with described the first mass and the second mass respectively, one second drives and determine broach and one second detection and determines broach and be relatively arranged on the described second beam both sides that shake, and described first beam and second beam that shakes that shakes is in Z-direction, to have different height in the direction perpendicular to glass basic surface.
With respect to prior art, three axle integrated silicone micro-resonance type accelerometers provided by the invention, by adopting the mode of the not contour beam that shakes, are integrated in three axle resonance type accelerometers on a chip, have high integration, miniaturization, high-precision advantage.
Brief description of the drawings
The three axle integrated silicone micro-resonance type accelerometer one-piece construction key diagrams that Fig. 1 provides for first embodiment of the invention.
The three axle integrated silicone micro-resonance type accelerometer metal carbonyl conducting layer key diagrams that Fig. 2 provides for first embodiment of the invention.
The axle side 3 D stereo views such as the three axle integrated silicone micro-resonance type accelerometers that Fig. 3 provides for first embodiment of the invention.
The figure of twin shaft mass local specification in the three axle integrated silicone micro-resonance type accelerometer planes that Fig. 4 provides for first embodiment of the invention.
The outer Z-axis of three axle integrated silicone micro-resonance type accelerometer planes that Fig. 5 provides for the first embodiment of the invention girder construction key diagram that shakes.
Main element symbol description
| Substrate of glass | C |
| Dual-axis silicon-micro resonance accelerometer | A |
| Single shaft silicon micro-resonance type accelerometer | B |
| Mass | A-1、B-1a、B-1b |
| Resonant mode double-ended tuning fork | A-2a、A-2b、A-2c、A-2d |
| Micromechanics lever | A-6a1、A-6a2、A-6b1、A-6b2、A-6c1、A-6c2、A-6d1、A-6d2 |
| Decoupling zero guide support | A-8a1、A-8a2、A-8b1、A-8b2、A-8c1、A-8c2、A-8d1、A-8d2 |
| Folded beam | A-17a3、A-17a4 |
| Elongated straight beam | A-16a2 |
| Orienting lug | A-15a2 |
| Power input end | A-14a2 |
| Power output terminal | A-12a2 |
| Drive electrode | A-4a1、A-4a2、A-4b1、A-4b2、A-4c1、A-4c2、A-4d1、A-4d2 |
| Detecting electrode | A-3a1、A-3a2、A-3b1、A-3b2、A-3c1、A-3c2、A-3d1、A-3d2 |
| Double-ended tuning fork power input end | A-10a |
| Jian Maohe district | A-5a、A-5b、A-5c、A-5d、A-7a1、A-7a2、A-7b1、A-7b2、A-7c1、A-7c2、A-7d1、A-7d2、A-18a1、A-18a2、A-18a3、A-18a4、A-18b1、A-18b2、A-18b3、A-18b4、A-18c1、A-18c2、A-18c3、A-18c4、A-18d1、A-18d2、A-18d3、A-18d4 |
| Fulcrum beam | A-13a2 |
| First beam that shakes | B-2a |
| Second beam that shakes | B-2b |
| Broach is determined in the first driving | B-3a |
| Broach is determined in the second driving | B-3b |
| Broach is determined in the first detection | B-4a |
| Broach is determined in the second detection | B-4b |
| The first bonding platform | B-6a1、B-6a2 |
| The second bonding platform | B-6b1、B-6b2 |
| The first brace summer | B-5a1、B-5a2 |
| The second brace summer | B-5b1、B-5b2 |
| Contact conductor | D-2、D-1a、D-1b、D-1c、D-1d、D-3a1、D-3a2、D-3b1、D-3b2、D-3c1、D-3c2、D-3d1、D-3d2、D-4a1、D-4a2、D-4b1、D-4b2、D-4c1、D-4c2、D-4d1、D-4d2、D-5a、D-6a、D-5b、D-6b |
Following specific embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Describe silicon micro-resonance type accelerometer provided by the invention in detail below with reference to accompanying drawing.
Three axle integrated silicone micro-resonance type accelerometers provided by the invention comprise that a twin shaft silicon micro-resonance type detection architecture and a single shaft silicon micro-resonance type detection architecture are arranged at the surface of a substrate of glass.Described twin shaft silicon micro-resonance type detection architecture is for detection of the axial acceleration of orthogonal XY in plane; Described single shaft silicon micro-resonance type detection architecture is for detection of the acceleration of the Z-direction perpendicular to XY direction.Described twin shaft silicon resonance type detection architecture and single shaft silicon micro-resonance type detection architecture can be fixed on glass basic surface by bonding anchor district, and are electrically connected by the contact conductor that is arranged at glass basic surface.
Described twin shaft silicon resonance type detection architecture and bonding anchor district can pass through SOG(Silicon-on-Glass) processes forms, and forming multiple silicon microstructures at described glass basic surface.Described movable silicon micro mechanical structure comprises a mass and four silicon micromechanical structure unit, and described mass is a centrosymmetric structure, is suspended in described glass basic surface, arranges with described glass basic surface interval; Described four silicon micromechanical structure unit distribute around the Central Symmetry of described mass.Each silicon micromechanical structure unit comprises one group of resonant mode double-ended tuning fork, one group of micromechanics lever and one group of decoupling zero guide support.Described decoupling zero guide support passes to resonant mode double-ended tuning fork by described micromechanics lever by inertial force.
Described decoupling zero guide support comprises a pair of folded beam, an elongated straight beam and an orienting lug.Described orienting lug, by elongated straight beam quality of connection piece, by the fixing also constrained motion of a pair of folded beam, and transmits inertial force by being connected with a power input end of micromechanics lever.Described elongated straight beam provides in the input rigidity of sensitive axes and the support flexibility of orthogonal axes for mass.Described a pair of folded beam is symmetricly set in described mass in the both sides perpendicular in elongated straight beam direction, one end of each folded beam can be fixed on the bonding platform of substrate of glass by a bonding anchor district, the other end connects orienting lug, the motion of support guide piece sensitive axes direction (direction of elongated straight beam), restricted guidance piece orthogonal axes direction (perpendicular to the direction of elongated straight beam) motion.
There are its sensitive direction and non-sensitive orthogonal directions for each group decoupling zero guide support.In the time that sensitive direction acceleration is inputted, elongated straight beam tension and compression pass to micromechanics lever by orienting lug by inertial force; In the time that orthogonal directions acceleration is inputted, elongated straight beam deflection, the orienting lug being attached thereto does not move, and effectively reduces the coupling of normal force input.
Every group of decoupling zero guide support connects one group of micromechanics lever.Micromechanics lever has a power input end and the power output terminal relative with described power input end, and described power input end is connected with orienting lug by described elongated straight beam.Described micromechanics lever is connected with a resonant mode double-ended tuning fork power input end of described resonant mode double-ended tuning fork by power output terminal.Described micromechanics lever comprises that a fulcrum beam is arranged between described power input end and power output terminal, and arranges near described power output terminal.Described fulcrum beam one end is connected with described micromechanics lever, and one end can be fixed on a bonding platform of substrate of glass by a bonding anchor district.Described fulcrum beam is as the fulcrum of described micromechanics lever.
Described resonant mode double-ended tuning fork comprises relative two ends, and one end is described resonant mode double-ended tuning fork power input end, and the other end is fixed in substrate of glass by bonding anchor district.Every group of resonant mode double-ended tuning fork comprises two symmetrically arranged resonance beam, shakes beam vibration in anti-phase mode by drive electrode and two of detecting electrode controls, reduces energy leakage.
Preferably, each silicon micromechanical structure unit comprises two groups of micromechanics levers and two groups of decoupling zero guide supports.Described two groups of micromechanics levers and two groups of decoupling zero guide supports are symmetrically distributed in resonant mode double-ended tuning fork central axis both sides, can further slow down tuning fork vibration couple of force and be incorporated on mass, cause the interference that mass twisting vibration causes.Further, the resonance frequency of two groups of resonant mode double-ended tuning forks in central axial direction can be not identical, thereby in useful range, avoid locking phenomenon to occur.
Described single shaft silicon micro-resonance type detection architecture comprises that two masses are mirror image symmetry and interval arranges, multiple brace summers and two beam compositions that shake.Described single shaft silicon micro-resonance type detection architecture can be bonded to described glass basic surface by the bonding platform on silicon microstructure, and described each mass can be suspended and is arranged in substrate of glass by two brace summers, arrange with described substrate of glass interval, in the time being subject to the acceleration action of Z-direction, produce twisting.Described two beams that shake are set in parallel between described two masses, and the two ends of the described every beam that shakes are connected with described two masses respectively, and described two beams that shake are positioned at the differing heights of Z-direction.Each beam that shakes is arranged at a driving to be determined broach and detects and determine between broach, passes to described driving and determines broach and detect and determine broach, and be converted into electric signal output with degree of will speed up.
Preferably, two masses are two eccentric mass block structures, and the eccentric direction of described two masses is mirror image and distributes, and described eccentric position is near the axis of symmetry between described two masses.
Further, described two thickness of beam in Z-direction that shake are less than the thickness of described mass, and described two beams that shake are positioned at perpendicular to the Different Plane in glass baseplate surface direction.
In the time that Z axis has acceleration input, described mass reverses around brace summer, the beam that shakes being connected with mass is subject to mass and reverses the pulling force that produces or pressure and produce natural frequency and change, and changes Z-direction inertial force into the beam axial force transmission of shaking and determine broach and determines broach and detect with detection to driving.
Described mass, bonding platform, the material therefor such as beam, brace summer that shakes can be monocrystalline silicon.
See also Fig. 1 to Fig. 4, and invent the first embodiment a kind of three axle silicon micro-resonance type accelerometers are provided, described three axle silicon micro-resonance type accelerometers comprise that a twin shaft silicon micro-resonance type detection architecture (A) and a single shaft silicon micro-resonance type detection architecture (B) are arranged at intervals at the surface of described substrate of glass (C).
Described twin shaft silicon micro-resonance type detection architecture (A) comprises a movable silicon micro mechanical structure, and described movable silicon micro mechanical structure comprises a mass (A-1), four groups of resonant mode double-ended tuning forks (A-2a, A-2b, A-2c, A-2d), eight groups of micromechanics levers (A-6a1, A-6a2, A-6b1, A-6b2, A-6c1, A-6c2, A-6d1, A-6d2), eight groups of decoupling zero guide supports (A-8a1, A-8a2, A-8b1, A-8b2, A-8c1, A-8c2, A-8d1, A-8d2).Described movable silicon micro mechanical structure can be fixed in substrate of glass (C) by bonding anchor district (A-5a, A-5b, A-5c, A-5d, A-7a1, A-7a2, A-7b1, A-7b2, A-7c1, A-7c2, A-7d1, A-7d2, A-18a1, A-18a2, A-18a3, A-18a4, A-18b1, A-18b2, A-18b3, A-18b4, A-18c1, A-18c2, A-18c3, A-18c4, A-18d1, A-18d2, A-18d3, A-18d4).
Described mass (A-1) is a square structure, is respectively arranged with a recess on four limits of described square structure, and described four recesses distribute around the axis of symmetry full symmetric of described square structure.Set up coordinate axis taking the center of described square structure as initial point, the axis of symmetry direction at two relative recess places is x axle, and the axis of symmetry at two other symmetrical recess place is the y axle perpendicular to x.
State described four groups of resonant mode double-ended tuning forks (A-2a, A-2b, A-2c, A-2d) omnidirectional distribution.Concrete, described resonant mode double-ended tuning fork (A-2a) distributes along y axle with resonant mode double-ended tuning fork (A-2b); Described resonant mode double-ended tuning fork (A-2c) distributes along x axle with resonant mode double-ended tuning fork (A-2d).The resonant mode double-ended tuning fork (A-2a) of y axle and resonant mode double-ended tuning fork (A-2b) difference export resonance frequency, the resonant mode double-ended tuning fork (A-2c) of x axle and resonant mode double-ended tuning fork (A-2d) difference export resonance frequency.Described resonant mode double-ended tuning fork (A-2a) is different from the resonance frequency of resonant mode double-ended tuning fork (A-2b), similarly, described resonant mode double-ended tuning fork (A-2c) is different from the resonance frequency of resonant mode double-ended tuning fork (A-2d), thereby can effectively avoid the generation of locking phenomenon.
Described resonant mode double-ended tuning fork (A-2a) comprises two resonance beam that are symmetrically distributed in y axle both sides, one drive electrode (A-4a1) and a detecting electrode (A-3a1) are symmetrically distributed in resonance beam both sides, and a drive electrode (A-4a2) and a detecting electrode (A-3a2) are symmetrically distributed in another resonance beam both sides.Two beam vibrations that shake can be controlled in anti-phase mode by drive electrode (A-4a1, A-4a2) and detecting electrode (A-3a1, A-3a2), thereby energy leakage can be reduced.
Same, described resonant mode double-ended tuning fork (A-2b) comprises that a drive electrode (A-4b1, A-4b2) and detecting electrode (A-3b1, A-3b2) are arranged in described resonant mode double-ended tuning fork (A-2b) according to example; Described resonant mode double-ended tuning fork (A-2c) comprises that a drive electrode (A-4c1, A-4c2) and detecting electrode (A-3c1, A-3c2) are arranged in described resonant mode double-ended tuning fork (A-2c) according to example; Described resonant mode double-ended tuning fork (A-2d) comprises that a drive electrode (A-4d1, A-4d2) and detecting electrode (A-3d1, A-3d2) are arranged in described resonant mode double-ended tuning fork (A-2d) according to example.Meeting under the prerequisite that detects minimum capacity, two groups resonant mode double-ended tuning fork transverse vibration rigidity is identical, the beam that shakes is identical in quality, the quality of the beam broach that shakes has fine difference, and the resonance frequency that can reach two groups of resonant mode double-ended tuning forks differs tens to hundreds of hertz.
Described eight groups of decoupling zero guide supports (8a1, A-8a2, A-8b1, A-8b2, A-8c1, A-8c2, A-8d1, A-8d2) are all connected with described mass (A-1) and are symmetrical.Described decoupling zero guide support (A-8a1, A-8a2) is symmetrically distributed in resonant mode double-ended tuning fork (A-2a) both sides and is connected with Input Forces with one end of resonant mode double-ended tuning fork (A-2a).Same, described decoupling zero guide support (A-8b1, A-8b2) is symmetrically distributed in resonant mode double-ended tuning fork (A-2b) both sides, is also jointly connected with Input Forces with one end of resonant mode double-ended tuning fork (A-2b); Described decoupling zero guide support (A-8c1, A-8c2) is symmetrically distributed in resonant mode double-ended tuning fork (A-2c) both sides and is connected with Input Forces with one end of resonant mode double-ended tuning fork (A-2c); Described decoupling zero guide support (A-8d1, A-8d2) is symmetrically distributed in resonant mode double-ended tuning fork (A-2d) both sides and is connected with Input Forces with one end of resonant mode double-ended tuning fork (A-2d).
Refer to Fig. 2, describe in detail as an example of decoupling zero guide support (A-8a2) example.Described decoupling zero guide support (A-8a2) comprises a pair of folded beam (A-17a3, A-17a4), an elongated straight beam (A-16a2) and an orienting lug (A-15a2).Described elongated straight beam (A-16a2) extends in the y-direction, and described orienting lug (A-15a2) is by elongated straight beam (A-16a2) quality of connection piece (A-1).Described a pair of folded beam (A-17a3, A-17a4) is symmetrically distributed in the both sides of elongated straight beam (A-16a2) in x direction, fixes and retrain orienting lug (A-15a2) motion by folded beam (A-17a3, A-17a4).It is upper that described substrate of glass (C) is fixed on by a bonding anchor district (1A-8a3) in one end of described folded beam (A-17a3), and the other end is connected with described orienting lug (A-15a2); Similarly, it is upper that described substrate of glass (c) is fixed on by Jian Maohe district (1A-8a4) in described folded beam (A-17a4) one end, and the other end is connected with described orienting lug (A-15a2).Described folded beam (A-17a3, A-17a4) is the motion in sensitive axes (y axle) direction for support guide piece (A-15a2), and restricted guidance piece (A-15a2) moves in orthogonal axes (x axle) direction.
Described elongated straight beam (A-16a2) extends in the y-direction, and one end is connected with described mass (A-1), and the other end is connected with described orienting lug (A-15a2).Described elongated straight beam (A-16a2) is for providing the input rigidity of mass (A-1) in sensitive axes (y axle) and the support flexibility of orthogonal axes (x axle).
Described decoupling zero guide support (A-8a2) is connected with micromechanics lever (A-6a2), concrete, described micromechanics lever (A-6a2) extends in the x-direction, comprises a power input end (A-14a2) and a relative power output terminal (1A-2a2) at the above micromechanics lever (A-6a2) of bearing of trend.The power input end (A-14a2) of described micromechanics lever (A-6a2) is connected with orienting lug (A-15a2), to transmit inertial force.Described power output terminal (A-12a2) is connected with resonant mode double-ended tuning fork (A-2a), pass to resonant mode double-ended tuning fork (A-2a) with the resonant mode double-ended tuning fork power input end (A-14a2) that the inertial force of reception is connected by the beam that shakes (A-11a) and with the beam that shakes (A-11a), the other end of described resonant mode double-ended tuning fork (A-2a) is fixed in described substrate of glass (C) by bonding anchor district (A-5a).
Described micromechanics lever (A-6a2) supports by a fulcrum beam (A-13a2), described fulcrum beam (A-13a2) is arranged between the power input end (A-14a2) and power output terminal (A-12a2) of described micromechanics lever (A-6a2), and arranges near described power output terminal (A-12a2).Described micromechanics lever (A-6a2) is supported in one end of described fulcrum beam (A-13a2), and the other end is fixed in described substrate of glass (C) by Yi Jianmaohe district (7a2).
See also Fig. 5, described single shaft silicon micro-resonance type detection architecture (B) comprises that one first mass (B-1a), the second mass (B-1b), one first beam (B-2a), one second beam (B-2b), first that shakes that shakes drives and determine broach (B-3a), second and drives and determine that broach (B-3b), the first detection are determined broach (B-4a), broach (B-4b), two the first brace summers (B-5a1, B-5a2), two the second brace summers (B-5b1, B-5b2) are determined in the second detection.Described the first mass (B-1a) and the second mass (B-1b) are fixed and are suspended in substrate of glass (C) by four bonding platforms (B-6a1, B-6a2, B-6b1, B-6b2).
It is symmetrical that described the first mass (B-1a) and the second mass (B-1b) are mirror image, and space arranges.The shape of described the first mass (B-1a) and the second mass (B-1b) is concave shape, have respectively a recess and be positioned at the fin of recess both sides, and recess is oppositely arranged.Described the first mass (B-1a) and the second mass (B-1b) itself are a symmetrical structure, all have along the axis of symmetry of a first direction (as Y direction); Described the first mass (B-1a) and the second mass (B-1b) are symmetrical arranged about axis of symmetry (as the X-axis) mirror image of a second direction.Described the first mass (B-1a) and the second mass (B-1b) can be 30 microns to 100 microns perpendicular to the thickness in described substrate of glass (C) direction (being Z axis).In the present embodiment, the thickness of described the first mass (B-1a) and the second mass (B-1b) is 60 microns.
Described the first mass (B-1a) supports by symmetrically arranged two the first brace summers (B-5a1, B-5a2), is suspended in described substrate of glass (C) surface.Described two the first brace summers (B-5a1, B-5a2) are symmetrically distributed in the edge of described the first mass (B-1a) in the second direction perpendicular to first direction, and support described the first mass (B-1a).Described the first brace summer (B-5a1, B-5a2), near the axis of symmetry setting between described the first mass (B-1a) and the second mass (2a), is right avertence core structure thereby make described the first mass (B-1a).One end of described the first brace summer (B-5a1) is connected with described the first mass (B-1a), and the other end is connected with the bonding platform (B-6a1) being arranged in described substrate of glass (C); One end of described the first brace summer (B-5a2) is connected with described the first mass (B-1a), and the other end is connected with the bonding platform (B-6a2) being arranged in described substrate of glass (C).
Same, described the second mass (B-1b) supports by symmetrically arranged the second brace summer (B-5b1, B-5b2), is suspended in described substrate of glass (C) surface.Described two the second brace summers (B-5b1, B-5b2) are symmetrically distributed in described the second mass (B-1b) edge in a first direction, and support described the second mass (B-1b).Described two the second brace summers (B-5b1, B-5b2), near the axis of symmetry setting between described the first mass (B-1a) and the second mass (B-1b), are a left avertence core structure thereby make described the second mass (B-1b).Described the second brace summer (B-5b1) one end is connected with the second mass (B-1b), and the other end is connected with bonding platform (5b); Described the second brace summer (B-5b2) one end is connected with the second mass (B-1b), and the other end is connected with the second bonding platform (B-6b1).Further, described the first brace summer (B-5a1, B-5a2) and the second brace summer (B-5b1, B-5b2) are mirror image with respect to the axis of symmetry between described the first mass (B-1a) and the second mass (B-1b) and are symmetrical arranged.
Described first beam (B-2a) and second beam (B-2b) that shakes that shakes extends along directions X, and connect described the first mass (B-1a) and the second mass (B-1b), described first beam (B-2a) and second beam (B-2b) that shakes that shakes is symmetrical arranged at the axis of symmetry of directions X about the first mass (B-1a) and the second mass (B-1b).Concrete, described first beam (B-2a) and second beam (B-2b) that shakes that shakes is parallel and be arranged at intervals in the recess of described the first mass (B-1a) and the second mass (B-1b), and described first the shake two ends of beam (B-2b) of beam (B-2a) and second that shake are connected respectively described the first mass (B-1a) and the second mass (B-1b).Described first the shake length of beam (B-2b) of beam (B-2a) and second of shaking can be 500 microns to 2000 microns, and in the present embodiment, described length is 1000 microns.Described first beam (B-2a) and second beam (B-2b) that shakes that shakes is identical at the thickness of Z-direction (perpendicular to the direction of X, Y), but is different from the thickness of described the first mass (B-1a) and the second mass (B-1b), can be 20 microns
Further, described first beam (B-2a) and second beam (B-2b) that shakes that shakes is positioned at the differing heights in Z-direction.In the present embodiment, described first shakes beam (B-2a) near described substrate of glass (C) setting, and is connected with described the first mass (B-1a) and the second mass (B-1b); The described first surface that shakes the close described substrate of glass (C) of beam (B-2a) arranges, with the surface co-planar of described the first mass (B-1a) near described substrate of glass (C).Relative, described second beam (B-2b) that shakes arranges away from described substrate of glass (C) relatively, described second shakes beam (B-2b) away from the surface of described substrate of glass (C), with the surface co-planar of described the first mass (B-1a) away from described substrate of glass (C).
Described first drives and determine broach (B-3a) and first and detects and determine broach (B-4a) and be arranged at described first beam (B-2a) both sides that shake, and is respectively used to the variation of load driver power and detection resonance frequency, realizes static excitation and capacitance detecting.Described first drives and determine broach (B-3a) and the first detection is determined broach (B-4a) and can be connected to the contact conductor (D-5a, D-5b) being arranged in substrate of glass (C) by metal wire.
Similarly, described second drives and determine broach (B-3b) and second and detects and determine broach (B-4b) and be arranged at described second beam (B-2b) both sides that shake, and is respectively used to the variation of load driver power and detection resonance frequency, realizes static excitation and capacitance detecting.Described second drives and determine broach (B-3b) and the second detection is determined broach (B-4b) and can be connected to the contact conductor (D-6a, D-6b) being arranged in substrate of glass (C) by metal wire.Further, described first drive and determine broach (B-3a), first and detect and determine broach (B-4a), second and drive and determine broach (B-3b) and the second detection is determined broach (B-4b) all along the axis of symmetry distribution between described the first mass (B-1a) and the second mass (B-1b).
The principle of work of described three axle silicon micro-resonance type accelerometers is as follows: in twin shaft silicon micro-resonance type detection architecture (A), two groups of double-ended tuning fork (A-2a that distribute with y axle, A-2b) be example, in the time that its sensitive direction (y axle) acceleration is inputted, elongated straight beam (the A-6a1 of sensitive direction, A-6a2, A-6b1, A-6b2) tension and compression are by orienting lug (A-15a1, A-15a2, A-15b1, A-15b2) inertial force is passed to micromechanics lever (A-6a1, A-6a2, A-6b1, A-6b2), meanwhile, elongated straight beam (the A-6c1 of orthogonal directions (x axle), A-6c2, A-6d1, A-6d2) bending, provide the flexibility of sensitive direction to support, in the time that orthogonal directions (x axle) acceleration is inputted, elongated straight beam (A-6a1, A-6a2, A-6b1, the A-6b2) bending of sensitive direction (y axle), the orienting lug (A-15a1, A-15a2, A-15b1, A-15b2) being attached thereto does not move, and effectively reduces the coupling of normal force input.In the time that Z axis acceleration is inputted, in single shaft silicon micro-resonance type detection architecture (B), both sides mass (B-1a, B-1b) is because eccentric mass effect deflects.Be connected with two masses bottoms first shake beam (B-2a) be connected with two mass tops second shake that beam (B-2b) is subject to respectively two mass pulling force or pressure deforms.Therefore two shake beam because axial force changes, and cause that resonance frequency changes.By drive determine broach (B-3a, B-3b) and detect determine broach (B-4a, B-4b) and accordingly resonance closed loop circuit system be that two beams that shake are operated in respectively in resonance frequency separately.Change and detect Z axis input acceleration by the resonance frequency of output.
Three axle integrated silicone micro-resonance type accelerometers provided by the invention, are integrated in dual-axis silicon-micro resonance accelerometer and single shaft silicon micro-resonance type accelerometer on a chip, have high integration, miniaturization, high-precision advantage.Secondly, described dual-axis silicon-micro resonance accelerometer and single shaft silicon micro-resonance type accelerometer all adopt the resonance structure sensitive acceleration of vibration beam type, and machinery and electrical specification are mature and stable, and static excitation and capacitance detecting principle are simple to operation.Moreover, the compatible body silicon of described three axle integrated silicone micro-resonance type accelerometers SOG technique, machining precision is high, and the complete decoupling of three axles is simple in structure.Finally, the sensitive structure of described single shaft silicon micro-resonance type accelerometer has reduced the dependence of system performance to machined parameters, has increased the yield rate of single-chip tri-axis integrated silicone micro-resonance type accelerometer.
In addition, those skilled in the art also can do other and change in spirit of the present invention, and these variations of doing according to spirit of the present invention certainly, all should be included in the present invention's scope required for protection.
Claims (10)
1. three axle integrated silicone micro-resonance type accelerometers, mainly comprise:
One substrate of glass;
One twin shaft silicon micro-resonance type detection architecture and a single shaft silicon micro-resonance type detection architecture are arranged at the surface of described substrate of glass, and described twin shaft silicon micro-resonance type detection architecture is for detection of being parallel to the axial acceleration of orthogonal XY in the plane of glass basic surface; Described single shaft silicon micro-resonance type detection architecture is for detection of the acceleration of the Z-direction perpendicular to XY direction;
Described twin shaft silicon micro-resonance type detection architecture comprises a mass and four silicon micromechanical structure unit, and described mass is a centrosymmetric structure, the distribution that is centrosymmetric around the center of described mass of described four silicon micromechanical structure unit; Each silicon micromechanical structure unit comprises one group of resonant mode double-ended tuning fork, one group of micromechanics lever and one group of decoupling zero guide support, described decoupling zero guide support one end is connected reception inertial acceleration with described mass, the other end is connected with a power input end of described micromechanics lever, by a power output terminal of micromechanics lever, the inertial force of reception is passed to described resonant mode double-ended tuning fork;
Described single shaft silicon micro-resonance type detection architecture comprises that one first mass, one second mass are mirror image and are symmetrical arranged, described the first mass and the second mass are suspended in described glass basic surface by two brace summers respectively, and rotate taking two brace summers as axle; One first beam and one second beam that shakes that shakes is set in parallel between described the first mass and the second mass, the described first two ends that shake beam are connected with the first mass and the second mass respectively, and one first drives and determine broach and one first detection and determines broach and be relatively arranged on the described first beam both sides that shake; The described second two ends that shake beam are connected with described the first mass and the second mass respectively, one second drives and determine broach and one second detection and determines broach and be relatively arranged on the described second beam both sides that shake, and described first beam and second beam that shakes that shakes is in Z-direction, to have different height in the direction perpendicular to glass basic surface.
2. three axle integrated silicone micro-resonance type accelerometers as claimed in claim 1, it is characterized in that, described decoupling zero guide support comprises a pair of folded beam, elongated straight beam and an orienting lug, described orienting lug one end is connected with described mass by elongated straight beam, the other end is connected to input inertial force to resonant mode double-ended tuning fork with the power input end of described micromechanics lever, and described a pair of folded beam is arranged at described orienting lug both sides fixes and retrain the motion of orienting lug.
3. three axle integrated silicone micro-resonance type accelerometers as claimed in claim 2, it is characterized in that, described a pair of folded beam is symmetrical arranged with described mass in the both sides perpendicular in elongated straight beam direction, one end of each folded beam is connected with support guide piece in the axial motion of sensitivity with described orienting lug, and restricted guidance piece is in orthogonal axial motion, the other end is fixed in described substrate of glass.
4. three axle integrated silicone micro-resonance type accelerometers as claimed in claim 2, it is characterized in that, described micromechanics lever comprises that a fulcrum beam is arranged between described power input end and described power output terminal, and arranges near described power output terminal, to support described micromechanics lever.
5. three axle integrated silicone micro-resonance type accelerometers as claimed in claim 1, it is characterized in that, described resonant mode double-ended tuning fork comprises two symmetrically arranged resonance beam, and described symmetrically arranged two resonance beam are vibrated in anti-phase mode under the control of drive electrode and detecting electrode.
6. three axle integrated silicone micro-resonance type accelerometers as claimed in claim 1, it is characterized in that, described first beam and second beam that shakes that shakes is different from the thickness of described the first mass and the second mass in Z direction, described first beam and second beam that shakes that shakes is parallel to each other, and two ends are connected with described the first mass and the second mass respectively.
7. three axle integrated silicone micro-resonance type accelerometers as claimed in claim 6, is characterized in that, described the first mass has an axis of symmetry that is parallel to glass basic surface, and described first beam and second beam that shakes that shakes is symmetrically distributed in the both sides of described axis of symmetry.
8. three axle integrated silicone micro-resonance type accelerometers as claimed in claim 1, is characterized in that, described first shake beam near the surface of described substrate of glass and described the first mass the surface co-planar near described substrate of glass; Described second shakes beam relatively away from described substrate of glass setting, and described second shakes beam away from the surface of described substrate of glass, with the surface co-planar of described the first mass away from described substrate of glass.
9. three axle integrated silicone micro-resonance type accelerometers as claimed in claim 1, it is characterized in that, described the first mass and the second mass are eccentric structure, the eccentric position of described the first mass becomes mirror image symmetrical with the eccentric position of the second mass, and near the axis of symmetry between described the first mass and the second mass.
10. three axle integrated silicone micro-resonance type accelerometers as claimed in claim 1, it is characterized in that, described glass basic surface is fixed and be suspended in to described dual-axis silicon-micro resonance accelerometer and single shaft silicon micro-resonance type accelerometer by the bonding anchor district on silicon microstructure.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102147424A (en) * | 2011-03-01 | 2011-08-10 | 东南大学 | Triaxial integration silicon micro-resonance type accelerometer |
| CN102243251A (en) * | 2011-04-25 | 2011-11-16 | 东南大学 | Micromechanical silicon resonant accelerometer with different resonant frequencies |
| US20130152684A1 (en) * | 2009-05-26 | 2013-06-20 | Denso Corporation | Sensor for detecting acceleration and angular velocity |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130152684A1 (en) * | 2009-05-26 | 2013-06-20 | Denso Corporation | Sensor for detecting acceleration and angular velocity |
| CN102147424A (en) * | 2011-03-01 | 2011-08-10 | 东南大学 | Triaxial integration silicon micro-resonance type accelerometer |
| CN102243251A (en) * | 2011-04-25 | 2011-11-16 | 东南大学 | Micromechanical silicon resonant accelerometer with different resonant frequencies |
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