CN103901733A - Exposure device - Google Patents
Exposure device Download PDFInfo
- Publication number
- CN103901733A CN103901733A CN201210587429.6A CN201210587429A CN103901733A CN 103901733 A CN103901733 A CN 103901733A CN 201210587429 A CN201210587429 A CN 201210587429A CN 103901733 A CN103901733 A CN 103901733A
- Authority
- CN
- China
- Prior art keywords
- mask
- silicon chip
- platform
- exposure device
- work stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides an exposure device which is used for projecting a circuit pattern to a silicon wafer coated with photoresist. The exposure device comprises an exposure system, a movement table system, a measurement system, an alignment system and a transmission system, wherein the exposure system is used for projecting the circuit pattern to the silicon wafer; the movement table system is used for bearing a mask plate and the silicon wafer and has capability of quickly stepping, locating and finely adjusting; the measurement system is used for measuring a long-travel relative motion distance between a workpiece table and a mask table; the alignment system is used for measuring relative positions among the mask plate, the mask table and the workpiece table; the transmission system is used for switching the mask plate and the silicon wafer. Through the exposure device, certain solutions are provided for enlarging exposure vision field, reducing framework stabling time and improving the production rate, thereby improving the exposure accuracy and the exposure efficiency of the exposure device.
Description
Technical field
The present invention relates to field of lithography, relate in particular to a kind of exposure device.
Background technology
The manufacture process of advanced VLSI (very large scale integrated circuit) is a great system engineering, and it comprises five fabrication phases: silicon chip preparation, silicon chip manufacture, silicon test, assembling and encapsulation, survey eventually.The silicon chip fabrication phase is that a whole set of integrated circuit is forever etched in to the process on silicon chip, and it comprises the operations such as Wafer Cleaning, film forming, photoetching, etching, doping, and wherein photoetching is considered to the core procedure in large scale integrated circuit manufacture.
Litho machine is a kind of exposure device of silicon chip fabrication phase for photoetching, and it is to utilize the principle of optical projection imaging that the high graphics on mask is imaged on gluing silicon chip.Along with the raising of large scale integrated circuit device integrated level, photoetching resolution requires more and more high, require the stability of litho machine complete machine mechanical system and exposure system more and more higher, the precision of measuring system and motion platform is also more and more higher, and operation wavelength is also more and more short simultaneously.When improving photoetching working resolution, can not cause the loss of productive rate, in order to avoid affect the economic performance of equipment.
The patent of invention that is CN1617048A in disclosed publication number in 2005 has been announced a kind of exposure device, this exposure device is by using a kind of special material, such as thering is high thermal expansion coefficient, high manufacturability, low cost, the aluminium alloy of short process-cycle, in the framed structure of exposure device, increase cool cycles pipeline simultaneously, increase the measures such as temperature control loop road, realize the high precision control to framework temperature variation, thereby improve the thermal stability of complete machine mechanical system, the thermal stability of exposure system and the precision of measuring system, but this exposure device just improves its exposure accuracy by increasing its thermal stability, and do not set about the exposure accuracy of exposure device to compensate from other aspects of exposure device, the method that can increase its exposure efficiency is not provided yet.
Summary of the invention
The object of this invention is to provide a kind of exposure device, increasing exposure visual field, reduce the frame stability time, improve the aspect such as productive rate some solutions are provided, to improve the exposure accuracy of exposure device, increase the exposure efficiency of exposure device.
For achieving the above object, the invention provides a kind of exposure device, its for by circuitous pattern projection in the silicon chip that scribbles photoresist, described exposure device comprises complete machine frame system, transmission system and be arranged on the exposure system of described complete machine frame system inside, sports platform system, measuring system and alignment system, described exposure system is used for circuitous pattern projection in described silicon chip, comprise lighting module, object lens and lamp house, described object lens adopt enlargement ratio, described sports platform system comprises mask platform and work stage, described mask platform and work stage are respectively used to carry mask and silicon chip, described mask director stroke adopts rough micro-moving mechanism structure, in described work stage, be also provided with counter-force Wai Yin mechanism, described measuring system is for the relative motion distance of measuring workpieces platform and mask director stroke, described alignment system is used for measuring described mask, relative position between mask platform and work stage three, described transmission system is for the exchange work of described mask and silicon chip.
Further, the enlargement ratio of described object lens is 1:2.
Further, described exposure device also comprises environmental control system, and described environmental control system is used for temperature, humidity, pressure and the cleanliness factor of the other system of controlling this exposure device.
Further, the light source that described lamp house provides through described lighting module filtering, even light, expand after, be irradiated on described mask, light beam is irradiated on described silicon chip through described object lens after receiving the mask information on described mask.
Further, described complete machine frame system comprises damper system and by the separated inner frame of described damper system and external frame.
Further, described sports platform system also comprises workpiece director stroke motor stator, described counter-force Wai Yin mechanism comprises that two work stage counter-forces draw support, spring and impact damper outward, described two work stage counter-forces are drawn spacer support frame outward and are arranged in the external frame of described complete machine frame system, the two ends of described workpiece director stroke motor stator are outward drawn support with impact damper with described two work stage counter-forces by described spring respectively and are connected, and described work stage is moved on described workpiece director stroke motor stator.
Further, described inner frame comprises hanging box, main substrate, mask platform support and illuminating bracket, described damper system is arranged in described external frame, described hanging box is arranged on described damper system, described main substrate is arranged in described hanging box, described mask platform support is arranged on described main substrate, described illuminating bracket is arranged on described mask platform support, described hanging box is used for carrying described work stage, described object lens are arranged in described mask platform support and main substrate, described mask platform support is used for carrying described mask platform, described illuminating bracket is used for carrying described lighting module.
Further, described main substrate is " bridge " formula structure.
Further, described main substrate part hollow out.
Further, the hollow part of described main substrate is filled damping material.
Further, described damping material is resin or rubber.
Further, described damper system comprises four vibration dampers, is arranged at respectively four jiaos of described external frame.
Further, the level that described damper system provides according to described work stage and mask platform is done feedforward compensation to signal for faster and position signalling to described inner frame.
Further, described sports platform system also comprises leveling parallels, and described leveling parallels is arranged under described external frame, and described leveling parallels is for sports platform system described in leveling.
Further, described measuring system comprises mask platform laser interferometer and work stage laser interferometer, and described mask platform laser interferometer and work stage laser interferometer are respectively used to measure the long stroke relative motion distance of described mask platform and work stage.
Further, described measuring system also comprises mask platform reference light laser interferometer, and the auxiliary described mask platform laser interferometer of described mask platform reference light laser interferometer is carried out the relative motion range observation of mask director stroke.
Further, described alignment system comprises coaxial alignment sensor, off-axis alignment sensor, leveling and focusing sensor and the vertical capacitive transducer of mask platform, described coaxial alignment sensor for determine described work stage with respect to the level of described mask platform to position relationship, described off-axis alignment sensor is for determining the position relationship of described work stage with respect to described silicon chip, described leveling and focusing sensor is for detection of the vertical position of described silicon chip, and the vertical capacitive transducer of described mask platform is for detection of the vertical position of described mask.
Further, described transmission system comprises mask transmission system and silicon chip transmission system, and described mask transmission system is for the fluctuating plate exchange of described mask, and described silicon chip transmission system is for the fluctuating plate exchange of described silicon chip.
Further, described mask transmission system comprises mask transmission manipulator and mask plate store, and described mask transmission manipulator exchanges the mask in the mask in described mask platform and described mask plate store.
Further, described silicon chip transmission system comprises silicon chip conveying mechanical hand, wafer pre-alignment platform and silicon chip storehouse, described wafer pre-alignment platform makes described silicon chip conveying mechanical hand aim at the silicon chip in described work stage, and described silicon chip conveying mechanical hand exchanges the silicon chip in the silicon chip in described work stage and described silicon chip storehouse.
Further, described alignment system also comprises mask prealignment sensor, and described mask prealignment sensor is the position relationship with respect to described mask transmission manipulator for detection of mask described in exchange is when mask.
Further, described alignment system also comprises silicon chip secondary prealignment sensor, and described silicon chip secondary prealignment sensor is the position relationship with respect to described silicon chip conveying mechanical hand for detection of silicon chip described in exchange is when silicon chip.
Compared with prior art, the present invention has following beneficial effect:
Exposure device provided by the invention is with respect to the difference of prior art: (1) this exposure device adopts framed structure, possesses high rigidity, light-weighted feature, and the required precision of this exposure device and degree of stability can be provided; (2) the exposure visual field of this exposure device is larger, with increasing substantially exposure efficiency under equiluminous and then improve productive rate; (3) this exposure device adopts work stage counter-force to draw scheme outward, and the vibration of abatement device more quickly reduces stabilization time of vibroshock; (4) this exposure device adopts leveling parallels to carry out the leveling of device, and its leveling time is shorter, and leveling precision is higher.
Brief description of the drawings
Below in conjunction with accompanying drawing, the invention will be further described:
The front view of the exposure device that Fig. 1 provides for the embodiment of the present invention;
The side view of the exposure device that Fig. 2 provides for the embodiment of the present invention;
The structural representation of the outer guiding structure of work stage counter-force in the exposure device that Fig. 3 provides for the embodiment of the present invention;
The layout structure figure of vibroshock in the exposure device that Fig. 4 provides for the embodiment of the present invention;
Fig. 5 is the structural representation of the inner frame of exposure device in prior art;
The structural representation of inner frame in the exposure device that Fig. 6 provides for the embodiment of the present invention.
In Fig. 1 to Fig. 6,
1: silicon chip; 2: mask; 101: lighting module; 102: mask platform; 103: object lens; 104: leveling and focusing sensor; 105: off-axis alignment sensor; 106: silicon chip secondary prealignment sensor; 107: wafer pre-alignment platform; 108: silicon chip conveying mechanical hand; 109: silicon chip storehouse; 110: leveling parallels; 111: vibration damper; 112: ground; 113: external frame; 114: hanging box; 115: work stage; 116: work stage laser interferometer; 117: main substrate; 118: mask platform support; 119: mask platform reference light laser interferometer; 120: mask platform laser interferometer; 121: illuminating bracket; 122: lamp house; 123: coaxial alignment sensor; 124: environmental control system; 201: mask prealignment sensor; 202: mask transmission manipulator; 203: mask transmit buffering platform; 204: mask transmission unlocking mechanism; 205: mask plate store; 206: the vertical capacitive transducer of mask platform; 301: spring; 302: workpiece director stroke motor stator; 304: work stage marble; 305: impact damper; 307: work stage counter-force is drawn support outward; 501: main substrate; 502: supporting leg; 503: hanging box; 602: main substrate fabrication hole.
Embodiment
Exposure device the present invention being proposed below in conjunction with the drawings and specific embodiments is described in further detail.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of the aid illustration embodiment of the present invention lucidly.
Core concept of the present invention is, a kind of exposure device is provided, its for by circuitous pattern projection in the silicon chip that scribbles photoresist, described exposure device comprises exposure system, sports platform system, measuring system, alignment system and transmission system, described exposure system is used for circuitous pattern projection in described silicon chip, described sports platform system comprises mask, mask platform and work stage, described mask platform and work stage are respectively used to carry described mask and silicon chip, described mask platform and work stage all possess Fast Marching, location and fine-tuning capability, described sports platform system adopts framed structure to support and to stablize described mask platform and work stage, described measuring system is for the relative motion distance of measuring workpieces platform and mask director stroke, described alignment system is used for measuring described mask, relative position between mask platform and work stage three, described transmission system is for the exchange work of described mask and silicon chip, exposure device provided by the invention is with respect to the difference of prior art: (1) this exposure device adopts framed structure, possesses high rigidity, light-weighted feature, the required precision of this exposure device and degree of stability can be provided, (2) the exposure visual field of this exposure device is larger, with increasing substantially exposure efficiency under equiluminous and then improve productive rate, (3) this exposure device adopts work stage counter-force to draw scheme outward, and the vibration of abatement device more quickly reduces stabilization time of vibroshock, (4) this exposure device adopts leveling parallels to carry out the leveling of device, and its leveling time is shorter, and leveling precision is higher.
Please refer to Fig. 1 to Fig. 6, the front view of the exposure device that Fig. 1 provides for the embodiment of the present invention; The side view of the exposure device that Fig. 2 provides for the embodiment of the present invention; The structural representation of the outer guiding structure of work stage counter-force in the exposure device that Fig. 3 provides for the embodiment of the present invention; The layout structure figure of vibroshock in the exposure device that Fig. 4 provides for the embodiment of the present invention; Fig. 5 is the structural representation of the inner frame of exposure device in prior art; The structural representation of inner frame in the exposure device that Fig. 6 provides for the embodiment of the present invention.
Embodiment mono-
Please emphasis with reference to figure 1 and Fig. 2, as depicted in figs. 1 and 2, the embodiment of the present invention provides a kind of exposure device, be used for circuitous pattern projection in the silicon chip that scribbles photoresist, described exposure device comprises complete machine frame system, transmission system and be arranged on the exposure system of described complete machine frame system inside, sports platform system, measuring system and alignment system, described exposure system is used for circuitous pattern projection in described silicon chip 1, described exposure system comprises lighting module 101, object lens 103 and lamp house, described object lens 103 adopt enlargement ratio, described sports platform system comprises mask platform 102 and work stage 115, described mask platform 102 and work stage 115 are respectively used to carry mask 2 and silicon chip 1, described mask director stroke adopts rough micro-moving mechanism structure, in described work stage 115, be also provided with counter-force Wai Yin mechanism, described measuring system is for the relative motion distance of measuring workpieces platform 115 and mask platform 102 long strokes, described alignment system is used for measuring described mask 2, relative position between mask platform 102 and work stage 115 threes, described transmission system is for the exchange work of described mask 2 and silicon chip 1.
Further, described exposure device also comprises environmental control system 124, and described environmental control system 124 is for controlling temperature, humidity, pressure and the cleanliness factor of other system of this exposure device.
Exposure is to see through mask with the light wave of certain wavelength and intensity, and photolithography glue selectively makes the photoresist generation chemical reaction of exposure part.In the exposure device that the embodiment of the present invention provides, exposure system is mainly made up of three parts: lighting module 101, object lens 103 and lamp house 122.The light source that lamp house 122 provides through lighting module 101 filtering, even light, expand after, uniform irradiation to mask, carrying mask information light beam through object lens 103 uniform irradiations to scribbling on the silicon chip of photoresist.
The principal element that affects productive rate in subsystem performance comprises the series of factors such as the movement velocity of objective angular field, silicon chip face illumination, work stage and mask platform and acceleration, vibration damper stabilization time, upper and lower version time, fluctuating plate time, the time of aligning, leveling and focusing time, the embodiment of the present invention is from improving the multiplying power of object lens 103, and the angle that increases its objective angular field is set out and in keeping precision, improved the exposure efficiency of this exposure device.
The object lens 103 that the embodiment of the present invention provides adopt the magnification ratio of 1:2, be that visual field, object lens image planes place is 2 times of visual field, object lens object plane place, the silicon chip face field number that it provides exceedes 200mm, with increasing substantially exposure efficiency under equiluminous, be that the region of exposing to the sun in the unit interval is more, productive rate is improved and has very large contribution.Because the multiplying power of object lens in the embodiment of the present invention 103 is enlargement ratio, pattern level in mask platform 102 is to can 2 times being amplified in work stage 115, therefore with respect to equal proportion and scaled down litho machine, under equal exposure quality, the control accuracy of mask platform 102 requires to need to improve a lot, therefore mask platform structure precision of the present invention is had relatively high expectations, based on this reason, the long stroke motion of mask platform 102 that the embodiment of the present invention provides need adopt rough micro-moving mechanism structure, be the long stroke scanning motion that coarse motion completes mask, fine motion completes its level to fine setting.The long stroke motion of work stage 115 adopts the mode settling at one go, and complete machine control adopts mask platform 102 to follow the strategy of work stage 115.
Further, described complete machine frame system comprises damper system and by the separated inner frame of described damper system and external frame 113.
Please emphasis with reference to figure 3, as shown in Figure 3, described sports platform system also comprises workpiece director stroke motor stator 302, described counter-force Wai Yin mechanism comprises that two work stage counter-forces draw support 307 outward, spring and 301 impact dampers 305, described two work stage counter-forces are drawn support 307 outward and are arranged at intervals in the external frame 113 of described complete machine frame system, the two ends of described workpiece director stroke motor stator 302 are outward drawn support 307 with impact damper 305 with described two work stage counter-forces by described spring 301 respectively and are connected, described work stage 115 is moved on described workpiece director stroke motor stator 302.
Further, described inner frame comprises hanging box 114, main substrate 117, mask platform support 118 and illuminating bracket 121, described damper system is arranged in described external frame 113, described hanging box 114 is arranged on described damper system, described main substrate 117 is arranged in described hanging box 114, described mask platform support 118 is arranged on described main substrate 117, described illuminating bracket 121 is arranged on described mask platform support 118, described hanging box 114 is for carrying described work stage 115, described object lens 103 are arranged in described mask platform support 118 and main substrate 117, described mask platform support 117 is for carrying described mask platform 102, described illuminating bracket 121 is for carrying described lighting module 101.
In order to improve exposure efficiency, precise motion platform system need to possess high-speed motion ability, but the work stage 115 of high-speed motion certainly will be introduced disturbing force and upsetting moment to inner frame and work stage 115.The exposure device that the embodiment of the present invention provides adopts active vibration damping device 111 to come this disturbing force of balance and upsetting moment, but in order to reduce the stabilization time of vibration damper 11, the damping demand that reduces vibration damper 11, raising productive rate, be necessary the reacting force of motor to draw from inner frame and work stage 115.As shown in Figure 3, the power producing on workpiece director stroke motor stator 302 is delivered to work stage counter-force by spring 301 and impact damper 305 and draws outward on support 307, be delivered in ground 112 through external frame 113, this has reduced greatly because of work stage 115 impact that inner frame is produced of moving.Due to the magnification ratio of object lens employing 1:2 of the present invention, mask platform 102 is with respect to work stage 115, all much smaller from heavy moving parts or movement velocity aspect, draw outward and have little significance and can increase structure difficulty therefore mask platform 102 designs counter-force, therefore only designed counter-force for workpiece director stroke draws scheme outward to the embodiment of the present invention.The long stroke of work stage 115 adopts the mode settling at one go, and with respect to rough micro-moving mechanism structure, same precision index needs higher control bandwidth, and the mode of this inner frame to this exposure device is had higher requirement.
Please emphasis with reference to figure 6, the structural representation of the inner frame that Fig. 6 provides for the embodiment of the present invention, as shown in Figure 6, described main substrate 117 is " bridge " formula structure, described main substrate 117 redundancy section hollow outs, form main substrate fabrication hole 602, in the main substrate fabrication hole 602 of described main substrate 117, fill damping material, described damping material is resin or rubber.
Please emphasis with reference to figure 5, Fig. 5 is the structural representation of the inner frame of exposure device in prior art, as shown in Figure 5, inner frame of the prior art comprises main substrate 501, four supporting legs 502 and hanging boxes 503, described four supporting legs 502 are arranged on four jiaos of described hanging box 503, described four supporting legs 502 are for supporting described main substrate 501, and work stage is placed in described supporting leg 502 and supports in the space reserving.
Please emphasis with reference to figure 4, as shown in Figure 4, described damper system comprises four vibration dampers 111, is arranged at respectively four jiaos of described external frame 113.
Further, the level that described shock absorber system provides according to described work stage 115 and mask platform 102 is done feedforward compensation to signal for faster and position signalling to described inner frame.
The vibration damper 111 that the embodiment of the present invention provides adopts 4 layout type, it is basic identical that its place that is better than 3 layout type is that 4 layouts can make complete machine main unit be assigned to the bearing capacity of each vibration damper 111, thereby give the type selecting of vibration damper 111, the control of vibration damper 111, the serviceable life of vibration damper 111, advantage is brought in the maintenance maintenance aspect of the deflection control of inner frame statics and vibration damper 111 aspect installing components, 4 layouts can also make vibration damper 111 further reduce ground to be delivered to the vibration of inner frame, disturbing force and upsetting moment that balance exercise platform system motion produces, vibration damper 111 also designs and possesses sports platform feed forward function, the level that to be vibration damper 111 provide according to work stage 115 and mask platform 102 is inputted as feedforward compensation to acceleration signal and position signalling, reduce the stabilization time of vibration damper 111.
Further, described sports platform system also comprises leveling parallels 110, and described leveling parallels 110 is arranged at described external frame 113 times, and described leveling parallels 110 is for sports platform system described in leveling.
In this exposure device, the framework of sports platform system adopts leveling parallels 110 to carry out leveling, and leveling resolution is better than 0.1mm.Leveling parallels 110 can effectively reduce assembly work amount, saves installation time, improve leveling precision with respect to the leveling of choker block sheet.
Further, described measuring system is mainly by mask platform laser interferometer 120, mask platform reference light laser interferometer 119 and work stage laser interferometer 116 form, described mask platform laser interferometer 120 is arranged on described mask platform support 118, described work stage laser interferometer 116 is arranged in the space that described main substrate 117 and hanging box 114 surround, work stage laser interferometer 116 is mainly used in the long stroke relative motion distance of measuring workpieces platform 115, mask platform laser interferometer 120 is mainly used in measuring the long stroke relative motion distance of mask platform 102, because the part external force of the external force of mask platform 102 and work stage 115 is not drawn, in order to improve the measuring accuracy of mask platform laser interferometer 120 with respect to work stage laser interferometer 116, in mask platform 120, increase mask platform reference light laser interferometer 119.Mask platform laser interferometer 120 and work stage laser interferometer 116 all adopt null pick-up to carry out zero clearing work.
Further, described alignment system mainly comprises coaxial alignment sensor 123, off-axis alignment sensor 105, mask prealignment sensor 201, leveling and focusing sensor 104 and the vertical capacitive transducer 206 of mask platform, wherein off-axis alignment sensor 105 and leveling and focusing sensor 104 are all installed on main substrate 117, the vertical capacitive transducer 206 of mask prealignment sensor 201 and mask platform is all installed on object lens 103, and coaxial alignment sensor 123 is installed in work stage 115.Mask (not shown) is arranged in mask platform 102, silicon chip (not shown) is arranged in work stage 115, when exposure, mask prealignment sensor 201 for determine mask platform 102 with respect to the level of mask to position relationship, coaxial alignment sensor 123 for determine work stage 115 with respect to mask or work stage 115 with respect to the level of mask platform 102 to position relationship, off-axis alignment sensor 105 is for determining that work stage 115 is with respect to the position relationship of silicon chip, so just obtained mask with respect to the level of silicon chip to position relationship.Leveling and focusing sensor 104 is for detection of the vertical position of silicon chip, the vertical capacitive transducer 206 of mask platform is for detection of the vertical position of mask, by adjust silicon chip and mask position can make that mask face " overlaps " in vertical direction with object lens object plane, silicon chip face " overlaps " in vertical direction with object lens image planes.
Further, described transmission system comprises mask transmission system and silicon chip transmission system, and described mask transmission system is for the fluctuating plate exchange of described mask, and described silicon chip transmission system is for the fluctuating plate exchange of described silicon chip.
Further, described mask transmission system comprises mask transmission manipulator 202, mask transmit buffering platform 203, mask transmission unlocking mechanism 204 and mask plate store 205, and described mask transmission manipulator 202 exchanges the mask in the mask in described mask platform 102 and described mask plate store 205.
Further, described silicon chip transmission system comprises silicon chip conveying mechanical hand 108, wafer pre-alignment platform 107 and silicon chip storehouse 109, described wafer pre-alignment platform 107 makes described silicon chip conveying mechanical hand 108 aim at the silicon chip in described work stage 115, and described silicon chip conveying mechanical hand 108 exchanges the silicon chip in the silicon chip in described work stage 115 and described silicon chip storehouse 109.
Further, described mask prealignment sensor 201 is the position relationship with respect to described mask transmission manipulator 202 for detection of mask described in exchange is when mask also, to reach the accurately object of upper and lower version.
Further, described alignment system also comprises silicon chip secondary prealignment sensor 106, described silicon chip secondary prealignment sensor 106 is the position relationship with respect to described silicon chip conveying mechanical hand 108 for detection of silicon chip described in exchange is when silicon chip, to play the object of accurate fluctuating plate.
Obviously, those skilled in the art can carry out various changes and distortion and not depart from the spirit and scope of the present invention the present invention.Like this, if these amendments of the present invention and within modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.
Claims (22)
1. an exposure device, be used for circuitous pattern projection in the silicon chip that scribbles photoresist, it is characterized in that, comprise complete machine frame system, transmission system and be arranged on the exposure system of described complete machine frame system inside, sports platform system, measuring system and alignment system, described exposure system is used for circuitous pattern projection in described silicon chip, comprise lighting module, object lens and lamp house, described object lens adopt enlargement ratio, described sports platform system comprises mask platform and work stage, described mask platform and work stage are respectively used to carry mask and silicon chip, described mask director stroke adopts rough micro-moving mechanism structure, in described work stage, be also provided with counter-force Wai Yin mechanism, described measuring system is for the relative motion distance of measuring workpieces platform and mask director stroke, described alignment system is used for measuring described mask, relative position between mask platform and work stage three, described transmission system is for the exchange work of described mask and silicon chip.
2. exposure device according to claim 1, is characterized in that, the enlargement ratio of described object lens is 1:2.
3. exposure device according to claim 1, is characterized in that, also comprises environmental control system, and described environmental control system is for controlling temperature, humidity, pressure and the cleanliness factor of other system of this exposure device.
4. exposure device according to claim 1, it is characterized in that, the light source that described lamp house provides through described lighting module filtering, even light, expand after, be irradiated on described mask, light beam is irradiated on described silicon chip through described object lens after receiving the mask information on described mask.
5. exposure device according to claim 1, is characterized in that, described complete machine frame system comprises damper system and by the separated inner frame of described damper system and external frame.
6. exposure device according to claim 5, it is characterized in that, described sports platform system also comprises workpiece director stroke motor stator, described counter-force Wai Yin mechanism comprises that two work stage counter-forces draw support, spring and impact damper outward, described two work stage counter-forces are drawn spacer support frame outward and are arranged in the external frame of described complete machine frame system, the two ends of described workpiece director stroke motor stator are outward drawn support with impact damper with described two work stage counter-forces by described spring respectively and are connected, and described work stage is moved on described workpiece director stroke motor stator.
7. exposure device according to claim 6, it is characterized in that, described inner frame comprises hanging box, main substrate, mask platform support and illuminating bracket, described damper system is arranged in described external frame, described hanging box is arranged on described damper system, described main substrate is arranged in described hanging box, described mask platform support is arranged on described main substrate, described illuminating bracket is arranged on described mask platform support, described hanging box is used for carrying described work stage, described object lens are arranged in described mask platform support and main substrate, described mask platform support is used for carrying described mask platform, described illuminating bracket is used for carrying described lighting module.
8. exposure device according to claim 7, is characterized in that, described main substrate is " bridge " formula structure.
9. exposure device according to claim 8, is characterized in that described main substrate part hollow out.
10. exposure device according to claim 9, is characterized in that, the hollow part of described main substrate is filled damping material.
11. exposure devices according to claim 10, is characterized in that, described damping material is resin or rubber.
12. exposure devices according to claim 7, is characterized in that, described damper system comprises four vibration dampers, is arranged at respectively four jiaos of described external frame.
13. exposure devices according to claim 7, is characterized in that, the level that described damper system provides according to described work stage and mask platform is done feedforward compensation to signal for faster and position signalling to described inner frame.
14. exposure devices according to claim 6, is characterized in that, also comprise leveling parallels, described leveling parallels is arranged under described external frame, and described leveling parallels is for sports platform system described in leveling.
15. exposure devices according to claim 1, it is characterized in that, described measuring system comprises mask platform laser interferometer and work stage laser interferometer, and described mask platform laser interferometer and work stage laser interferometer are respectively used to measure the long stroke relative motion distance of described mask platform and work stage.
16. according to exposure device described in claim 15, it is characterized in that, described measuring system also comprises mask platform reference light laser interferometer, and the auxiliary described mask platform laser interferometer of described mask platform reference light laser interferometer is carried out the relative motion range observation of mask director stroke.
17. exposure devices according to claim 1, it is characterized in that, described alignment system comprises coaxial alignment sensor, off-axis alignment sensor, the vertical capacitive transducer of leveling and focusing sensor and mask platform, described coaxial alignment sensor for determine described work stage with respect to the level of described mask platform to position relationship, described off-axis alignment sensor is for determining the position relationship of described work stage with respect to described silicon chip, described leveling and focusing sensor is for detection of the vertical position of described silicon chip, the vertical capacitive transducer of described mask platform is for detection of the vertical position of described mask.
18. exposure devices according to claim 1, it is characterized in that, described transmission system comprises mask transmission system and silicon chip transmission system, and described mask transmission system is for the fluctuating plate exchange of described mask, and described silicon chip transmission system is for the fluctuating plate exchange of described silicon chip.
19. according to exposure device described in claim 18, it is characterized in that, described mask transmission system comprises mask transmission manipulator and mask plate store, and described mask transmission manipulator exchanges the mask in the mask in described mask platform and described mask plate store.
20. according to exposure device described in claim 18, it is characterized in that, described silicon chip transmission system comprises silicon chip conveying mechanical hand, wafer pre-alignment platform and silicon chip storehouse, described wafer pre-alignment platform makes described silicon chip conveying mechanical hand aim at the silicon chip in described work stage, and described silicon chip conveying mechanical hand exchanges the silicon chip in the silicon chip in described work stage and described silicon chip storehouse.
21. according to exposure device described in claim 19, it is characterized in that, described alignment system also comprises mask prealignment sensor, and described mask prealignment sensor is the position relationship with respect to described mask transmission manipulator for detection of mask described in exchange is when mask.
22. according to exposure device described in claim 20, it is characterized in that, described alignment system also comprises silicon chip secondary prealignment sensor, and described silicon chip secondary prealignment sensor is the position relationship with respect to described silicon chip conveying mechanical hand for detection of silicon chip described in exchange is when silicon chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210587429.6A CN103901733B (en) | 2012-12-28 | 2012-12-28 | Exposure device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210587429.6A CN103901733B (en) | 2012-12-28 | 2012-12-28 | Exposure device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103901733A true CN103901733A (en) | 2014-07-02 |
| CN103901733B CN103901733B (en) | 2017-02-22 |
Family
ID=50993140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210587429.6A Active CN103901733B (en) | 2012-12-28 | 2012-12-28 | Exposure device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103901733B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105467770A (en) * | 2014-09-09 | 2016-04-06 | 上海微电子装备有限公司 | Reacting force external introduction device and reacting force external introduction method |
| WO2016107507A1 (en) * | 2014-12-30 | 2016-07-07 | 上海微电子装备有限公司 | Silicon wafer edge protection device |
| CN106292196A (en) * | 2015-05-24 | 2017-01-04 | 上海微电子装备有限公司 | A kind of litho machine vibration damping framework |
| WO2018019226A1 (en) * | 2016-07-29 | 2018-02-01 | 上海微电子装备（集团）股份有限公司 | Levellable mask repository device |
| CN107664263A (en) * | 2016-07-29 | 2018-02-06 | 上海微电子装备（集团）股份有限公司 | A kind of gas bath device and control method and application |
| CN108020995A (en) * | 2016-10-31 | 2018-05-11 | 上海微电子装备（集团）股份有限公司 | Litho machine horizontal direction measuring device and method |
| CN108802882A (en) * | 2018-06-05 | 2018-11-13 | 邢明 | A kind of diffraction grating etching machine |
| WO2020011222A1 (en) * | 2018-07-11 | 2020-01-16 | 上海微电子装备（集团）股份有限公司 | Exposure machine |
| CN111913369A (en) * | 2020-08-24 | 2020-11-10 | 福建安芯半导体科技有限公司 | Stepping high-precision photoetching machine |
| CN108807167B (en) * | 2018-06-05 | 2020-11-10 | 深圳市信展通电子有限公司 | Production and manufacturing method of diode electrode |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001057328A (en) * | 1999-08-18 | 2001-02-27 | Nikon Corp | Reflection mask, exposure apparatus, and manufacture of integrated circuit |
| CN1658075A (en) * | 2005-03-25 | 2005-08-24 | 上海微电子装备有限公司 | Exposure device |
| JP2006005194A (en) * | 2004-06-18 | 2006-01-05 | Canon Inc | Mask-holding method and mask magnification correcting method |
| CN1837964A (en) * | 2006-04-20 | 2006-09-27 | 上海微电子装备有限公司 | Composite vibration damping type photolithography device |
| CN202394848U (en) * | 2011-12-15 | 2012-08-22 | 东莞华中科技大学制造工程研究院 | Double-axis floating stator linear platform |
-
2012
- 2012-12-28 CN CN201210587429.6A patent/CN103901733B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001057328A (en) * | 1999-08-18 | 2001-02-27 | Nikon Corp | Reflection mask, exposure apparatus, and manufacture of integrated circuit |
| JP2006005194A (en) * | 2004-06-18 | 2006-01-05 | Canon Inc | Mask-holding method and mask magnification correcting method |
| CN1658075A (en) * | 2005-03-25 | 2005-08-24 | 上海微电子装备有限公司 | Exposure device |
| CN1837964A (en) * | 2006-04-20 | 2006-09-27 | 上海微电子装备有限公司 | Composite vibration damping type photolithography device |
| CN202394848U (en) * | 2011-12-15 | 2012-08-22 | 东莞华中科技大学制造工程研究院 | Double-axis floating stator linear platform |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105467770A (en) * | 2014-09-09 | 2016-04-06 | 上海微电子装备有限公司 | Reacting force external introduction device and reacting force external introduction method |
| US9964864B2 (en) | 2014-12-30 | 2018-05-08 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Silicon wafer edge protection device |
| WO2016107507A1 (en) * | 2014-12-30 | 2016-07-07 | 上海微电子装备有限公司 | Silicon wafer edge protection device |
| TWI569358B (en) * | 2014-12-30 | 2017-02-01 | Silicone edge protection device | |
| CN106292196A (en) * | 2015-05-24 | 2017-01-04 | 上海微电子装备有限公司 | A kind of litho machine vibration damping framework |
| CN106292196B (en) * | 2015-05-24 | 2018-07-20 | 上海微电子装备（集团）股份有限公司 | A kind of litho machine vibration damping frame |
| WO2018019226A1 (en) * | 2016-07-29 | 2018-02-01 | 上海微电子装备（集团）股份有限公司 | Levellable mask repository device |
| CN107664263A (en) * | 2016-07-29 | 2018-02-06 | 上海微电子装备（集团）股份有限公司 | A kind of gas bath device and control method and application |
| CN107664263B (en) * | 2016-07-29 | 2019-04-12 | 上海微电子装备（集团）股份有限公司 | A kind of gas bath device and control method and application |
| US10976673B2 (en) | 2016-07-29 | 2021-04-13 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Levellable mask repository device |
| CN108020995A (en) * | 2016-10-31 | 2018-05-11 | 上海微电子装备（集团）股份有限公司 | Litho machine horizontal direction measuring device and method |
| CN108020995B (en) * | 2016-10-31 | 2020-05-01 | 上海微电子装备（集团）股份有限公司 | Horizontal measuring device and method for photoetching machine |
| CN108802882A (en) * | 2018-06-05 | 2018-11-13 | 邢明 | A kind of diffraction grating etching machine |
| CN108807167B (en) * | 2018-06-05 | 2020-11-10 | 深圳市信展通电子有限公司 | Production and manufacturing method of diode electrode |
| WO2020011222A1 (en) * | 2018-07-11 | 2020-01-16 | 上海微电子装备（集团）股份有限公司 | Exposure machine |
| CN111913369A (en) * | 2020-08-24 | 2020-11-10 | 福建安芯半导体科技有限公司 | Stepping high-precision photoetching machine |
| CN111913369B (en) * | 2020-08-24 | 2022-06-07 | 福建安芯半导体科技有限公司 | Stepping high-precision photoetching machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103901733B (en) | 2017-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103901733A (en) | Exposure device | |
| CN103765315B (en) | The optical imagery with each active supporting component is arranged | |
| US6388733B1 (en) | Exposure apparatus with an anti-vibration structure | |
| CN100520592C (en) | Lithographic apparatus and device manufacturing method | |
| CN100578362C (en) | Vertically delicate adjusting and gravity force compensating mechanism and photo-etching machine | |
| CN102681352A (en) | Lithographic apparatus | |
| CN1797212A (en) | Lithographic apparatus and device manufacturing method | |
| CN102385255A (en) | Stage apparatus, lithographic apparatus and method of positioning an object table | |
| CN1617048A (en) | Lithographic apparatus and device manufacturing method | |
| CN101840159A (en) | Lithographic equipment and device making method | |
| CN104238275A (en) | Six-degree-of-freedom micropositioner and application thereof | |
| CN1721994A (en) | Lithographic apparatus, control system and device manufacturing method | |
| CN105045042A (en) | Six-free-degree displacement measurement method of exposure zone on wafer stage | |
| CN103472678B (en) | Lithography and workpiece table system applied in lithography | |
| CN1252542C (en) | Ultra-precise silicon wafer positioning system with balance weight damping apparatus | |
| CN102809902B (en) | Balancing mass system of photoetching machine | |
| CN1658075A (en) | Exposure device | |
| CN105493237A (en) | Mobile body apparatus, exposure apparatus, and device manufacturing method | |
| CN100468206C (en) | Composite vibration damping type photolithography device | |
| CN103034073B (en) | Double silicon wafer platform exchange system provided with immersion-liquid recovery devices and laser interferometers | |
| CN1896875A (en) | Photoetching equipment | |
| CN112965344A (en) | Photoetching system and exposure compensation method thereof | |
| US11243476B2 (en) | Stage apparatus, lithographic apparatus, control unit and method | |
| CN102103329B (en) | Light beam stabilizing device applied to photoetching equipment | |
| CN103197506A (en) | Lithography machine using mirror image wafer stage |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |